SiP system and electronic product

Abstract

The embodiment of the utility model provides a SiP system and an electronic product. The SiP system comprises a core system SiP, a WiFi SiP, an antenna module and an isolation assembly. The first surface is connected with the core system SiP, and the WiFi module is arranged between the first surface and the second surface; the sputtering coating antenna is arranged on the second surface; the sputtering coating antenna is electrically connected with the core system SiP through the first connecting piece; the first isolation part is arranged between the WiFi module and the first connecting piece; an isolation groove is formed between the WiFi module and the sputtering coating antenna, the second isolation part is arranged in the isolation groove, and the second isolation part is connected with the first isolation part so as to isolate the WiFi module from the antenna module; through the arrangement of the sputtering antenna and the isolation assembly, the stacking structure of the SiP system is effectively reduced, and the stability of the SiP system is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product processing, and more specifically, to a SiP system and an electronic product. Background Art

[0002] In the prior art, in order to meet the requirements of miniaturization and lightweight of AR (Augmented Reality) modules, the core system part of the AR module is usually made into SiP (System in Package) to form a SiP system.

[0003] However, the WiFi antenna in the current SiP system is usually integrated into the structure of the WiFi part by using an onboard or external FPC (Flexible Printed Circuit) antenna, resulting in a larger stacked structure of the SiP system and poor stability.

[0004] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content

[0005] One purpose of the utility model is to provide a new technical solution for a SiP system and electronic products.

[0006] According to a first aspect of the present utility model, a SiP system is provided, wherein the SiP system comprises:

[0007] Core system SiP;

[0008] A WiFi SiP, wherein the WiFi SiP comprises a first surface, a second surface and a WiFi module, wherein the first surface and the second surface are two opposite sides of the WiFi SiP, the first surface is connected to the core system SiP, and the WiFi module is arranged between the first surface and the second surface;

[0009] An antenna module, the antenna module comprising a sputtering antenna and a first connector, the sputtering antenna being disposed on the second surface, and the sputtering antenna being electrically connected to the core system SiP through the first connector;

[0010] An isolation component, the isolation component includes a first isolation portion and a second isolation portion, the first isolation portion is arranged between the WiFi module and the first connecting member; an isolation groove is arranged between the WiFi module and the sputtering antenna, the second isolation portion is arranged in the isolation groove, and the second isolation portion is connected to the first isolation portion, so as to isolate the WiFi module from the antenna module.

[0011] Optionally, the isolation groove is trapezoidal.

[0012] Optionally, the material of the first isolation portion includes at least one of nickel silver, 314 stainless steel and 316 stainless steel;

[0013] The second isolation portion is made of silver paste.

[0014] Optionally, the SiP system further includes a shielding portion, which surrounds at least a portion of the WiFi module, and the shielding portion is connected to the second isolation portion.

[0015] Optionally, the material of the shielding portion includes at least one of 314 stainless steel and 316 stainless steel.

[0016] Optionally, the material of the sputtering antenna includes at least one of 314 stainless steel and 316 stainless steel.

[0017] Optionally, the first connecting member is a copper column.

[0018] Optionally, the SiP system further includes a second connector, and the second connector is used to electrically connect the WiFi module and the core system SiP.

[0019] Optionally, the SiP system further includes a flexible printed circuit board, and the flexible printed circuit board is electrically connected to the core system SiP.

[0020] According to a second aspect of the present invention, an electronic product is provided, which includes a SiP system as arbitrarily described in the first aspect.

[0021] According to an embodiment of the utility model, a SiP system is provided, the SiP system includes a core system SiP, a WiFi SiP, an antenna module and an isolation component, the WiFi SiP includes a first surface, a second surface and a WiFi module, the first surface and the second surface are two opposite sides of the WiFi SiP, the first surface is connected to the core system SiP, and the WiFi module is arranged between the first surface and the second surface; the antenna module includes a sputtering antenna and a first connector, the sputtering antenna is arranged on the second surface, and the sputtering antenna is electrically connected to the core system SiP through the first connector; the isolation component includes a first isolation part and a second isolation part, the first isolation part is arranged between the WiFi module and the first connector; an isolation groove is arranged between the WiFi module and the sputtering antenna, the second isolation part is arranged in the isolation groove, and the second isolation part is connected to the first isolation part, so as to isolate the WiFi module from the antenna module; through the arrangement of the sputtering antenna and the isolation component, the stacking structure of the SiP system is effectively reduced, and the stability of the SiP system is ensured.

[0022] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0024] Figure 1 It is a structural schematic diagram of a SiP system in one embodiment of the utility model.

[0025] Figure 2 It is a flow chart of a method for manufacturing a SiP system in one embodiment of the utility model.

[0026] Description of reference numerals:

[0027] 1. Core system SiP; 2. WiFi SiP; 21. First surface; 22. Second surface; 23. WiFi module; 231. Main chip; 232. Auxiliary circuit; 24. Isolation groove; 3. Antenna module; 31. Sputtered antenna; 32. First connector; 4. Isolation component; 41. First isolation part; 42. Second isolation part; 5. Shielding part; 6. Flexible printed circuit board. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0029] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0030] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0031] According to an embodiment of the present application, a SiP system is provided. Figure 1 As shown, the SiP system includes a core system SiP1, a WiFi SiP2, an antenna module 3 and an isolation component 4. The WiFi SiP2 includes a first surface 21, a second surface 22 and a WiFi module 23. The first surface 21 and the second surface 22 are the WiFi On the opposite sides of SiP2, the first surface 21 is connected to the core system SiP1, and the WiFi module 23 is arranged between the first surface 21 and the second surface 22; the antenna module 3 includes a sputtered antenna 31 and a first connecting member 32, the sputtered antenna 31 is arranged on the second surface 22, and the sputtered antenna 31 is electrically connected to the core system SiP1 through the first connecting member 32; the isolation component 4 includes a first isolation part 41 and a second isolation part 42, the first isolation part 41 is arranged between the WiFi module 23 and the first connecting member 32; an isolation groove 24 is arranged between the WiFi module 23 and the sputtered antenna 31, the second isolation part 42 is arranged in the isolation groove 24, and the second isolation part 42 is connected to the first isolation part 41, so as to isolate the WiFi module 23 from the antenna module 3.

[0032] Specifically, Figure 1As shown, the core system SiP1 described in the embodiment of the present application is a core system highly integrated module that uses SiP to encapsulate the core system part, and the WiFi SiP2 is a WiFi highly integrated module that uses SiP to encapsulate the WiFi part. The core system SiP1 includes a display, a sensor, a computing platform, an interactive interface, a network connection, and a rendering engine. The WiFi SiP2 includes the first surface 21 and the second surface 22, and the first surface 21 is connected to the core system SiP1. Among them, after the WiFi SiP2 is connected to the core system SiP1, the side of the WiFi SiP2 facing away from the core system SiP1 is formed with a mold surface of the WiFi SiP2, and the mold surface of the WiFi SiP2 is the second surface 22. The second surface 22 can be formed by the sputtering antenna pattern method to form the sputtering antenna 31, and the sputtering antenna 31 is connected to the core system SiP1 through the first connector 32.

[0033] Therefore, the embodiment of the present application makes the core system part and the WiFi part into a modular SiP, and forms the sputtering antenna 31 on the mold surface of the formed WiFi SiP2, so that the sputtering antenna 31 can be built into the WiFi SiP2. In this way, the stacking structure size of the SiP system in the embodiment of the present application is effectively reduced, the height of the package size is reduced, and compared with the traditional setting method of using a board-mounted or external FPC antenna integrated in the structure of the WiFi part, the size and area of ​​the core circuit of the SiP system are greatly saved, making the ID (Industrial Design) of the electronic product including the SiP system more flexible and beautiful, and more conducive to the promotion and use of electronic products.

[0034] In addition, in order to further prevent the sputtering antenna 31 built into the WiFi SiP2 from affecting the performance of the WiFi module 23 of the WiFi SiP2, resulting in poor stability of the SiP system, the embodiment of the present application also provides an isolation component 4 between the WiFi module 23 and the antenna module 3, the isolation component 4 includes a first isolation portion 41 and a second isolation portion 42, the first isolation portion 41 is provided between the WiFi module 23 and the first connector 32; an isolation groove 24 is provided between the WiFi module 23 and the sputtering antenna 31, the second isolation portion 42 is provided in the isolation groove 24, and the second isolation portion 42 is connected to the first isolation portion 41. In this way, through the provision of the first isolation portion 41 and the second isolation portion 42, the isolation of the WiFi module 23 and the antenna module 3 is effectively achieved, which greatly ensures the working stability and reliability of the WiFi module 23, and significantly improves the stability of the SiP system.

[0035] Among them, the SiP is an advanced electronic packaging technology, which refers to the integration of multiple electronic components and functions in one packaging unit to form a complete system. For example, the SiP can integrate multiple chips and passive components in one package, and reduce the physical distance between the components to effectively reduce the power consumption of the overall module and improve the integration of the overall module. In addition, the SiP can also adopt a variety of different packaging forms, including BGA (Ball Grid Array), WLP (Wafer Level Package), 3D-IC (Three-dimensional integrated circuit) stacking, etc., to make the applicability of the SiP wider. Furthermore, the SiP can also reduce the number of external components, effectively simplify the PCB (Printed Circuit Board) design, and significantly reduce the overall cost. In addition, the SiP also helps to achieve the miniaturization of electronic equipment and meet the needs of miniaturization and lightweight electronic products.

[0036] Optionally, the isolation groove 24 is trapezoidal.

[0037] Specifically, Figure 1 As shown, the WiFi module 23 of the embodiment of the present application includes a main chip 231 and an auxiliary circuit 232, and the mounting surfaces of the main chip 231 and the auxiliary circuit 232 are located in the same plane. The first isolation portion 41 is a metal shielding cover, and the first isolation portion 41 covers at least part of the auxiliary circuit 232 to isolate the auxiliary circuit 232 from the first connecting member 32.

[0038] Therefore, in order to further isolate the WiFi module 23 from the sputtered antenna 31, the embodiment of the present application further provides an isolation groove 24 facing the first surface 21 on the second surface 22. The bottom of the isolation groove 24 is located on the side of the first isolation portion 41 facing the second surface 22, so that after the second isolation portion 42 is arranged in the isolation groove 24, the second isolation portion 42 can be connected to the first isolation portion 41, thereby better achieving the isolation between the WiFi module 23 and the antenna module 3.

[0039] Among them, the isolation groove 24 described in the embodiment of the present application is trapezoidal, so as to effectively ensure the molding quality of the second isolation part 42 and improve the stability and reliability of the SiP system.

[0040] Of course, on the basis of satisfying the molding quality of the second isolation portion 42, the isolation groove 24 can also be set to be a rectangle or a triangle. Those skilled in the art can make a choice according to actual needs, and this application does not make any specific restrictions here.

[0041] Optionally, the material of the first isolation portion 41 includes at least one of nickel silver, 314 stainless steel and 316 stainless steel; the material of the second isolation portion 42 is silver paste.

[0042] Specifically, the embodiment of the present application effectively ensures the isolation effect of the first isolation part 41 and significantly reduces the manufacturing cost of the first isolation part 41 by setting the material of the first isolation part 41 to any one of nickel silver, 314 stainless steel and 316 stainless steel.

[0043] Of course, the embodiment of the present application can also select any two or three of nickel silver, 314 stainless steel and 316 stainless steel to manufacture the first isolation part 41. Those skilled in the art can make a selection according to actual needs, and the present application does not make any specific restrictions here.

[0044] In addition, in the embodiment of the present application, the material of the second isolation portion 42 is set to silver paste, so that when the second isolation portion 42 is formed, the isolation effect of the second isolation portion 42 can be more effectively guaranteed.

[0045] Optionally, the SiP system further includes a shielding portion 5 , wherein the shielding portion 5 surrounds at least a portion of the WiFi module 23 , and the shielding portion 5 is connected to the second isolation portion 42 .

[0046] Specifically, Figure 1As shown, the shielding portion 5 described in the embodiment of the present application can cover the outer surface of the WiFi SiP2 to completely surround the WiFi module 23; or, the shielding portion 5 can cover at least part of the outer surface of the WiFi SiP2 to at least part of the WiFi module 23.

[0047] Furthermore, by connecting the shielding portion 5 with the second isolation portion 42 , the WiFi module 23 is effectively isolated from other modules, and the working stability and reliability of the WiFi module 23 are further ensured.

[0048] Optionally, the shielding portion 5 is made of at least one of 314 stainless steel and 316 stainless steel.

[0049] Specifically, the embodiment of the present application effectively ensures the isolation effect of the shielding part 5 and significantly reduces the manufacturing cost of the shielding part 5 by setting the material of the shielding part 5 to any one of 314 stainless steel and 316 stainless steel.

[0050] Of course, the embodiment of the present application may also select a combination of 314 stainless steel and 316 stainless steel to manufacture the shielding portion 5. Those skilled in the art may make the selection according to actual needs, and the present application does not make any specific limitation here.

[0051] Optionally, the material of the sputtering antenna 31 includes at least one of 314 stainless steel and 316 stainless steel.

[0052] Specifically, since 314 stainless steel and 316 stainless steel have excellent corrosion resistance and high temperature resistance, high strength, good plasticity and weldability, and strong electromagnetic compatibility, the sputtering antenna 31 is manufactured using 314 stainless steel and 316 stainless steel, which can effectively ensure the stability and reliability of the sputtering antenna 31 and make the sputtering antenna 31 have a longer service life.

[0053] In addition, since the shielding part 5 and the sputtering antenna 31 described in the embodiment of the present application can be manufactured using at least one of 314 stainless steel and 316 stainless steel, and the shielding part 5 and the sputtering antenna 31 can be arranged on the second surface 22, the present application can use Sputter sputtering to simultaneously form the shielding part 5 and the sputtering antenna 31, so as to effectively improve the manufacturing efficiency of the SiP system and reduce the manufacturing cost of the SiP system.

[0054] In addition, the present application adopts the Sputter sputtering method to form the shielding part 5 and the sputtering antenna 31, which can also significantly enhance the molding quality of the shielding part 5 and the sputtering antenna 31, so that the structure of the shielding part 5 and the sputtering antenna 31 is more uniform, dense, firm and reproducible, thereby further improving the performance of the SiP system.

[0055] Optionally, the first connecting member 32 is a copper column.

[0056] Specifically, in the embodiment of the present application, by setting the first connecting member 32 to be a copper column, the stability and reliability of the first connecting member 32 can be effectively improved, and the manufacturing cost of the first connecting member 32 can be reduced.

[0057] Among them, when the first connecting member 32 is a copper column, the first connecting member 32 can be mounted on the WiFi SiP2 using SMT (Surface-Mounted Technology), thereby greatly reducing the volume of the SiP system, and making the SiP system have better component density, significantly improving assembly efficiency and consistency, and reducing manufacturing costs.

[0058] Of course, the first connecting member 32 may also be a POP (Package on Package) structure, and those skilled in the art may make a selection according to actual needs, and this application does not make any specific limitation here.

[0059] Optionally, the SiP system further includes a second connector, and the second connector is used to electrically connect the WiFi module 23 and the core system SiP1.

[0060] Specifically, in the embodiment of the present application, the second connecting member can be a copper column or an Interposer board (adapter board) to effectively improve the connection performance between the WiFi module 23 and the core system SiP1, and make the SiP system have higher integration and smaller footprint.

[0061] Optionally, the SiP system further includes a flexible printed circuit board 6 , and the flexible printed circuit board 6 is electrically connected to the core system SiP1 .

[0062] Specifically, Figure 1 As shown, the core system SiP1 in the embodiment of the present application can be connected to an external circuit through the flexible printed circuit board 6, thereby further improving the performance of the SiP system.

[0063] According to another embodiment of the present application, a method for manufacturing a SiP system is provided, which is applied to the SiP system as described in the embodiment of the present application, and the manufacturing method includes:

[0064] S101, setting a first isolation part 41 on the WiFi SiP2;

[0065] S102, packaging the WiFi SiP2 to form a second surface 22 on the WiFi SiP2;

[0066] S103 , opening an isolation groove 24 on the second surface 22 , and filling the isolation groove 24 with a second isolation portion 42 , so that the second isolation portion 42 is connected to the first isolation portion 41 .

[0067] Specifically, in step S101 , the embodiment of the present application sets the first isolation part 41 on the WiFiSiP2 , and the first isolation part 41 covers at least a part of the auxiliary circuit 232 , so that the first isolation part 41 can isolate the auxiliary circuit 232 from the first connecting member 32 .

[0068] The first isolation portion 41 may be a metal shielding cover, and the material of the first isolation portion 41 may include at least one of nickel silver, 314 stainless steel, and 316 stainless steel.

[0069] In step S102 , the embodiment of the present application packages the WiFi SiP2 with a packaging material, so that a mold surface of the WiFi SiP2 is formed on a side of the WiFi SiP2 away from the core system SiP1 , and the mold surface of the WiFi SiP2 is the second surface 22 .

[0070] In step S103, the embodiment of the present application opens an isolation groove 24 on the second surface 22 toward the first surface 21, and the bottom of the isolation groove 24 is located on the side of the first isolation portion 41 facing the second surface 22, so that after the second isolation portion 42 is filled in the isolation groove 24, the second isolation portion 42 can be connected to the first isolation portion 41, thereby better realizing the isolation between the WiFi module 23 and the antenna module 3.

[0071] The isolation groove 24 may be trapezoidal, and the second isolation portion 42 may be made of silver paste.

[0072] Optionally, the SiP system manufacturing method further includes:

[0073] A1, sputtering the second surface 22 to form a sputtered material layer;

[0074] A2, partially removing the sputtered material layer to form the shielding portion 5 and the sputtered antenna 31;

[0075] A3, opening the isolation groove 24 at the position where the sputtered material layer is removed.

[0076] Specifically, in step A1, the embodiment of the present application may adopt a Sputter sputtering method to sputter the sputtering material layer, and the material of the sputtering material layer may include at least one of 314 stainless steel and 316 stainless steel.

[0077] In step A2 , the embodiment of the present application may use a laser etching process to partially remove the sputtered material layer to form the shielding portion 5 and the sputtered antenna 31 .

[0078] In step A3, the embodiment of the present application may use a laser etching process to open the isolation groove 24 at the position where the sputtered material layer is removed.

[0079] Optionally, before step S101, the method further includes:

[0080] S100, setting the WiFi SiP2 in the core system SiP1.

[0081] Specifically, the embodiment of the present application arranges two Interposer boards between the first surface 21 of the WiFi SiP2 and the core system SiP1, so that the two Interposer boards can connect the WiFi SiP2 with the core system SiP1, thereby effectively reducing the stacking structure size of the SiP system and reducing the height of the SiP system packaging size.

[0082] According to another embodiment of the present application, an electronic product is provided, including the SiP system as described in the embodiment of the present application.

[0083] Specifically, the electronic product described in the embodiment of the present application may be smart glasses (such as AR / VR glasses), a head-mounted device, a display screen or headphones, etc.

[0084] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0085] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A SiP system, characterized in that: include: Core System in Package (SiP) (1); A WiFi SiP (2), the WiFi SiP (2) comprising a first surface (21), a second surface (22) and a WiFi module (23), the first surface (21) and the second surface (22) being two opposite sides of the WiFi SiP (2), the first surface (21) being connected to the core system SiP (1), and the WiFi module (23) being arranged between the first surface (21) and the second surface (22); An antenna module (3), the antenna module (3) comprising a sputtered antenna (31) and a first connecting member (32), the sputtered antenna (31) being arranged on the second surface (22), and the sputtered antenna (31) being electrically connected to the core system SiP (1) via the first connecting member (32); An isolation component (4), the isolation component (4) comprising a first isolation portion (41) and a second isolation portion (42), the first isolation portion (41) being arranged between the WiFi module (23) and the first connecting member (32); an isolation groove (24) being arranged between the WiFi module (23) and the sputtering antenna (31), the second isolation portion (42) being arranged in the isolation groove (24), and the second isolation portion (42) being connected to the first isolation portion (41), so as to isolate the WiFi module (23) from the antenna module (3).

2. The SiP system according to claim 1, characterized in that: The isolation groove (24) is trapezoidal.

3. The SiP system according to claim 1, characterized in that: The material of the first isolation part (41) includes at least one of nickel silver, 314 stainless steel and 316 stainless steel; The material of the second isolation portion (42) is silver paste.

4. The SiP system according to claim 1, characterized in that: The SiP system further comprises a shielding portion (5), wherein the shielding portion (5) surrounds at least a portion of the WiFi module (23), and the shielding portion (5) is connected to the second isolation portion (42).

5. The SiP system according to claim 4, characterized in that: The material of the shielding part (5) includes at least one of 314 stainless steel and 316 stainless steel.

6. The SiP system according to claim 1, characterized in that: The material of the sputtering antenna (31) includes at least one of 314 stainless steel and 316 stainless steel.

7. The SiP system according to claim 1, characterized in that: The first connecting member (32) is a copper column.

8. The SiP system according to claim 1, characterized in that: The SiP system also includes a second connector, which is used to electrically connect the WiFi module (23) and the core system SiP (1).

9. The SiP system according to claim 1, characterized in that: The SiP system also includes a flexible printed circuit board (6), and the flexible printed circuit board (6) is electrically connected to the core system SiP (1).

10. An electronic product, characterized in that: Comprising the SiP system as described in any one of claims 1-9.

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