High-airtightness LED lamp bead

Abstract

The utility model provides a high air tightness LED lamp bead, which comprises a substrate, a first bonding pad fixedly arranged at the central position of the substrate and second bonding pads uniformly arranged at the periphery of the first bonding pad, the first bonding pad is connected with three monochromatic chips which are arranged at intervals through conductive adhesive, and the first bonding pad is connected with the second bonding pad through conductive adhesive. The number of the second bonding pads is the same as that of the single-color chips, the three single-color chips are connected with the corresponding second bonding pads through bonding wires respectively, the three single-color chips are annularly distributed along the center of the substrate, printing ink areas are arranged at the positions of four corners of the substrate, and the printing ink areas are connected with the single-color chips through bonding wires. According to the utility model, the risk of chip burn caused by water vapor infiltration is avoided, and the phenomenon of chip metal migration is effectively avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lamp beads, and specifically relates to a high-airtightness LED lamp bead. Background Art

[0002] Existing small-pitch LED devices use a flat BT substrate as a bracket. The substrate is divided into a single-layer board with front and back circuits. The front circuit is used to bind the light-emitting chip and realize electrical interconnection. The back circuit is used to weld with the LED display module PCB. The front and back circuits are connected and conducted through through holes. The front circuit of the substrate includes three monochrome chips, a first pad, a second pad, bonding wires, and packaging glue arranged above the monochrome chips. The red monochrome chip is fixed on the first pad with conductive glue, and the blue and green monochrome chips are fixed on the corresponding first pad with insulating glue or silver glue. The monochrome chips are connected to the second pads respectively through bonding wires. The specific structure is as follows: Figure 1 As shown, the three three-color chips are arranged vertically in a line. After molding and cutting processes, they are lamp beads that can emit RGB three-primary color light. During the use of small-pitch LED screens, airtightness issues have always been a common problem of existing small-pitch LED devices. Since the three single-color chips are arranged in a line, the functional area of ​​the chip is closer to the edge of the lamp bead. In nature, water vapor can easily enter the small-pitch LED device, causing the small-pitch LED device to fail easily, resulting in poor display effects such as caterpillars on the small-pitch LED screen, affecting the viewing effect. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a high airtightness LED lamp bead to solve the problems in the above background technology.

[0004] The utility model provides the following technical solution: a high-airtightness LED lamp bead, comprising a substrate, a first solder pad fixed at the center of the substrate, and a plurality of second solder pads evenly arranged around the first solder pad, three separated monochrome chips connected to the first solder pad by conductive glue, the number of the second solder pads is the same as the number of the monochrome chips, the three monochrome chips are respectively connected to the corresponding second solder pads by bonding wires, the three monochrome chips are distributed in a ring shape along the center of the substrate, and ink areas are provided at the four corner points of the substrate.

[0005] Compared with the prior art, the beneficial effects of the present application are as follows: the present application replaces all the original RGB chips with monochrome chips of a single-electrode structure, and changes the monochrome LED chips that were distributed in a straight line on the solid crystal functional area on the substrate to a petal-shaped arrangement, that is, a ring-shaped distribution, thereby expanding the distance between the solid crystal functional area and the edge of the lamp bead, effectively extending the water vapor infiltration path and increasing the area of ​​the packaging glue and the substrate area, thereby improving the bonding type of the packaging glue and the substrate, thereby avoiding the risk of chip burns caused by water vapor infiltration, and at the same time, changing the existing dual-electrode chip to a single-electrode chip also effectively avoids the chip metal migration phenomenon.

[0006] Preferably, the three single-color chips are respectively a red LED chip, a blue LED chip and a green LED chip.

[0007] Preferably, a plurality of electroplating leads are fixedly provided on the periphery of the first pad, and one of the electroplating leads is connected to one of the ink areas.

[0008] Preferably, the substrate is made of copper material.

[0009] Preferably, the second pad is connected to the ink area.

[0010] Preferably, pins are provided at four corner points of a side of the substrate facing away from the monochrome chip.

[0011] Preferably, a through hole is provided on one side of the pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0013] Figure 1 This is a front structural diagram of an LED lamp bead in the prior art;

[0014] Figure 2 A front structural diagram of a high-airtightness LED lamp bead provided in an embodiment of the utility model;

[0015] Figure 3 A partial cross-sectional structural diagram of a single monochrome chip provided in an embodiment of the utility model;

[0016] Figure 4 This is a back structural diagram of a high-airtightness LED lamp bead provided in an embodiment of the utility model.

[0017] Description of reference numerals:

[0018]

[0019] The present invention will be further described below in conjunction with the accompanying drawings and accompanying drawings. DETAILED DESCRIPTION

[0020] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0021] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0023] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0024] In one embodiment of the present invention, Figure 2 , Figure 3As shown, a high-airtightness LED lamp bead comprises a substrate 1, a first solder pad 6 fixed at the center of the substrate 1, and a plurality of second solder pads 9 uniformly arranged at the periphery of the first solder pad 6, three separated single-color chips 3 are connected to the first solder pad 6 through a conductive adhesive 7, the number of the second solder pads 9 is the same as the number of the single-color chips 3, the three single-color chips 3 are respectively connected to the corresponding second solder pads 9 through bonding wires 5, the three single-color chips 3 are distributed in a ring shape along the center of the substrate 1, and ink areas 8 are arranged at the four corner points of the substrate 1;

[0025] Specifically, the substrate 1 is a carrier for carrying the entire LED lamp bead structure. At the center position of the upper surface of the substrate 1, a first soldering pad 6 is provided along the center position of the substrate 1. Three monochrome chips 3 are provided on the first soldering pad 6 and are distributed in a ring along the center position of the first soldering pad 6. The three monochrome chips 3 are close to each other and leave a certain gap. In the present application, the three monochrome chips 3 are all unipolar LED chips. At the same time, the same number of second soldering pads 9 as the monochrome chips 3 are provided on the periphery of the first soldering pad 6, that is, three second soldering pads 9 are provided. Solder beads are provided on the three monochrome chips 3. The solder beads are connected to the corresponding second soldering pads 9 through bonding wires 5, and the polarity of the first soldering pad 6 is opposite to that of the second soldering pad 9. At the same time, the area where the first soldering pad 6 is located is a solid crystal area, which can also be called a solid crystal functional area. The area where the second soldering pad 9 is located is a wire bonding area, and the remaining area on the substrate 1 is an insulating area.

[0026] In the present application, all the original RGB chips are replaced with monochrome chips with a single-electrode structure, and the monochrome LED chips that were distributed in a line on the solid crystal functional area on the substrate 1 are changed to a petal-shaped arrangement, that is, a ring-shaped distribution, thereby expanding the distance between the solid crystal functional area and the edge of the lamp bead, effectively extending the water vapor penetration path and increasing the area of ​​the packaging glue 4 and the substrate 1 area, thereby improving the bonding type of the packaging glue 4 and the substrate 1, thereby avoiding the risk of chip burns caused by water vapor penetration. At the same time, changing the existing dual-electrode chip to a single-electrode chip also effectively avoids the chip metal migration phenomenon.

[0027] In this embodiment, the three monochromatic chips 3 are respectively a red LED chip, a blue LED chip and a green LED chip;

[0028] Specifically, red, green and blue LED chips are commonly used light-emitting chips for lamp beads in the prior art.

[0029] In this embodiment, a plurality of electroplating leads 10 are fixedly provided on the periphery of the first pad 6 , and one of the electroplating leads 10 is connected to one of the ink areas 8 .

[0030] In this embodiment, the substrate 1 is made of copper material.

[0031] In this embodiment, the second pad 9 is connected to the ink area 8;

[0032] Specifically, in the present application, four ink areas 8 are provided, one of the ink areas 8 is connected to one of the electroplating leads 10 , and the other three ink areas 8 are connected to three second pads 9 , respectively.

[0033] like Figure 4 As shown, in this embodiment, pins 2 are provided at four corner points of the substrate 1 facing away from the monochrome chip 3;

[0034] Specifically, for the lamp bead, the circuit on the upper surface of the substrate 1 is called the front circuit, which is used to bind the light-emitting chip, and the circuit on the lower surface of the substrate 1 is called the back circuit, which is used to be welded with the LED display module PCB through the pin 2.

[0035] In this embodiment, a through hole 11 is provided on one side of the pin 2;

[0036] Specifically, by providing the through hole 11 , the front circuit and the back circuit can be connected and conducted through the through hole 11 .

[0037] In summary, the high-airtightness LED lamp beads in the above-mentioned embodiments of the utility model replace all the original RGB chips with monochrome chips of a single-electrode structure, and change the monochrome LED chips distributed in a line on the solid crystal functional area on the substrate 1 to a petal-shaped arrangement, that is, a ring-shaped distribution, thereby expanding the distance between the solid crystal functional area and the edge of the lamp bead, effectively extending the water vapor penetration path and increasing the area of ​​the packaging glue 4 and the substrate 1 area, thereby improving the bonding type of the packaging glue 4 and the substrate 1, thereby avoiding the risk of chip burns caused by water vapor penetration, and at the same time, changing the existing dual-electrode chip to a single-electrode chip also effectively avoids the chip metal migration phenomenon.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high airtight LED lamp bead, characterized in that: It includes a substrate, a first pad fixed at the center of the substrate, and a plurality of second pads evenly arranged around the first pad, the first pad being connected to three separated monochrome chips via conductive adhesive, the number of the second pads being the same as the number of the monochrome chips, the three monochrome chips being connected to corresponding second pads via bonding wires, the three monochrome chips being distributed in a ring shape along the center of the substrate, and ink areas being arranged at the four corner points of the substrate.

2. The high airtightness LED lamp bead according to claim 1, characterized in that: The three single-color chips are respectively a red light LED chip, a blue light LED chip and a green light LED chip.

3. The high airtightness LED lamp bead according to claim 1, characterized in that: A plurality of electroplating leads are fixedly disposed on the periphery of the first pad, and one of the electroplating leads is connected to one of the ink areas.

4. The high airtightness LED lamp bead according to claim 1, characterized in that: The substrate is made of copper material.

5. The high airtightness LED lamp bead according to claim 1, characterized in that: The second pad is connected to the ink area.

6. The high airtightness LED lamp bead according to claim 1, characterized in that: Leads are arranged at four corner points of a side of the substrate facing away from the monochrome chip.

7. The high airtightness LED lamp bead according to claim 6, characterized in that: A through hole is provided on one side of the pin.

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