Virtual pixel lamp bead
By setting up two sets of RGB chipsets in staggered arrangement on the PCB board of LED lamp beads, the problems of small solid crystal space and high packaging difficulty are solved, and a more efficient packaging process and higher product quality are achieved. Rate.
Patent Information
- Application Number
- CN202420997782.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-09
AI Technical Summary
The existing four-in-one lamp beads have small solid crystal space, high packaging process, low packaging efficiency, and poor one chip, which leads to the entire lamp bead becoming a bad product.
By setting two sets of RGB chipsets arranged in an interlaced manner on the PCB board, four pixel points are formed, the number of RGB chips is reduced, the space of solid crystals and bonded wires is expanded, the packaging difficulty is reduced, and through the pads and leads The design increases solid crystal space and simplifies the packaging process.
Based on the traditional four-in-one lamp bead, it is realized that only two sets of RGB chips are used to form four pixel points, which reduces the chip usage cost, improves product yield, simplifies the packaging process, improves packaging efficiency and product stability. .
Smart Images
Figure CN222261065U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED devices, in particular to a virtual pixel lamp bead. Background Art
[0002] The RGB lamp beads in the display LED were originally mounted using a separate device method, that is, single lamp beads were mounted, with a minimum size of 0.6mm and a maximum size of 3.5mm.
[0003] With the development of display LED technology, the size of lamp beads is getting smaller and smaller. When the lamp beads are smaller, the precision requirements of chip patch are higher, resulting in a significant reduction in patch efficiency. At the same time, the size of lamp beads is getting smaller, the pads are densely arranged, and the pads are getting smaller. The thrust of the lamp beads on the PCB board is also reduced, and the risk of collision increases. Therefore, a four-in-one structure lamp bead is developed. The four-in-one structure lamp bead adopts integrated packaging technology, that is, the four-in-one array packaging technology is adopted. Two lamp beads are arranged horizontally and vertically respectively to form a structure with four lamp beads as one, and each lamp bead contains RGB three-color chips. The four-in-one lamp bead improves the testing efficiency and patch efficiency of the package, and meets the current demand for ultra-small pitch LED display screens.
[0004] The existing four-in-one lamp beads, whether they are flip-chip or face-mounted, all contain four groups of RGB chips to form four pixels. However, for small-sized four-in-one lamp beads, the solid crystal space is small, the operation is difficult, the packaging efficiency is low, and defective products are easily produced. Moreover, due to its four-in-one characteristics, if one chip is defective, the entire lamp bead will become a defective product. Utility Model Content
[0005] In view of the deficiencies in the prior art, the purpose of the present utility model is to provide a virtual pixel lamp bead, aiming to solve the problems in the prior art of small solid crystal space, difficult packaging process and low packaging efficiency of a four-in-one lamp bead with four pixels.
[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:
[0007] A virtual pixel lamp bead comprises a PCB board, a first chip group and a second chip group are arranged on the PCB board, the first chip group and the second chip group both comprise a first color chip, a second color chip and a third color chip, the third color chip, the second color chip and the first color chip are arranged in sequence along the X direction in the first chip group, the second color chip, the first color chip and the third color chip are arranged in sequence along the X direction in the second chip group, the first color chip, the second color chip and the third color chip all comprise a first electrode and a second electrode, two first pad groups and two second pad groups are arranged along the Y direction on one side of the PCB board facing the first chip group, the two second pad groups are located between the two first pad groups, the first pad group comprises three first pads, the first pad is connected to the first electrode, the second pad group comprises three second pads, the second pad is connected to the second electrode, a plurality of first through holes are provided on the PCB board, and the first through holes penetrate the PCB board.
[0008] Compared with the prior art, the beneficial effect of the present invention is that by setting the first chipset and the second chipset and setting an interlaced chip arrangement order, four pixel points can be formed by only two groups of RGB chips. On the basis of the traditional four-in-one lamp beads, four pixel points are guaranteed while the number of RGB chips is reduced, which can reduce the cost of chip use, increase the space for solid crystal and wire bonding, reduce the difficulty of packaging process, and is beneficial to improving product yield.
[0009] Furthermore, the distance between the two first color chips in the X direction is equal to the distance between them in the Y direction, the distance between the two second color chips in the X direction is equal to the distance between them in the Y direction, and the distance between the two third color chips in the X direction is equal to the distance between them in the Y direction.
[0010] Furthermore, the three first electrodes in the first chip group are electrically connected through three first pads and first leads, and the three first electrodes in the second chip group are electrically connected through three first pads and fourth leads, and the first lead and the fourth lead are respectively connected to one first through hole.
[0011] Furthermore, the second electrodes of two first color chips are electrically connected through two second solder pads and second leads, and the second electrodes of two second color chips are electrically connected through two second solder pads and third leads, and the second lead and the third lead are respectively connected to one first through hole.
[0012] Furthermore, a second through hole and a third through hole are disposed on the PCB board, and the second through hole and the third through hole both penetrate the PCB board.
[0013] Furthermore, the second electrode on the third color chip in the first chip group is electrically connected to the second through hole through the second pad, and the second electrode on the third color chip in the second chip group is electrically connected to the third through hole through the second pad.
[0014] Furthermore, a fifth lead is connected between the second through hole and the third through hole, and the fifth lead is located on a side of the PCB board facing away from the first chipset.
[0015] Furthermore, a plurality of back pads are arranged on a side of the PCB board facing away from the first chipset, and a plurality of the first through holes, the second through holes and the third through holes are respectively connected to one of the back pads. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the structure of the virtual pixel lamp bead in the embodiment of the utility model;
[0017] Figure 2 This is a partial structural diagram of a virtual pixel lamp bead in an embodiment of the utility model;
[0018] Figure 3 A schematic diagram of the distance between two first color chips in a virtual pixel lamp bead in an embodiment of the utility model;
[0019] Figure 4 A schematic diagram of virtual pixel lamp beads forming pixel points in an embodiment of the utility model;
[0020] Figure 5 This is a schematic diagram of the structure of the pads and leads in a traditional four-in-one lamp bead;
[0021] Description of main component symbols:
[0022] PCB board 100 First lead 101 Second lead 102 The third lead 103 Fourth lead 104 Fifth lead 105 The first pad group 110 Second pad group 120 First color chip 210 Second color chip 220 Third color chip 230 First through hole 300 Second through hole 301 The third through hole 302 Back pad 400 First pixel 501 The second pixel 502 The third pixel 503 The fourth pixel 504
[0023] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0027] See also Figures 1 to 4 The virtual pixel lamp bead in the embodiment of the utility model includes a PCB board 100, on which a first chip group and a second chip group are arranged, and the first chip group and the second chip group both include a first color chip 210, a second color chip 220 and a third color chip 230. The third color chip 230, the second color chip 220 and the first color chip 210 are arranged in sequence along the X direction in the first chip group, and the second color chip 220, the first color chip 210 and the third color chip 230 are arranged in sequence along the X direction in the second chip group. The distance between the two first color chips 210 in the X direction is equal to the distance in the Y direction, the distance between the two second color chips 220 in the X direction is equal to the distance in the Y direction, and the distance between the two third color chips 230 in the X direction is equal to the distance in the Y direction. Preferably, the first color chip 210 is a red chip, the second color chip 220 is a green chip, and the third color chip 230 is a blue chip. The first chip group and the second chip group are both RGB chips. Please refer to Figure 3 The distance between the two first color chips 210 in the X direction and the distance between the two second color chips 220 in the X direction and the distance between the two second color chips 220 in the Y direction are equal, both are L, and the distance between the two third color chips 230 in the X direction and the distance between the two third color chips 230 in the Y direction are equal, both are L. Please refer to Figure 4, a group of RGB chips are arranged in a straight line in the X direction, forming two pixel points in the Y direction, namely the first pixel point 501 and the second pixel point 502; the red chip and the green chip in the first chip group and the blue chip in the second chip group form a third pixel point 503, the blue chip in the first chip group and the red chip and the green chip in the second chip group form a fourth pixel point 504, and the third pixel point 503 and the fourth pixel point 504 are distributed along the Y direction. It can be understood that only two groups of RGB chips are used to realize the function of four pixel points. Compared with the traditional four-in-one lamp beads, the virtual pixel lamp beads reduce two groups of RGB chips, reduce the cost of chip use, greatly increase the space for solid crystal, and because the number of chips in a lamp bead is reduced, the defective rate of the lamp bead due to the chip is reduced.
[0028] The first color chip 210, the second color chip 220 and the third color chip 230 all include a first electrode and a second electrode. Two first pad groups 110 and two second pad groups 120 are arranged along the Y direction on one side of the PCB board 100 facing the first chip group. The two second pad groups 120 are located between the two first pad groups 110. The first pad group 110 includes three first pads, and the first pads are connected to the first electrode. The second pad group 120 includes three second pads, and the second pads are connected to the second electrode. The PCB board 100 is provided with a plurality of first through holes 300, second through holes 301 and third through holes 302. The first through holes 300, the second through holes 301 and the third through holes 302 all penetrate the PCB board 100. Preferably, the three first pads are arranged in a straight line along the X direction, and the three second pads are arranged in a straight line along the X direction. The first through holes 300, the second through holes 301 and the third through holes 302 are all used for conducting electricity.
[0029] The three first electrodes in the first chip group are electrically connected through three first pads and a first lead 101, the three first electrodes in the second chip group are electrically connected through three first pads and a fourth lead 104, the first lead 101 and the fourth lead 104 are respectively connected to one first through hole 300, the second electrodes of two first color chips 210 are electrically connected through two second pads and a second lead 102, the second electrodes of two second color chips 220 are electrically connected through two second pads and a third lead 103, the second lead 102 and the third lead 103 are respectively connected to one first through hole 300.
[0030] The second electrode on the third color chip 230 in the first chip group is electrically connected to the second through hole 301 through the second solder pad, and the second electrode on the third color chip 230 in the second chip group is electrically connected to the third through hole 302 through the second solder pad. The fifth lead 105 is connected between the second through hole 301 and the third through hole 302. The fifth lead 105 is located on the side of the PCB board 100 facing away from the first chip group. A plurality of back solder pads 400 are arranged on the side of the PCB board 100 facing away from the first chip group, and a plurality of the first through holes 300, the second through holes 301 and the third through holes 302 are respectively connected to one of the back solder pads 400. Preferably, the first lead 101, the second lead 102, the third lead 103, the fourth lead 104 and the fifth lead 105 are all bent electroplated leads, which are arranged on the PCB board 100. The back pad 400 is square and is used to connect an external circuit. It can be understood that by arranging pads and leads on both sides of the PCB board 100, it is beneficial to further increase the space for solid crystal, facilitate processing, and prevent the difficulty of the packaging process from increasing due to excessive density of leads.
[0031] See also Figure 5 In the traditional four-in-one lamp bead structure, there are a large number of leads and pads, which are densely arranged, with a small solid crystal space and great difficulty in operation. The virtual pixel lamp bead increases the solid crystal space while ensuring that the number of pixels is not reduced, greatly reduces the difficulty of mounting, improves packaging efficiency, and improves the yield rate.
[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A virtual pixel lamp bead, characterized in that: The invention comprises a PCB board, on which a first chip group and a second chip group are arranged, the first chip group and the second chip group both comprise a first color chip, a second color chip and a third color chip, the third color chip, the second color chip and the first color chip are arranged in sequence along the X direction in the first chip group, the second color chip, the first color chip and the third color chip are arranged in sequence along the X direction in the second chip group, the first color chip, the second color chip and the third color chip all comprise a first electrode and a second electrode, two first pad groups and two second pad groups are arranged along the Y direction on one side of the PCB board facing the first chip group, the two second pad groups are located between the two first pad groups, the first pad group comprises three first pads, the first pads are connected to the first electrode, the second pad group comprises three second pads, the second pads are connected to the second electrode, and a plurality of first through holes are provided on the PCB board, the first through holes penetrate the PCB board.
2. The virtual pixel lamp bead according to claim 1, characterized in that: The distance between the two first color chips in the X direction is equal to the distance between them in the Y direction, the distance between the two second color chips in the X direction is equal to the distance between them in the Y direction, and the distance between the two third color chips in the X direction is equal to the distance between them in the Y direction.
3. The virtual pixel lamp bead according to claim 1, characterized in that: The three first electrodes in the first chip group are electrically connected via three first pads and first leads, and the three first electrodes in the second chip group are electrically connected via three first pads and fourth leads, and the first lead and the fourth lead are respectively connected to one of the first through holes.
4. The virtual pixel lamp bead according to claim 1, characterized in that: The second electrodes of the two first color chips are electrically connected via two second pads and a second lead, and the second electrodes of the two second color chips are electrically connected via two second pads and a third lead, and the second lead and the third lead are respectively connected to one of the first through holes.
5. The virtual pixel lamp bead according to claim 1, characterized in that: The PCB board is provided with a second through hole and a third through hole, and the second through hole and the third through hole both penetrate the PCB board.
6. The virtual pixel lamp bead according to claim 5, characterized in that: The second electrode on the third color chip in the first chip group is electrically connected to the second through hole through the second pad, and the second electrode on the third color chip in the second chip group is electrically connected to the third through hole through the second pad.
7. The virtual pixel lamp bead according to claim 6, characterized in that: A fifth lead is connected between the second through hole and the third through hole, and the fifth lead is located on a side of the PCB board facing away from the first chipset.
8. The virtual pixel lamp bead according to claim 7, characterized in that: A plurality of back pads are arranged on a side of the PCB board facing away from the first chipset, and a plurality of the first through holes, the second through holes and the third through holes are respectively connected to one of the back pads.