Magnet electroplating device

Abstract

The utility model belongs to the technical field of electroplating, and particularly relates to a magnet electroplating device which comprises an electroplating box. The clamping device comprises a first clamping plate, a second clamping plate and at least two guide rods, the two ends of each guide rod are fixedly connected to the inner wall of the electroplating box, a first assembling hole is formed in the first clamping plate, and the first clamping plate is assembled on the guide rods in a sliding mode through the first assembling hole; the second clamping plate is assembled on the guide rods in a sliding mode through the second assembling holes, multiple sets of first ejector pin assemblies are arranged on the first clamping plate, each first ejector pin assembly comprises multiple first ejector pins distributed in a rectangular mode, multiple sets of second ejector pin assemblies are arranged on the second clamping plate, and each second ejector pin assembly comprises multiple second ejector pins distributed in a rectangular mode. The second ejector pin assemblies are aligned with the first ejector pin assemblies one by one. According to the electroplating device, the strip-shaped magnets can be fixed between the first clamping plate and the second clamping plate through the first ejector pin assembly and the second ejector pin assembly, and mutual attraction between the magnets in the electroplating process is avoided.

Description

Technical Field

[0001] The present application belongs to the field of electroplating technology, and in particular, relates to a magnet electroplating device. Background Art

[0002] Electroplating is the process of plating a layer of other metals or alloys on certain metal surfaces using the principle of electrolysis, thereby preventing corrosion, improving wear resistance, conductivity, reflectivity and enhancing aesthetics. Since metal parts have beautiful appearance and good performance, electroplating technology is becoming more and more common in industry. In the field of magnets, electroplating also has universal use value, because magnets are made of a mixture of various rare metal materials, and some of the components are chemically unstable and easily oxidized in an environment exposed to air. Once the magnet oxidizes, its magnetic properties will be affected and its performance will also decline. Therefore, electroplating is an important process in the production and processing of magnets.

[0003] In the process of electroplating bar magnets in the existing magnet electroplating device, the bar magnets are usually placed directly on a bracket in the electroplating box. During the electroplating process, the two magnets are too close to each other and are easily attracted to each other, which affects the magnet electroplating. Utility Model Content

[0004] An embodiment of the present application provides a magnet electroplating device, which can fix a bar magnet between a first clamping plate and a second clamping plate through a first ejector pin assembly and a second ejector pin assembly to prevent the magnets from being adsorbed on each other during the electroplating process.

[0005] A magnet electroplating device, comprising:

[0006] Electroplating box;

[0007] The clamping device comprises a first clamping plate, a second clamping plate and at least two guide rods, each of the guide rods is arranged at intervals along the length direction of the electroplating box, and both ends of the guide rods are respectively fixedly connected to the inner wall of the electroplating box, the first clamping plate is provided with a first assembly hole, the second clamping plate is provided with a second assembly hole, the first clamping plate is slidably assembled on each of the guide rods through the first assembly hole, and the second clamping plate is slidably assembled on each of the guide rods through the second assembly hole, the first clamping plate and the second clamping plate are arranged opposite to each other, a plurality of groups of first ejector pin assemblies are provided on the first clamping plate, each of the first ejector pin assemblies is arranged at intervals along the length direction of the first clamping plate, the first ejector pin assembly comprises a plurality of first ejector pins distributed in a rectangular shape, the second clamping plate is provided with a plurality of second ejector pin assemblies, the second ejector pin assemblies comprise a plurality of second ejector pins distributed in a rectangular shape, each of the second ejector pin assemblies is arranged at intervals along the length direction of the second clamping plate, and each of the second ejector pin assemblies is aligned one by one with each of the first ejector pin assemblies.

[0008] According to some other embodiments of the magnet electroplating device of the utility model, the clamping device also includes a first driving motor, the first driving motor is installed on the outer wall of the electroplating box, the electroplating box is provided with a first through hole, the power output end of the first driving motor is installed with a first push rod, the first push rod passes through the first through hole and is fixedly connected to the first clamping plate.

[0009] According to other embodiments of the magnet electroplating device of the present invention, the clamping device also includes a second drive motor, the second drive motor is installed on the outer wall of the electroplating box, the electroplating box is provided with a second through hole, a second push rod is installed at the power output end of the second drive motor, and the second push rod passes through the second through hole and is fixedly connected to the second clamping plate.

[0010] According to some other embodiments of the magnet electroplating device of the present invention, a first sliding sleeve is installed in the first assembly hole, and the first sliding sleeve is slidably assembled on the guide rod.

[0011] According to some other embodiments of the magnet electroplating device of the present invention, a second sliding sleeve is installed in the second assembly hole, and the second sliding sleeve is slidably assembled on the guide rod.

[0012] According to the magnet electroplating devices of other embodiments of the utility model, handles are provided on both sides of the electroplating box.

[0013] The magnet electroplating device of the embodiment of the utility model has at least the following beneficial effects: during operation, a bar magnet is placed between the first clamping plate and the second clamping plate, the first clamping plate and the second clamping plate are slid, the two ends of the bar magnet are pushed in and clamped by the first ejector assembly and the second ejector assembly, and then the electroplating box is powered on for electroplating. This electroplating device can fix the bar magnet between the first clamping plate and the second clamping plate by the first ejector assembly and the second ejector assembly, so as to avoid mutual adsorption between the magnets during the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of a magnet electroplating device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0015] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0016] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0017] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0018] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0019] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0020] Electroplating is the process of plating a layer of other metals or alloys on certain metal surfaces using the principle of electrolysis, thereby preventing corrosion, improving wear resistance, conductivity, reflectivity and enhancing aesthetics. Since metal parts have beautiful appearance and good performance, electroplating technology is becoming more and more common in industry. In the field of magnets, electroplating also has universal use value, because magnets are made of a mixture of various rare metal materials, and some of the components are chemically unstable and easily oxidized in an environment exposed to air. Once the magnet oxidizes, its magnetic properties will be affected and its performance will also decline. Therefore, electroplating is an important process in the production and processing of magnets.

[0021] In the process of electroplating bar magnets in the existing magnet electroplating device, the bar magnets are usually placed directly on a bracket in the electroplating box. During the electroplating process, the two magnets are too close to each other and are easily attracted to each other, which affects the magnet electroplating.

[0022] Reference Figure 1 The present application provides a magnet electroplating device, including an electroplating box 1001 and a clamping device, the clamping device including a first clamping plate 210, a second clamping plate and at least two guide rods 220, the two ends of each guide rod 220 are respectively fixedly connected to the inner wall of the electroplating box 1, and each guide rod 220 is arranged at intervals along the length direction of the electroplating box 1, the first clamping plate 210 is provided with a first assembly hole, the second clamping plate is provided with a second assembly hole, the first clamping plate 210 is slidably assembled on each guide rod 220 through the first assembly hole, and the second clamping plate is slidably assembled on each guide rod 220 through the second assembly hole On the rod 220, the first splint 210 and the second splint are arranged opposite to each other, and the first splint 210 is provided with a plurality of groups of first ejector pin assemblies 211, each of which is arranged at intervals along the length direction of the first splint 210, and the first ejector pin assembly 211 includes a plurality of first ejector pins 2110 distributed in a rectangular shape, and the second splint is provided with a plurality of groups of second ejector pin assemblies, the second ejector pin assemblies include a plurality of second ejector pins distributed in a rectangular shape, each of which is arranged at intervals along the length direction of the second splint, and each second ejector pin assembly is aligned one by one with each first ejector pin assembly 211.

[0023] During operation, the bar magnet is placed between the first clamp 210 and the second clamp, the first clamp 210 and the second clamp are slid, the two ends of the bar magnet are pushed in and clamped by the first ejector assembly 211 and the second ejector assembly, and then the electroplating box 1 is energized for electroplating. This electroplating device can fix the bar magnet between the first clamp 210 and the second clamp by the first ejector assembly 211 and the second ejector assembly, thereby avoiding mutual adsorption between the magnets during the electroplating process.

[0024] In the embodiment shown in the present application, four guide rods 220 are provided, and the four guide rods 220 are arranged at equal intervals along the length direction of the electroplating box 1 at the bottom of the electroplating box 1, and the two ends of the guide rods 220 are detachably connected to the electroplating box 1 through connecting plates.

[0025] Each set of first ejector pin assemblies 211 includes four first ejector pins 2110 vertically mounted on the first clamping plate 210, and each set of second ejector pin assemblies includes four second ejector pins vertically mounted on the second clamping plate. When clamping the magnet assembly, the four first ejector pins 2110 are pressed against one end of the magnet assembly, and the four second ejector pins are pressed against the other end of the magnet assembly.

[0026] The first clamping plate 210 is provided with four first through holes corresponding to the guide rods 220, and the second clamping plate is provided with four second through holes corresponding to the guide rods 220. The first clamping plate 210 is slidably assembled on the four guide rods 220 through the four first through holes, and the second clamping plate is slidably assembled on the four guide rods 220 through the four second through holes. The first clamping plate 210 and the second clamping plate are arranged on the guide rod 220 at intervals along the length direction of the guide rod 220. The first clamping plate 210 and the second clamping plate can approach or move away from each other along the guide rod 220 to achieve a clamping or loosening action.

[0027] In order to reduce the wear between the first through hole and the guide rod 220 , in some embodiments, a first sliding sleeve is installed in the first assembly hole, and the first sliding sleeve is slidably assembled on the guide rod 220 .

[0028] In some other embodiments, a second sliding sleeve is installed in the second assembly hole, and the second sliding sleeve is slidably assembled on the guide rod 220 .

[0029] In some embodiments, the clamping device also includes a first drive motor, which is installed on the outer wall of the electroplating box 1. The electroplating box 1 is provided with a first through hole. The power output end of the first drive motor is installed with a first push rod 300, and the first push rod 300 passes through the first through hole and is fixedly connected to the first clamping plate 210.

[0030] In some embodiments, the clamping device also includes a second drive motor 230, which is installed on the outer wall of the electroplating box 1. A second through hole is provided on the electroplating box 1. A second push rod is installed at the power output end of the second drive motor 230, and the second push rod passes through the second through hole and is fixedly connected to the second clamp.

[0031] During operation, the first drive motor pushes the first clamping plate 210 to slide along the guide rod 220 through the first push rod 300, and the second drive motor 230 pushes the second clamping plate to slide along the guide rod 220 through the second push rod, so that the first ejector assembly 211 and the second ejector assembly push in and clamp or release the two ends of the bar magnet.

[0032] In some embodiments, handles 101 are provided on both sides of the electroplating box 1 to facilitate carrying the entire electroplating box 1 .

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

Claims

1. A magnet electroplating device, characterized in that: include: Electroplating box; The clamping device comprises a first clamping plate, a second clamping plate and at least two guide rods, each of the guide rods is arranged at intervals along the length direction of the electroplating box, and both ends of the guide rods are respectively fixedly connected to the inner wall of the electroplating box, the first clamping plate is provided with a first assembly hole, the second clamping plate is provided with a second assembly hole, the first clamping plate is slidably assembled on each of the guide rods through the first assembly hole, and the second clamping plate is slidably assembled on each of the guide rods through the second assembly hole, the first clamping plate and the second clamping plate are arranged opposite to each other, a plurality of groups of first ejector pin assemblies are provided on the first clamping plate, each of the first ejector pin assemblies is arranged at intervals along the length direction of the first clamping plate, the first ejector pin assembly comprises a plurality of first ejector pins distributed in a rectangular shape, the second clamping plate is provided with a plurality of second ejector pin assemblies, the second ejector pin assemblies comprise a plurality of second ejector pins distributed in a rectangular shape, each of the second ejector pin assemblies is arranged at intervals along the length direction of the second clamping plate, and each of the second ejector pin assemblies is aligned one by one with each of the first ejector pin assemblies.

2. The magnet electroplating device according to claim 1, characterized in that: The clamping device also includes a first driving motor, which is installed on the outer wall of the electroplating box. The electroplating box is provided with a first through hole. A first push rod is installed at the power output end of the first driving motor, and the first push rod passes through the first through hole and is fixedly connected to the first clamping plate.

3. The magnet electroplating device according to claim 2, characterized in that: The clamping device also includes a second drive motor, which is installed on the outer wall of the electroplating box. A second through hole is provided on the electroplating box. A second push rod is installed at the power output end of the second drive motor, and the second push rod passes through the second through hole and is fixedly connected to the second clamping plate.

4. The magnet electroplating device according to claim 1, characterized in that: A first sliding sleeve is installed in the first assembly hole, and the first sliding sleeve is slidably assembled on the guide rod.

5. The magnet electroplating device according to claim 4, characterized in that: A second sliding sleeve is installed in the second assembly hole, and the second sliding sleeve is slidably assembled on the guide rod.

6. The magnet electroplating device according to claim 1, characterized in that: Handles are provided on both sides of the electroplating box.

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