Package structure
By using a multi-directional thermal conductor in the package structure to fill the internal space of the thermal conduction module, the problem of low heat dissipation efficiency of miniaturized products is solved, and the efficient transfer of heat in multiple directions is achieved, which improves heat dissipation efficiency and extends the use of components. life.
Patent Information
- Application Number
- CN202420620715.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-28
AI Technical Summary
With the miniaturization of products and the high density of internal components, the heat dissipation efficiency is difficult to improve, resulting in heat accumulation and reduced performance and damage problems.
A multi-directional thermal conductor is used to fill the internal space of the thermal conductor module, cover the heat source through the frame and connect it to the heat dissipation module, providing thermal conduction paths in multiple directions to improve heat transfer efficiency.
Through the use of multi-directional thermal conductor, the heat dissipation efficiency is significantly improved, the heat is transferred in multiple directions, the temperature accumulation is reduced, and the service life of the components is extended.
Smart Images
Figure CN222263435U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a packaging structure, and in particular to a packaging structure capable of improving heat dissipation efficiency. Background Art
[0002] With the advancement of technology, the trend of product miniaturization and high density of internal components, the issue of heat dissipation has become particularly important. Once too much heat accumulates inside the product, it will lead to reduced product performance and even damage to components. Utility Model Content
[0003] The utility model relates to a packaging structure, which transmits the heat generated by a heat source to all directions through a multi-directional heat conductor to improve the heat dissipation efficiency.
[0004] The utility model provides a packaging structure, including a circuit board, a heat source, a heat dissipation module and a heat conduction module. The heat conduction module includes a frame and a multi-directional heat conductor. The frame is arranged on the circuit board and covers the heat source. The multi-directional heat conductor fills the internal space of the frame.
[0005] In order to better understand the above and other aspects of the present invention, the following embodiments are specifically described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figure 1 is a three-dimensional diagram of a packaging structure according to an embodiment of the utility model;
[0007] Figure 2 yes Figure 1 Exploded view of the packaging structure;
[0008] Figure 3A and Figure 3B They are drawn from different perspectives. Figure 1 Exploded view of the thermal module;
[0009] Figure 4 is along Figure 1 A cross-sectional view of the cutting line 4-4'. DETAILED DESCRIPTION
[0010] The following will describe in detail various embodiments of the utility model, and will be illustrated with accompanying drawings. In addition to these detailed descriptions, the utility model can also be widely implemented in other embodiments, and any easy replacement, modification, and equivalent changes of the embodiments are included in the scope of the utility model and are subject to the claims. In the description of the specification, in order to give the reader a more complete understanding of the utility model, many specific details and implementation examples are provided; however, these specific details and implementation examples should not be regarded as limitations of the utility model. In addition, well-known steps or components are not described in the details to avoid unnecessary limitations on the utility model.
[0011] Figure 1 is a three-dimensional diagram of a packaging structure 100 according to an embodiment of the present utility model; Figure 2 yes Figure 1 An exploded view of the package structure 100 .
[0012] Please refer to Figure 1 and Figure 2 The packaging structure 100 at least includes a heat conduction module 110, a heat source 120, a heat dissipation module 130 and a circuit board 140. The heat conduction module 110 is disposed between the heat source 120 and the heat dissipation module 130, and is thermally connected to the heat source 120 and the heat dissipation module 130, so that the heat generated by the heat source 120 can be transferred to the heat dissipation module 130 by heat conduction. The heat dissipation module 130 may include a plurality of heat dissipation fins 131, and the heat dissipation fins 131 can increase the surface area in contact with the air. After the heat generated by the heat source 120 is transferred to the heat dissipation module 130, the heat can further pass through the heat dissipation fins 131 to generate heat convection and radiation with the nearby airflow, thereby accelerating the temperature reduction.
[0013] The heat source 120 and the heat conducting module 110 may be disposed on the circuit board 140. The heat source 120 may include one or more heating elements. The present invention takes three heating elements 121, 122, and 123 as an example, but the present invention should not be limited thereto. The heating element may be a chip, including but not limited to a computing module, a memory, and a controller. With the improvement of its computing efficiency, the increase of the vertical / horizontal stacking density of the circuit, and the trend of area / volume miniaturization, the chip is more likely to generate heat and cause a higher temperature. If the heat is not dissipated in time, the device performance will be affected.
[0014] Figure 3A and Figure 3B Draw from different perspectives Figure 1 Please refer to the exploded view of the thermal module 110. Figure 2 , Figure 3A and Figure 3B, the heat-conducting module 110 may include a frame 111 and a multi-directional heat conductor 112. The frame 111 is disposed between the heat source 120 and the heat dissipation module 130. The frame 111 may include a bottom portion 111a and an outer frame portion 111b. The bottom portion 111a has an outer surface 111a1 and an inner surface 111a2 opposite to each other. The outer frame portion 111b is disposed on the inner surface 111a2 of the bottom portion 111a and surrounds the edge of the bottom portion 111a, so that the outer frame portion 111b and the bottom portion 111a together form an inner space S of the frame 111. The heat-conducting module 110 covers the heat source 120 in the inner space S through the bottom portion 111a and the outer frame portion 111b, and the multi-directional heat conductor 112 may fill the inner space S of the frame 111.
[0015] Figure 4 is along Figure 1 Please refer to the section view of the cutting line 4-4'. Figure 4 , the multi-directional heat conductor 112 covers the heat source 120. The multi-directional heat conductor 112 is a horizontal and vertical heat conductor, which can provide heat conduction paths in multiple directions, such as providing heat conduction paths in the horizontal direction (any direction on the XZ plane) and the vertical direction (Y-axis direction), rather than only providing a heat conduction path in a single direction. In one embodiment, each heating element 121, 122, 123 of the heat source 120 can have different heights. With the help of the multi-directional heat conductor 112, heat conduction paths can be provided for the heating elements 121, 122, 123 of different heights at the same time, wherein the multi-directional heat conductor 112 can be a heat dissipation paste. In one embodiment, the heat dissipation paste can be based on silicone paste, and a material with a high thermal conductivity is added to increase the thermal conductivity of the heat dissipation paste, wherein the material with a high thermal conductivity can be aluminum oxide, but is not limited thereto, and a material with a thermal conductivity equivalent to or higher than that of aluminum oxide can also be used. The heat dissipation paste is in liquid or semi-solid state and can fill any uneven gaps between the heating elements 121, 122, 123 at different heights and the frame 111. Since the internal space S of the frame 111 has a certain height on the Y axis, the multi-directional heat conductor 112 filling the internal space S can not only transfer the heat generated by the heating elements 121, 122, 123 at different heights in the vertical direction (Y axis direction), but also transfer the heat in the horizontal direction (any direction on the XZ plane), thereby increasing the surface area of heat conduction to the heat dissipation module 130 to improve the heat dissipation efficiency.
[0016] In one embodiment, the heat conducting module 110 may further include a heat conducting sheet 113. The heat conducting sheet 113 is disposed between the multi-directional heat conducting body 112 and the frame 111. Figure 3B and Figure 4The heat conducting sheet 113 can be attached to the inner surface 111a2 of the bottom portion 111a of the frame 111, and its area can be close to the area of the exposed inner surface 111a2, or substantially equal to the area of the inner surface 111a2. Then, the multi-directional heat conducting body 112 is filled in the remaining inner space S of the frame 111.
[0017] In one embodiment, the heat conductive sheet 113 is a horizontal heat conductive sheet. When the heat conductive sheet 113 receives heat from the multi-directional heat conductor 112 from all directions, a heat conductive path in the horizontal direction (any direction on the XZ plane) can be provided through the large-area heat conductive sheet 113, so that the heat can be evenly diffused to the frame 111. In one embodiment, the heat conductive sheet 113 may include a metal sheet and a graphite sheet, the graphite sheet is arranged between the frame 111 and the metal sheet, and the graphite sheet is attached to the metal sheet, wherein the metal sheet may be a copper foil. The high thermal conductivity of the graphite sheet itself in the horizontal direction and the high thermal conductivity of the copper foil enable the heat to be quickly diffused in the horizontal direction.
[0018] Please refer to Figure 2 and Figure 4 In one embodiment, a thermal interface material 150 may be disposed between the thermally conductive module 110 and the heat dissipation module 130 to improve the speed and / or efficiency of heat conduction. The thermal interface material 150 may include a thermally conductive adhesive. Specifically, the thermal interface material 150 may be coated between the outer surface 111a1 of the bottom portion 111a of the frame 111 of the thermally conductive module 110 and the heat dissipation module 130 to serve as a heat conduction medium between the thermally conductive module 110 and the heat dissipation module 130, but this is not a limitation of the present invention. In another embodiment, the frame 111 of the thermally conductive module 110 may also be in direct contact with the heat dissipation module 130.
[0019] The frame 111 may be a plastic frame or a metal frame. In one embodiment, the frame 111 may be a heat-conductive plastic frame, and the heat-conductive plastic used in the heat-conductive plastic frame may be a mixture of plastic mixed with graphite and / or metal, so that it has a higher thermal conductivity than general plastics.
[0020] In the utility model, Figure 3A and Figure 3B As shown, the heat conduction module 110 defines a heat conduction frame through a frame 111, and then fills the internal space S of the frame 111 with a multi-directional heat conductor 112 to serve as a medium for horizontal and vertical heat transfer, thus forming a modular structure that is conducive to mass production. Figure 4 As shown, this modular structure can be applicable to various types of heat sources 120, such as various heating elements 121, 122, 123 with different heights, and the heat generated by the heat source 120 is transferred to all directions through the multi-directional heat conductor 112 to improve the heat dissipation efficiency.
[0021] In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. A person skilled in the art of the present invention may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the claims.
Claims
1. A packaging structure, characterized in that: The package structure includes: a circuit board; a heat source, disposed on the circuit board; a heat dissipation module; and A heat conduction module includes a frame and a multi-directional heat conductor. The frame is arranged on the circuit board and covers the heat source. The multi-directional heat conductor fills the inner space of the frame.
2. The packaging structure according to claim 1, characterized in that: The heat source comprises one or more chips.
3. The packaging structure according to claim 1, characterized in that: The multi-directional heat conductor is a heat conductor in horizontal and vertical directions.
4. The packaging structure according to claim 1, characterized in that: The heat conduction module further includes a heat conduction sheet disposed between the multi-directional heat conductor and the frame.
5. The packaging structure according to claim 4, characterized in that: The heat conducting sheet is a horizontal heat conducting sheet.
6. The packaging structure according to claim 4, characterized in that: The heat conducting sheet includes a metal sheet and a graphite sheet.
7. The packaging structure according to claim 6, characterized in that: The graphite sheet is arranged between the frame and the metal sheet.
8. The packaging structure according to claim 1, characterized in that: The multi-directional heat conductor is heat dissipation paste.
9. The packaging structure according to claim 1, characterized in that: The frame is a heat-conducting plastic frame or a metal frame.
10. The packaging structure according to claim 1, wherein: The heat dissipation module includes a plurality of heat dissipation fins.