Packaging equipment

Abstract

The embodiment of the utility model provides packaging equipment, and the equipment comprises a rack which comprises a placement platform; the lifting mechanism is located on the placing platform and comprises a guide rod and a lifting platform, and the lifting platform moves up and down along the guide rod; the upper die is fixed at the bottom of the lifting platform; the lower mold is fixed on the placing platform, and the lower mold is provided with a first accommodating cavity with an opening in one end and is used for loading a product to be subjected to heat sealing; wherein the upper die and the lower die are opposite in position, the upper die and the lower die are connected to the two electrodes of the high frequency respectively, under the control of the control mechanism, the lifting platform moves downwards along the guide rod so that products to be subjected to heat sealing in the upper die and the lower die can make close contact, and the high frequency starts heating so that the upper die and the lower die can be fixed in a heat sealing mode. According to the technical scheme, the problems that a traditional heat sealing device is uneven in heating area, a heating piece is prone to being burnt out, and burnt bubbles are prone to being generated can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of plastic product processing, and in particular to a packaging device. Background Art

[0002] With the continuous development of industrial automation, packaging technology has become an indispensable part of the manufacturing industry. In the field of plastic product processing, heat sealing packaging technology is favored because of its high efficiency, environmental protection and wide applicability.

[0003] In the existing heat sealing packaging technology, traditional heat sealing equipment heats the materials by direct electric heating. However, this method has problems such as uneven heating area, easy burning of the heating plate and easy generation of burnt bubbles.

[0004] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0005] The embodiments of the present application provide a packaging device to solve or alleviate one or more of the technical problems mentioned above.

[0006] As one aspect of an embodiment of the present application, an embodiment of the present application provides a packaging device, including: a rack, the rack including a placement platform;

[0007] A lifting mechanism is located on the placement platform, the lifting mechanism comprises a guide rod and a lifting platform, and the lifting platform moves up and down along the guide rod;

[0008] An upper mold, the upper mold is fixed to the bottom of the lifting platform;

[0009] A lower mold, the lower mold is fixed on the placement platform, and the lower mold has a first accommodating cavity with an open end for loading the product to be heat-sealed;

[0010] Among them, the upper mold is opposite to the lower mold, and the upper mold and the lower mold are respectively connected to two electrodes of high frequency. Under the control of the control mechanism, the lifting platform moves downward along the guide rod so that the products to be heat-sealed in the upper mold and the lower mold are in close contact, and the high frequency starts heating so that the upper mold and the lower mold are heat-sealed and fixed.

[0011] Optionally, the rack further comprises a support portion, the support portion is located on the placement platform and is spaced apart from the placement platform by a preset distance in the height direction; the support portion has a second accommodating cavity, the second accommodating cavity faces the placement platform; the second accommodating cavity is provided with a downward opening, and a fixing platform is provided at the opening of the second accommodating cavity;

[0012] The lifting platform comprises a first lifting platform, a second lifting platform located under the first lifting platform, and a third lifting platform located under the second lifting platform, wherein the first lifting platform is located under the fixed platform; the first end of the guide rod is fixed to the first lifting platform, and the second end of the guide rod extends out of the fixed platform; the lifting mechanism further comprises a cylinder, a connecting rod and an insulating rod; the first end of the cylinder is connected to the fixed platform, and the second end of the cylinder is connected to the first lifting platform; the first end of the connecting rod is connected to the first lifting platform, and the second end of the connecting rod is connected to the second lifting platform; the first end of the insulating rod is connected to the second lifting platform, and the second end of the insulating rod is connected to the third lifting platform;

[0013] Among them, the upper mold is fixed to the third lifting platform. Under the control of the cylinder, the first lifting platform moves up and down along the guide rod, and the second lifting platform and the third lifting platform cooperate with the movement of the first lifting platform, thereby driving the upper mold to move.

[0014] Optionally, the number of connecting rods is six.

[0015] Optionally, the number of the insulating rods is four.

[0016] Optionally, the connecting rod is a screw rod, which is used to adjust the distance between the first lifting platform and the second lifting platform.

[0017] Optionally, the frame further comprises two side panels;

[0018] The support part is fixed above the placement platform through the two side plates, and the support part and the placement platform form an operating space.

[0019] Optionally, a touch screen is provided on the outer wall of the support portion, the touch screen is provided with a plurality of buttons, and the support portion is used to accommodate a control circuit.

[0020] Optionally, the packaging device further comprises a turntable; wherein:

[0021] The turntable is rotatably located on the placement platform;

[0022] Wherein, the lower mold is fixed on the turntable, and under the control of the motor, the turntable rotates so that the upper mold and the lower mold are positioned opposite to each other.

[0023] Optionally, there are multiple lower dies, and the multiple lower dies are circumferentially distributed on the edge of the turntable.

[0024] Optionally, a spring is embedded in the lower die, and the spring is used to absorb the impact force generated by the upper die and the lower die during the closing process.

[0025] The above technical solution adopted in the embodiment of the present application may include the following advantages: by connecting the upper mold and the lower mold to the two electrodes of the high frequency wave respectively, the control mechanism controls the lifting mechanism to move downward, so that the products to be heat-sealed in the upper mold and the lower mold are in close contact. The high frequency wave starts heating so that the upper mold and the lower mold are heat-sealed and fixed, thereby solving the problem of uneven heating area, easy burning of the heating plate and easy generation of burnt bubbles caused by direct electric heating of the traditional heat-sealing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0027] Figure 1 It is a schematic diagram of the structure of the packaging device provided in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] Frame 1, support part 11, fixed platform 111, placement platform 12, turntable 121, lifting mechanism 2, connecting rod 21, guide rod 22, lifting platform 23, first lifting platform 231, second lifting platform 232, third lifting platform 233, cylinder 24, insulating rod 25, upper mold 3, lower mold 4. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other in the absence of conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] The following provides an explanation of the terms used in this application.

[0033] High frequency: It is a high frequency electromagnetic wave with a frequency greater than 100KHz. Its working principle is to use high frequency electromagnetic field to make the molecules inside the material collide violently with each other to generate high temperature, so as to achieve the purpose of welding and welding. According to different needs, such as the characteristics of PVC, TPU, EVA, PET and other plastics or plastic materials, corresponding heat welding is carried out.

[0034] Hereinafter, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. It should be noted that these exemplary embodiments can be implemented in many different forms and should not be construed as being limited to the embodiments described herein.

[0035] like Figure 1 As shown, the packaging equipment may include: a frame 1, a lifting mechanism 2, an upper mold 3, and a lower mold 4.

[0036] The structures and matching relationships of the frame 1, the lifting mechanism 2, the upper mold 3, and the lower mold 4 are introduced below.

[0037] A rack 1, the rack 1 includes a placement platform 12;

[0038] The lifting mechanism 2 is located on the placement platform 12. The lifting mechanism 2 includes a guide rod 22 and a lifting platform. The lifting platform moves up and down along the guide rod 22.

[0039] The upper mold 3 is fixed to the bottom of the lifting platform;

[0040] The lower mold 4 is fixed on the placement platform 12, and the lower mold 4 has a first accommodating cavity with one end open for loading the product to be heat-sealed.

[0041] Among them, the upper mold 3 and the lower mold 4 are positioned opposite to each other, and the upper mold 3 and the lower mold 4 are respectively connected to two electrodes of the high frequency. Under the control of the control mechanism, the lifting platform moves downward along the guide rod 22 so that the products to be heat-sealed in the upper mold 3 and the lower mold 4 are in close contact, and the high frequency starts heating so that the upper mold 3 and the lower mold 4 are heat-sealed and fixed.

[0042] Specifically, the placement platform 12 can be made of materials that are wear-resistant, high-temperature resistant, and have high flatness, such as stainless steel or aluminum alloy, so as to improve the durability and load-bearing capacity of the platform. The bottom of the frame 1 can be provided with adjustable support feet so that it can be adjusted according to the height and levelness of the work site. The lifting mechanism 2 is located on the placement platform 12. The lifting mechanism 2 includes a guide rod 22 and a lifting platform. The surface of the guide rod 22 can be specially treated (such as chrome plating) to reduce friction and thus improve durability. The guide rod 22 can use a linear guide rail, and the lifting platform moves up and down along the guide rod 22, thereby improving the stability of the movement of the lifting platform. The lifting platform uses lightweight and high-strength materials (such as aluminum alloy) to reduce the overall weight while ensuring strength. The upper mold 3 is fixed to the bottom of the lifting platform. The lower mold 4 is fixed to the placement platform 12. The lower mold 4 has a first accommodating cavity with an opening at one end for loading the product to be heat-sealed. The corresponding molds (upper mold 3 and lower mold 4) can be made according to different products, so that the products to be heat-sealed in the upper mold 3 and the lower mold 4 can fit closely, thereby achieving uniform heating. A temperature sensor can be integrated inside the mold to monitor the mold temperature in real time. The upper mold 3 and the lower mold 4 are opposite to each other, and the upper mold 3 and the lower mold 4 are respectively connected to two high-frequency electrodes. High-frequency heating provides a uniform heating area and reduces damage to the material. An insulating layer can be set between the electrode and the mold to reduce the possibility of leakage.

[0043] In this embodiment, under the control of the control mechanism, the lifting platform moves downward along the guide rod 22 so that the products to be heat-sealed in the upper mold 3 and the lower mold 4 are in close contact. The high-frequency heating makes the upper mold 3 and the lower mold 4 heat-sealed and fixed, thereby alleviating the problems of uneven heating area, easy burning of the heating plate and easy generation of burnt bubbles caused by direct electric heating in traditional heat-sealing equipment.

[0044] In an optional embodiment, the rack 1 further includes a support portion 11, the support portion 11 is located on the placement platform 12 and is spaced apart from the placement platform 12 by a preset distance in the height direction; the support portion 11 has a second accommodating cavity, the second accommodating cavity faces the placement platform 12; the second accommodating cavity is provided with a downward opening, and a fixing platform 111 is provided at the opening of the second accommodating cavity;

[0045] The lifting platform includes a first lifting platform 231, a second lifting platform 232 located under the first lifting platform 231, and a third lifting platform 233 located under the second lifting platform 232, wherein the first lifting platform 231 is located under the fixed platform 111; the first end of the guide rod 22 is fixed to the first lifting platform 231, and the second end of the guide rod 22 extends out of the fixed platform 111; the lifting mechanism 2 also includes a cylinder 24, a connecting rod 21 and an insulating rod 25; the first end of the cylinder 24 is connected to the fixed platform 111, and the second end of the cylinder 24 is connected to the first lifting platform 231; the first end of the connecting rod 21 is connected to the first lifting platform 231, and the second end of the connecting rod 21 is connected to the second lifting platform 232; the first end of the insulating rod 25 is connected to the second lifting platform 232, and the second end of the insulating rod 25 is connected to the third lifting platform 233;

[0046] Among them, the upper mold 3 is fixed to the third lifting platform 233. Under the control of the cylinder 24, the first lifting platform 231 moves up and down along the guide rod 22, and the second lifting platform 232 and the third lifting platform 233 cooperate with the movement of the first lifting platform 231, thereby driving the upper mold 3 to move.

[0047] Specifically, the rack 1 includes a support portion 11 in addition to the placement platform 12. The support portion 11 is located above the placement platform 12 and is spaced a certain distance from the placement platform 12 in the height direction. The support portion 11 is provided with a second accommodating cavity facing the placement platform 12. The second accommodating cavity is provided with a downward opening. A fixed platform 111 is provided at the opening of the second accommodating cavity, and the fixed platform 111 is used to provide stable support for the lifting mechanism 2. The platform can be fixed to the platform at the opening of the second accommodating cavity by welding, so that it is not easy to fall off or deform when subjected to heavy pressure. In addition, there are other alternative solutions, such as using bolts and nuts to tightly connect the platform to the opening of the second accommodating cavity, so as to facilitate installation and disassembly, which is suitable for occasions where frequent adjustment or replacement of the platform is required. The lifting platform is located on the placement platform 12. The lifting platform is composed of a multi-layer platform, including a first lifting platform 231, a second lifting platform 232 located under the first lifting platform 231, and a third lifting platform 233 located under the second lifting platform 232. The first lifting platform 231 is located under the fixed platform 111. The first end of the guide rod 22 is fixed to the first lifting platform 231, and the second end of the guide rod 22 extends out of the fixed platform 111, thereby providing a stable guide for the movement of the lifting platform. The lifting mechanism 2 also includes a cylinder 24, a connecting rod 21 and an insulating rod 25. The first end of the cylinder 24 is connected to the fixed platform 111, and the second end thereof is connected to the first lifting platform 231. By controlling the extension and contraction of the cylinder 24, the up and down movement of the first lifting platform 231 is effectively controlled. The first end of the connecting rod 21 is connected to the first lifting platform 231, and the second end of the connecting rod 21 is connected to the second lifting platform 232. Through the transmission of the connecting rod 21, the movement of the first lifting platform 231 will drive the second lifting platform 232 to move synchronously. The connecting rod 21 can be made of high-strength materials (such as stainless steel, etc.) so that it can withstand sufficient pressure during the lifting process. The first end of the insulating rod 25 is connected to the second lifting platform 232, and the second end of the insulating rod 25 is connected to the third lifting platform 233, so that the movement of the second lifting platform 232 will drive the third lifting platform 233 to move synchronously, and at the same time, it also plays a role in isolating the current, thereby increasing the safety of the equipment. The upper mold 3 is fixed to the third lifting platform 233. Bolts and nuts can be used to fix the upper mold 3 and the third lifting platform 233, thereby improving the efficiency of replacing the upper mold 3. In addition, welding can also be used to fix the upper mold 3, so that the upper mold 3 remains stable in a high-speed working environment and is not easy to fall off. The fixing method between the upper mold 3 and the third lifting platform 233 can also be determined according to actual conditions.

[0048] In this embodiment, under the control of the cylinder 24, the first lifting platform 231 moves up and down along the guide rod 22, the second lifting platform 232 and the third lifting platform 233 cooperate with the movement of the first lifting platform 231, and drive the upper mold 3 to move, thereby achieving close contact between the products to be heat-sealed in the upper mold 3 and the lower mold 4.

[0049] In an optional embodiment, the number of connecting rods 21 can be six. The six connecting rods 21 can be evenly distributed around the lifting platform, thereby providing a uniform supporting force for the platform. It should be noted that the number of connecting rods 21 can also be determined according to actual needs.

[0050] In an optional embodiment, the number of insulating rods 25 can be four. The four insulating rods 25 can be located at the four corners of the lifting platform respectively. The insulating rods 25 can be made of materials with excellent electrical insulation properties, such as insulating plastics or glass fiber reinforced plastics (FRP). The four insulating rods 25 not only provide support and transfer lifting force, but also provide electrical insulation protection, thereby improving the safety of operation. It should be noted that the number of insulating rods 25 can also be determined according to actual needs.

[0051] In an optional embodiment, the connecting rod 21 may be a screw rod. The screw rod is used to adjust the distance between the first lifting platform 231 and the second lifting platform 232. In order to improve the accuracy of the adjustment, a scale or mark may be provided on the screw rod so that the operator can directly read the adjustment distance.

[0052] In an optional embodiment, the frame 1 further includes two side panels;

[0053] The support portion 11 is fixed above the placement platform 12 through two side panels, and the support portion 11 and the placement platform 12 form an operating space.

[0054] Specifically, the support part 11 is fixed on the top of the placement platform 12 through two side plates. The side plates, the placement platform 12, and the support part 11 can be fixed by welding or using fasteners such as bolts. The support part 11 and the placement platform 12 form an operating space that can accommodate the lifting mechanism 2, the mold (upper mold 3 and lower mold 4) and other components. The size and height of the operating space can be set according to the specific usage scenario.

[0055] In an optional embodiment, a touch screen is provided on the outer wall of the support portion 11, and the touch screen is provided with a plurality of buttons, and the support portion 11 is used to accommodate a control circuit. Heating time, holding time, and other parameters can be set and realized on the touch screen. Through the touch screen, the operator can intuitively control and monitor various functions and working states of the rack 1.

[0056] In an optional embodiment, the packaging device may further include a turntable 121, which is rotatably located on the placement platform 12; wherein the lower mold 4 is fixed on the turntable 121, and under the control of a motor, the turntable 121 rotates so that the upper mold 3 and the lower mold 4 are positioned relative to each other.

[0057] In some embodiments, the turntable 121 is circular or other suitable shapes, which are not limited here. The turntable 121 can be rotatably fixed on the placement platform 12, and the connection method between the turntable 121 and the placement platform 12 can be by installing one or more bearing seats at the center of the placement platform 12, and the bearings are installed in the bearing seats. The turntable 121 is connected to the bearings through one or more shafts, and the two ends of the shafts are fixed in the bearings, so that the turntable 121 can rotate on the bearings. The design of the bearing seat and the shaft can be adjusted according to the size and weight of the turntable 121 to improve the stability and load-bearing capacity of the rotation. Bolt holes can be preset on the lower mold 4 and the turntable 121, and bolts and nuts can be used to fix the lower mold 4 on the turntable 121, so as to improve the firmness of the connection between the lower mold 4 and the turntable 121. Under the control of the motor, the turntable 121 rotates so that the upper mold 3 and the lower mold 4 are opposite.

[0058] In this embodiment, under the control of the motor, the turntable 121 rotates the product to be heat-sealed placed in the lower mold 4 to a position corresponding to the upper mold 3. The lifting mechanism 2 drives the upper mold 3 downward, and the products to be heat-sealed in the upper mold 3 and the lower mold 4 are in close contact. The high-frequency heating starts, and after a fixed time, the high-frequency heating stops. After the heating stops, there will be a cooling and holding time. After the holding time, the lifting mechanism 2 drives the upper mold 3 upward to reset, and the heat-sealing package is completed.

[0059] In an optional embodiment, there are multiple lower molds 4, and the multiple lower molds 4 are circumferentially distributed on the edge of the turntable 121. The turntable 121 is controlled by a motor to rotate and rotate the product to be heat-sealed on the lower mold 4 to a position corresponding to the upper mold 3. After the heat-sealing and packaging of the product in one lower mold 4 is completed, the turntable 121 continues to rotate and enters the next working cycle, thereby improving the production efficiency.

[0060] In an optional embodiment, the lower die 4 may have a built-in spring, which is used to absorb the impact force generated by the upper die 3 and the lower die 4 during the closing process.

[0061] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0062] For the convenience of description, the orientation or position relationship indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, vertical, horizontal" and "top, bottom" is usually based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Therefore, the exemplary term "above..." can include both "above..." and "below..." orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used here are interpreted accordingly.

[0063] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0064] Unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0065] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0066] It should also be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when a specific feature, structure or characteristic is described in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present invention.

[0067] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0068] It should also be noted that the above are only preferred embodiments of the present application, and the patent protection scope of the present application is not limited thereto. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A packaging device, characterized in that: include: A frame, wherein the frame includes a placement platform; A lifting mechanism is located on the placement platform, the lifting mechanism comprises a guide rod and a lifting platform, and the lifting platform moves up and down along the guide rod; An upper mold, the upper mold is fixed to the bottom of the lifting platform; A lower mold, the lower mold is fixed on the placement platform, and the lower mold has a first accommodating cavity with an open end for loading the product to be heat-sealed; Among them, the upper mold is opposite to the lower mold, and the upper mold and the lower mold are respectively connected to two electrodes of high frequency. Under the control of the control mechanism, the lifting platform moves downward along the guide rod so that the products to be heat-sealed in the upper mold and the lower mold are in close contact, and the high frequency starts heating so that the upper mold and the lower mold are heat-sealed and fixed.

2. The packaging device according to claim 1, characterized in that: Also includes: The frame further comprises a support portion, the support portion is located on the placement platform and is spaced apart from the placement platform by a preset distance in the height direction; the support portion has a second accommodating cavity, the second accommodating cavity faces the placement platform; the second accommodating cavity is provided with a downward opening, and a fixing platform is provided at the opening of the second accommodating cavity; The lifting platform comprises a first lifting platform, a second lifting platform located under the first lifting platform, and a third lifting platform located under the second lifting platform, wherein the first lifting platform is located under the fixed platform; the first end of the guide rod is fixed to the first lifting platform, and the second end of the guide rod extends out of the fixed platform; the lifting mechanism further comprises a cylinder, a connecting rod and an insulating rod; the first end of the cylinder is connected to the fixed platform, and the second end of the cylinder is connected to the first lifting platform; the first end of the connecting rod is connected to the first lifting platform, and the second end of the connecting rod is connected to the second lifting platform; the first end of the insulating rod is connected to the second lifting platform, and the second end of the insulating rod is connected to the third lifting platform; Among them, the upper mold is fixed to the third lifting platform. Under the control of the cylinder, the first lifting platform moves up and down along the guide rod, and the second lifting platform and the third lifting platform cooperate with the movement of the first lifting platform, thereby driving the upper mold to move.

3. The packaging device according to claim 2, characterized in that: The number of the connecting rods is six.

4. The packaging device according to claim 2, characterized in that: The number of the insulating rods is four.

5. The packaging device according to claim 2, characterized in that: The connecting rod is a screw rod, which is used to adjust the distance between the first lifting platform and the second lifting platform.

6. The packaging device according to claim 2, characterized in that: The frame also includes two side panels; The support part is fixed above the placement platform through the two side plates, and the support part and the placement platform form an operating space.

7. The packaging device according to claim 2, characterized in that: The outer wall of the support part is provided with a touch screen, the touch screen is provided with a plurality of buttons, and the support part is used to accommodate a control circuit.

8. The packaging device according to any one of claims 1 to 7, characterized in that: Also included is a turntable; wherein: The turntable is rotatably located on the placement platform; The lower die is fixed on the turntable, and under the control of a motor, the turntable rotates so that the upper die and the lower die are positioned opposite to each other.

9. The packaging device according to claim 8, characterized in that: There are multiple lower molds, and the multiple lower molds are circumferentially distributed on the edge of the turntable.

10. The packaging device according to any one of claims 1 to 7, characterized in that: A spring is embedded in the lower die, and the spring is used to absorb the impact force generated by the upper die and the lower die during the closing process.

Images