Power module and electronic device

Abstract

The utility model relates to a power module and an electronic device. The power module includes: an insulator having a first main surface and a second main surface; a first contact plate and a second contact plate protruding through the first main surface and the second main surface of the insulator, respectively, and accessible from the outside; and a first power board and a second power board which are at least partially embedded in the insulator and face each other. A first set of power devices is housed on the first power plate and coupled to the first contact plate. A second set of power devices is housed on the second power plate and coupled to the second contact plate. The first contact plate, the second contact plate, the first power plate, and the second power plate are stacked in a direction perpendicular to the first power plate and the second power plate.

Description

Technical Field

[0001] The present disclosure relates to a power module with reduced parasitic effects, the power module including semiconductor power devices arranged in a multi-level structure. Background Art

[0002] "Power electronics" generally refers to the branch of technology dedicated to managing the flow of electrical energy, studying solutions capable of providing a voltage and current suitable for supplying a specific load or user. The so-called "power" module is a unit that transforms and / or influences energy from one or more sources to direct it to one or more loads. For example, a power module, usually called an "inverter", transforms direct current (DC) into alternating current (AC) to supply AC loads; a power module, usually called a "rectifier", transforms alternating current into direct current; or similarly, a power module called a "DC / DC converter" is able to increase or decrease the direct current voltage (DC) between input and output.

[0003] Currently, there are a wide variety of applications that use power conversion and / or regulation. To name a few, rectifier and DC / DC converter modules can be found in charging units of consumer electronic devices or when operating machines that operate at low DC voltages. In the increasingly prominent field of electric vehicles, as well as the electric drive of transportation vehicles, energy from batteries that store energy in the form of DC charge is inverted by modules that convert it into energy that is usable by AC loads. Similarly, in the field of renewable energy, the components of photovoltaic modules naturally produce direct energy, which will be inverted and fed into the backup distribution grid.

[0004] A power module can house different power devices, which are manufactured using semiconductor technology and implemented in suitable circuit solutions to achieve energy conversion. The semiconductor power devices inside the module are usually soldered or sintered on a substrate, which serves as a support for the same power devices, provides the necessary contacts and electrical insulation, and ensures the necessary thermal contact for maximizing the operating efficiency of the power module.

[0005] Power devices are typically associated with silicon (Si) or silicon carbide (SiC) technology, such as, for example, MOSFET (“Metal Oxide Semiconductor Field Effect Transistor”) transistors, superjunction MOSFETs, IGBTs (“Insulated Gate Bipolar Transistors”), etc., capable of operating at high voltages (up to hundreds of volts) and currents with fast switching time trends, such as gallium nitride (GaN) devices.

[0006] One of the most common circuit configurations in the field of power modules is the so-called "bridge" configuration, and more specifically the "half-bridge" configuration, which is a basic element of high power converters. Utility Model Content

[0007] It is therefore an object of the present disclosure to overcome or at least alleviate the disadvantages and limitations of the prior art.

[0008] According to the present disclosure, a power module and a method for assembling a power module are provided.

[0009] The power module includes an insulator having a first main surface and a second main surface opposite to the first main surface along a first direction. The power module also includes: a first contact plate and a second contact plate, the first contact plate and the second contact plate protrude through the first main surface and the second main surface of the insulator respectively and are accessible from the outside; a first power plate and a second power plate, the first power plate and the second power plate are at least partially embedded in the insulator and face each other, and the first power plate protrudes from the insulator; a first group of power devices, the first group of power devices is on the first power plate and coupled to the first contact plate; and a second group of power devices, the second group of power devices is accommodated on the second power plate and coupled to the second contact plate. The power module includes a first control plate, and the first control plate is coupled to the first power plate using a bonding wire. The first contact plate, the second contact plate, the first power plate, and the second power plate are at least partially stacked in the first direction.

[0010] One embodiment of the present disclosure provides a power module, which includes: an insulator, the insulator having a first main surface and a second main surface, the second main surface being opposite to the first main surface along a first direction; a first contact plate and a second contact plate, the first contact plate and the second contact plate respectively protrude through the first main surface and the second main surface of the insulator and are accessible from the outside; a first power board and a second power board, the first power board and the second power board are at least partially embedded in the insulator and face each other, and a portion of the first power board extends from the insulator; a first group of power devices, the first group of power devices is on the first power board and coupled to the first contact plate; a second group of power devices, the second group of power devices is on the second power board and coupled to the second contact plate; and a first control board, the first control board is coupled to the first group of power devices on the first power board; wherein the first contact plate, the second contact plate, the first power board and the second power board are at least partially stacked along the first direction.

[0011] According to an embodiment, a first group of power devices is stacked with a corresponding power device of a second group in a first direction.

[0012] According to an embodiment, the portion of the first power plate extending from the insulator defines an external conductive terminal.

[0013] According to an embodiment, a power module includes a first connection structure connecting a plurality of first electrically conductive terminals of a first group of power devices to a first contact plate and extending in a first direction.

[0014] According to an embodiment, the first connection structure includes a conductive pillar fixed to a plurality of first conductive terminals of a first group of power devices and a first contact plate.

[0015] According to an embodiment, the plurality of first electrically conductive terminals of the power devices of the first group are directly coupled to the first contact plate.

[0016] According to an embodiment, the plurality of second conductive terminals of the power devices of the first group are coupled to a face of the first power board.

[0017] According to an embodiment, the power module comprises a second connection structure connecting a plurality of first conductive terminals of the power devices of the second group to the first power board and extending in the first direction.

[0018] According to an embodiment, the second connection structure includes a conductive bridge having a support post fixed to the plurality of first conductive terminals of the power devices of the second group and to the first power plate.

[0019] According to an embodiment, the plurality of first conductive terminals of the power devices of the second group are directly coupled to the first power board.

[0020] According to an embodiment, a second plurality of electrically conductive terminals of the second group of power devices are coupled to a face of the second power board.

[0021] According to an embodiment, the second power plate is coupled to the second contact plate.

[0022] According to an embodiment, the power module includes a second control board, which is coplanar with the second power board along a second direction and is connected to a second group of multiple control terminals of the power device, and the second direction is transverse to the first direction, wherein the first control board is coplanar with the first power board along the second direction and is connected to a first group of multiple control terminals of the power device.

[0023] According to an embodiment, a power module includes a first conductive column and a second conductive column, the first conductive column is fixed to a first control board and protrudes through a first main surface of an insulator, the second conductive column is fixed to a second control board and protrudes through a second main surface of the insulator, wherein the protruding portion of the first conductive column and the protruding portion of the second conductive column respectively define a first external control terminal and a second external control terminal.

[0024] According to an embodiment, a portion of the first control board and a portion of the second control board protrude from the insulator and define a first external control terminal and a second external control terminal, respectively.

[0025] Another embodiment of the present disclosure provides an electronic device, which includes: a first power board, the first power board having a first surface, the first surface being opposite to the second surface along a first direction; a first plurality of power devices, the first plurality of power devices being coupled to the first surface of the first power board, each of the first plurality of power devices including a first terminal and a second terminal; a first contact board, the first contact board being coupled to the first terminal of each power device in the plurality of power devices; a first control board, the first control board being coupled to the second terminal of each power device in the first plurality of power devices by a first plurality of bonding wires; a second power board, the second power board having a first surface, the first surface being opposite to the second surface along a first direction; a second plurality of power devices, the second plurality of power devices being coupled to the first surface of the second power board, each of the second plurality of power devices including a first terminal; and a conductive bridge, the conductive bridge being coupled between the first terminal of each power device in the second plurality of power devices and the first power board.

[0026] According to an embodiment, the electronic device includes a second control board coupled to a second terminal of each power device of a second plurality of power devices by a second plurality of bond wires.

[0027] According to an embodiment, an electronic device includes: an insulator, the insulator at least partially covering a first power board and a second power board, the insulator having a first surface opposite to a second surface; a second contact plate, the second contact plate being coupled to a second surface of the second power board; and a first conductive column, the first conductive column being coupled to a first control board, wherein the first conductive column and the first contact plate each protrude through the first surface of the insulator, and the second contact plate protrudes through the second surface of the insulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] For a better understanding of the present disclosure, reference is made to the accompanying drawings, in which preferred embodiments are presented by way of non-limiting examples, in which:

[0029] Figure 1 is a top view of a power module according to the prior art;

[0030] Figure 2 is a perspective view of a power module according to one embodiment of the present disclosure;

[0031] Figure 3 is along Figure 2 The line III-III is intercepted through Figure 2 The cross section of the power module;

[0032] Figure 4 yes Figure 2 An exploded perspective view of a power module;

[0033] Figure 5 is with Figure 2Electrical diagrams related to the power modules;

[0034] Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 and Fig.12 Shown for assembly Figure 2 The successive steps of the process of producing a power module;

[0035] Fig.13 is a perspective view of a power module according to various embodiments of the present disclosure;

[0036] Fig.14 is along Fig.13 The line XIV-XIV intercepts the Fig.13 The cross section of the power module;

[0037] Fig.15 is a perspective view of a power module according to another embodiment of the present disclosure;

[0038] Fig.16 is along Fig.15 The line XVI-XVI intercepts the Fig.15 A cross section of a power module; and

[0039] Fig.17 is along Fig.15 The line XVII-XVII intersects the Fig.15 Cross section of a power module. DETAILED DESCRIPTION

[0040] Figure 1 A power module 1 is shown, which is used, for example, as an inverter, having a half-bridge configuration: this type of configuration generally provides a first side 3 and a second side 5, which are also referred to as "high side" and "low side", respectively, comprising circuit elements, such as a power device 2 of the type described previously; the power device 2 may also be a vertical channel transistor. Generally, the two sides 3, 5 are such that the source terminal 2 of the power device 2 of the high side 3 is electrically connected in series with the drain terminal of the power device 2 of the low side 5 by a conductor 4, so that the two sides 3, 5 can be defined as a cascade connection.

[0041] The first terminal 6 is externally connected to the power module 1 to connect to a DC power source ( Figure 1 The third terminal 10 is connected to the positive terminal of the power device 2 on the high side 3 and is internally connected to the drain terminal of the power device 2 on the high side 3. The second terminal 8 is externally connected to the negative terminal of the DC power source and is internally connected to the source terminal of the power device 2 on the low side 5. The third terminal 10 is externally connected to the negative terminal of the DC power source and is internally connected to the source terminal of the power device 2 on the low side 5. Figure 1The first terminal 6 and the second terminal 8 represent input terminals of the power module 1, while the third terminal 10 represents an output terminal of the power module 1. The gate terminal of the power device 2 on the low side 5 is connected to the fourth terminal 12 by means of a wire 16; the gate terminal of the power device 2 on the high side 3 is connected to the fifth terminal 14 by means of a wire 16. The fourth terminal 12 and the fifth terminal 14 serve as external control terminals for switching the two sides 3, 5 and Figure 1 The power module 1 is electrically connected to the external terminals of the power module 1 in a manner not shown.

[0042] Among the modules currently available on the market, Figure 1 The power module 1 of the embodiment of the present invention is generally located on the same plane of the power module 1, and the electrical connection between the high side 3 and the low side 5 is made using wire bonding technology. The wire 4 may generate a long current path, such as to generate high parasitic effects, which can be mainly quantified in terms of parasitic resistance and inductance. The high parasitic effects may limit the switching speed of the power module 1 and generate significant switching losses. The switching losses may have a negative impact on the operating efficiency of the power module 1, and actually represent energy in the form of heat that must be removed from the power module 1 to ensure the desired performance.

[0043] refer to Figures 2 to 4 , a power module according to one embodiment of the present disclosure is represented as a whole by the reference numeral 21 and includes: a plurality of power devices 22; a first connection structure or lead frame 23, which accommodates a first group of power devices 22, the first group of power devices 22 defining a low side 21a of the power module 21; a second connection structure or lead frame 25, which accommodates a second group of power devices 22, the second group of power devices 22 defining a high side 21b of the power module 21; a first contact plate 27 and a second contact plate 28. In this case, the terms "high" and "low" refer to the supply voltages as used in the industry. Specifically, the high side 21b is intended to be coupled to a power source at a higher voltage, and the low side 21a is intended to be coupled to a power source at a lower voltage. Figures 2 to 4 In the embodiment of the present invention, the low side 21a and the high side 21b each include three power devices 22 arranged side by side with each other. However, it is understood that the number of power devices 22 in the high side 21b and the low side 21a can be changed according to the structure of the power module 21 without significantly changing the structure of the power module 21. Figure 5 The electrical diagrams suggest design preferences to choose from.

[0044] The power module 21 also includes an insulator 30 of resin or other polymer material, in which the first lead frame 23 and the second lead frame 25 are at least partially embedded. The insulator 30 has a parallelepiped shape and has a first main face 30a and a second main face 30b opposite to each other and a pair of opposite side faces 30c. The first contact plate 27 and the second contact plate 28 protrude through the first main face 30a and the second main face 30b of the insulator 30, respectively, the first main face 30a and the second main face 30b are kept exposed to be accessible from the outside, and the first contact plate 27 and the second contact plate 28 respectively define the low-side power supply terminal (DC-) and the high-side power supply terminal (DC+) of the power module 21.

[0045] The power device 22 may be of any type, such as a MOSFET (“Metal Oxide Semiconductor Field Effect Transistor”) transistor, a superjunction MOSFET, an IGBT (“Insulated Gate Bipolar Transistor”), a Silicon Carbide (SiC) or Gallium Nitride (GaN) device, etc., capable of operating at high voltages (up to several thousand volts, such as 1200V SiC devices) and currents with fast switching time trends (up to tens of megahertz). Figures 2 to 4 In the embodiment of the present invention, in particular, the power device is a vertical channel power MOS transistor, wherein the source terminal 22a and the gate terminal 22b are on the first side and the drain terminal 22c ( Figure 3 ) on the second side.

[0046] Depending on design preference, the power devices 22 are also coupled to each other to form a power circuit. Figures 2 to 4 In the embodiment of the present invention, the power device 22 is coupled to form a Figure 5 1. The half-bridge circuit shown in the electrical diagram of FIG. Specifically, the power devices 22 of the high side 21b are connected in parallel with each other, and the power devices 22 of the low side 21a are connected in parallel with each other. However, it can be understood that the power devices 22 can be organized differently according to the function of the power module 21, for example, in a bridge configuration.

[0047] The first lead frame 23 and the second lead frame 25 are composed of an electrically and thermally conductive material (e.g., copper), are arranged at respective different levels inside the insulator 30, and are partially overlapped. In more detail, the first lead frame 23 includes a first power board 31 and a first control board 32; the second lead frame 25 includes a second power board 33 and a second control board 34. The first power board 31 and the second power board 33 at least partially face each other. The first control board 32 and the second control board 34 at least partially face each other and are coplanar with the first power board 31 and the second power board 33, respectively.

[0048] The first power board 31 has a first face 31 a and a second face 31 b opposite to each other. In addition, a portion of the first power board 31 protrudes through one of the side faces 30 c of the insulator 30 , and defines a phase terminal P of the power module 21 .

[0049] The first face 31 a of the first power board 31 accommodates the power devices 22 of the low side 21 a , and the second face 31 b of the first power board 31 is oriented toward the second power board 33 .

[0050] The second power board 33 has a first face 33a and a second face 33b opposite to each other. The first face 33a of the second power board 33 is oriented toward the first power board 31 and accommodates the power device 22 of the high side 21b. The power device 22 of the high side 21b is thus inserted between the first power board 31 and the second power board 33.

[0051] The power devices 22 of the low side 21 a have respective drain terminals 22 c which are joined to the first face 31 a of the first power plate 31 , for example by sintering.

[0052] The source terminal 22a of the power device 22 of the low side 21a is coupled to the first contact plate 27 by means of a corresponding conductive column 35 for connection to the outside, in particular to a power supply at a lower voltage. The first contact plate 27 and the conductive column 35 may be formed in a single piece.

[0053] The gate terminals 22 b of the power devices 22 of the low side 21 a are connected to the first control board 32 via respective bonding wires 36 .

[0054] The power device 22 of the high side 21b has a corresponding drain terminal 22c, which is bonded, for example by sintering, to a first face 33a of a second power plate 33. In turn, the second power plate 33 is bonded to a second contact plate 28 (e.g. formed in a single piece) for connection to the outside, in particular to a power supply at a higher voltage.

[0055] Conductive bridge 38 (see Figure 4 ) couples the source terminals 22a of the power devices 22 of the high side 21b to each other and couples them to the first power board 31. More precisely, the conductive bridge 38 has a pillar 38a engaged with the source terminal 22a and a beam 38b engaged with the second face 31b of the first power board 31. Alternatively, the pillar may be directly fixed to the first power board 31, in which case the first power board 31 also serves as a bridge for coupling the source terminals 22a to each other.

[0056] The gate terminals 22 b of the power devices 22 of the high side 21 b are connected to the second control board 34 via corresponding bonding wires 36 .

[0057] In practice, the first contact plate 27, the second contact plate 28, the first power plate 31, the second power plate 33, the power device 22 of the low side 21a, and the power device 22 of the high side 21b are all at least partially superimposed and at least partially stacked in a direction perpendicular to the first power plate 31 and the second power plate 33. The conductive pillars 35 and the conductive bridges 38 define a conductive path extending perpendicularly to the first power plate 31 and the second power plate 33, and therefore have a minimum length. Therefore, the conductive path between the high-side power supply terminal (DC+) and the phase terminal P and the conductive path between the low-side power supply terminal (DC-) and the phase terminal P are also minimized.

[0058] In one embodiment, the first control board 32 and the second control board 34 are completely embedded in the insulator 30 and are provided with a first conductive pillar 40 and a second conductive pillar 41, respectively, the first conductive pillar 40 protruding through the first main face 30a and the second conductive pillar 41 protruding through the second main face 30b. The protruding portion of the first conductive pillar 40 and the protruding portion of the second conductive pillar 41 respectively define the control terminal G of the low side 21a of the power module 21 L and the control terminal G of the high side 21b H .

[0059] Furthermore, the first control board 32 and the second control board 34 are formed so that the control terminal G L The conductive path between the gate terminal 22b of the power device 22 on the low side 21a and the control terminal G H The conductive path to the gate terminal 22 b of the power device 22 of the high side 21 b is balanced in terms of associated resistance, inductance and capacitance components.

[0060] Due to the stacked arrangement of the components of the power module 21, the conductive path between the supply terminals DC+, DC- and the phase terminal P is very short and is developed with the aid of components having a very wide channel cross section without the need to use intermediate bonding wires. Internal parasitic components associated with areas subject to the flow of high currents can be virtually eliminated, thereby facilitating switching speed and reducing associated losses.

[0061] In the described embodiment, the control terminal G L , G H The balancing of the electrical paths to the gate terminal 22 b of the power device 22 allows the power device 22 to be driven in a coherent manner.

[0062] In addition to the electrical benefits, the power module 21 described also has advantages from the point of view of heat dissipation. The heat is actually generated by the power devices 22, which are all coupled to the outside by means of high thermal conductivity paths, which are substantially transverse to the main faces 30a, 30b of the insulator 30 and therefore along the shortest vias. In addition, the structure of the power module 21 allows the use of components with wide channel cross-sections in a direction perpendicular to the main faces 30a, 30b of the insulator 30 and creates a wide heat exchange surface towards the outside according to design preferences. Heat extraction is thus allowed.

[0063] Since the first lead frame 23 and the second lead frame 25 are partially overlapped, the power module 21 has a smaller dimension relative to existing modules and can allow up to 50% area saving.

[0064] The power module 21 described can be obtained using a simplified manufacturing process, according to which, for example Figures 6 to 12 As shown, the low side 21a and the high side 21b are preassembled and then joined together.

[0065] Specifically, the power device 22 of the low side 21a is bonded to the first power board 31 ( Figure 6 ). However, it will be appreciated that in this, as in all subsequent steps of joining the components of the power module, any other coupling or die attach technique may be used according to design preference. For example, any type of welding or bonding as well as hybrid techniques may be used, such as sintering some components and welding other components of the same power module.

[0066] The conductive pillar 35 and the first contact plate 27 are then bonded to the source terminal 22a by sintering again ( Figure 7 ).

[0067] Then( Figure 8 ), the bonding wire 36 connecting the gate terminal 22b of the power device 22 of the low side 21a to the first control board 32 is formed, and the first conductive pillar 40 is applied to the first control board 32, still conveniently by sintering. The low side 21a is thus completed.

[0068] Similarly ( Fig. 9 ), the power device 22 of the high side 21b is bonded to the second power board 33 by sintering, and then the conductive bridge 38 is bonded to the source terminal 22a by sintering again ( Fig.10 ).

[0069] Then( Fig.11), a bonding wire 36 connecting the gate terminal 22b of the power device 22 of the high side 21b to the second control board 34 is formed, and a second conductive pillar 41 is applied to the second control board 34 again by sintering. The high side 21b is thus also completed.

[0070] The first power board 31 and the second power board 33 are then stacked and aligned, and the first power board is bonded to the beam 38b ( Fig.12 ).

[0071] The insulator 30 is then formed by co-molding, and Figures 2 to 4 A power module 21 is obtained.

[0072] refer to Fig.13 and Fig.14 The power module 121 according to various embodiments of the present disclosure includes: a plurality of power devices 122; a first connection structure or lead frame 123 accommodating a first group of the power devices 122, the first group of the power devices 122 defining a low side 121a of the power module 121; a second connection structure or lead frame 125 accommodating a second group of the power devices 122, the second group of the power devices 122 defining a high side 121b of the power module 121; a first contact plate 127; a second contact plate 128; and an insulator 130 of a resin or other polymer material, in which the first lead frame 123 and the second lead frame 125 are at least partially embedded. The insulator 130 has a parallelepiped shape and has a first main face 130a and a second main face 130b opposite to each other and a pair of opposite side faces 130c. The first contact plate 127 and the second contact plate 128 respectively protrude through the first main surface 130a and the second main surface 130b of the insulator 130, the first main surface 30a and the second main surface 30b are kept exposed to be accessible from the outside, and the first contact plate 127 and the second contact plate 128 respectively define the low-side power supply terminal (DC-) and the high-side power supply terminal (DC+) of the power module 121.

[0073] The first lead frame 123 includes a first power board 131 and a first control board 132; the second lead frame 125 includes a second power board 133 and a second control board 134. A portion of the first power board 131 protrudes through one of the sides 130c of the insulator 130 and defines a phase terminal P' of the power module 121.

[0074] The power device 122 of the low side 121a is arranged on the first face 131a of the first power board 131 and has a respective source terminal 122a coupled (in this case directly coupled) to the first contact plate 127. The drain terminal 122c of the power device 122 of the low side 121a is bonded to the first power board 131, for example by sintering, while the associated gate terminal 122b is connected to the first control board 132 by a respective bonding wire 136.

[0075] The power devices 122 of the high side 121b are arranged on a first face 133a of the second power board 133 oriented toward the first power board 131. The source terminals 122a of the power devices 122 of the high side 121b are coupled to each other and to the first power board 131 by means of a conductive bridge 138. In one embodiment, the conductive bridge 138 may be defined by a conductive rod directly coupled to the source terminal 122a of the power device 122 of the high side 121b and the power board 131. In practice, the source terminal 122a, the first contact plate 127, the second contact plate 128, and the conductive bridge 138 are aligned in a direction perpendicular to the first power board 131 and the second power board 133.

[0076] The drain terminal 122 c of the power device 122 of the high side 121 b is connected to the second power board 133 , for example by sintering, while the gate terminal 122 b is bonded to the second control board 134 by a corresponding bonding wire 136 .

[0077] The second power board 133 is coupled to the second contact board 128 for connecting with the outside. Specifically, the second contact board 128 extends from a second face 133b of the second power board 133 opposite to the first face 133a.

[0078] Portions of the first control board 132 and portions of the second control board 134 protrude through one of the side surfaces 130c in opposite directions relative to the first power board 131 and respectively define control terminals G of the low side 121a of the power module 121. L ' and the control terminal G of the high side 121b H '.

[0079] The first control board 132 and the second control board 134 are formed so that the control terminal G L ' and the conductive path between the gate terminal 122b of the power device 122 of the low side 121a and the control terminal G H The conductive path between the gate terminal 122b of the power device 122 of the high side 121b is balanced in terms of associated resistance, inductance and capacitance components. For example, the first control board 132 and the second control board 134 are provided with fingers 132a, 134a, which are connected from the control terminal G to the gate terminal 122b of the power device 122 of the high side 121b. L' and control terminal G H A corresponding bonding wire 136 is connected to each finger 132a, 134a, and the width of the finger 132a, 134a is respectively determined according to the bonding wire 136 and the control terminal G. L ' and control terminal G H ' distance to choose.

[0080] According to another embodiment of the present disclosure, Fig.15 , Fig.16 and Fig.17 As shown, a power module according to an embodiment of the present disclosure is indicated by reference numeral 221 as a whole and includes: a plurality of power devices 222; a first connection structure or lead frame 223 accommodating a first group of power devices 222, the first group of power devices 222 defining a low side 221a of the power module 221; a second connection structure or lead frame 225 accommodating a second group of power devices 222, the second group of power devices 222 defining a high side 221b of the power module 221; a first contact plate 227; and an insulator 230, in which the first lead frame 223 and the second lead frame 225 are at least partially embedded. The insulator 230 has a parallelepiped shape and has a first main face 230a and a second main face 230b opposite to each other and a pair of opposite side faces 230c. The first contact plate 227 and the portion of the second lead frame 225 that acts as the second contact plate respectively protrude through the first main surface 230a and the second main surface 230b of the insulator 230, and the first main surface 230a and the second main surface 230b are kept exposed to be accessible from the outside, and the first contact plate 227 and the portion of the second lead frame 225 that acts as the second contact plate respectively define the low-side power supply terminal (DC-) and the high-side power supply terminal (DC+) of the power module 221.

[0081] The first lead frame 223 includes a first power board 231 and a first control board 232; the second lead frame 225 includes a second power board 233 and a second control board 234. The first power board 231 and the second power board 233 at least partially face each other. The first control board 232 and the second control board 234 are coplanar with the first power board 231 and the second power board 233, respectively.

[0082] The first power board 231 accommodates the power device 222 of the low side 221a on the first face 231a, while the second face 231b of the first power board 231 is oriented toward the second power board 233. The drain terminal 222c of the power device 222 of the low side 221a is bonded to the first face 231a of the first power board 231. In addition, a portion of the first power board 231 protrudes through one of the side faces 230c of the insulator 230 and defines a phase terminal P″ of the power module 221.

[0083] The second power board 233 has a first face 233a and a second face 233b opposite to each other. The first face 233a of the second power board 233 is oriented toward the first power board 231 and accommodates the power device 222 of the high side 221b. The drain terminal 222c of the power device 222 of the high side 221b is bonded to the first face 233a of the first power board 233. A portion of the second power board 233 protrudes through the second main face 230b of the insulator 230 and defines a second contact plate of the power module 221.

[0084] In one embodiment, the first control board 232 and the second control board 234 are C-shaped and extend around the first power board 231 and the second power board 233, respectively. In addition, the connecting elements of the first control board 232 and the connecting elements of the second control board 234 protrude through one of the side surfaces 230c in opposite directions relative to the first power board 231, and respectively define the control terminals G of the low side 221a of the power module 221. L " and the control terminal G of the high side 221b H ”.

[0085] The first control board 232 has a rear portion 232a and an arm 232b extending from the rear portion 232a adjacent to a corresponding side of the first power board 231. The power devices 222 of the low side 221a are aligned in a row along the arm 232b and have gate terminals 222b oriented toward the same arm 232b. Bonding wires 236 connect the gate terminals 222b of the power devices 222 of the low side 221a to the corresponding adjacent arms 232b.

[0086] Similarly, the second control board 234 has a rear portion 234a and an arm 234b extending from the rear portion 234a adjacent to the corresponding side of the second power board 233. The power devices 222 of the high side 221b are aligned in a row along the arm 234b and have a gate terminal 222b oriented toward the same arm 234b. The bonding wire 236 connects the gate terminal 222b of the power device 222 of the high side 221b to the corresponding adjacent arm 234b. In one embodiment, the rear portion 234a of the second control board 234 is longer than the rear portion 232a of the first control board 232, and therefore the distance between the arms 234b is greater than the distance between the arms 232a.

[0087] exist Figures 15 to 17In the embodiment of the present invention, the first contact plate 227 is directly coupled to the source terminal 222a of the power device 222 of the low side 221a. Specifically, the contact plate 227 extends between the two rows of power devices 222 of the low side 221a and is superimposed on the source terminal 222a, and the same contact plate 227 is directly bonded to the source terminal 222a. The gate terminal 222b of the power device 222 of the low side 221a protrudes laterally from the first contact plate 227.

[0088] The first power board 231 is superimposed on the source terminal 222a of the power device 222 of the high side 221b and is directly coupled to the source terminal 222a of the power device 222 of the high side 221b, in which case no conductive bridge is inserted. The two rows of power devices 222 of the high side 221b are spaced apart from each other so that the associated gate terminal 222b protrudes laterally from the first power board 231.

[0089] Finally, it is evident that modifications and variations may be made to what is described and illustrated herein without thereby departing from the scope of the present disclosure as defined in the appended claims.

[0090] For example, power devices may be organized on more than two levels, with more than two lead frames stacked on top of each other.

[0091] A power module (21; 121; 221) can be summarized as comprising: an insulator (30; 130; 230b) having a first main face (30a; 130a; 230a) and a second main face (30b; 130b; 230b); a first contact plate (27; 127; 227) and a second contact plate (28; 128) protruding through the first main face (30a; 130a; 230a) and the second main face (30b; 130b; 230b) of the insulator (30; 130a; 230a) respectively and accessible from the outside; a first power board (31; 131; 231) and a second power board (33; 133; 233) at least partially embedded in the insulator (30; 130; 230) and facing each other; a power device (22; 122; A first group (21a; 121a; 221a) of power devices (22; 122; 222) is accommodated on a first power board (31; 131; 231) and coupled to a first contact board (27; 127; 227); a second group (21b; 121b; 221b) of power devices (22; 122; 222) is accommodated on a second power board (33; 133; 233) and coupled to a second contact board (28; 128); wherein the first contact board (27; 127; 227), the second contact board (28; 128), the first power board (31; 131; 231) and the second power board (33; 133; 233) are at least partially stacked in a direction perpendicular to the first power board (31; 131; 231) and the second power board (33; 133; 233).

[0092] The power devices (22; 122; 222) of the first group (21a; 121a; 221a) can be stacked with the corresponding power devices (22; 122; 222) of the second group (21b; 121b; 221b) in a direction perpendicular to the first power board (31; 131; 231) and the second power board (33; 133; 233).

[0093] A portion of the first power plate (31; 131; 231) may protrude from the insulator (30; 130; 230) and may define an external conductive terminal (P; P'; P").

[0094] The power module may include a first connection structure (35) connecting a first conductive terminal (22a) of a first group (21a) of power devices (22) to a first contact plate (27) and extending in a direction perpendicular to the first power plate (31; 131; 231) and the second power plate (33; 133; 233).

[0095] The first connection structure (35) may include a conductive column fixed to the first conductive terminal (22a) of the power device (22) of the first group (21a) and the first contact plate (27).

[0096] The first conductive terminals (22a) of the power devices (122; 222) of the first group (121a; 221a) may be directly coupled to the first contact plate (127; 227).

[0097] The second conductive terminals (22c; 122c; 222c) of the power devices (22; 122; 222) of the first group (21a; 121a; 221a) may be bonded to a face (31a; 131a; 231a) of the first power board (31; 131; 231).

[0098] The power module may include a second connecting structure (38; 138), which connects the first conductive terminals (22a; 122a) of the power devices (22; 122) of the second group (21b; 121b) to the first power board (31; 131) and extends in a direction perpendicular to the first power board (31; 131) and the second power board (33; 133).

[0099] The second connection structure (38; 138) may include a conductive bridge having a pillar (38a) fixed to the first conductive terminal (22a; 122a) of the power device (22; 122) of the second group (21b; 121b) and the first power board (31; 131).

[0100] The first conductive terminals (222a) of the power devices (222) of the second group (221b) may be directly coupled to the first power board (31; 131).

[0101] The second conductive terminals (22c; 122c; 222c) of the power devices (22; 122; 222) of the second group (21b; 121b; 221b) may be bonded to a face (33a; 133a; 233a) of a second power board (33; 133; 233).

[0102] The second power plate (33; 133; 233) may be bonded to the second contact plate (28; 128).

[0103] The power module may include a first control board (32; 132; 232) and a second control board (34; 134; 234), the first control board (32; 132; 232) being coplanar with the first power board (31; 131; 231) and being connected to control terminals (22b; 122b; 222b) of power devices (22; 122b; 222b) of a first group (21a; 121a; 221a), and the second control board (34; 134; 234) being coplanar with the second power board (33; 133; 233) and being connected to control terminals (22b; 122b; 222b) of power devices (22; 122; 222) of a second group (21b; 121b; 221b).

[0104] The power module may include a first conductive column (40) and a second conductive column (41), the first conductive column (40) being fixed to a first control board (32) and protruding through a first main surface (30a) of an insulator (30), and the second conductive column (41) being fixed to a second control board (34) and protruding through a second main surface (30b) of the insulator (30), wherein the protruding portion of the first conductive column (40) and the protruding portion of the second conductive column (41) respectively define a first external control terminal (G L ) and the second external control terminal (G H ).

[0105] A portion of the first control board (132; 232) and a portion of the second control board (134; 234) may protrude from the insulator (130; 230) and define external control terminals (G L 'G L ”) and external control terminal (G H 'G H ”).

[0106] A method for assembling a power module may include: bonding a first group (21a; 121a; 221a) of power devices (22; 122; 222) to a first power board (31; 131; 231); stacking and bonding a first contact board (27, 127, 227) to the power devices (22; 122; 222) of the first group (21a; 121a; 221a); ​​bonding a second group (21b; 121b; 221b) of power devices (22; 122; 222) to a second power board (33; 133; 233), wherein the second power board (33; 133; 233) is stacked and bonded to a second contact board (28; 128), and the second contact board (28; 128) is bonded to the second group (21b; 121b; 227). 1b) of the invention relates to a power device (22; 122; 222) extending relatively to each other; a first power board (31; 131; 231) is stacked and joined to a second power board (33; 133; 233); the first power board (31; 131; 231) and the second power board (33; 133; 233) are included in an insulator (30; 130; 230a) having a first main surface (30a; 130a; 230a) and a second main surface (30b; 130b; 230b), so that a first contact plate (27; 127; 227) and a second contact plate (28; 128) protrude through the first main surface (30a; 130a; 230a) and the second main surface (30b; 130b; 230b) of the insulator (30; 130; 230), respectively.

[0107] Stacking and joining a first power board (31; 131; 231) to a second power board (33; 133; 233) may include: stacking power devices (22; 122; 222) of a first group (21a; 121a; 221a) on corresponding power devices (22; 122; 222) of a second group (21b; 121b; 221b) in a direction perpendicular to the first power board (31; 131; 231) and the second power board (33; 133; 233).

[0108] The various embodiments described above can be combined to provide further embodiments. Aspects of the embodiments can be modified as necessary to employ concepts of the various patents, applications, and publications to provide further embodiments.

[0109] These and other changes can be made to the embodiments in light of the above detailed description. In general, in the appended claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full range of equivalents to which such claims are entitled. Therefore, the claims are not limited by this disclosure.

Claims

1. A power module, characterized in that: include: an insulator, the insulator having a first main surface and a second main surface, the second main surface being opposite to the first main surface along a first direction; a first contact plate and a second contact plate, the first contact plate and the second contact plate respectively protruding through the first main face and the second main face of the insulating body and being accessible from the outside; a first power board and a second power board, the first power board and the second power board being at least partially embedded in the insulator and facing each other, a portion of the first power board extending from the insulator; a first group of power devices, the first group of power devices being on the first power board and coupled to the first contact board; a second group of power devices, said second group of power devices being on said second power plate and coupled to said second contact plate; as well as a first control board coupled to the first group of the power devices on the first power board; The first contact plate, the second contact plate, the first power plate, and the second power plate are at least partially stacked along the first direction.

2. The power module according to claim 1, characterized in that: The power devices of the first group are stacked with corresponding power devices of the second group in the first direction.

3. The power module according to claim 1, characterized in that: The portion of the first power plate extending from the insulator defines an external conductive terminal.

4. The power module according to claim 1, characterized in that: A first connection structure is included, the first connection structure connects a plurality of first conductive terminals of the first group of the power devices to the first contact plate and extends in the first direction.

5. The power module according to claim 4, characterized in that: The first connection structure includes a conductive stud fixed to the plurality of first conductive terminals of the power devices of the first group and the first contact plate.

6. The power module according to claim 1, characterized in that: A first plurality of conductive terminals of the power devices of the first group are directly coupled to the first contact plate.

7. The power module according to claim 4, characterized in that: A plurality of second conductive terminals of the first group of the power devices are coupled to a face of the first power board.

8. The power module according to claim 1, characterized in that: A second connection structure is included, the second connection structure connects the plurality of first conductive terminals of the second group of the power devices to the first power board and extends in the first direction.

9. The power module according to claim 8, characterized in that: The second connection structure includes a conductive bridge having a support post fixed to the plurality of first conductive terminals of the power devices of the second group and the first power plate.

10. The power module according to claim 8, characterized in that: The plurality of first conductive terminals of the power devices of the second group are directly coupled to the first power board.

11. The power module according to claim 8, characterized in that: A second plurality of conductive terminals of the power devices of the second group are coupled to the face of the second power board.

12. The power module according to claim 1, characterized in that: The second power plate is coupled to the second contact plate.

13. The power module according to claim 1, characterized in that: A second control board is included, which is coplanar with the second power board along a second direction and is connected to multiple control terminals of the second group of the power device, and the second direction is transverse to the first direction, wherein the first control board is coplanar with the first power board along the second direction and is connected to multiple control terminals of the first group of the power device.

14. The power module according to claim 13, characterized in that: The invention comprises a first conductive column and a second conductive column, wherein the first conductive column is fixed to the first control board and protrudes through the first main surface of the insulator, and the second conductive column is fixed to the second control board and protrudes through the second main surface of the insulator, wherein the protruding portion of the first conductive column and the protruding portion of the second conductive column respectively define a first external control terminal and a second external control terminal.

15. The power module according to claim 13, characterized in that: A portion of the first control board and a portion of the second control board protrude from the insulator and define a first external control terminal and a second external control terminal, respectively.

16. An electronic device, characterized in that: include: A first power board, the first power board having a first surface, the first surface being opposite to the second surface along a first direction; a first plurality of power devices coupled to the first surface of the first power board, the first plurality of power devices each comprising a first terminal and a second terminal; a first contact plate coupled to the first terminal of each power device of the plurality of power devices; a first control board coupled to the second terminal of each of the first plurality of power devices by a first plurality of bond wires; a second power board, the second power board having a first surface, the first surface being opposite to the second surface along the first direction; a second plurality of power devices coupled to the first surface of the second power board, the second plurality of power devices each comprising a first terminal; and A conductive bridge is coupled between the first terminal of each power device in the second plurality of power devices and the first power plate.

17. The electronic device according to claim 16, characterized in that: A second control board is included, the second control board being coupled to a second terminal of each of the second plurality of power devices by a second plurality of bond wires.

18. The electronic device according to claim 16, characterized in that: include: an insulator, the insulator at least partially covering the first power board and the second power board, the insulator having a first surface opposite to a second surface; a second contact plate coupled to the second surface of the second power plate; as well as A first conductive post is coupled to the first control plate, wherein the first conductive post and the first contact plate each protrude through the first side of the insulator, and the second contact plate protrudes through the second side of the insulator.

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