Chip support and Mini POB lamp bead
The chip bracket and Mini POB lamp bead design addresses glue overflow and light distribution issues by incorporating a groove and reflective layer, enhancing production efficiency and reducing bead count in display modules.
Patent Information
- Application Number
- CN202421036354.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-14
AI Technical Summary
Mini POB lamp beads face issues such as glue overflow during dispensing, uncontrollable light-emitting angles, uneven light intensity distribution, and increased module thickness due to small size and arrangement density, leading to inefficient production and display module requirements for a large number of beads.
A chip bracket with a groove and overflow glue groove design, a phosphor layer, and a reflective layer to manage glue overflow, control light emission angles, and enhance light reflection, combined with a lens structure to optimize light distribution and reduce bead count.
The design prevents glue overflow, increases light-emitting angles, enhances light reflectivity, and reduces the number of beads needed in the display module, improving production efficiency and module thickness.
Smart Images
Figure CN222261113U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of LED packaging, in particular to a chip bracket and a Mini POB lamp bead. Background Art
[0002] With the development of technology, the market demand for products using Mini POB lamp beads is increasing, and the proportion of Mini POB lamp beads used in backlight displays is increasing. Compared with traditional backlight lamp beads, Mini POB lamp beads have been used in a wider range of applications due to their smaller size.
[0003] In the prior art, the existing Mini POB lamp beads are small in size, and glue overflow often occurs during the glue dispensing process, which greatly affects the production efficiency. In addition, the light-emitting angle of the Mini POB lamp beads is small, the light-emitting angle is uncontrollable, the top light intensity is strong, and the side light intensity is weak, which makes the distance between the Mini POB lamp beads and the diaphragm larger, thereby increasing the thickness of the display module using the Mini POB lamp beads, and the arrangement distance between the Mini POB lamp beads is small, so that the display module using the Mini POB lamp beads requires a large number of lamp beads. Utility Model Content
[0004] Based on this, the purpose of the utility model is to provide a chip bracket and a Mini POB lamp bead, which can effectively solve the deficiencies in the above-mentioned prior art.
[0005] A chip bracket comprises a bracket and a groove arranged inside the bracket for accommodating an LED chip, the bracket is made of a material with the property of reflecting light, the LED chip is connected to the bracket through a metal wire, the side wall of the groove is arranged at an angle so that the top of the groove forms a trumpet-shaped opening, the side wall of the groove is connected to the bottom of the groove by an arc, an overflow glue groove is opened on the top of the bracket, the overflow glue groove is arranged around the groove and the bottom of the overflow glue groove is connected to the groove, and the height of the bottom of the overflow glue groove is higher than the height of the metal wire.
[0006] Furthermore, a glue overflow hole is opened at the bottom of the glue overflow groove, and the glue overflow groove is connected to the groove through the glue overflow hole.
[0007] Furthermore, the height of the glue overflow hole close to one end of the groove is higher than the height of the metal wire.
[0008] Furthermore, a gel groove is provided on the top of the bracket, and the gel groove is arranged around the glue overflow groove.
[0009] On the other hand, the utility model also provides a Mini POB lamp bead, which includes a lens and the above-mentioned chip bracket.
[0010] Furthermore, the lens is arranged on the top of the bracket, and a phosphor layer is provided between the lens and the LED chip. The phosphor layer is arranged in the groove and wraps the LED chip and the metal wire, and the height of the phosphor layer is between the metal wire and the groove.
[0011] Furthermore, the lens includes a light incident surface, a light emitting surface, and an attachment surface attached to the top of the bracket, the light incident surface covers the phosphor layer, and the maximum diameter of the attachment surface is between the maximum diameter of the gel groove and the minimum diameter of the gel groove.
[0012] Furthermore, a reflective layer for reflecting and distributing light is provided between the light incident surface and the light emitting surface, and the reflective layer is provided in a spherical or ellipsoidal spherical surface.
[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: by setting the overflow glue groove around the groove and the bottom of the overflow glue groove being connected to the groove, during the glue dispensing process, the glue can overflow from the groove into the overflow glue groove, and the atmospheric pressure will make the height of the glue in the groove and the overflow glue groove flush, so that the height of the glue can be observed through the overflow glue groove to prevent the glue from overflowing; by setting the height of the bottom of the overflow glue groove higher than the height of the metal wire, so that when the glue overflows from the groove to the bottom of the overflow glue groove, the glue dispensing can be stopped, which is convenient for the staff to judge the glue dispensing situation and increase the work efficiency; by setting the side wall of the groove at an angle and forming a trumpet-shaped opening at the top of the groove, the light-emitting angle of the LED chip is increased, and by setting the side wall of the groove and the bottom of the groove to be connected in an arc, the light reflection angle of the LED chip toward the connection between the side wall of the groove and the bottom of the groove is increased, thereby increasing the arrangement distance between the Mini POB lamp beads in the display module, so that the display module using the Mini POB lamp beads needs to use Mini The number of POB lamp beads is reduced; the bracket is made of a material with light-reflecting properties to increase the reflectivity of the light emitted by the LED chip toward the inside of the groove, thereby increasing the luminous intensity; BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic cross-sectional view of the overall structure of the chip bracket in the first embodiment of the utility model;
[0015] Figure 2 for Figure 1 A magnified schematic diagram of the local A in the middle;
[0016] Figure 3 This is a schematic cross-sectional view of the overall structure of the Mini POB lamp bead in the second embodiment of the present utility model;
[0017] Description of main component symbols:
[0018]
[0019]
[0020] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0024] Embodiment 1
[0025] See also Figure 1 to Figure 2 The chip bracket in the first embodiment of the utility model includes a bracket 10 and a groove 11 arranged inside the bracket 10 for accommodating an LED chip 20. The bracket 10 is made of a material with the property of reflecting light. The LED chip 20 is connected to the bracket 10 through a metal wire 30. The side wall of the groove 11 is inclined so that the top of the groove 11 forms a trumpet-shaped opening. The side wall of the groove 11 is connected to the bottom of the groove 11 by an arc. A glue overflow groove 12 is opened at the top of the bracket 10, and a glue overflow hole 13 is opened at the bottom of the glue overflow groove 12. The glue overflow groove 12 is arranged around the groove 11 and the glue overflow hole 13 is connected to the groove 11, and the height of the bottom of the glue overflow groove 12 is higher than the height of the glue overflow hole 13 close to the groove 11. The height is higher than the height of the metal wire 30.
[0026] It can be understood that, by opening a glue overflow hole 13 at the bottom of the glue overflow groove 12 and the glue overflow hole 13 is connected to the groove 11, so that during the glue dispensing process, the glue can overflow from the groove 11 through the glue overflow hole 13 into the glue overflow groove 12, and the atmospheric pressure will make the height of the glue in the groove 11 and the glue overflow groove 12 flush, and then the height of the glue can be observed through the glue overflow groove 12 to prevent the glue from overflowing; by setting the height of the bottom of the glue overflow groove 12 higher than the height of the glue overflow hole 13 close to the groove 11 and higher than the height of the metal wire 30, so that when the glue When the glue overflows from the groove 11 to the bottom of the glue overflow groove 12 through the glue overflow hole 13, the glue dispensing can be stopped, which is convenient for the staff to judge the glue dispensing situation and increase the work efficiency; by setting the side wall of the groove 11 to be inclined and forming a trumpet-shaped opening at the top of the groove 11, the light-emitting angle of the LED chip 20 can be increased, and by setting the side wall of the groove 11 and the bottom of the groove 11 to be connected in an arc, the light reflection angle of the LED chip 20 toward the connection between the side wall of the groove 11 and the bottom of the groove 11 can be increased, thereby increasing the arrangement distance between the Mini POB lamp beads in the display module, so that the number of Mini POB lamp beads required for the display module using the Mini POB lamp beads is reduced; by making the bracket 10 of a material with the property of reflecting light, the reflectivity of the light emitted by the LED chip 20 toward the inside of the groove 11 can be increased, thereby increasing the luminous intensity.
[0027] Embodiment 2
[0028] See also Figure 3 , shown is the Mini POB lamp bead in the second embodiment of the present utility model, including a lens 40 and the chip bracket in the first embodiment, the lens 40 is arranged at the top of the bracket 10, and a phosphor layer 50 is arranged between the lens 40 and the LED chip 20, the phosphor layer 50 is arranged in the groove 11 and wraps the LED chip 20 and the metal wire 30, and the height of the phosphor layer 50 is between the metal wire 30 and the groove 11, the lens 40 includes a light incident surface, a light emitting surface and an attachment surface attached to the top of the bracket 10, the light incident surface covers the phosphor layer 50, the maximum diameter of the attachment surface is between the maximum diameter of the gel groove 14 and the minimum diameter of the gel groove 14, and a reflective layer 41 for reflecting light distribution is arranged between the light incident surface and the light emitting surface, and the reflective layer 41 is arranged in a spherical or elliptical spherical surface.
[0029] It can be understood that by setting a reflective layer 41 for reflecting light distribution between the light incident surface and the light emitting surface, the reflective layer 41 is set in a spherical or ellipsoidal surface, so that the top light intensity of the Mini POB lamp bead is reduced by the reflective layer 41, and the top light intensity is reflected to increase the side light intensity, thereby reducing the distance between the Mini POB lamp bead and the diaphragm, and reducing the thickness of the display module using the Mini POB lamp bead.
[0030] Furthermore, a gel groove 14 is provided on the top of the bracket 10 , and the gel groove 14 is arranged around the overflow glue groove 12 .
[0031] It can be understood that by providing the gel groove 14 , the mold of the lens can be placed in the gel groove 14 , thereby increasing the stability and convenience of manufacturing the lens 40 .
[0032] In summary, the chip bracket and Mini POB lamp beads in the above-mentioned embodiments of the utility model: by setting the overflow glue groove around the groove and the bottom of the overflow glue groove connected to the groove, so that during the glue dispensing process, the glue can overflow from the groove into the overflow glue groove, and the atmospheric pressure will make the height of the glue in the groove and the overflow glue groove flush, and then the height of the glue can be observed through the overflow glue groove to prevent the glue from overflowing; by setting the height of the bottom of the overflow glue groove higher than the height of the metal wire, so that when the glue overflows from the groove to the bottom of the overflow glue groove, the glue dispensing can be stopped, which is convenient for the staff to judge the glue dispensing situation and increase the work efficiency; by setting the side wall of the groove at an angle and forming a trumpet-shaped opening at the top of the groove, the light-emitting angle of the LED chip is increased, and by setting the side wall of the groove and the bottom of the groove to be connected in an arc, the light reflection angle of the LED chip toward the connection between the side wall of the groove and the bottom of the groove is increased, thereby increasing the arrangement distance between the Mini POB lamp beads in the display module, so that the display module using the Mini POB lamp beads needs to use Mini The number of POB lamp beads is reduced; the bracket is made of a material with light-reflecting properties to increase the reflectivity of the light emitted by the LED chip toward the inside of the groove, thereby increasing the luminous intensity.
[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A chip holder, characterized in that: It includes a bracket and a groove arranged inside the bracket for accommodating an LED chip, the bracket is made of a material with the property of reflecting light, the LED chip is connected to the bracket through a metal wire, the side wall of the groove is arranged at an angle so that the top of the groove forms a trumpet-shaped opening, the side wall of the groove is connected to the bottom of the groove by an arc, an overflow glue groove is opened on the top of the bracket, the overflow glue groove is arranged around the groove and the bottom of the overflow glue groove is connected to the groove, and the height of the bottom of the overflow glue groove is higher than the height of the metal wire.
2. The chip holder according to claim 1, characterized in that: A glue overflow hole is provided at the bottom of the glue overflow groove, and the glue overflow groove is connected to the groove through the glue overflow hole.
3. The chip holder according to claim 2, characterized in that: The height of the glue overflow hole close to one end of the groove is higher than the height of the metal wire.
4. The chip holder according to claim 1, characterized in that: A gel groove is also provided on the top of the bracket, and the gel groove is arranged around the overflow glue groove.
5. A Mini POB lamp bead, characterized in that: The invention comprises a lens and the chip holder according to any one of claims 1 to 4.
6. The Mini POB lamp bead according to claim 5, characterized in that: The lens is arranged on the top of the bracket, a phosphor layer is arranged between the lens and the LED chip, the phosphor layer is arranged in the groove and wraps the LED chip and the metal wire, and the height of the phosphor layer is between the metal wire and the groove.
7. The Mini POB lamp bead according to claim 6, characterized in that: The lens includes a light incident surface, a light emitting surface and an attachment surface attached to the top of the bracket, the light incident surface covers the phosphor layer, and the maximum diameter of the attachment surface is between the maximum diameter of the gel groove and the minimum diameter of the gel groove.
8. The Mini POB lamp bead according to claim 7, characterized in that: A reflective layer for reflecting and distributing light is provided between the light incident surface and the light emitting surface, and the reflective layer is provided in a spherical or elliptical spherical shape.