Heat exchange system for data center
By using condensed water to perform secondary cooling in the data center, the high energy dissipation and heat dissipation problem of data centers is solved, the low-cost cooling effect is achieved, and the energy utilization efficiency and equipment reliability are improved.
Patent Information
- Application Number
- CN202422838035.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Data centers have high energy consumption problems during the heat dissipation process, and traditional air-conditioning systems are difficult to effectively reduce operating costs.
A heat exchange system is designed, and the condensate generated by the refrigeration device is transported to the cooling device through a water pump. The cooling device is arranged above the unit, and the condensate is used for secondary cooling. Combined with the control of temperature, pressure and liquid level sensors, condensation is achieved. Efficient use of water.
It reduces the operating costs of data centers, improves energy utilization efficiency, extends the service life of equipment, reduces the incidence of failures, and reduces the dependence on traditional refrigeration devices.
Smart Images

Figure CN222263499U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of data center equipment, and in particular to a heat exchange system for a data center. Background Art
[0002] With the rapid development of information technology, the scale and density of data centers continue to increase. Nowadays, a large number of units, storage devices and network devices will continuously generate a lot of heat during high-speed operation. If this heat cannot be dissipated in a timely and effective manner, it will have a serious impact on the performance and reliability of the equipment, and may even cause equipment failure.
[0003] In the cooling method of data centers, the traditional air conditioning system heat dissipation method is generally used for heat dissipation. This heat dissipation method has high energy consumption and increases the operating cost of the data center.
[0004] Therefore, how to dissipate heat in data centers at low cost is an urgent problem to be solved. Utility Model Content
[0005] The present application provides a heat exchange system for a data center, which is used to dissipate heat in the data center on the basis of improving energy utilization efficiency and reducing the operating costs of the data center for heat dissipation.
[0006] In a first aspect, the present application provides a heat exchange system for a data center, comprising: a unit, a refrigeration device, a water storage device, a water pump, and a cooling device;
[0007] The condensed water pipe of the refrigeration device is connected to the water storage device, and the condensed water generated by the refrigeration device is transported to the water storage device through the condensed water pipe;
[0008] The water pump is arranged between the water storage device and the cooling device, and is used to transport the condensed water in the water storage device to the cooling device;
[0009] The cooling device is arranged above the unit, and uses the condensed water to cool the unit.
[0010] In one implementation, the cooling device is a cooling coil.
[0011] In one implementation, the heat exchange system further includes a temperature sensor;
[0012] The temperature sensor is arranged above the unit, and / or the temperature sensor is arranged at a preset position of the cooling device.
[0013] In one implementation, the heat exchange system further includes a control device;
[0014] The temperature sensor and the water pump are respectively connected to the control device, and the control device is used to control the opening or closing of the water pump according to the temperature of the temperature sensor.
[0015] In one implementation, the heat exchange system further includes an electric valve;
[0016] The electric valve is arranged between the cooling device and the water pump, and the electric valve is used to control the closing or opening of the water inlet pipe of the cooling device;
[0017] The electric valve is connected to the control device.
[0018] In one implementation, the heat exchange system further includes a pressure sensor;
[0019] The pressure sensor is arranged between the water pump and the cooling device;
[0020] The pressure sensor is connected to the control device.
[0021] In one implementation, the water storage device includes a liquid level sensor therein;
[0022] The liquid level sensor is used to detect the liquid level of condensed water in the water storage device;
[0023] The liquid level sensor is connected to the control device.
[0024] In one implementation, the refrigeration device forms a cold channel and a hot channel between the plurality of units, the channel through which the cold air generated by the refrigeration device flows is the cold channel, and the channel through which the hot air generated by the units flows is the hot channel.
[0025] In one implementation, the cooling device is disposed above each of the cold channels.
[0026] In one implementation, a water collecting pan is provided below the cooling device.
[0027] The heat exchange system for a data center provided by the present application includes: a unit, a refrigeration device, a water storage device, a water pump and a cooling device; the condensation water pipe of the refrigeration device is connected to the water storage device, and the condensation water generated by the refrigeration device is transported to the water storage device through the condensation water pipe; the water pump is arranged between the water storage device and the cooling device, and the water pump is used to transport the condensation water in the water storage device to the cooling device; the cooling device is arranged above the unit, and the cooling device uses the condensation water to cool the hot air generated by the unit. If the condensation water of the refrigeration device is not used, it will usually be directly discharged. Through the arrangement of the present application, the condensation water is reasonably used to perform secondary cooling of the data center, thereby reducing the temperature of the data center and improving the energy utilization efficiency, thereby reducing the operating cost of the data center. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0029] Figure 1 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 1 ;
[0030] Figure 2 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 2 ;
[0031] Figure 3 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 3 ;
[0032] Figure 4 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 4 ;
[0033] Figure 5 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 5 ;
[0034] Figure 6 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 6 ;
[0035] Figure 7 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 7 ;
[0036] Figure 8 A schematic diagram of the connections within the heat exchange system provided in this application;
[0037] Fig. 9A schematic cross-sectional view of a cooling coil provided in this application.
[0038] Description of reference numerals:
[0039] 10-unit; 20-refrigeration device; 30-water storage device; 301-liquid level sensor; 40-water pump; 50-cooling device; 502-water collection tray; 60-temperature sensor; 70-control device; 80-electric valve; 90-pressure sensor.
[0040] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0041] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0042] There are a large number of units in the data center, so the heat dissipation of the data center is very important. The traditional heat dissipation method is to dissipate heat through air conditioning, which often consumes a lot of energy.
[0043] In view of the above problems, considering that the air conditioners and other refrigeration devices in the data center will generate a large amount of condensed water every day, and the temperature of the condensed water is lower than that of the normal temperature water, the condensed water can be reused as a cold source to cool the data center and further improve the energy utilization efficiency. Based on this, the present application proposes a heat exchange system for a data center, which places the cold source of condensed water above the unit. In this arrangement, the hot air generated by the unit will rise and meet the set cold source for heat exchange, and the generated cold air will sink and flow, so as to achieve the purpose of cooling the data center.
[0044] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0045] Figure 1 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 1 ,like Figure 1As shown, the heat exchange system for a data center includes: a unit 10, a refrigeration device 20, a water storage device 30, a water pump 40 and a cooling device 50; wherein, the number of the units 10 can be multiple, and the number of the cooling devices 50 can also be multiple.
[0046] The condensed water pipe of the refrigeration device 20 is connected to the water storage device 30, and the condensed water generated by the refrigeration device 20 is transported to the water storage device 30 through the condensed water pipe. The condensed water generated by the refrigeration device is lower in temperature than ordinary tap water and can be used as a cold source for secondary cooling. Therefore, the condensed water generated by the refrigeration device is collected and collected in the water storage device 30 through the condensed water pipe.
[0047] The water pump 40 is disposed between the water storage device 30 and the cooling device 50, and is used to transport the condensed water in the water storage device 30 to the cooling device 50. The water pump 40 provides power for the water supply flow of the condensed water, so that it flows into the cooling device 50. The water pump 40 can be manually turned on by the user, or automatically turned on by the controller according to the execution logic.
[0048] The cooling device 50 is arranged above the unit 10, and the cooling device 50 uses condensed water to cool the hot air generated by the unit in the data center. The hot air generated by the unit will rise when it is working. Placing the cooling device above the unit can increase the probability of heat exchange between the cooling device and the hot air, and improve the utilization efficiency of condensed water.
[0049] In some embodiments, the condensed water flowing out of the cooling device 50 is discharged through a drain port.
[0050] In some embodiments, the refrigeration device 20 of the data center includes at least one of the following: an air conditioner, a constant humidity machine, and a cold air machine.
[0051] In some embodiments, the cooling device 50 is a cooling coil, and the condensed water flows in the cooling coil, which can directly contact the hot air and quickly take away the heat, thereby effectively reducing the hot spot temperature. Compared with traditional air conditioning systems, cooling by cooling disks has lower energy consumption. The cooling disk is small in size and light in weight, and can be flexibly installed at the hot spot position of the hot channel. There is no need for large-scale modification of the existing structure of the data center, and it is very convenient for both installation and maintenance. A water collection tray is installed under the coil to prevent condensed water from dripping onto the unit, and to prevent the water pipe from bursting and causing the condensed water in the pipe to drip onto the unit.
[0052] If condensed water is not utilized, it is usually discharged directly. Through the arrangement of this embodiment, the condensed water generated by refrigeration equipment such as air conditioners is used to perform secondary cooling on the data center. By rationally utilizing the condensed water, the temperature of the data center is reduced, and the energy utilization efficiency is improved, thereby reducing the operating costs of the data center.
[0053] The original cooling method of the data center was to cool down only through traditional refrigeration devices. For example, multiple air conditioners were arranged. On the basis of the original layout of the data center, cooling devices for auxiliary refrigeration were arranged. This did not affect the original infrastructure and reduced the difficulty of renovating the pipelines and rearranging them.
[0054] By making full use of the cooling capacity of condensed water, the reliance on traditional refrigeration devices and their cooling capacity can be reduced, thereby reducing equipment costs. At the same time, the condensed water treatment and delivery system is relatively simple, and the maintenance cost is also low. The service life of the equipment is increased. By reducing the operating load of refrigeration devices such as air conditioners, the wear and failure rate of the equipment can be reduced, the service life of the equipment can be extended, and the cost can be further reduced.
[0055] Figure 2 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 2 ,like Figure 2 As shown, the heat exchange system further includes a temperature sensor 60;
[0056] The temperature sensor 60 is disposed above the unit 10 , and is used to detect the temperature above the unit.
[0057] The staff can check the temperature of the temperature sensor, and when the temperature exceeds a certain temperature, the water pump 40 can be manually turned on to allow condensed water to flow into the cooling device 50 to lower the temperature.
[0058] Through the detection of temperature sensors, the temperature above the unit in the data center can be obtained in real time to determine whether the temperature is too high. If the temperature is too high, the cooling device can be turned on in time to cool it down. The cooling device can be turned on manually by the user, or it can be turned on automatically when the temperature reaches a certain preset threshold. In the above embodiment, the water pump is turned on manually by the user according to the temperature. Figure 3 Shows how to automatically turn on the water pump based on temperature. Figure 3 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 3 , the heat exchange system further comprises a control device 70;
[0059] The temperature sensor 60 and the water pump 40 are respectively connected to the control device 70, and the control device 70 is used to control the opening or closing of the water pump according to the temperature of the temperature sensor 60. Specifically, when the temperature exceeds the preset upper temperature limit, the water pump is turned on to cool down; when the temperature is lower than the preset lower temperature limit, the water pump is turned off to allow the water storage device 30 to collect condensed water.
[0060] Figure 4 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 4 ,like Figure 4As shown, the heat exchange system further includes an electric valve 80 ; the electric valve 80 is connected to the control device 70 .
[0061] The electric valve 80 is disposed between the cooling device 50 and the water pump 40 , and is used to control the closing or opening of the water inlet pipe of the cooling device 50 .
[0062] like Figure 4 As shown, a data center is usually equipped with a large number of units, and there are correspondingly multiple cooling devices 50 in the heat exchange system for cooling. Therefore, if you want to control the opening or closing of a cooling device 50 alone, you cannot directly control the water pump 40 to achieve this, so you need to use an electric valve 80. An electric valve is provided between each cooling device 50 and the water pump 40, so that when it is necessary to control a cooling device, the control device can control its electric valve to open or close the operating state of the cooling device.
[0063] In some embodiments, a temperature sensor 60 is provided at a preset position of each cooling device 50, and the temperature sensor corresponds to the electric valve of the cooling device. When the temperature of a temperature sensor is detected to exceed the preset temperature, the corresponding electric valve is controlled to open, thereby controlling the operation of the cooling device. The preset position may be the top, bottom, side, water outlet or water inlet of the cooling device, which is not limited here.
[0064] In this way, when a local hot spot is detected in the data center, the corresponding cooling device above the hot spot can be controlled to turn on for local cooling, saving the use of condensed water and improving resource utilization efficiency.
[0065] Figure 5 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 5 ,like Figure 5 As shown, the heat exchange system further includes a pressure sensor 90 , which is connected to the control device 70 .
[0066] The pressure sensor 90 is arranged between the water pump 40 and the cooling device 50. The pressure sensor is used to detect the pressure in the water pipe. When the water supply pressure increases, the control device will increase the operating frequency of the water pump to ensure that the condensed water can quickly respond to the possible high-load cooling demand with a larger flow rate; when the pressure becomes smaller, the operating frequency of the water pump is reduced accordingly to avoid unnecessary energy consumption and achieve efficient energy utilization and precise regulation.
[0067] In some embodiments, the pressure sensor 90 may also be disposed in the drainage pipeline of the cooling device 50 to detect the pressure of the drainage pipe. When the pressure of the drainage pipe exceeds a threshold, the operating frequency of the water pump is reduced. Figure 5As shown, the pressure sensor 90 can be arranged in the main water pipe after the water pump to detect the pressure of the main water pipe. In some other embodiments, the pressure sensor can also be arranged between the cooling device 50 and the electric valve 80 to detect the pressure of the branch water pipe.
[0068] Multiple cooling devices may each have a drain pipe, or multiple drain pipes may be combined into one drain pipe. When the drain pipes of multiple cooling devices are combined into one drain pipe, the drainage pressure may be too high when multiple cooling devices are working, which may have an adverse effect on the drain pipe or cooling device, such as causing the drain pipe to bulge or backflow into the cooling device. By detecting the pressure of the drain pipe, adjusting the operating frequency of the water pump and adjusting the pipeline flow, it is possible to prevent the adverse effect of excessive drainage pressure on the heat exchange system.
[0069] Through the method of this embodiment, the system can adjust the operating frequency of the water pump according to the real-time pressure changes to adapt to different cooling needs, thereby improving the flexibility and response speed of the system. By reducing unnecessary water pump operating frequency, the system can significantly reduce energy consumption and improve overall energy efficiency. Monitoring drainage pressure helps prevent pipeline damage caused by excessive drainage pressure, protects the safety of cooling devices and pipelines, and extends the service life of the equipment.
[0070] Figure 6 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 6 ,like Figure 6 As shown, the water storage device 30 includes a liquid level sensor 301 therein, and the liquid level sensor 301 is connected to the control device 70 .
[0071] The liquid level sensor 301 is used to detect the liquid level of condensed water in the water storage device.
[0072] The liquid level sensor can directly obtain the liquid level value of the condensed water in the water storage device, and can also set different liquid level monitoring levels in the water storage device, and trigger the corresponding strategy when the liquid level reaches a certain liquid level detection level.
[0073] Exemplarily, the liquid level sensor 301 is provided with three different monitoring levels: high liquid level, low liquid level and limit liquid level. High liquid level: indicates that the water level is normal and the circulating water pump can continue to be used. Low liquid level: indicates that the water level is low and attention may be required, but the circulating water pump can still operate. Limit liquid level: When the water level is too low, in order to avoid idling damage of the circulating water pump and to save energy, the control device controls the water pump to stop running according to the liquid level data.
[0074] The liquid level sensor 301 may be any of the following types of sensors:
[0075] Float type liquid level sensor: uses a float to float on the liquid surface. As the liquid level changes, the height change of the float will cause the mechanical or electronic switch to operate, thereby indicating different liquid level states.
[0076] Capacitive level sensor: detects liquid level through changes in capacitance. The dielectric constant of liquid is different from that of air, so as the liquid level changes, the capacitance value of the sensor will change.
[0077] Ultrasonic liquid level sensor: calculates the liquid level by emitting ultrasonic waves and measuring their reflection time. This method is suitable for non-contact measurement and can monitor liquid level changes without direct contact with the liquid.
[0078] Liquid level pressure sensor: The liquid level is determined based on the static pressure of the liquid. The pressure increases as the liquid level increases. The high liquid level, low liquid level and limit liquid level are determined by the set pressure value.
[0079] Optionally, the water storage device also includes a warning device on the outside, which can be a speaker or a display screen. When the liquid level reaches a certain threshold, the user can be fed back information through the warning device and other means so that timely measures can be taken.
[0080] The liquid level in the water storage device is detected by a liquid level sensor, and then the water pump is controlled to prevent idling caused by low water level and protect the water pump.
[0081] By real-time monitoring of parameters such as room temperature and condensate level, the operating status of the circulating water pump and the flow of condensate can be automatically adjusted to ensure that hot spots are cooled promptly and effectively. This improves the stability and reliability of the system. Intelligent control logic can automatically adjust system operating parameters according to actual conditions, avoiding system failures caused by human operating errors or environmental changes, and improving the stability and reliability of the system.
[0082] Figure 7 A schematic diagram of the structure of the heat exchange system for a data center provided in this application Figure 7 ,like Figure 7 As shown, in a data center, cold channels and hot channels are formed between multiple units through static pressure chambers. The static pressure chambers are arranged in the floor channels of the data center, which can effectively guide the cold air generated by the refrigeration device to flow from the floor channels to the middle of the units, ensuring that the cold air reaches the areas that need cooling.
[0083] The channel where the cold air generated by the refrigeration device flows is the cold channel, and the channel where the hot air generated by the unit flows is the hot channel. A cooling device is installed above each cold channel. The hot air generated by the unit rises from the hot channel and is cooled by the cooling device above the cabinet. The generated cold air falls from the cold channel, thereby cooling the unit, thereby forming an air flow and promoting heat exchange.
[0084] Through such an arrangement, a cooling device is installed above the cold channel of each unit. Through the measurement of the temperature sensor, the condensed water can be accurately delivered to the top of the hot spot area of the data center, ensuring that the condensed water directly acts on the parts that need cooling, avoiding energy waste and achieving rapid cooling.
[0085] The design of the cold channel and hot channel allows the cold air and hot air to form a good flow path, promoting the effective exchange of heat. Hot air rises from the hot channel and cold air falls from the cold channel, forming a stable air flow and enhancing the efficiency of heat transfer. Placing the cooling device above the unit effectively utilizes the space of the data center, improves the overall compactness of the cooling system, and reduces the cost of infrastructure construction and maintenance.
[0086] In some other embodiments, the cooling device may be disposed directly above the hot channel to directly cool the hot air.
[0087] The cooling device directly cools the flowing hot air, which can quickly reduce the temperature of the hot air and improve the cooling efficiency. This direct contact cooling method reduces the residence time of the hot air and quickly removes the heat. In addition, it can also reduce the temperature rise problem caused by the accumulation of hot air, thereby optimizing the overall cooling effect of the data center.
[0088] In addition, if Figure 7 As shown in the figure, the refrigeration device cools the data center through a plenum, which provides a stable air flow environment to ensure that the cold air is evenly distributed in the data center, avoiding hot spots caused by uneven cold air flow. The plenum can form independent cold channels and hot channels. The plenum helps prevent the mixing of cold air and hot air, improves cooling efficiency, and ensures that the cold air will not be consumed prematurely by hot air.
[0089] The plenum can also effectively guide the cold air from the floor channel or air conditioning equipment to the cabinet, ensuring that the cold air reaches the area that needs cooling. The plenum can also reduce the noise generated by the operation of the cooling equipment to a certain extent; the plenum can also help maintain the pressure balance of the system, reduce equipment failures caused by pressure fluctuations, and ensure the stable operation of the data center.
[0090] Figure 8 This is a connection diagram within the heat exchange system provided in the present application, where the control device 70 is connected to the pressure sensor 90 , the temperature sensor 60 , the electric valve 80 , the water pump 40 , and the liquid level sensor 301 , respectively.
[0091] The control device controls the status of the electric valve and water pump according to the data of each sensor.
[0092] The water storage device is arranged in the air-conditioning room adjacent to the module room of the data center. With the powerful power of the circulating water pump, the condensed water is transported to the cooling coil arranged above the cold channel of the module room. The cooling coil is installed above the cold channel of the room.
[0093] There is no limit on the number of water storage devices.
[0094] The cooling coil can be curved, spiral, or rectangular, including water inlets and outlets, valves, etc. For example, Fig. 9 The cross-sectional schematic diagram of the cooling coil provided in this application, the working principle of the cooling coil is to use the flowing cooling medium to remove the heat from the surrounding environment. Fig. 9 In the figure, the outer frame represents the outer shell of the cooling coil, the horizontal solid lines inside represent the pipelines, and condensed water flows in the pipelines. The blank spaces between the solid lines represent the locations where air can flow, relying on the flowing condensed water to carry away the heat in the air.
[0095] Cooling coils can be made of copper, aluminum or polymer materials. Among them, copper is the most commonly used material, and its excellent thermal conductivity is suitable for cooling needs; aluminum is a lightweight and economical choice, suitable for occasions with lower requirements; stainless steel is suitable for environments with higher requirements.
[0096] Copper, aluminum or polymer materials may also be used for the condenser and the channel pipes for the condensed water.
[0097] A water collecting pan 502 is installed under the cooling coil to prevent the condensed water produced by the hot air from dripping onto the unit. The specific location is as follows: Figure 7 As shown. After the condensed water enters the cooling coil, it exchanges heat with the hot air in the computer room, and the cooled cold air is re-delivered to the cold channel. After the heat exchange of the condensed water is completed, it is directly discharged through the sewage outlet. Compared with the existing technology, this solution uses auxiliary equipment to perform secondary cooling of local hot spots in the computer room, using condensed water as a cold source. Through such a complete system design, the low temperature characteristics of condensed water can be fully utilized to accurately and efficiently cool the data center module computer room, greatly improving the operating stability and energy utilization efficiency of the data center.
[0098] Finally, it should be noted that those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the contents disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application, is not limited to the precise structure described above and shown in the drawings, and can be modified and changed in various ways without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A heat exchange system for a data center, characterized in that: include: A machine unit (10), a refrigeration device (20), a water storage device (30), a water pump (40) and a cooling device (50); The condensed water pipe of the refrigeration device (20) is connected to the water storage device (30), and the condensed water generated by the refrigeration device (20) is transported to the water storage device (30) through the condensed water pipe; The water pump (40) is arranged between the water storage device (30) and the cooling device (50), and the water pump (40) is used to transport condensed water in the water storage device (30) to the cooling device (50); The cooling device (50) is arranged above the unit (10), and the cooling device (50) uses the condensed water to cool the unit (10).
2. The heat exchange system according to claim 1, characterized in that: The cooling device (50) is a cooling coil.
3. The heat exchange system according to claim 1 or 2, characterized in that: The heat exchange system further comprises a temperature sensor (60); The temperature sensor (60) is arranged above the unit (10), and / or the temperature sensor (60) is arranged at a preset position of the cooling device (50).
4. The heat exchange system according to claim 3, characterized in that: The heat exchange system further comprises a control device (70); The temperature sensor (60) and the water pump (40) are respectively connected to the control device (70), and the control device (70) is used to control the opening or closing of the water pump (40) according to the temperature of the temperature sensor (60).
5. The heat exchange system according to claim 4, characterized in that: The heat exchange system further comprises an electric valve (80); The electric valve (80) is arranged between the cooling device (50) and the water pump (40), and the electric valve (80) is used to control the closing or opening of the water inlet pipe of the cooling device (50); The electric valve (80) is connected to the control device (70).
6. The heat exchange system according to claim 4, characterized in that: The heat exchange system further comprises a pressure sensor (90); The pressure sensor (90) is arranged between the water pump (40) and the cooling device (50); The pressure sensor (90) is connected to the control device (70).
7. The heat exchange system according to claim 4, characterized in that: The water storage device (30) comprises a liquid level sensor (301) therein; The liquid level sensor (301) is used to detect the liquid level of condensed water in the water storage device (30); The liquid level sensor (301) is connected to the control device (70).
8. The heat exchange system according to claim 1 or 2, characterized in that: The refrigeration device (20) forms a cold channel and a hot channel between the plurality of units (10); the channel through which the cold air generated by the refrigeration device (20) flows is the cold channel, and the channel through which the hot air generated by the unit (10) flows is the hot channel.
9. The heat exchange system according to claim 8, characterized in that: The cooling device (50) is arranged above each cold channel.
10. The heat exchange system according to claim 1 or 2, characterized in that: A water collecting tray (502) is provided below the cooling device (50).
