SOT23 lead frame structure with artificial pins

Abstract

The utility model discloses an SOT23 lead frame structure with artificial pins, which comprises a rectangular frame substrate and a plurality of product units, the plurality of product units are distributed in the rectangular frame substrate in a rectangular array mode, each product unit comprises a base island, a plurality of pins are arranged in the base island, the artificial pins are arranged on the outer side of the base island, and the pins are arranged on the outer side of the base island. The utility model relates to an artificial pin of a single product unit, which comprises a plurality of artificial pins and pins, the artificial pins are connected with the pins through connecting ribs, the artificial pins comprise a first artificial pin, a second artificial pin, a third artificial pin and a fourth artificial pin, and the first artificial pin, the second artificial pin, the third artificial pin and the fourth artificial pin are respectively arranged at four corners of the single product unit. In the product cutting process, the pins are firstly formed, and the product units are not separated from the frame at the moment, so that the product can be conveyed to the next rib cutting step by directly conveying the frame, and finally, the connecting rib on the outermost side is cut, the risk that a plastic package body is crushed due to the fact that the connecting rib is left on a track is effectively reduced, and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a lead frame structure of a SOT23 with attached false pins. Background Art

[0002] Chip packaging is a technology that uses insulating plastic or ceramic materials to package integrated circuits. It not only plays a role in placing, fixing, sealing, protecting chips and enhancing thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit. Small outline transistor packaging is a commonly used small surface mount chip packaging. Figure 4 The existing SOT23 lead frame structure includes a frame A, a plurality of mounting units B and a flow channel C arranged on the frame, each mounting unit includes a base island and pins arranged on the upper and lower sides of the base island, each pin includes an outer pin and an inner pin. In the traditional SOT23 lead frame structure, in order to increase the number of lead frame units arranged per unit area, a multi-row and multi-column matrix array arrangement is often adopted. This structure places higher requirements on packaging equipment.

[0003] In the prior art, there is a SOT23 lead frame structure with application number 202222930468.3, which includes: a lead frame, a plurality of unit base islands arranged on the lead frame, and a plurality of unit pins connected to the unit base islands. By setting a pre-cut gap, the unit pins are separated from the lead frame, which is convenient for reducing the subsequent punching process, thereby effectively improving the processing efficiency. However, in the production process of the SOT23 lead frame design, there is a quality problem that the product becomes a unit that is not connected to the frame because all the connecting ribs are cut first, so that the product unit can only be driven by pulling the frame during the subsequent material pulling, so that some connecting rib fragments remain in the track, and then the frame pulls the product unit plastic package body to be crushed. Utility Model Content

[0004] The utility model aims to provide a SOT23 lead frame structure with a false foot, so as to solve the problem in the prior art that the SOT23 lead frame design has a problem in the production process that all the connecting ribs are cut first, resulting in the product becoming a unit that is not connected to the frame, so that when the material is subsequently pulled, the product unit can only be driven by pulling the frame, so that some connecting rib fragments remain in the track, and then the frame pulls the product unit plastic package body and the quality problem is that the unit plastic package is damaged.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a SOT23 lead frame structure with a false foot, comprising a rectangular frame substrate and a plurality of product units, wherein a plurality of the product units are distributed in a rectangular array inside the rectangular frame substrate, the product units comprising a base island, a plurality of pins are arranged inside the base island, and a false foot is arranged outside the base island.

[0006] Furthermore, the number of the product units is 1080, and the product units are arranged in 18 rows along the width direction of the frame, with 9 rows forming a group, and 60 rows are arranged along the length direction of the frame substrate, and every two adjacent rows of lead frame units constitute a product unit.

[0007] Furthermore, the plurality of pins in the base island are composed of external pins and internal pins, the external pins include a first external pin, a second external pin and a third external pin, and the internal pins include a first internal pin, a second internal pin and a third internal pin.

[0008] Furthermore, the outer pins and the inner pins are symmetrically arranged about the middle of the product unit, and the width of the outer pins is greater than the width of the inner pins.

[0009] Furthermore, the prosthetic foot includes a first prosthetic foot, a second prosthetic foot, a third prosthetic foot and a fourth prosthetic foot, and the first prosthetic foot, the second prosthetic foot, the third prosthetic foot and the fourth prosthetic foot are respectively located at four corners of a single product unit.

[0010] Furthermore, the prosthetic feet are in even number, and the number can be two, four, six or eight.

[0011] Furthermore, the rectangular frame substrate 1 has a length of 300.000±0.100 mm, a width of 90.000±0.05 mm, a lateral spacing of product units of 4.846±0.050 mm, an inner longitudinal spacing of a product unit of 3.526±0.050 mm, and a longitudinal spacing of adjacent product units 2 of 10.052±0.050 mm.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model provides a false foot on the outer side of the base island of the product unit, and the false foot is connected to the pin by a connecting rib. In this way, the false foot is added, and the pin is first formed during the product cutting process. At this moment, the product unit is not detached from the frame, so the product can be directly transferred to the next rib cutting step by directly transferring the frame, and finally the outermost connecting rib is cut, which effectively reduces the risk of the plastic package being crushed due to the remaining connecting rib on the track, thereby improving the product quality.

[0014] 2. The utility model comprises a first false foot, a second false foot, a third false foot and a fourth false foot, and the first false foot, the second false foot, the third false foot and the fourth false foot are respectively provided at the four corners of a single product unit, and the false feet are in even number, and the number can be two, four, six or eight. By changing the number and layout of the pins of the product unit, the purpose of sharing a set of molds for different product processes is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a schematic diagram of the entire partial structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the structure of a single product unit of the utility model;

[0018] Figure 3 It is a schematic diagram of the final cutting product structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the product unit structure of the prior art.

[0020] In the figure: 1. rectangular frame substrate; 2. product unit; 3. base island; 4. first outer pin; 5. second outer pin; 6. third outer pin; 7. first inner pin; 8. second inner pin; 9. third inner pin; 10. first false pin; 11. second false pin; 12. third false pin; 13. fourth false pin. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 In the embodiment of the utility model, a lead frame structure of SOT23 with false feet includes a rectangular frame substrate 1 and multiple product units 2. The product units 2 are distributed in a rectangular array inside the rectangular frame substrate 1. The product units 2 include a base island 3, and multiple pins and flow channels are arranged inside the base island 3. A false foot is arranged outside the base island 3. The false foot and the pin are connected by connecting ribs. After adding the false foot, the pin and the false foot are bent first, and then the connecting ribs are cut, which greatly reduces the risk of crushing the plastic package. There are also problems in terms of utilization and fault tolerance in product layout space.

[0023] Preferably, the number of product units 2 is 1080, and there are 18 rows of product units 2 along the width direction of the frame, with 9 rows forming a group, and 60 rows arranged along the length direction of the frame substrate 1. Every two adjacent rows of lead frame units constitute a product unit, so that the unit products are all equipped with false feet to maximize the use of the product frame space while ensuring product quality.

[0024] Preferably, the multiple pins in the base island 3 are composed of external pins and internal pins, the external pins include a first external pin 4, a second external pin 5 and a third external pin 6, the internal pins include a first internal pin 7, a second internal pin 8 and a third internal pin 9, the external pins and the internal pins are symmetrically arranged about the middle of the product unit 2, and the width of the external pins is greater than the width of the internal pins, which is convenient for cutting the unit product.

[0025] Preferably, the artificial foot includes a first artificial foot 10, a second artificial foot 11, a third artificial foot 12 and a fourth artificial foot 13, and the first artificial foot 10, the second artificial foot 11, the third artificial foot 12 and the fourth artificial foot 13 are respectively located at the four corners of a single product unit 2. The artificial feet are in even number, and the number can be two, four, six or eight. The purpose of sharing a set of molds for different product processes can be achieved by changing the number and layout of the pins of the product unit.

[0026] Preferably, the rectangular frame substrate 1 has a length of 300.000±0.100 mm and a width of 90.000±0.05 mm, a lateral spacing of product units 2 of 4.846±0.050 mm, an inner longitudinal spacing of a product unit 2 of 3.526±0.050 mm, and a longitudinal spacing of adjacent product units 2 of 10.052±0.050 mm.

[0027] The working principle and use process of the utility model are as follows: a false foot is provided on the outer side of the base 3 of the product unit 2, and the false foot is connected to the pin by a connecting rib. By adding the false foot, the pin is first formed during the product cutting process. At this moment, the product unit 2 is not detached from the rectangular frame substrate 1, so the frame can be directly conveyed to allow the product to be conveyed to the next rib cutting step, and finally the outermost connecting rib is cut, which effectively reduces the risk of the plastic package being crushed due to the connecting rib remaining on the track, thereby improving the product quality.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A SOT23 lead frame structure with a false lead, comprising a rectangular frame substrate (1) and a plurality of product units (2), characterized in that: The product units (2) are distributed in a rectangular array in a plurality inside the rectangular frame substrate (1). The product units (2) include a base island (3) having a plurality of pins inside the base island (3). A false foot is provided outside the base island (3), and the false foot is connected to the pin by connecting ribs.

2. A SOT23 lead frame structure with a false lead according to claim 1, characterized in that: The number of the product units (2) is 1080. The product units (2) are arranged in 18 rows along the width direction of the frame, with 9 rows forming a group. 60 rows are arranged along the length direction of the frame substrate (1), and every two adjacent rows of lead frame units constitute a product unit.

3. A SOT23 lead frame structure with a false lead according to claim 1, characterized in that: The plurality of pins in the base island (3) are composed of external pins and internal pins, wherein the external pins include a first external pin (4), a second external pin (5) and a third external pin (6), and the internal pins include a first internal pin (7), a second internal pin (8) and a third internal pin (9).

4. A SOT23 lead frame structure with a false lead according to claim 3, characterized in that: The outer pins and the inner pins are symmetrically arranged about the middle of the product unit (2), and the width of the outer pins is greater than the width of the inner pins.

5. The SOT23 lead frame structure with a false lead according to claim 1, characterized in that: The artificial foot comprises a first artificial foot (10), a second artificial foot (11), a third artificial foot (12) and a fourth artificial foot (13), and the first artificial foot (10), the second artificial foot (11), the third artificial foot (12) and the fourth artificial foot (13) are respectively located at the four corners of a single product unit (2).

6. A SOT23 lead frame structure with a false lead according to claim 5, characterized in that: The artificial feet are in even number, and the quantity is two, four, six or eight.

7. The SOT23 lead frame structure with attached false pins according to claim 1, characterized in that: The rectangular frame substrate (1) has a length of 300.000±0.100 mm and a width of 90.000±0.05 mm, a lateral spacing of product units (2) of 4.846±0.050 mm, an inner longitudinal spacing of a product unit (2) of 3.526±0.050 mm, and a longitudinal spacing of adjacent product units (2) of 10.052±0.050 mm.

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