Solar cell packaging structure
The photovoltaic cells are encapsulated through laser technology, and the incomplete corresponding upper cover plate and lower cover plate structure and fill layer are designed, which solves the problems of excessively long electrode wires and poor sealing performance, and achieves a more stable and reliable solar cell packaging structure. Improves the durability and safety of the product.
Patent Information
- Application Number
- CN202420308203.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-02-07
- Filing Date
- 2024-02-20
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-02-20
AI Technical Summary
The existing solar cell components of glass element type waste effective surface space due to the long electrode wires, and the sealing performance of polymer or plastic packaging is poor, and the water and gas barrier effect is limited.
The photovoltaic cell is encapsulated by laser technology. The upper cover plate is designed to not correspond exactly to the lower cover plate, and the retained part of the lower cover plate is exposed so that the electrode wire can be attached to the outside of the substrate, and the packaging layer and the filling layer are arranged to maintain the sealing properties. Optimize electrode wire output via semicircular notch.
Effectively utilize the space in the packaging area, improve the stability and sealing of the packaging structure, enhance the output flexibility of the electrode wires, and provide better water and gas barrier effects, extending product life.
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Figure CN222261080U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solar cells, and in particular to a thin-film solar cell packaging structure. Background Art
[0002] Solar cells are devices that directly convert solar energy into electrical energy, and they have broad application prospects in environmental protection, energy conservation and renewable energy. Among them, thin-film photovoltaic elements are a relatively new solar cell technology, which has the advantages of light weight, thinness, shortness and low production cost, so they are widely used in building integration, portable power supplies, solar bicycles and other scenarios.
[0003] However, if the solar cell element is a glass element, both sides of the element are glass substrates, and the electrode wires are mostly led out from the side of the element, which limits the product's appearance and structural design. If the electrode wires are too long, the effective surface space will be wasted. Referring to known technologies such as the patent CN102856413A, holes are directly opened on one surface of the glass surface to lead out the electrode wires. The electrode wire openings of the glass panel holes are inside the glass surface and are directly led out from the panel, which can fully and effectively utilize the panel structure. However, such structures are only suitable for adhesive structures encapsulated with polymers or plastics, and the water and gas barrier effects are limited, and the element sealing performance is poor. Utility Model Content
[0004] Based on the above technical problems, the main purpose of the utility model is to overcome the above technical defects and provide a solar cell packaging structure, which can be used to package photovoltaic cells using laser technology, and the upper cover plate of the structure does not completely correspond to the lower cover plate, and the lower cover plate is partially exposed, so that the electrode wire can be attached to the substrate and exposed outside the packaging area, and the sealing of the packaging structure can be maintained. Therefore, the process is simple, the packaging structure is more stable, and the product life can be increased.
[0005] In order to achieve the above technical objectives, the technical solution of the utility model provides a solar cell packaging structure, comprising: a lower cover plate, a lower conductive layer, a photovoltaic layer, an upper conductive layer, at least one electrode wire, a packaging layer, an upper cover plate and a filling layer. The lower conductive layer is arranged on a side surface of the lower cover plate, and the lower conductive layer is composed of a plurality of lower electrode circuits. The photovoltaic layer is composed of a plurality of photovoltaic units, and the photovoltaic units are arranged on the lower electrode circuits, so that a gap is formed between each of the photovoltaic units. The upper conductive layer is composed of a plurality of upper electrode circuits, and the upper electrode circuits are arranged on a side surface of the photovoltaic unit and are electrically connected to the lower electrode circuits. The electrode wires are electrically connected to the lower conductive layer or the upper conductive layer, and each of the electrode wires has a line end. The packaging layer is arranged on the periphery of the lower cover plate and on the electrode wires, so that the line ends of the electrode wires are exposed. The upper cover is arranged on the packaging layer, and the upper cover is not completely corresponding to the lower cover, so that a part of the lower cover is left exposed, so that an exposed area is formed between the upper cover and the lower cover, and the wire ends of the electrode wires are attached to the lower cover and exposed outside the packaging area, so that the upper cover does not cover the wire ends exposed outside the packaging area. The filling layer is arranged in the packaging area.
[0006] Optionally, the wire end of the electrode wire is exposed outside the packaging area in the packaging layer as a semicircular notch.
[0007] Optionally, one end of the upper cover plate has a semicircular end edge notch corresponding to the semicircular notch.
[0008] Optionally, the upper cover plate and the lower cover plate are glass substrates or plastics.
[0009] Optionally, the photovoltaic layer has a thickness of 0.1 μm to 500 μm.
[0010] Optionally, the photovoltaic layer has a thickness of 10 μm to 150 μm.
[0011] Optionally, the photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin oxide thin film solar cell, a silicon thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell.
[0012] Optionally, the photovoltaic unit is stacked in sequence by an electron transfer layer, an active layer and a hole transfer layer.
[0013] Optionally, the photovoltaic unit is stacked in sequence by a hole transfer layer, an active layer and an electron transfer layer.
[0014] Optionally, the filling layer is a transparent filling material.
[0015] Optionally, the encapsulation layer has a thickness of 10 μm to 1000 μm.
[0016] Optionally, the encapsulation layer is arranged at the periphery of the photovoltaic layer without being directly adjacent to the photovoltaic layer, and maintains a gap of at least 2 mm with the photovoltaic layer.
[0017] Through the above technical solution, the utility model can achieve the following beneficial effects:
[0018] The solar cell packaging structure of the utility model changes the electrode wire 50 to be output from one side of the upper cover plate 60 and the lower cover plate 10, making full use of the space utilization of the non-photovoltaic area in the packaging area 71, which can be beneficial to the structural configuration application requirements of the corresponding matching circuit board. In addition, the filling layer 80 is arranged in the packaging area 71 to strengthen the structural stress in the packaging area 71, and also has the effect of blocking water and gas, and the selection of materials for the packaging glue can be more diversified. The utility model structure provides many effects such as structural safety, reliability, durability and good weather resistance. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a side cross-sectional schematic diagram of a semi-finished solar cell packaging structure according to the first embodiment of the utility model;
[0020] Figure 2 for Figure 1 A partial enlarged schematic diagram of the solar cell packaging structure;
[0021] Figure 3 for Figure 1 A schematic side cross-sectional view of a semi-finished product of a solar cell packaging structure having a packaging layer and an upper cover plate sealed thereon;
[0022] Figure 4 for Figure 3 A top view schematic diagram of
[0023] Figure 5 This is a side cross-sectional view of a semi-finished solar cell packaging structure according to the second embodiment of the present utility model;
[0024] Figure 6 for Figure 5 Schematic top view of .
[0025] Reference numerals:
[0026] 10. Lower cover plate; 20. Lower conductive layer; 21. Lower electrode circuit; 30. Photovoltaic layer; 31. Photovoltaic unit; 31a. Electron transfer layer; 31b. Active layer; 31c. Hole transfer layer; 32. Gap; 40. Upper conductive layer; 41. Upper electrode circuit; 50. Electrode wire; 51. Wire end; 60. Upper cover plate; 61. Exposed area; 62. Semicircular end notch; 70. Encapsulation layer; 71. Encapsulation area; 72. Semicircular notch; 80. Filling layer. DETAILED DESCRIPTION
[0027] The present invention is further described in detail below in conjunction with the accompanying drawings so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0028] The technical content and detailed description of the utility model are now described as follows with the accompanying drawings:
[0029] See also Figure 1 , 2 , is a side cross-sectional view of a semi-finished solar cell packaging structure of the first embodiment of the utility model and Figure 1 As shown in the figure: the solar cell packaging structure of the utility model at least includes: a lower cover plate 10, a lower conductive layer 20, a photovoltaic layer 30, an upper conductive layer 40 and an electrode wire 50.
[0030] When the solar cell packaging structure is manufactured, a lower cover plate 10 is prepared first. The lower cover plate 10 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP). In this embodiment, the lower cover plate 10 is selected to be, but not limited to, a glass substrate.
[0031] Next, a lower conductive layer 20 is formed on one side of the lower cover plate 10. The lower conductive layer 20 can be formed into a plurality of transparent lower electrode circuits 21 by etching technology containing inorganic conductive materials. In this figure, the inorganic conductive material is indium tin oxide (ITO) or silver paste. In this embodiment, indium tin oxide ITO is selected but not limited.
[0032] Next, a photovoltaic layer 30 is fabricated on one side of the lower conductive layer 20. The photovoltaic layer 30 is composed of a plurality of photovoltaic units 31. The photovoltaic units 31 are arranged on one side of the lower electrode lines 21, so that there is a gap 32 between the photovoltaic units 31. The photovoltaic units 31 are sequentially composed of a stacked structure of an electron transfer layer 31a, an active layer 31b and a hole transfer layer 31c, or sequentially composed of a stacked structure of a hole transfer layer 31c, an active layer 31b and an electron transfer layer 31a. The photovoltaic layer 30 is an organic solar cell, a copper indium gallium selenide (CIGS) thin film solar cell, a cadmium tetroxide (CdTe) thin film solar cell, a silicon (α-Si) thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell (DSSC). In this figure, the thickness of the photovoltaic layer 30 is 0.1 μm to 500 μm. The thickness of the photovoltaic layer 30 is 10 μm to 150 μm.
[0033] Next, an upper conductive layer 40 is formed on one side of the photovoltaic units 31 and electrically connected to the lower conductive layer 20. The upper conductive layer 40 may be formed by evaporating, sputtering or coating an inorganic conductive material and then etching to form a plurality of transparent upper electrode circuits 41. In this figure, the inorganic conductive material is aluminum or silver.
[0034] Finally, the electrode wire 50 is manufactured. The electrode wire 50 is a copper foil, copper wire or silver paste which is printed and disposed on one side of the lower cover plate 10 and is electrically connected to the lower conductive layer 20 or the upper conductive layer 40. In this way, a semi-finished solar cell packaging structure is completed. After the semi-finished solar cell packaging structure and the electrode wire 50 are electrically connected, the manufacturing of the solar cell packaging structure is completed.
[0035] See also Figure 3 , 4 ,for Figure 1 A packaging layer and an upper cover plate are sealed on the semi-finished product of the solar cell packaging structure. Figure 3 As shown in the figure: Then, the semi-finished element of the solar cell packaging structure is coated with a polyimide (PIB) packaging layer 70, and the packaging coating is applied to the periphery of the lower cover plate 10 and the two electrode wires 50 by a dispensing machine, so that the two wire ends 51 of the two electrode wires 50 are exposed, and the packaging layer 70 is arranged around the photovoltaic layer 30 without being directly adjacent to the photovoltaic layer 30, and a gap of at least 2 mm is maintained with the photovoltaic layer 30.
[0036] Next, a filling layer 80 of a transparent material such as polyolefin elastomer (POE) is coated in the packaging area 71 in the packaging layer. The filling layer 80 is in the packaging area, and then aligned with the upper cover plate 60 and fixed with a clamp. The upper cover plate 60 corresponds to the line end 51 of the electrode wire 50, which is exposed and not covered. Therefore, there is an exposed area 61 in a hollow area, or the upper cover plate 60 is not completely corresponding or asymmetrical to the lower cover plate 10, so that a part of the lower cover plate 10 remains exposed, so that the line end 51 of the electrode wire 50 can be attached to the lower cover plate 10 and exposed outside the packaging area 71.
[0037] Then it is placed in a vacuum heating packaging furnace for packaging. The packaging furnace is first evacuated to make the pressure in the cavity lower than 10 -3 torr, and then heated. The heating temperature can be controlled at 100-150°C without damaging the photovoltaic layer material. The sealing is continued for about 30 minutes, and then the packaging furnace is returned to room temperature. After the vacuum is broken, the finished packaged photovoltaic element is taken out. In this figure, the thickness of the packaging layer 70 can be 10μm to 1000μm. In this figure, the packaging layer 70 is glass glue, polyurethane (PU), ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB) or polyimide (PIB). In this figure, the filling layer 80 is a transparent filler, and the transparent filler is a polyolefin elastomer (POE), an ionomer, ethylene-vinyl acetate (EVA) or polyvinyl butyral (PVB).
[0038] Alternatively, the semi-finished product covered with the upper cover plate 60 is fixed by a clamp after alignment, and then placed in a vacuum packaging furnace for packaging. The packaging furnace is first evacuated to make the air pressure in the cavity lower than 10 -3torr, and then the encapsulation layer is laser-heated externally to solidify the encapsulation layer 70 and connect the upper cover plate 60 and the lower cover plate 10, and the air is evacuated at the same time without damaging the material of the photovoltaic layer 30. After encapsulation, the vacuum is broken and the finished encapsulated photovoltaic element is taken out. In this figure, the upper cover plate 60 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers Ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP).
[0039] See also Figure 5 , 6 , is a side cross-sectional view of a semi-finished solar cell according to a second embodiment of the present invention and Figure 5 As shown in the figure: this embodiment and Figure 1 to Figure 4 The first embodiment is substantially the same, except that a dispensing machine is used to apply the encapsulation coating to the periphery of the lower cover plate 10 and to expose the semicircular notches 72 of the two wire ends 51 of the two electrode wires 50, and a semicircular end edge notch 62 is provided on the end edge of one end of the upper cover plate 60 corresponding to the semicircular notch 72 to expose the two wire ends 51.
[0040] In summary, the solar cell packaging structure of the utility model changes the electrode wire 50 to be output from one side of the upper cover plate 60 and the lower cover plate 10, making full use of the space utilization of the non-photovoltaic area in the packaging area 71, which can be beneficial to the structural configuration application requirements of the corresponding matching circuit board. In addition, the filling layer 80 is arranged in the packaging area 71 to strengthen the structural stress in the packaging area 71, and also has the effect of blocking water and gas, and the selection of materials for the packaging glue can be more diversified. The utility model structure provides many effects such as structural safety, reliability, durability and good weather resistance.
[0041] This specific implementation is a preferred implementation of the utility model, and is not intended to limit the protection scope of the utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the utility model should be included in the protection scope of the utility model.
Claims
1. A solar cell packaging structure, characterized in that: include: Lower the cover; a lower conductive layer, which is disposed on one side of the lower cover plate, and the lower conductive layer is composed of a plurality of lower electrode circuits; a photovoltaic layer, which is composed of a plurality of photovoltaic units, wherein the photovoltaic units are arranged on the lower electrode circuit so that a gap is formed between each of the photovoltaic units; An upper conductive layer, which is composed of a plurality of upper electrode circuits, wherein the upper electrode circuits are disposed on one side of the photovoltaic unit and are electrically connected to the lower electrode circuits; At least one electrode wire, which is electrically connected to the lower conductive layer or the upper conductive layer, and each of the electrode wires has a wire end; a packaging layer, which is arranged on the periphery of the lower cover plate and on the electrode wire, so that the wire end of the electrode wire is exposed; an upper cover plate, which is disposed on the packaging layer, wherein the upper cover plate does not completely correspond to the lower cover plate, so that a portion of the lower cover plate is left exposed, so that an exposed area is formed between the upper cover plate and the lower cover plate, and the wire end of the electrode wire is attached to the lower cover plate and exposed outside the packaging area, so that the upper cover plate does not cover the wire end exposed outside the packaging area; A filling layer is disposed in the packaging area.
2. A solar cell packaging structure as claimed in claim 1, characterized in that: The wire end of the electrode wire is exposed in the packaging layer outside the packaging area in the form of a semicircular notch.
3. A solar cell packaging structure as claimed in claim 2, characterized in that: One end of the upper cover plate has a semicircular end edge notch corresponding to the semicircular notch.
4. A solar cell packaging structure as claimed in claim 1, characterized in that: The upper cover plate and the lower cover plate are glass substrates or plastics.
5. The solar cell packaging structure according to claim 1, characterized in that: The photovoltaic layer has a thickness of 0.1 μm to 500 μm.
6. The solar cell packaging structure according to claim 1, characterized in that: The photovoltaic layer has a thickness of 10 μm to 150 μm.
7. The solar cell packaging structure according to claim 1, characterized in that: The photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin oxide thin film solar cell, a silicon thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell.
8. The solar cell packaging structure according to claim 1, characterized in that: The photovoltaic unit is stacked in sequence by an electron transfer layer, an active layer and a hole transfer layer.
9. The solar cell packaging structure according to claim 1, characterized in that: The photovoltaic unit is stacked in sequence by a hole transfer layer, an active layer and an electron transfer layer.
10. The solar cell packaging structure according to claim 1, characterized in that: The filling layer is a transparent filling material.
11. The solar cell packaging structure according to claim 1, characterized in that: The packaging layer has a thickness of 10 μm to 1000 μm.
12. The solar cell packaging structure according to claim 1, characterized in that: The encapsulation layer is arranged at the periphery of the photovoltaic layer without being directly adjacent to the photovoltaic layer, and maintains a gap of at least 2 mm with the photovoltaic layer.
Citation Information
Cited By
Perovskite solar cell module encapsulation method
TWI940322B
