Packaging equipment for semiconductor power supply sealing shell
By using a double-head motor and a touch-pressure button in the power packing equipment, the clamping of the clamping plate is automatically controlled, and the design of the threaded rod and fixing nut is combined, the problem of difficult control of clamping force and adaptability to different sizes and shapes is solved. Improves packaging quality and production efficiency.
Patent Information
- Application Number
- CN202420840038.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The existing power enclosure packaging equipment is difficult to control during clamping, which easily leads to damage to the enclosure or internal components. It takes a long time to set up and adjust the enclosure of different sizes and shapes, increasing production preparation time.
The clamping process of the clamping plate is automatically stopped by the double-head motor and the pressure button. The clamping plate is removed and replaced by the threaded rod and the fixing nut, suitable for different sizes and shapes. Power enclosure.
It improves packaging quality, avoids damage to the seal, shortens production preparation time, and enhances the applicability and practicality of the equipment.
Smart Images
Figure CN222289281U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging equipment, in particular to packaging equipment for a semiconductor power supply shell. Background Art
[0002] Power supply enclosure packaging equipment generally refers to equipment used to package power modules or power adapters. These devices may include automatic or semi-automatic machines that are used to encapsulate power components in plastic or metal enclosures and ensure that they are securely and stably connected.
[0003] However, existing packaging equipment still has certain defects. For example, the force applied by the packaging equipment during the clamping process cannot be controlled. If the force is too large, the power supply shell or internal components will be damaged, affecting the reliability and life of the product. Secondly, for power supply shells of different sizes and shapes that need to be frequently replaced, the packaging equipment may take a long time to set up and adjust, which will increase the production preparation time. Utility Model Content
[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a packaging device for a semiconductor power supply shell. Through the cooperation of a double-headed motor and a touch-pressure button, the clamping plate can automatically stop during the clamping process to avoid excessive or unstable clamping of the power supply shell, thereby improving the packaging quality. At the same time, the clamping plate can be disassembled and replaced through threaded rods and fixing nuts, so that the device can replace clamping plates of different sizes and shapes, thereby being suitable for clamping power supply shells of different sizes and shapes, thereby improving the practicability of the device.
[0005] The utility model also provides a packaging device having the above-mentioned semiconductor power supply enclosure, comprising:
[0006] A packaging table, wherein a motor is fixedly connected to the upper surface of the packaging table, a first reciprocating screw is fixedly connected to the output end of the motor, a fixing plate is threadedly connected to the outer surface of the first reciprocating screw, a guide rod is slidably connected to the inner surface of the fixing plate, a spring is provided on the outer surface of the guide rod, a cavity is provided on the inner surface of the fixing plate, an air pump is fixedly connected to the inner surface of the cavity, and a suction cup is fixedly connected to the output end of the air pump.
[0007] The inner surface of the packaging table is provided with a slide groove, the inner surface of the slide groove is fixedly connected to a double-headed motor, the output end of the double-headed motor is fixedly connected to a second reciprocating screw, the outer surface of the second reciprocating screw is threadedly connected to a slider, the upper surface of the slider is fixedly connected to a threaded rod, the outer surface of the threaded rod is slidably connected to a clamping plate, the side surface of the clamping plate is provided with a touch button, and the outer surface of the threaded rod is threadedly connected to a fixing nut.
[0008] According to the packaging device for a semiconductor power supply shell, the outer surface of the first reciprocating screw is rotatably connected to the packaging stage, and the rear surface of the fixing plate is in contact with the packaging stage.
[0009] According to the packaging device for a semiconductor power supply shell, both ends of the guide rod are fixedly connected to the packaging platform, and the suction cup extends into the interior of the cavity, which facilitates the connection and installation of the air pump and the suction cup.
[0010] According to the packaging device for a semiconductor power supply shell, the number of the springs is two and they are distributed on the left and right, and the lower surface of the spring is fixedly connected to the packaging platform to buffer the force when the cover plate moves downward.
[0011] According to the packaging device for a semiconductor power supply shell, rollers are fixedly connected to the lower surface of the packaging platform. The number of the rollers is four and they are distributed in a rectangular array, which facilitates the movement of the device.
[0012] According to the packaging device for a semiconductor power supply shell, the number of the threaded rods is two and they are distributed on the left and right, and the lower surface of the threaded rod is in contact with the packaging platform, which is convenient for replacing the clamping plate.
[0013] According to the packaging device of a semiconductor power supply shell, the touch button is electrically connected to the double-headed motor to avoid damage to the power supply shell caused by excessive clamping, and the upper surface of the slider is in contact with the clamping plate.
[0014] According to the packaging device of a semiconductor power supply shell, the motor and the air pump are both electrically connected to an external power supply, and the lower surface of the fixing nut is in contact with the clamping plate.
[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;
[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor power supply enclosure packaging device of the utility model;
[0018] Figure 2 for Figure 1 A schematic diagram of the structure enlargement at the center A;
[0019] Figure 3 It is a partial structural exploded schematic diagram of a semiconductor power supply enclosure packaging device of the utility model;
[0020] Figure 4The utility model is a partial structural cross-sectional view of a semiconductor power supply enclosure packaging device.
[0021] Legend:
[0022] 1. Packaging table; 2. Motor; 3. First reciprocating screw; 4. Fixed plate; 5. Guide rod; 6. Spring; 7. Slide; 8. Double-headed motor; 9. Second reciprocating screw; 10. Slider; 11. Threaded rod; 12. Clamping plate; 13. Touch button; 14. Fixed nut; 15. Cavity; 16. Air pump; 17. Suction cup; 18. Roller. DETAILED DESCRIPTION
[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0024] Reference Figure 1-4 The utility model embodiment is a packaging device for a semiconductor power supply shell, which includes: a packaging table 1, a motor 2 is fixedly connected to the upper surface of the packaging table 1, a first reciprocating screw 3 is fixedly connected to the output end of the motor 2, the outer surface of the first reciprocating screw 3 is threadedly connected to a fixing plate 4, the inner surface of the fixing plate 4 is slidably connected to a guide rod 5, the outer surface of the guide rod 5 is provided with a spring 6, the inner surface of the fixing plate 4 is provided with a cavity 15, the inner surface of the cavity 15 is fixedly connected to an air pump 16, the output end of the air pump 16 is fixedly connected to a suction cup 17, the outer surface of the first reciprocating screw 3 is rotatably connected to the packaging table 1, the rear surface of the fixing plate 4 contacts the packaging table 1, both ends of the guide rod 5 are fixedly connected to the packaging table 1, the suction cup 17 extends into the interior of the cavity 15, the number of springs 6 is two and distributed left and right, the lower surface of the spring 6 is fixedly connected to the packaging table 1, the lower surface of the packaging table 1 is fixedly connected to rollers 18, the number of rollers 18 is four and distributed in a rectangular array, the motor 2 and the air pump 16 are both electrically connected to an external power supply.
[0025] The inner surface of the packaging table 1 is provided with a slide groove 7, the inner surface of the slide groove 7 is fixedly connected with a double-headed motor 8, the output end of the double-headed motor 8 is fixedly connected with a second reciprocating screw 9, the outer surface of the second reciprocating screw 9 is threadedly connected with a slider 10, the upper surface of the slider 10 is fixedly connected with a threaded rod 11, the outer surface of the threaded rod 11 is slidably connected with a clamping plate 12, the side surface of the clamping plate 12 is provided with a touch button 13, the outer surface of the threaded rod 11 is threadedly connected with a fixing nut 14, the number of threaded rods 11 is two and they are distributed on the left and right, the lower surface of the threaded rod 11 is in contact with the packaging table 1, the touch button 13 is electrically connected to the double-headed motor 8, the upper surface of the slider 10 is in contact with the clamping plate 12, and the lower surface of the fixing nut 14 is in contact with the clamping plate 12.
[0026] Working principle: Use the roller 18 to move the equipment to the processing area, and according to the shape of the power supply shell, insert the clamping plates 12 of different shapes and sizes into the threaded rod 11, and screw the fixing nut 14 to fix the position of the clamping plate 12, so that it is suitable for clamping power supply shells of different shapes and sizes. Then place the power supply shell on the packaging table 1, start the double-headed motor 8, drive the second reciprocating screw 9 to drive the two clamping plates 12 to move toward each other, and clamp the power supply shell. When the touch button 13 on the clamping plate 12 contacts the power supply shell, the double-headed motor 8 is controlled to stop automatically, so as to avoid excessive clamping. Then start the air pump 16, and use the suction cup 17 to adsorb and fix the cover plate. At this time, start the motor 2 to drive the fixed plate 4 to move downward along the guide rod 5 as a whole. Under the action of the spring 6, it can provide buffering for the fixed plate 4 when it moves downward, and finally encapsulate the cover plate on the power supply shell to complete the packaging operation.
[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A semiconductor power supply package device, characterized in that: include: A packaging platform (1), wherein a motor (2) is fixedly connected to the upper surface of the packaging platform (1), a first reciprocating screw (3) is fixedly connected to the output end of the motor (2), a fixing plate (4) is threadedly connected to the outer surface of the first reciprocating screw (3), a guide rod (5) is slidably connected to the inner surface of the fixing plate (4), a spring (6) is provided on the outer surface of the guide rod (5), a cavity (15) is provided on the inner surface of the fixing plate (4), an air pump (16) is fixedly connected to the inner surface of the cavity (15), and a suction cup (17) is fixedly connected to the output end of the air pump (16); The inner surface of the packaging table (1) is provided with a slide groove (7), the inner surface of the slide groove (7) is fixedly connected to a double-headed motor (8), the output end of the double-headed motor (8) is fixedly connected to a second reciprocating screw (9), the outer surface of the second reciprocating screw (9) is threadedly connected to a slider (10), the upper surface of the slider (10) is fixedly connected to a threaded rod (11), the outer surface of the threaded rod (11) is slidably connected to a clamping plate (12), the side surface of the clamping plate (12) is provided with a touch button (13), and the outer surface of the threaded rod (11) is threadedly connected to a fixing nut (14).
2. The semiconductor power supply package device according to claim 1, characterized in that: The outer surface of the first reciprocating screw (3) is rotatably connected to the packaging platform (1), and the rear surface of the fixed plate (4) is in contact with the packaging platform (1).
3. The semiconductor power supply package device according to claim 1, characterized in that: Both ends of the guide rod (5) are fixedly connected to the packaging platform (1), and the suction cup (17) extends into the interior of the cavity (15).
4. The semiconductor power supply package device according to claim 1, characterized in that: The number of the springs (6) is two and they are distributed on the left and right sides, and the lower surface of the spring (6) is fixedly connected to the packaging platform (1).
5. The semiconductor power supply package device according to claim 1, characterized in that: Rollers (18) are fixedly connected to the lower surface of the packaging platform (1), and the number of the rollers (18) is four and they are distributed in a rectangular array.
6. The semiconductor power supply package device according to claim 1, characterized in that: The number of the threaded rods (11) is two and they are distributed on the left and right sides, and the lower surfaces of the threaded rods (11) are in contact with the packaging platform (1).
7. The semiconductor power supply package device according to claim 1, characterized in that: The touch button (13) is electrically connected to the double-headed motor (8), and the upper surface of the slider (10) is in contact with the clamping plate (12).
8. The semiconductor power supply package device according to claim 1, characterized in that: The motor (2) and the air pump (16) are both electrically connected to an external power source, and the lower surface of the fixing nut (14) is in contact with the clamping plate (12).