Electroplating production line

Abstract

The electroplating production line comprises a pre-coating mechanism and a thickening coating mechanism which are arranged in sequence, the pre-coating mechanism comprises a plurality of first electroplating units, each first electroplating unit adopts a conductive roller as a cathode to conduct electricity, and currents of the plurality of first electroplating units are increased in sequence; the thickening coating mechanism comprises a plurality of second electroplating units, each second electroplating unit adopts a conductive clamp as a cathode to conduct electricity, and the current of the plurality of second coating units is sequentially increased; and the current of the first second coating unit is greater than that of the adjacent first electroplating unit. According to the embodiment of the utility model, in the film plating process, the organic combination of low-current pre-plating at the front half section and high-current-velocity thickness increasing at the rear half section is realized, and low current is adopted at the front half section, so that a copper plating layer can be well formed on a base material, and the problems of holes and the like are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film electroplating, in particular to an electroplating production line. Background Art

[0002] Electroplating is an important method for forming a copper coating of a conductive metal film. Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics. It is widely used. Conductive metal film is a type of material with many good properties. It is now widely used in batteries as positive or negative current collectors.

[0003] However, in the prior art, the electroplating device adopts a high current plating method of 60-150A during the entire plating process, and the cathode current provided to each part of the film surface is equal. Since the square resistance of the film surface is relatively large in the early stage of electroplating, applying a high current at this time will cause the problem of burn holes on the film surface. In addition, if the current is too small during the electroplating process, the plating efficiency will also be reduced. Utility Model Content

[0004] In view of this, the purpose of the embodiments of the utility model is to provide an electroplating production line to solve the technical problem in the prior art that high current is used for coating during the entire electroplating process, resulting in burn holes on the surface of the film.

[0005] To achieve the above-mentioned purpose, the embodiment of the utility model provides an electroplating production line, which comprises: a pre-plating mechanism and a thickening plating mechanism arranged in sequence,

[0006] Wherein, the pre-plating mechanism comprises a plurality of first electroplating units, each of which uses a conductive roller as a cathode to conduct electricity, and the currents of the plurality of first electroplating units are increased sequentially;

[0007] The thickening coating mechanism comprises a plurality of second electroplating units, each of which uses a conductive clip as a cathode to conduct electricity, and the currents of the plurality of second electroplating units are increased sequentially;

[0008] The current of the first second electroplating unit is greater than the current of a first electroplating unit adjacent thereto.

[0009] In some possible implementations, the current of the first electroplating unit is 0 to 60A.

[0010] In some possible implementations, the currents of the plurality of first electroplating units are increased sequentially at first preset intervals.

[0011] In some possible implementations, the current of the second electroplating unit is 60A to 400A.

[0012] In some possible implementations, the currents of the plurality of second electroplating units are increased sequentially at second preset intervals.

[0013] In some possible implementations, the thickening coating mechanism further includes:

[0014] The spray water washing component is arranged between any two adjacent second electroplating units and is used to spray the film during the thickening coating process to reduce the temperature of the film surface.

[0015] In some possible implementations, the thickening coating mechanism further includes:

[0016] The stripping and hanging spraying assembly is arranged between any two adjacent second electroplating units and is used for removing the copper plating on the conductive clip.

[0017] In some possible implementations, the thickening coating mechanism further includes:

[0018] The hot and cold control unit is used to heat or cool the plating solution in each of the second electroplating units to control the temperature of the plating solution.

[0019] In some possible implementations, the electroplating production line further includes:

[0020] The water washing mechanism, the anti-oxidation mechanism and the drying mechanism are sequentially arranged at the rear end of the thickening coating mechanism, and are used for washing, anti-oxidation and drying the coated film respectively.

[0021] In some possible implementations, the number of the first electroplating units is six, and the currents of the six first electroplating units are 5A, 10A, 15A, 20A, 25A and 30A respectively;

[0022] In some possible implementations, the number of the second coating units is six, and the currents of the six second electroplating units are 80A, 120A, 160A, 180A, 200A and 220A respectively.

[0023] The beneficial technical effects of the above technical solution are:

[0024] The utility model provides an electroplating production line, which includes: a pre-plating mechanism and a thickening mechanism, wherein the pre-plating mechanism includes a plurality of first electroplating units, each of which uses a conductive roller as a cathode for conducting electricity, and the current of the plurality of first electroplating units increases in sequence; the thickening mechanism includes a plurality of second electroplating units, each of which uses a conductive clip as a cathode for conducting electricity, and the current of the plurality of second electroplating units increases in sequence; the current of the first second electroplating unit is greater than the current of a first electroplating unit adjacent thereto. In the process of plating, the utility model embodiment combines low-current pre-plating in the first half and high-current rapid thickness increase in the second half. In the first half, low current is used to form a copper plating layer on the substrate, and problems such as holes are avoided. At the same time, in the second half, when the substrate has formed a basic copper plating layer, high current rapid thickening is performed, which not only improves efficiency, but also makes the overall plating effect excellent and avoids holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of a thin film electroplating production line according to an embodiment of the utility model;

[0027] Figure 2 It is a structural schematic diagram of a second electroplating production line according to an embodiment of the utility model;

[0028] Figure 3 It is a structural schematic diagram of a magnetron sputtering coating mechanism of an embodiment of the utility model;

[0029] Figure 4 It is a structural schematic diagram of a second thickening coating mechanism of an embodiment of the utility model;

[0030] Figure 5 It is a structural schematic diagram of a third thickening coating mechanism of an embodiment of the utility model;

[0031] Figure 6 It is a structural schematic diagram of a third thickening coating mechanism of an embodiment of the utility model;

[0032] Figure 7 It is a structural schematic diagram of a second electroplating production line according to an embodiment of the utility model;

[0033] Figure 8It is a structural schematic diagram of a second electroplating production line according to an embodiment of the utility model.

[0034] Description of Figure Numbers:

[0035] 1. Magnetron sputtering coating mechanism; 10. Cavity; 11. Unwinding roller; 12. Winding roller; 13. First coating main roller; 14. Second coating main roller; 15. Target material; 16. Flattening roller; 17. Passing roller;

[0036] 2. Pre-plating mechanism; 21. First electroplating unit;

[0037] 3. Thickening coating mechanism; 31. Second electroplating unit; 32. Spraying and washing assembly; 33. Peeling and hanging spray assembly; 34. Hot and cold control unit;

[0038] 4. Water washing mechanism; 5. Anti-oxidation mechanism; 6. Drying mechanism. DETAILED DESCRIPTION

[0039] The features and exemplary embodiments of various aspects of the utility model will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without the need for some of these specific details. The following description of the embodiment is only to provide a better understanding of the utility model by illustrating an example of the utility model. In the drawings and the following description, at least part of the known structures and technologies are not shown in order to avoid unnecessary ambiguity to the utility model; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0040] Figure 1 Schematic diagram of the structure of a thin film electroplating production line according to an embodiment of the utility model. Figure 1 As shown, the electroplating production line includes: a pre-plating mechanism 2 and a thickening coating mechanism 3 which are arranged in sequence, wherein the pre-plating mechanism 2 includes a plurality of first electroplating units 21, each of which uses a conductive roller as a cathode for conducting electricity, and the currents of the plurality of first electroplating units 21 increase in sequence in the direction in which the film advances; the thickening coating mechanism 3 includes a plurality of second electroplating units 31, each of which uses a conductive clip as a cathode for conducting electricity, and the currents of the plurality of second electroplating units 31 increase in sequence in the direction in which the film advances; the current of the first second coating unit 31 is greater than the current of a first electroplating unit 21 adjacent thereto.

[0041] In this embodiment, the pre-plating mechanism 2 uses a conductive roller as the cathode of a roller-based electroplating horizontal line mode, also commonly known as an LA line, and uses a successively increasing low current pre-plating, and the magnitude of the current increase can be determined according to actual conditions; and the thickening coating mechanism 3 uses a conductive clip as the cathode for conduction, also commonly known as a clip line, and the coating is quickly thickened through the clip line until the square resistance meets the product requirements.

[0042] Specifically, during the low current pre-plating and thickening process, the line speed of the film is 8m / min to 12m / min, the plating solution temperature is 25 degrees Celsius, and the concentration of metal ions in the plating solution is 80g / L to 100g / L. At the same time, during the whole process, the metal ion concentration is 80-100g / L (2-3 times higher than that in the prior art), the line speed is 4 times that in the prior art, and the plating length is 2.5 times that in the prior art. It can be seen that this embodiment greatly improves the plating speed, reduces the plating time and plating power, and greatly improves the plating efficiency.

[0043] In the coating process of the embodiment of the utility model, low current pre-plating is performed in the first half, and the coating is rapidly thickened by the coating thickening mechanism 3 in the second half using successively increasing high currents. The coating is plated by combining high and low currents. In the first half, low current is used, which can not only form a copper coating on the substrate better, but also avoid problems such as holes. At the same time, in the second half, when the basic copper coating has been formed on the film, high current is used for rapid thickening, which can not only improve efficiency, but also make the overall coating effect excellent and avoid holes.

[0044] In some embodiments, the current of the first electroplating unit 21 is 0 to 60 A. For example, the current of the plurality of first electroplating units 21 in the direction of the film advance can be any one of 1A, 2A, 5A, 10A, 20A, 35A, 50A and 60A, respectively, and these current values ​​can also be increased in sequence at a first preset interval, for example, if the first preset interval is 10A, then the currents of the plurality of first electroplating units 21 are 10A, 20A, 30A, 40A, 50A and 60A respectively; of course, they can also be gradually increased at any interval, depending on the actual electroplating situation.

[0045] In some embodiments, the current of the second electroplating unit 31 is 60A to 400A. For example, the current of the plurality of second electroplating units 31 in the direction of the film advance can be any one of 70A, 80A, 100A, 200A, 250A, 350A and 400A, respectively, and these current values ​​can also be increased in sequence at the second preset interval, such as, the second preset interval is 50A, and the current of the plurality of second electroplating units 31 is 70A, 120A, 170A, 220A, 270A, 320A and 370A, etc.; of course, it can also be gradually increased at any interval, depending on the actual electroplating situation.

[0046] Figure 2 Schematic diagram of the structure of the second electroplating production line of the utility model embodiment, such as Figure 2 As shown, the electroplating production line also includes: a magnetron sputtering coating mechanism 1, which is arranged in front of the pre-coating mechanism and is used to perform magnetron sputtering coating on the thin film.

[0047] In this embodiment, the initial coating vacuum can be 5.0E-3Pa, the argon flow rate can be 80ml / min to 100ml / min, the general cooling temperature can be -10°C, the winding speed can be 4m / min to 5m / min, the target power can be 13KW, the coating voltage can be 600V±20V, and the coating time can be 80s to 100s.

[0048] Figure 3 Schematic diagram of the structure of the magnetron sputtering coating mechanism of the utility model embodiment, such as Figure 3 As shown, in some embodiments, the magnetron sputtering coating mechanism 1 includes: a chamber 10, an unwinding roller 11, a winding roller 12, a first coating main roller 13, a second coating main roller 14 and a plurality of target materials 15 arranged in the chamber 10, the unwinding roller 11, the winding roller 12, the first coating main roller 13 and the second coating main roller 14 are rotatably arranged on the side wall of the chamber 10 respectively, the unwinding roller 11 and the winding roller 12 are used to unwind and wind the film respectively, and the plurality of target materials 15 are evenly arranged in an arc shape on one side of the first coating main roller 13 and the second coating main roller 14 close to the side wall of the chamber 10. By evenly distributing the target materials 15 in an arc shape, and the curvature of the arc shape, the film covering the first coating main roller 13 and the second coating main roller 14 can be evenly coated.

[0049] like Figure 3As shown, in some embodiments, the magnetron sputtering coating mechanism 1 further includes a plurality of flattening rollers 16, which are rotatably disposed on the side walls of the chamber 10, and are used to flatten the film. The flattening rollers 16 are disposed on the chamber 10, respectively close to the unwinding roller 11, the winding roller 12, the first coating main roller 13, and the second coating main roller 14, so that the film is not wrinkled during the unwinding and winding processes, and the film is not wrinkled when being coated on the first coating main roller 13 and the second coating main roller 14, thereby improving the coating quality.

[0050] like Figure 3 As shown, in some embodiments, the magnetron sputtering coating mechanism may further include a plurality of rollers 17, which are rotatably disposed on the side walls of the chamber 10, respectively, for guiding the film. In the embodiment of the utility model, the plurality of rollers 17 are used to guide the film after the first surface of the film is coated by the first coating main roller 13, and then the film is introduced into the second coating main roller 14, and the second surface of the film is coated by the second coating main roller 14. In addition, the first coating main roller 13, the second coating main roller 14, the unwinding roller 11, the winding roller 12, the plurality of flattening rollers 16 and the plurality of rollers 17 in the embodiment of the utility model are arranged parallel to each other. In this way, the tension of the film during the film-feeding process can be better controlled.

[0051] Figure 4 Schematic diagram of the structure of the second thickening coating mechanism of the utility model embodiment, such as Figure 4 As shown, in some embodiments, the thickening coating mechanism 3 also includes: a spray water washing component 32, which is arranged between any two adjacent second electroplating units 31. The number of the spray water washing components 32 can be multiple, which is used to spray the thin film during the thickening coating process to reduce the temperature of the film surface and avoid the film surface being burned by high temperature, affecting the product quality.

[0052] Figure 5 Schematic diagram of the structure of the third thickening coating mechanism of the utility model embodiment, such as Figure 5 As shown, in some embodiments, the thickening coating mechanism 3 may further include: a peeling and spraying assembly 33, which is arranged between any two adjacent second electroplating units 31, and is used to remove the copper plating on the conductive clip to prevent copper crystals from piercing the film and affecting the coating quality. Specifically, the peeling and spraying assembly in this embodiment includes a spraying tank, which is arranged on the side of the conductive clip away from the electroplating tank, and is used to clean the copper crystals generated on the conductive clip to prevent copper crystals from piercing the film surface. Similarly, water washing and other treatments are also required after the peeling and spraying.

[0053] Figure 6 Schematic diagram of the structure of the third thickening coating mechanism of the utility model embodiment, such as Figure 6As shown, the thickening coating mechanism also includes: a hot and cold control unit 34, which is used to heat or cool the plating solution in each second electroplating unit 31 to control the temperature of the plating solution. Because the plating solution in this embodiment not only processes liquids such as copper sulfate, but also contains a brightener, and because the brightener has a better effect within a certain temperature range, the present application needs to heat or cool the plating solution during the electroplating process to ensure the quality of the coating. In addition, in this embodiment, the hot and cold control unit 34 may include a temperature control system, which is connected to each second coating unit 31 through a circulation pipeline. The temperature control system has a heating element (such as an electric heater) and a cooling element (such as a cooling water circulation or a refrigerator) inside. According to the set temperature value, the temperature control system can transport the heated or cooled medium (such as water or oil) to each electroplating unit through the circulation pipeline, thereby adjusting the temperature of the plating solution.

[0054] The plating solution may also be directly heated / cooled, for example, a heating element (such as an electric heating rod) and / or a cooling element (such as a cooling coil) may be provided inside each second coating unit 31. The hot and cold control unit 34 directly controls these elements to heat or cool the plating solution according to the required temperature.

[0055] Of course, in order to achieve accurate temperature control, the hot and cold control unit 34 will also include a temperature sensor for real-time monitoring of the temperature of the plating solution. These sensors will feed back the temperature data to the control system, and the control system will adjust the intensity of heating or cooling according to the difference between the set temperature and the actual temperature. In order to prevent the adverse effects of the plating solution temperature being too high or too low on the electroplating process, the hot and cold control unit 34 is usually equipped with a safety protection and alarm system. Once the plating solution temperature exceeds the safe range, the system will automatically take measures (such as cutting off the heating / cooling power supply) and sound an alarm to remind the operator to intervene in time. In addition, the hot and cold control unit 34 often also integrates automation and intelligent management functions. This includes remote monitoring and control through network connection, and optimizing the temperature control strategy through an algorithm to reduce energy consumption and improve the stability of temperature control. In this embodiment, the plating solution in each second electroplating unit 31 is heated or cooled by the hot and cold control unit 34 to control the temperature of the plating solution and improve the coating efficiency.

[0056] Figure 7 Schematic diagram of the structure of the second electroplating production line of the utility model embodiment, such as Figure 7 As shown, in some embodiments, the electroplating production line further includes: a washing mechanism 4, an anti-oxidation mechanism 5 and a drying mechanism 6 sequentially arranged at the rear end of the thickening coating mechanism 3, respectively used to wash, anti-oxidize and dry the film after coating. In this embodiment, the composite current collector can be subjected to anti-oxidation and drying treatments by an anti-oxidation tank and a drying box, and the general drying time is about 2 minutes, thereby improving the anti-oxidation performance and bonding strength of the film surface.

[0057] Figure 8 Schematic diagram of the structure of the second electroplating production line of the utility model embodiment, such as Figure 8 As shown, in some embodiments, the number of the first electroplating units 21 is six, and the currents of the six first electroplating units 21 are 5A, 10A, 15A, 20A, 25A and 30A respectively; the number of the second electroplating units 31 is six, and the currents of the six second electroplating units 31 are 80A, 120, 160A, 180A, 200A and 220A respectively.

[0058] In addition, the embodiment of the utility model organically combines low current pre-plating in the first half and high current rapid thickness increase in the second half during the coating process. In the first half, low current is used, which can not only form a copper coating on the substrate better, but also avoid problems such as holes. At the same time, in the second half, when a basic copper coating has been formed on the substrate, high current rapid thickening is performed, which can not only improve efficiency, but also make the overall coating effect excellent and avoid holes.

[0059] In the description of the embodiments of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper, lower, inner and outer" are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present utility model. In addition, the terms "first, second or third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0060] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "install, connect, connect" should be understood in a broad sense, for example: it can be a fixed connection, a detachable connection or an integral connection; it can also be a mechanical connection, an electrical connection or a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A thin film electroplating production line, characterized in that: The electroplating production line comprises: a pre-plating mechanism (2) and a thickening plating mechanism (3) which are arranged in sequence, The pre-plating mechanism (2) comprises a plurality of first electroplating units (21), each of the first electroplating units (21) uses a conductive roller as a cathode to conduct electricity, and the current of the plurality of first electroplating units (21) increases sequentially along the direction in which the film moves; The thickening coating mechanism (3) comprises a plurality of second electroplating units (31), each of the second electroplating units (31) uses a conductive clip as a cathode to conduct electricity, and the current of the plurality of second electroplating units (31) increases sequentially along the direction in which the film moves; The current of the first second electroplating unit (31) is greater than the current of a first electroplating unit (21) adjacent thereto.

2. A thin film electroplating production line according to claim 1, characterized in that: The current of the first electroplating unit (21) is 0 to 60A.

3. A thin film electroplating production line according to claim 2, characterized in that: The currents of the plurality of first electroplating units (21) are increased in sequence at a first preset interval.

4. A thin film electroplating production line according to claim 1, characterized in that: The current of the second electroplating unit (31) is 60A to 400A.

5. A thin film electroplating production line according to claim 4, characterized in that: The plurality of second electroplating units (31) are sequentially increased at second preset intervals.

6. A thin film electroplating production line according to any one of claims 1 to 5, characterized in that: The thickening coating mechanism (3) further comprises: The spray water washing component (32) is arranged between any two adjacent second electroplating units (31) and is used to spray the thin film during the thickening coating process to reduce the temperature of the film surface.

7. A thin film electroplating production line according to claim 6, characterized in that: The thickening coating mechanism (3) further comprises: A stripping spray assembly (33) is arranged between any two adjacent second electroplating units (31) and is used to remove the copper plating on the conductive clip.

8. A thin film electroplating production line according to claim 6, characterized in that: The thickening coating mechanism (3) further comprises: A hot and cold control unit (34) is used to heat or cool the plating solution in each of the second electroplating units (31) to control the temperature of the plating solution.

9. A thin film electroplating production line according to any one of claims 1-5, 7 or 8, characterized in that: The electroplating production line also includes: The water washing mechanism (4), the anti-oxidation mechanism (5) and the drying mechanism (6) are sequentially arranged at the rear end of the thickening coating mechanism (3), and are used to respectively perform water washing, anti-oxidation and drying treatments on the coated film.

10. A thin film electroplating production line according to any one of claims 1-5, 7 or 8, characterized in that: The number of the first electroplating units (21) is six, and the currents of the six first electroplating units (21) are 5A, 10A, 15A, 20A, 25A and 30A respectively; The number of the second electroplating units (31) is six, and the currents of the six second electroplating units (31) are 80A, 120A, 160A, 180A, 200A and 220A respectively.

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