Infrared thermal imaging machine core and infrared thermal imager

Abstract

The utility model provides an infrared thermal imaging machine core and an infrared thermal imager. The infrared thermal imaging machine core comprises a shutter assembly and a detector assembly. The detector assembly comprises a detector body and a circuit board support. The detector body comprises a detector circuit board and a detector chip arranged on the surface of one side of the detector circuit board; the circuit board bracket is arranged on one side, deviating from the detector chip, of the detector circuit board; and the shutter assembly covers the detector assembly and is fixedly connected with the circuit board bracket to form a closed space for accommodating the detector body. The infrared thermal imaging machine core and the infrared thermal imager provided by the utility model have the advantages of small and exquisite structure, wide application range and the like.

Description

Technical Field

[0001] The present application relates to the technical field of infrared thermal imaging equipment, and in particular to an infrared thermal imaging core and an infrared thermal imager. Background Art

[0002] Infrared thermal imager is a device that uses infrared thermal imaging technology to detect the infrared radiation of the target object and convert the image of the temperature distribution of the target object into a visible image by means of signal processing, photoelectric conversion, etc. The infrared thermal imager accurately quantifies the actual detected heat and images the entire target object in real time in the form of a surface, so it can accurately identify the suspected fault area that is heating up. The operator uses the image color displayed on the screen and the hot spot tracking display function to preliminarily judge the heating situation and fault location, and strictly analyzes it, thereby demonstrating high efficiency and high accuracy in confirming the problem.

[0003] The infrared thermal imaging core of existing infrared thermal imagers mostly adopts a stacked structure, and most of them lock the detector body and the circuit board bracket through connecting parts such as screws. The circuit board bracket is arranged on the side surface of the detector body where the detector chip is provided. The circuit board bracket will occupy a part of the area of ​​the detector body when it is set, resulting in the detector body being larger in length and width, which cannot meet the ultra-small size installation requirements of the infrared thermal imaging core, and its application range is limited. Summary of the invention

[0004] Based on this, the present application provides an infrared thermal imaging movement and an infrared thermal imager to improve the problems existing in the prior art such as the infrared thermal imaging movement being too large in size and having a small application range.

[0005] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0006] On the one hand, an embodiment of the present application provides an infrared thermal imaging movement, including a shutter assembly and a detector assembly; the detector assembly includes a detector body and a circuit board bracket; the detector body includes a detector circuit board and a detector chip arranged on one side surface of the detector circuit board; the circuit board bracket is arranged on the side of the detector circuit board away from the detector chip; the shutter assembly cover is arranged outside the detector assembly and is fixedly connected to the circuit board bracket to form a closed space for accommodating the detector body.

[0007] In one embodiment, the shutter assembly includes a shutter body and an adapter; the adapter is a shell structure with openings at both ends; a first boss portion is provided at one end of the shutter body close to the detector assembly, and one end of the adapter is sleeved outside the first boss portion.

[0008] In one embodiment, the circuit board bracket includes a bracket body and a rear cover plate, the bracket body is a shell structure with openings at both ends, and the rear cover plate is arranged on a side of the bracket body away from the detector body for closing an open end of the bracket body.

[0009] In one embodiment, a second boss portion is provided at one end of the bracket body close to the shutter assembly, and the other end of the adapter is sleeved outside the second boss portion; the shutter body, the adapter and the bracket body together form a closed space for accommodating the detector body.

[0010] In one of the embodiments, an inner recess is provided at one end of the bracket body away from the shutter assembly.

[0011] In one embodiment, the rear cover is provided with a first connecting hole, and the shutter body is provided with a second connecting hole for matching use, and the rear cover and the shutter body are fixed by inserting connecting pieces through the first connecting hole and the second connecting hole.

[0012] In one embodiment, the detector body is fixed on the second boss portion, and corresponding positioning structures are respectively provided on the second boss portion and the detector circuit board.

[0013] In one embodiment, the positioning structure includes a positioning pin and a positioning hole used in conjunction with the positioning pin, one of the positioning pin and the positioning hole is arranged on the second boss portion, and the other is arranged on the detector circuit board.

[0014] In one embodiment, the shutter assembly and the circuit board bracket are respectively made of metal materials.

[0015] On the other hand, an embodiment of the present application provides an infrared thermal imager, comprising the infrared thermal imaging core as described above.

[0016] The present application has at least the following beneficial effects: the infrared thermal imaging movement provided in the embodiment of the present application includes a shutter assembly and a detector assembly, and the circuit board bracket of the detector assembly is arranged on the side surface of the detector circuit board where the detector chip is not arranged. In this way, the circuit board bracket does not need to avoid the detector chip, and therefore does not occupy the length and width dimensions of the detector circuit board, which can reduce the length and width dimensions of the infrared thermal imaging movement, thereby facilitating the reduction of the overall size of the infrared thermal imaging movement and making its application range wider. At the same time, the shutter assembly and the circuit board bracket jointly form a closed space for accommodating the detector body, and the entire detector body is surrounded in the closed space, which is conducive to protecting the detector body and avoiding damage to important components such as the detector chip, thereby improving the reliability of the equipment. The infrared thermal imager provided in the embodiment of the present application includes the above-mentioned infrared thermal imaging movement, and therefore also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the infrared thermal imaging core of an embodiment of the present application.

[0018] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the infrared thermal imaging movement.

[0019] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure of the infrared thermal imaging movement.

[0020] Figure 4 for Figure 2 A schematic structural diagram of a bracket body from one perspective.

[0021] Figure 5 for Figure 2 A schematic structural diagram of the bracket body from another perspective.

[0022] The meanings of the symbols in the accompanying drawings are as follows:

[0023] 1. shutter assembly; 11. shutter body; 111. first boss portion; 12. adapter;

[0024] 2. Detector assembly; 21. Circuit board bracket; 211. Bracket body; 2111. Second boss portion; 2112. Positioning pin; 2113. Inner recess; 212. Back cover; 2121. First connecting hole; 22. Detector body; 221. Detector circuit board; 222. Detector chip. DETAILED DESCRIPTION

[0025] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] See also Figure 1 and Figure 2 The infrared thermal imaging core of the embodiment of the present application includes a shutter assembly 1 and a detector assembly 2. The shutter assembly 1 and the detector assembly 2 are assembled separately to form a module structure, which is convenient for the subsequent assembly and fixation of the two components, saves assembly time, and simplifies the assembly process.

[0030] As Figure 1 and Figure 3 As shown, the shutter assembly 1 of this embodiment is covered outside the detector assembly 2, and includes a shutter body 11 and an adapter 12. The adapter 12 is a shell structure with two ends open. In this embodiment, the cross section of the adapter 12 is a square ring. The shutter body 11 is provided with a first boss portion 111 at one end close to the detector assembly 2.

[0031] like Figure 2 and Figure 3As shown, the detector assembly 2 of this embodiment includes a detector body 22 and a circuit board bracket 21. The detector body 22 includes a detector circuit board 221 and a detector chip 222 arranged on one side surface of the detector circuit board 221. The circuit board bracket 21 is arranged on the side of the detector circuit board 221 away from the detector chip 222. The circuit board bracket 21 of this embodiment includes a bracket body 211 and a rear cover plate 212. The bracket body 211 is a shell structure with openings at both ends. The rear cover plate 212 is covered on a side of the bracket body 211 away from the detector body 22, and is used to close an open end of the bracket body 211. For example, the detector circuit board 221 of the detector body 22 can be fixedly connected to the bracket body 211 by glue dispensing.

[0032] like Figure 4 and Figure 5 As shown, a second boss portion 2111 is provided at one end of the bracket body 211 close to the shutter assembly 1, one end of the adapter 12 is sleeved outside the first boss portion 111 of the shutter body 11, and the other end of the adapter 12 is sleeved outside the second boss portion 2111 of the bracket body 211, and the outer wall surface of the adapter 12 is kept aligned with the outer wall surfaces of the shutter body 11 and the bracket body 211 to form an integral structure. The adapter 12 forms a limiting structure with the shutter body 11 and the bracket body 211 through two boss portions (the first boss portion 111 and the second boss portion 2111), which facilitates the installation of the adapter 12 and the positioning of the shutter assembly 1 and the detector assembly 2, avoids installation misalignment, and improves the accuracy of installation. The adapter 12 can be fixedly connected to the shutter body 11 and the bracket body 211 respectively by glue dispensing. During assembly, the adapter 12 and the shutter body 11 can be bonded and fixed to form the shutter assembly 1. At the same time, the components of the detector assembly 2 are assembled to form an integral structure, and then the two components are fixed to facilitate installation. The shutter body 11, the adapter 12 and the bracket body 211 together form a closed space for accommodating the detector body 22. The detector circuit board 221 and the detector chip 222 are completely surrounded in the closed space, which is conducive to protecting them, thereby improving the reliability of the infrared thermal imager.

[0033] An inner recess 2113 is provided at one end of the bracket body 211 away from the shutter assembly 1. The setting of the inner recess 2113 can reduce the weight of the bracket body 211 and form a space for accommodating electronic components such as connectors, making the overall structure more compact and small.

[0034] The detector body 22 is adhesively fixed to the second boss portion 2111, and corresponding positioning structures are respectively provided on the second boss portion 2111 and the detector circuit board 221. The positioning structure includes a positioning pin 2112 and a positioning hole (not shown) used in conjunction with the positioning pin 2112, and one of the positioning pin 2112 and the positioning hole is provided on the second boss portion 2111, and the other is provided on the detector circuit board 221. For example, a protruding positioning pin 2112 can be provided near any one corner or any two corners of the second boss portion 2111, and a positioning hole is correspondingly provided on the detector circuit board 221. The positioning pin 2112 is inserted into the positioning hole to realize the positioning function. During assembly, the detector body 22 and the circuit board bracket 21 can be first positioned by the positioning structure, and then fixed by glue, so as to improve the accuracy of the assembly position and facilitate quick assembly. Figure 2 As shown, a first connecting hole 2121 may be provided on the rear cover plate 212, and a second connecting hole (not shown) for matching use may be provided on the shutter body 11, and the rear cover plate 212 and the shutter body 11 may be fixed by inserting connecting pieces through the first connecting hole 2121 and the second connecting hole.

[0035] The shutter assembly 1 and the circuit board bracket 21 can be made of metal materials, which is beneficial to improving the parallelism between the imaging plane and the imaging plane of the lens optical path. The metal material can be, for example, aluminum alloy.

[0036] The present application also provides an infrared thermal imager, which includes the above-mentioned infrared thermal imaging core.

[0037] The infrared thermal imaging movement and infrared thermal imager provided in the embodiments of the present application have the advantages of small size, precise imaging, high reliability, and easy assembly, which can increase the application scope of the infrared thermal imaging movement and make it more competitive in the market.

[0038] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0039] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An infrared thermal imaging core, characterized in that: The invention comprises a shutter assembly (1) and a detector assembly (2); the detector assembly (2) comprises a detector body (22) and a circuit board bracket (21); the detector body (22) comprises a detector circuit board (221) and a detector chip (222) arranged on a surface of one side of the detector circuit board (221); the circuit board bracket (21) is arranged on a side of the detector circuit board (221) away from the detector chip (222); the shutter assembly (1) is arranged outside the detector assembly (2) and is fixedly connected to the circuit board bracket (21) to form a closed space for accommodating the detector body (22).

2. The infrared thermal imaging core according to claim 1, characterized in that: The shutter assembly (1) comprises a shutter body (11) and an adapter (12); the adapter (12) is a shell structure with openings at both ends; a first boss portion (111) is provided at one end of the shutter body (11) close to the detector assembly (2), and one end of the adapter (12) is sleeved outside the first boss portion (111).

3. The infrared thermal imaging core as claimed in claim 2, characterized in that: The circuit board bracket (21) comprises a bracket body (211) and a rear cover plate (212); the bracket body (211) is a shell structure with openings at both ends; the rear cover plate (212) is arranged on a side of the bracket body (211) away from the detector body (22) and is used to close an open end of the bracket body (211).

4. The infrared thermal imaging core as claimed in claim 3, characterized in that: A second boss portion (2111) is provided at one end of the bracket body (211) close to the shutter assembly (1), and the other end of the adapter (12) is sleeved outside the second boss portion (2111); the shutter body (11), the adapter (12) and the bracket body (211) together form a closed space for accommodating the detector body (22).

5. The infrared thermal imaging core as claimed in claim 3, characterized in that: An inner recess (2113) is provided at one end of the support body (211) away from the shutter assembly (1).

6. The infrared thermal imaging core as claimed in claim 3, characterized in that: The rear cover plate (212) is provided with a first connection hole (2121), and the shutter body (11) is provided with a second connection hole for matching use, and the rear cover plate (212) and the shutter body (11) are fixed by inserting a connection piece through the first connection hole (2121) and the second connection hole.

7. The infrared thermal imaging core according to claim 4, characterized in that: The detector body (22) is fixed on the second boss portion (2111), and corresponding positioning structures are respectively provided on the second boss portion (2111) and the detector circuit board (221).

8. The infrared thermal imaging core according to claim 7, characterized in that: The positioning structure comprises a positioning pin (2112) and a positioning hole used in conjunction with the positioning pin (2112); one of the positioning pin (2112) and the positioning hole is arranged on the second boss portion (2111), and the other is arranged on the detector circuit board (221).

9. The infrared thermal imaging core according to claim 1, characterized in that: The shutter assembly (1) and the circuit board bracket (21) are respectively made of metal materials.

10. An infrared thermal imager, characterized in that: It comprises the infrared thermal imaging core as described in any one of claims 1 to 9.

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