PCB structure for improving bonding welding of aluminum wire

Abstract

The utility model relates to the technical field of bonding welding of a PCB (Printed Circuit Board), in particular to a PCB structure for improving bonding welding of an aluminum wire, which comprises a circuit board, a silicon-based chip and a front glass cover plate, the silicon-based chip is assembled at the upper end of the circuit board, the front glass cover plate is arranged at the upper end of the silicon-based chip, a plurality of layers of electrode pin bonding pads are arranged on the circuit board, and the front glass cover plate is arranged at the lower end of the silicon-based chip. A plurality of layers of electrode pin bonding pads are arranged on the silicon-based chip, chip electrode pin bonding pads are arranged on the silicon-based chip, each layer of electrode pin bonding pad in the plurality of layers of electrode pin bonding pads vertically corresponds to the chip electrode pin bonding pad, and all layers of electrode pin bonding pads in the plurality of layers of electrode pin bonding pads are staggered at intervals. According to the device, when the electrode pin bonding pad on the circuit board and the chip electrode pin bonding pad on the surface of the silicon-based chip are welded through the metal lead, the electrode pin bonding pad and the chip electrode pin bonding pad are kept perpendicular to each other, the problem that the aluminum wire cannot be welded due to the fact that the wedge-shaped welding angle of the aluminum wire is too large can be effectively solved, and bonding quality is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board bonding welding, in particular to a PCB board structure used for improving aluminum wire bonding welding. Background Art

[0002] Wire bonding is a method of connecting metal wires to pads, that is, a technology that connects internal and external chips. Structurally, the metal wires act as a bridge between the chip pads (primary bonding) and the carrier pads (secondary bonding).

[0003] Compared with the OLED panel of the mobile phone, the silicon-based OLED chip has a smaller area, smaller pixel unit, higher PPI, and a relatively small electrode pin pad (PAD). However, the minimum line width and line spacing of the circuit board (PCB) process cannot meet the requirements of the silicon-based chip. The electrode line width and line spacing of the PCB will be larger than that of the silicon-based chip, resulting in a certain angle between the PCB electrode and the chip electrode. In the aluminum wire wedge welding process, the solder joint is generally ellipsoidal and the surface is elliptical. In the bonding process, the angle is too large, resulting in welding failure and low welding yield. To this end, in response to the problems raised in the background technology of the tree, the technicians in this field proposed a PCB board structure and bonding process for improving aluminum wire bonding. Utility Model Content

[0004] The purpose of the utility model is to provide a PCB board structure for improving aluminum wire bonding welding, so as to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A PCB board structure for improving aluminum wire bonding welding comprises a circuit board, a silicon-based chip and a front glass cover plate, wherein the silicon-based chip is assembled on the upper end of the circuit board, the front glass cover plate is arranged on the upper end of the silicon-based chip, the circuit board is provided with multiple layers of electrode pin pads, the silicon-based chip is provided with chip electrode pin pads, the electrode pin pads of each layer in the multiple layers of electrode pin pads correspond vertically to the chip electrode pin pads, and the electrode pin pads of each layer in the multiple layers of electrode pin pads are spaced and staggered from each other.

[0007] Preferably, the multi-layer electrode pin pads include a first layer of electrode pin pads and a second layer of electrode pin pads from near to far distances from the silicon-based chip, and the first layer of electrode pin pads and the second layer of electrode pin pads are spaced and staggered from each other.

[0008] Preferably, the first layer of electrode pin pads and the second layer of electrode pin pads both correspond vertically to the chip electrode pin pads.

[0009] Preferably, the multi-layer electrode pin pads include, from near to far, a first layer of electrode pin pads, a second layer of electrode pin pads and a third layer of electrode pin pads to the silicon-based chip, and the first layer of electrode pin pads, the second layer of electrode pin pads and the third layer of electrode pin pads are spaced and staggered from each other.

[0010] Preferably, the first layer electrode pin pads, the second layer electrode pin pads and the third layer electrode pin pads are vertically corresponding to the chip electrode pin pads, and the distance between the third layer electrode pin pads and the second layer electrode pin pads is 0.5-1 mm.

[0011] Preferably, the distance between the second layer electrode pin pads and the first layer electrode pin pads 4 is 0.5-1 mm, and the distance between the first layer electrode pin pads and the chip electrode pin pads is 1-1.5 mm.

[0012] Preferably, the first layer electrode pin pads and the second layer electrode pin pads are respectively connected to the chip electrode pin pads through metal leads, and the metal lead arc height between the second layer electrode pin pads and the chip electrode pin pads is 150-200um higher than the metal lead arc height between the first layer electrode pin pads and the chip electrode pin pads.

[0013] Preferably, the third layer electrode pin pad is connected to the chip electrode pin pad via a metal lead, and the metal lead arc height between the third layer electrode pin pad and the chip electrode pin pad is 150-200um higher than the metal lead arc height between the second layer electrode pin pad and the chip electrode pin pad.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model provides multiple layers of electrode pin pads, and the multiple layers of electrode pin pads are staggered with each other. Each layer of electrode pin pads corresponds vertically to the chip electrode pin pads on the silicon-based chip. When the electrode pin pads on the PCB board and the chip electrode pin pads on the surface of the silicon-based chip are welded through metal leads, the two are kept vertical, which can effectively solve the problem that the aluminum wire wedge welding angle is too large and cannot be welded, and effectively improve the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a top view of specific embodiment 1 of the utility model;

[0017] Figure 2It is a side view of specific embodiment 1 of the utility model;

[0018] Figure 3 It is a top view of specific embodiment 2 of the utility model;

[0019] Figure 4 It is a side view of specific embodiment 2 of the utility model;

[0020] Figure 5 The top view of the PCB board structure with bonding in the prior art.

[0021] In the figure: 1. Circuit board; 2. Silicon-based chip; 3. Front glass cover; 4. First layer electrode pin pad; 5. Second layer electrode pin pad; 6. Chip electrode pin pad; 7. Third layer electrode pin pad. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Specific embodiment 1

[0023] See also Figure 1-2 The utility model provides a PCB board structure for improving aluminum wire bonding welding, including a circuit board 1, a silicon-based chip 2 and a front glass cover 3. The silicon-based chip 2 is assembled on the upper end of the circuit board 1, and the front glass cover 3 is arranged on the upper end of the silicon-based chip 2. Two layers of electrode pin pads are arranged on the circuit board 1, and the two layers of electrode pin pads respectively include a first layer of electrode pin pads 4 and a second layer of electrode pin pads 5. The first layer of electrode pin pads 4 and the second layer of electrode pin pads 5 are spaced and staggered from each other. Chip electrode pin pads 6 are arranged on the silicon-based chip 2, and the first layer of electrode pin pads 4 and the second layer of electrode pin pads 5 are both vertically corresponding to the chip electrode pin pads 6.

[0024] The distance between the first layer electrode pin pad 4 and the chip electrode pin pad 6 is 1-1.5 mm.

[0025] The distance between the second layer electrode pin pad 5 and the first layer electrode pin pad 4 is 0.5-1 mm.

[0026] The first layer of electrode pin pads 4 includes B, D, F, H, J, L, N, P, R, and T electrode pin pads, and the second layer of electrode pin pads 5 includes A, C, E, G, I, K, M, O, Q, and S electrode pin pads.

[0027] The chip electrode pin pads 6 include 1, 2, ③, ④, ⑤, ⑥, ⑦, ⑧, ⑨, ⑩, ⑪, ⑫, ⑬, ⑭, ⑮, ⑯, ⑰, ⑱, ⑲, 20 electrode pin pads.

[0028] The bonding method for improving the aluminum wire bonding welding PCB board structure provided in the specific embodiment 1 adopts the following steps:

[0029] S1: Solder metal leads between the B, D, F, H, J, L, N, P, R, T electrode pin pads and the 2, ④, ⑥, ⑧, ⑩, ⑫, ⑭, ⑯, ⑱, 20 electrode pin pads;

[0030] S2: Solder metal leads between the A, C, E, G, I, K, M, O, Q, S electrode pin pads and the 1, ③, ⑤, ⑦, ⑨, ⑪, ⑬, ⑮, ⑰, ⑲ electrode pin pads;

[0031] The arc height of the metal lead welded in step S2 is 150-200 um higher than that of the metal lead welded in step S1. Specific embodiment 2

[0032] See also Figure 3-4 The utility model provides a PCB board structure for improving aluminum wire bonding welding, including a circuit board 1, a silicon-based chip 2 and a front glass cover 3, the silicon-based chip 2 is assembled on the upper end of the circuit board 1, the front glass cover 3 is arranged on the upper end of the silicon-based chip 2, and three layers of electrode pin pads are arranged on the circuit board 1, and the three layers of electrode pin pads respectively include a first layer of electrode pin pads 4, a second layer of electrode pin pads 5 and a third layer of electrode pin pads 7, and the first layer of electrode pin pads 4, the second layer of electrode pin pads 5 and the third layer of electrode pin pads 7 are spaced and staggered from each other, and a chip electrode pin pad 6 is arranged on the silicon-based chip 2, and the first layer of electrode pin pads 4, the second layer of electrode pin pads 5 and the third layer of electrode pin pads 7 are all vertically corresponding to the chip electrode pin pads 6.

[0033] The distance between the first layer electrode pin pad 4 and the chip electrode pin pad 6 is 1-1.5 mm.

[0034] The distance between the second layer electrode pin pad 5 and the first layer electrode pin pad 4 is 0.5-1 mm.

[0035] The distance between the third-layer electrode pin pad 7 and the second-layer electrode pin pad 5 is 0.5-1 mm.

[0036] The first layer of electrode pin pads 4 includes B, E, H, K, N, Q, and T electrode pin pads, the second layer of electrode pin pads 5 includes A, D, G, J, M, P, and S electrode pin pads, and the third layer of electrode pin pads 7 includes C, F, I, L, O, and R electrode pin pads.

[0037] The chip electrode pin pads 6 include 1, 2, ③, ④, ⑤, ⑥, ⑦, ⑧, ⑨, ⑩, ⑪, ⑫, ⑬, ⑭, ⑮, ⑯, ⑰, ⑱, ⑲, 20 electrode pin pads.

[0038] The bonding method for improving the aluminum wire bonding welding PCB board structure provided in the specific embodiment 2 adopts the following steps:

[0039] S1: Solder metal leads between the B, E, H, K, N, Q, T electrode pin pads and the ②, ⑤, ⑧, ⑪, ⑭, ⑰, ⑳ electrode pin pads;

[0040] S2: Solder metal leads between the A, D, G, J, M, P, S electrode pin pads and the ①, ④, ⑦, ⑩, ⑬, ⑯, ⑲ electrode pin pads;

[0041] S3: Weld metal leads between the C, F, I, L, O, R electrode pin pads and the ③, ⑥, ⑨, ⑫, ⑮, ⑱ electrode pin pads;

[0042] The arc height of the metal lead welded in step S2 is 150-200 um higher than that of the metal lead welded in step S1 , and the arc height of the metal lead welded in step S3 is 150-200 um higher than that of the metal lead welded in step S2 .

[0043] The connection between the circuit board 1 and the silicon-based chip 2 in the specific embodiment 1 and the specific embodiment 2 is the same as that in the prior art, and the silicon-based chip 2 and the front glass cover plate 3 can be connected by OCA glue.

[0044] pass Figure 5 It can be seen that in the existing bonding soldering PCB board structure, there is an angle θ between the electrode pin pads on both sides, and in the aluminum wire wedge welding process, the solder joints are generally ellipsoidal and the surface is elliptical. In the bonding process, the angle is too large, resulting in welding failure and low welding yield.

[0045] The utility model arranges two or three layers of electrode pin pads on the circuit board 1, and the electrode pin pads of each layer are arranged alternately. Each electrode pin pad on the first layer, the second layer, the electrode pin pad 5 and the third layer can respectively correspond vertically to the chip electrode pin pad 6 including 1, 2...20 electrode pin pads. When the electrode pin pads on the PCB board and the chip electrode pin pads on the surface of the silicon-based chip are welded through metal leads, the two are kept vertical, which can effectively solve the problem that the aluminum wire wedge welding angle is too large and cannot be welded, and effectively improve the bonding quality.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB board structure for improving aluminum wire bonding welding, characterized by: It includes a circuit board, a silicon-based chip and a front glass cover plate, wherein the silicon-based chip is assembled on the upper end of the circuit board, the front glass cover plate is arranged on the upper end of the silicon-based chip, the circuit board is provided with multiple layers of electrode pin pads, the silicon-based chip is provided with chip electrode pin pads, the electrode pin pads of each layer in the multiple layers of electrode pin pads correspond vertically to the chip electrode pin pads, and the electrode pin pads of each layer in the multiple layers of electrode pin pads are spaced and staggered from each other.

2. A PCB board structure for improving aluminum wire bonding according to claim 1, characterized in that: The multi-layer electrode pin pads include a first layer of electrode pin pads and a second layer of electrode pin pads in order from near to far distances from the silicon-based chip, and the first layer of electrode pin pads and the second layer of electrode pin pads are spaced and staggered from each other.

3. A PCB board structure for improving aluminum wire bonding according to claim 2, characterized in that: The first layer electrode pin pads and the second layer electrode pin pads both correspond vertically to the chip electrode pin pads.

4. A PCB board structure for improving aluminum wire bonding according to claim 1, characterized in that: The multi-layer electrode pin pads include, from near to far, a first layer of electrode pin pads, a second layer of electrode pin pads and a third layer of electrode pin pads, and the first layer of electrode pin pads, the second layer of electrode pin pads and the third layer of electrode pin pads are spaced and staggered from each other.

5. A PCB board structure for improving aluminum wire bonding according to claim 4, characterized in that: The first layer electrode pin pads, the second layer electrode pin pads and the third layer electrode pin pads are vertically corresponding to the chip electrode pin pads, and the distance between the third layer electrode pin pads and the second layer electrode pin pads is 0.5-1mm.

6. A PCB board structure for improving aluminum wire bonding according to claim 3 or 5, characterized in that: The distance between the second layer electrode pin pads and the first layer electrode pin pads is 0.5-1 mm, and the distance between the first layer electrode pin pads and the chip electrode pin pads is 1-1.5 mm.

7. A PCB board structure for improving aluminum wire bonding according to claim 6, characterized in that: The first layer electrode pin pads and the second layer electrode pin pads are respectively connected to the chip electrode pin pads through metal leads, and the metal lead arc height between the second layer electrode pin pads and the chip electrode pin pads is 150-200um higher than the metal lead arc height between the first layer electrode pin pads and the chip electrode pin pads.

8. The PCB structure for improving aluminum wire bonding according to claim 5, characterized in that: The third layer electrode pin pad is connected to the chip electrode pin pad via a metal lead, and the arc height of the metal lead between the third layer electrode pin pad and the chip electrode pin pad is 150-200um higher than the arc height of the metal lead between the second layer electrode pin pad and the chip electrode pin pad.

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