Middle frame and electronic equipment

Abstract

The utility model provides a middle frame and electronic equipment, the middle frame comprises a composite metal frame, the composite metal frame comprises a metal outer frame, the metal outer frame is made of a first metal material, and the first metal material can be an aluminum alloy material; the composite metal frame comprises a metal outer frame and a nonmetal bottom plate made of a carbon fiber material, the density of the nonmetal bottom plate is smaller than that of the metal outer frame, the composite metal frame further comprises a metal framework made of a second metal material, the second metal material can be a magnesium alloy material, and the metal framework can be embedded into the metal outer frame. According to the middle frame provided by the invention, the weight of the middle frame is reduced while the strength of the middle frame is kept, and the light weight of the middle frame and the electronic equipment can be realized.

Description

Technical Field

[0001] The present application relates to the field of terminal device hardware, and in particular, to a middle frame and an electronic device. Background Art

[0002] The middle frame is one of the main structural parts in current electronic devices. It is used to fix components and keep reasonable gaps between components to protect the internal devices of electronic devices from external impact damage. Aluminum alloy has a low density, rich color matching and metallic texture after anodizing, so most electronic devices use aluminum alloy middle frames. However, with the lightweight development of high-end electronic devices and foldable electronic devices, aluminum alloy can no longer meet the lightweight demand. It is necessary to reduce the weight of the middle frame while maintaining its strength. How to reduce the weight of the middle frame without reducing its strength is a question worth considering. Utility Model Content

[0003] The present application provides a middle frame and an electronic device, which can reduce the weight of the middle frame while ensuring the strength of the middle frame.

[0004] In a first aspect, a middle frame is provided, comprising: a composite metal frame, the composite metal frame comprising a metal outer frame, the metal outer frame being made of a first metal material; and a non-metallic bottom plate, the non-metallic bottom plate being made of a carbon fiber material, the density of the carbon fiber material being less than the density of the first metal material.

[0005] Based on the above technical solution, by introducing a bottom plate made of low-density and high-hardness carbon fiber material into the middle frame, the weight of the middle frame can be effectively reduced while ensuring the strength of the middle frame, thereby improving the user experience when using the electronic device.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the composite metal frame further includes a metal skeleton, the metal skeleton is made of a second metal material, and the density of the second metal material is less than the density of the first metal material.

[0007] Based on the above technical solution, by introducing a metal skeleton with a lower density than the metal outer frame into the middle frame, it is possible to provide support for other structural parts in the electronic device, improve the practicality of the middle frame, and reduce the weight of the middle frame.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the metal skeleton is embedded in the metal outer frame.

[0009] Based on the above technical solution, the increase in thickness caused by simply stacking the metal skeleton and the metal outer frame is avoided, thereby reducing the thickness of the middle frame, which is beneficial to reducing the thickness of the entire electronic device.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the metal skeleton further includes cross beams and / or longitudinal beams and supporting parts connected to the cross beams and / or longitudinal beams.

[0011] Based on the above technical solution, the metal frame has cross beams and / or longitudinal beams, which can improve the firmness and strength of the middle frame, and the supporting part can provide effective support for other structural parts of the electronic device, thereby improving the practicality of the middle frame.

[0012] In combination with the first aspect, in certain implementations of the first aspect, a first glue dispensing layer is provided between the composite metal frame and the non-metallic base plate.

[0013] Based on the above technical solution, the composite metal frame and the non-metallic bottom plate are connected by glue spotting, which effectively improves the firmness of the middle frame and reduces the complexity of the process when preparing the middle frame.

[0014] In combination with the first aspect, in certain implementations of the first aspect, a first glue groove is provided on a surface of the composite metal frame facing the non-metallic bottom plate, and the first glue dot layer is accommodated in the first glue groove.

[0015] Based on the above technical solution, providing the first glue groove can reduce the increase in the thickness of the middle frame caused by the thickness of the first glue layer itself, thereby thinning the thickness of the middle frame, which is beneficial to reducing the thickness of the entire electronic device.

[0016] In combination with the first aspect, in certain implementations of the first aspect, a second glue dispensing layer is provided between the metal outer frame and the metal skeleton.

[0017] Based on the above technical solution, the metal outer frame and the metal skeleton are connected by glue dispensing, which effectively improves the firmness of the middle frame and reduces the complexity of the process when preparing the middle frame.

[0018] In combination with the first aspect, in certain implementations of the first aspect, a second glue groove is provided on a surface of the metal skeleton facing the metal outer frame, and the second glue dispensing layer is accommodated in the second glue groove.

[0019] Based on the above technical solution, providing the second glue groove can reduce the increase in the thickness of the middle frame caused by the thickness of the second glue layer itself, thereby thinning the thickness of the middle frame, which is beneficial to reducing the thickness of the entire electronic device.

[0020] In combination with the first aspect, in certain implementations of the first aspect, a first threaded hole is further provided on the surface of the metal outer frame, and a second threaded hole corresponding to the position of the first threaded hole is further provided on the surface of the metal skeleton facing the metal outer frame; the middle frame also includes a fastener, which passes through the first threaded hole and the second threaded hole to connect the metal outer frame and the metal skeleton.

[0021] Based on the above technical solution, the metal outer frame and the metal skeleton are further connected through threaded holes and fasteners, which can improve the stability of the connection of the middle frame and make the middle frame more reliable.

[0022] In combination with the first aspect, in certain implementations of the first aspect, a silver paste layer is further provided on the surface of the non-metallic base plate facing the composite metal frame, and a conductive adhesive layer is provided at a position of the composite metal frame corresponding to the silver paste layer, and the silver paste layer is in contact with the conductive adhesive layer.

[0023] Based on the above technical solution, the composite metal frame and the non-metallic base plate can be electrically connected in a simple manner, thereby improving the practicality of the middle frame.

[0024] In combination with the first aspect, in certain implementations of the first aspect, a recessed area is provided on the surface of the non-metallic base plate, and the recessed area is used to accommodate at least one of a heat sink, a flexible circuit board FPC, an adhesive component or a conductive foam.

[0025] In combination with the first aspect, in certain implementations of the first aspect, the first metal material is an aluminum alloy.

[0026] Based on the above technical solution, the metal outer frame is made of aluminum alloy material, which can ensure the stability of the metal outer frame.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the second metal material is a magnesium alloy.

[0028] Based on the above technical solution, the metal frame is made of a magnesium alloy with lower density, which can effectively reduce the weight of the middle frame.

[0029] In combination with the first aspect, in some implementations of the first aspect, the surface of the metal outer frame has an anodized layer.

[0030] Based on the above technical solution, the metal outer frame can present a variety of colors and metallic textures after anodizing, thereby improving the aesthetics of the middle frame.

[0031] In a second aspect, an electronic device is provided, comprising the middle frame described in the first aspect and any one of its implementations, wherein the middle frame is used to fix parts of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural explosion diagram of a middle frame 100 provided in an embodiment of the present application.

[0033] Figure 2 1 is a schematic diagram of the structure of the middle frame 100 provided in an embodiment of the present application.

[0034] Figure 3 yes Figure 2 Cross-sectional structure diagram of area A along the X direction.

[0035] Figure 4 It is a structural explosion diagram of a middle frame 200 provided in an embodiment of the present application.

[0036] Figure 5 It is a structural schematic diagram of the middle frame 200 provided in an embodiment of the present application.

[0037] Figure 6 yes Figure 5 Cross-sectional structure diagram of area B along the X direction. DETAILED DESCRIPTION

[0038] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0039] Embodiments of the present application are described in detail below, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0040] In the description of this application, it should be understood that the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0043] The middle frame is one of the main structural parts in current electronic devices. It is used to fix components and keep reasonable gaps between components to protect the internal components of electronic devices from external impact damage. Aluminum alloy has low density, rich anodized color and bright metal, so most electronic devices use aluminum alloy middle frames. However, with the lightweight development of high-end electronic devices and foldable electronic devices, aluminum alloy can no longer meet the lightweight demand. It is necessary to reduce the weight of the middle frame while maintaining its strength. How to reduce the weight of the middle frame without reducing its strength is a question worth considering.

[0044] To solve the above problems, an embodiment of the present application provides a middle frame, which includes a composite metal frame and a non-metallic bottom plate, and the composite metal frame includes a metal outer frame, which is made of a first metal material. The composite metal frame can provide a certain structural strength for the middle frame; the non-metallic bottom plate is made of a carbon fiber material, which can provide support for the screen or other components of the electronic device, has a thin thickness and a high hardness, and the density of the carbon fiber material is less than that of the first metal material, which can reduce the overall weight of the middle frame while ensuring the strength of the middle frame.

[0045] In some possible implementations, the composite metal frame further includes a metal skeleton, where the metal skeleton is made of a second metal material, and the density of the second metal material is less than the density of the first metal material.

[0046] Based on the above technical solution, the weight of the middle frame can be reduced without reducing the strength of the middle frame, thereby achieving lightweight electronic equipment and improving user experience.

[0047] The shape of the metal frame, metal skeleton and non-metal bottom plate can be rectangular or other shapes. The embodiments of the present application are not limited to this. The following embodiments are described when the shape of the metal frame, metal skeleton and non-metal bottom plate is rectangular.

[0048] Figure 11 is a structural exploded diagram of a middle frame 100 provided in an embodiment of the present application. The middle frame 100 includes a composite metal frame 101 and a non-metallic bottom plate 120. The composite metal frame 101 includes a metal outer frame 110. A first glue layer ( Figure 1 (not shown) to achieve the connection between the metal frame 110 and the non-metal base plate 120.

[0049] It should be understood that in the middle frame 100 , the metal outer frame 110 may be regarded as a composite metal frame 101 .

[0050] In some possible implementations, a first glue groove ( Figure 1 (not shown), the first glue groove can be used to accommodate the first glue layer. When the first glue layer is arranged in the first glue groove, it can avoid the first glue layer occupying excess thickness, so that the thickness of the middle frame 100 can be further reduced.

[0051] A recessed area 121 is provided on the surface of the non-metallic bottom plate 120 facing the metal outer frame 110. The recessed area 121 can be used to accommodate heat sinks, flexible printed circuits (FPC), adhesive components, or conductive foam and other structural parts. The heat sink can be a graphite sheet, which can be used to dissipate heat from heating elements in electronic devices; the adhesive component can be a backing adhesive, which can be used to fix batteries, circuit boards and other structural parts, and the conductive foam can play a role in shock absorption and buffering. The shape of the recessed area 121 can be determined according to the shape of the structural parts to be accommodated, and the embodiments of the present application do not limit this.

[0052] The number of the recessed areas 121 may be one or more, which is not limited in the embodiment of the present application.

[0053] In some embodiments, the recessed area 121 may also be provided on the surface of the non-metallic bottom plate 120 away from the metal outer frame 110 , which is not limited in the embodiments of the present application.

[0054] The first metal material may be an aluminum alloy, and the density of the aluminum alloy may be 2.7 g / cm 3 The aluminum alloy frame has a good metal texture and beautiful appearance, which can improve the user experience when using electronic devices.

[0055] The metal outer frame 110 may be provided with a first threaded hole 110a, which may be used to fix other structural components in the electronic device, such as a display screen or a circuit board. The first threaded hole 110a may be used to fix other structural components by bolt connection.

[0056] The number of the first threaded holes 110a can be multiple, for example, four, and a first threaded hole 110a is provided on each frame of the metal outer frame 110 (for example, Figure 1 As shown), the four first threaded holes 210a may also be disposed at the four corners of the metal outer frame 110. The embodiment of the present application does not limit the number and positions of the first threaded holes 110a.

[0057] When the middle frame further includes a metal frame, the first threaded hole can also be used to connect with the metal frame.

[0058] The non-metallic bottom plate 120 is made of carbon fiber material, and the density of the carbon fiber material can be 1.5 g / cm 3 -2g / cm 3 For example, the density of the carbon fiber material can be 1.5 g / cm 3 , 1.6g / cm 3 , 1.7g / cm 3 , 1.8g / cm 3 , 1.9g / cm 3 or 2g / cm 3 Since the carbon fiber material has a lower density than aluminum alloy and a higher hardness, it can reduce the weight of the middle frame 100 while ensuring that the strength of the middle frame 100 does not decrease, and at the same time can also reduce the thickness of the non-metallic bottom plate 120, which is beneficial to reducing the overall thickness of the electronic device.

[0059] The metal outer frame 110 can be processed by a computer numerical control (CNC) machine tool.

[0060] In some possible implementations, the metal outer frame 110 may be anodized to form an anodized layer on the surface of the metal outer frame 110 , thereby enriching the color variety of the metal outer frame 110 and improving the overall metal texture of the middle frame 100 .

[0061] A first glue layer may be formed between the metal outer frame 110 and the non-metal bottom plate 120 through a glue dispensing process, for example, the first glue layer is set by a glue dispensing machine, so as to achieve connection between the metal outer frame 110 and the non-metal bottom plate 120 .

[0062] The non-metallic base plate 120 can be manufactured by a molding method, and the above-mentioned recessed area 121 can be formed integrally during the molding process, or the non-metallic base plate 120 without the recessed area 121 can be first manufactured, and then grooved by CNC or other methods to obtain the recessed area 121.

[0063] Figure 2 is a schematic diagram of the structure of the middle frame 100 provided in an embodiment of the present application, Figure 3yes Figure 2 The cross-sectional structure diagram of the middle A area along the X direction. Figure 2 Further references Figure 3 A silver paste layer 1201 is disposed on the surface of the non-metallic bottom plate 120 facing the metal outer frame 110. The silver paste layer 1201 can be engraved on the surface of the non-metallic bottom plate 120 by laser engraving. A conductive adhesive layer 1101 is disposed at a position corresponding to the contact between the metal outer frame 110 and the silver paste layer 1201. The conductive adhesive layer 1101 can be a non-woven conductive adhesive. After the silver paste layer 1201 contacts the conductive adhesive layer 1101, electrical connection can be achieved between the metal outer frame 110 and the non-metallic bottom plate 120.

[0064] It should be understood that the position where the silver paste layer 1201 is disposed is not fixed. For example, the silver paste layer 1201 may be disposed at a partial contact position between the non-metallic base plate 120 and one of the frames of the metal outer frame 110 .

[0065] In some embodiments, the area of ​​the conductive adhesive layer 1101 may be equal to or unequal to the area of ​​the silver paste layer 1201. When the conductive adhesive layer 1101 and the silver paste layer 1201 are in contact, electrical connection between the metal frame 110 and the non-metallic base plate 120 can be achieved. The embodiments of the present application do not limit this.

[0066] It should be understood that Figure 2 The area A is only used to illustrate an optional area example when the conductive adhesive layer 1101 and the silver paste layer 1201 are set, and does not mean that the conductive adhesive layer 1101 and the silver paste layer 1201 can only be set in area A. The silver paste layer 1201 can also be set at other positions on the surface of the non-metallic bottom plate 120 that contacts one side of the metal outer frame 110, and the conductive adhesive layer 1101 is correspondingly set on the metal outer frame 110.

[0067] In some electronic devices, there are a large number of internal structural parts of the electronic devices, and the composition structure may also be relatively complex. Relying solely on a non-metallic bottom shell and a metal outer frame is not sufficient to provide sufficient support for the structural parts in the electronic device. Therefore, in other embodiments provided in the present application, the composite metal frame may further include a metal skeleton, which is used to provide support for the structural parts in the electronic device, and can also further enhance the overall structural strength of the middle frame.

[0068] Figure 4This is a structural exploded diagram of another middle frame 200 provided in an embodiment of the present application. The middle frame 200 includes a composite metal frame 201 and a non-metallic bottom plate 220. The composite metal frame 201 includes a metal outer frame 210 and a metal skeleton 230. The metal outer frame 210 is made of a first metal material, the metal skeleton 230 is made of a second metal material, and the non-metallic bottom plate 220 is made of a carbon fiber material. The density of the carbon fiber material and the density of the second metal material are both less than the density of the first metal material. A second glue layer 2101 ( Figure 4 Not shown, please refer to Figure 6 ), a first glue layer is provided between the composite metal frame 201 and the non-metallic bottom plate 220, and the connection among the metal outer frame 210, the metal skeleton 230 and the non-metallic bottom plate 220 is realized through two layers of glue layers.

[0069] In some possible implementations, a first glue groove ( Figure 4 The metal frame 230 is surrounded by a second adhesive groove (not shown). Figure 4 (not shown in the figure), the first glue groove and the second glue groove can be used to accommodate the first glue layer and the second glue layer respectively. When the first glue layer and the second glue layer are respectively arranged in the first glue groove and the second glue groove, it can avoid the first glue layer and the second glue layer occupying excess thickness, so that the thickness of the middle frame 200 can be further thinned.

[0070] A recessed area 221 is provided on the surface of the non-metallic bottom plate 220 facing the composite metal frame 201. The recessed area 221 can be used to accommodate structural parts such as heat sinks, FPCs, adhesive components or conductive foam. The heat sink can be a graphite sheet, which can be used to dissipate heat from heating elements in electronic devices; the adhesive component can be a backing adhesive, which can be used to fix structural parts such as batteries and circuit boards, and the conductive foam can play a role in shock absorption and buffering. The shape of the recessed area 221 can be determined according to the shape of the structural parts to be accommodated, and the embodiments of the present application do not limit this.

[0071] The number of the recessed areas 221 may be one or more, which is not limited in the embodiments of the present application.

[0072] In some embodiments, the recessed area 221 may also be provided on the surface of the non-metallic bottom plate 220 away from the metal outer frame 210 , and the embodiments of the present application are not limited to this.

[0073] The first metal material may be an aluminum alloy material, and the second metal material may be a magnesium alloy material. The density of the magnesium alloy material and the carbon fiber material are both lower than that of the aluminum alloy material, thereby effectively reducing the weight of the middle frame 200. The densities of the above different materials can refer to the description in the middle frame 100, and for the sake of brevity, they will not be repeated here.

[0074] In some embodiments, the second metal material may also be other types of metal materials other than magnesium alloys, the density of which is lower than that of the first metal material.

[0075] The metal frame 230 can be obtained by CNC processing. The metal frame 230 may include a crossbeam and / or a longitudinal beam 231 and a support portion 232 connected to the crossbeam and / or the longitudinal beam 231. Various structures on the metal frame 230 are also obtained by CNC processing at one time. The crossbeam and / or the longitudinal beam 231 can be used to connect the support portion 232. The support portion 232 may be provided with a characteristic structure including a BOSS column 232a or a positioning column 232b. The support portion 232 may be used to fix other structural parts in the electronic device, such as circuit boards and other components.

[0076] In some possible implementations, the metal outer frame 210 may be anodized to form an anodized layer on the surface of the metal outer frame 210 , thereby enriching the color variety of the metal outer frame 210 and improving the overall metal texture of the middle frame 200 .

[0077] In some possible implementations, the size of the metal outer frame 210 is slightly larger than the metal skeleton 230, and the border of the metal outer frame 210 can be set as an L-shaped border, so that the metal skeleton 230 can be embedded in the metal outer frame 210. By adopting this solution, the increase in thickness caused by simply stacking the metal outer frame 210 and the metal skeleton 230 can be avoided, thereby reducing the thickness of the middle frame 200.

[0078] It should be understood that in the middle frame 200, the composite metal frame 201 is composed of a metal outer frame 210 and a metal skeleton 230, so the first glue layer may be glued to the metal outer frame 210, may be glued to the metal skeleton 230, or may be glued to the metal outer frame 210 and the metal skeleton 230 at the same time, and the embodiment of the present application does not limit this.

[0079] After the metal outer frame 210 and the metal skeleton 230 are simply overlapped, further connection reinforcement is required to improve the tightness of the connection between the two. For example, a second glue layer is set through a glue dispensing process so that the metal outer frame 210 and the metal skeleton 230 are overlapped and glued to achieve the connection between the metal outer frame 210 and the metal skeleton 230.

[0080] Figure 5 is a schematic diagram of the structure of the middle frame 200 provided in an embodiment of the present application, combined with Figure 4 and Figure 5 In order to make the connection between the metal outer frame 210 and the metal skeleton 230 more firm and reliable, a first threaded hole 210a may be provided on the surface of the metal outer frame 210 facing the metal skeleton 230, and a second threaded hole 230a corresponding to the first threaded hole 210a is provided on the metal skeleton 230. A fastener (not shown in the figure) is used to pass through the first threaded hole 210a and the second threaded hole 230a in sequence to connect the metal outer frame 210 and the metal skeleton 230.

[0081] The fastener may be a screw, through which the metal outer frame 210 and the metal skeleton 230 are connected; the fastener may also be connected in a matching manner using a nut and a bolt, thereby achieving a further reinforced connection between the metal outer frame 210 and the metal skeleton 230 .

[0082] Based on the above solution, compared with welding to connect different types of metals, the connection and assembly between two different types of metals using mature technology such as dispensing and / or bolt locking has higher reliability and durability.

[0083] The embodiment of the present application does not limit the number and position of the first threaded holes 210a and the second threaded holes 230a. For example, the number of the first threaded holes 210a can be four, and a first threaded hole 210a can be respectively provided on each of the four frames of the metal outer frame 210 (e.g. Figure 4 and Figure 5 The four first threaded holes 210a may also be disposed at the four corners of the metal outer frame 210. The number and position of the second threaded holes 230a may correspond to the number and position of the first threaded holes 210a.

[0084] Figure 6 yes Figure 5 The cross-sectional structure diagram of the middle B area along the X direction. Figure 5 Further references Figure 6 A silver paste layer 2201 is disposed on the surface of the non-metallic bottom plate 220 facing the composite metal frame 201. The silver paste layer 2201 can be engraved on the surface of the non-metallic bottom plate 220 by laser engraving. A conductive adhesive layer 2301 is disposed at a position corresponding to the contact between the composite metal frame 201 and the silver paste layer 2201. The conductive adhesive layer 2301 can be a non-woven conductive adhesive. After the silver paste layer 2201 contacts the conductive adhesive layer 2301, electrical connection can be achieved between the composite metal frame 201 and the non-metallic bottom plate 220.

[0085] It should be understood that the position where the silver paste layer 2201 is set is not fixed. For example, the silver paste layer 2201 can be set at a partial contact position between the non-metallic base plate 220 and one of the frames of the metal outer frame 210 .

[0086] In some embodiments, the area of ​​the conductive adhesive layer 2301 may be equal to or unequal to the area of ​​the silver paste layer 2201. When the conductive adhesive layer 2301 is in contact with the silver paste layer 2201, electrical connection between the composite metal frame 201 and the non-metallic base plate 220 can be achieved. The embodiments of the present application do not limit this.

[0087] It should be understood that Figure 5 The area B is only used to illustrate an optional area example when the conductive adhesive layer 2301 and the silver paste layer 2201 are set, and does not mean that the conductive adhesive layer 2301 and the silver paste layer 2201 can only be set in area B. The silver paste layer 2201 can also be set at other positions on the surface of the non-metallic bottom plate 220 that contacts one side of the composite metal frame 201, and the conductive adhesive layer 2301 is correspondingly set on the composite metal frame 201.

[0088] It should be understood that, unlike the middle frame 100, since the composite metal frame 201 in the middle frame 200 is composed of a metal outer frame 210 and a metal skeleton 230, when the non-metal bottom plate 220 contacts the composite metal frame 201, it may be that the metal skeleton 230 contacts the non-metal bottom plate 220, or the metal outer frame 210 contacts the non-metal bottom plate 220, or the metal outer frame 210 and the metal skeleton 230 contact the non-metal bottom plate 220 at the same time; that is, the conductive adhesive layer 2301 may be disposed on the metal outer frame 210, on the metal skeleton 230, or on both the metal outer frame 210 and the metal skeleton 230. Figure 6 As shown, the conductive adhesive layer 2301 is disposed on the surface of the metal frame 230 facing the non-metallic bottom plate 220 .

[0089] In some embodiments, the metal outer frame 210 and the metal skeleton 230 can be connected only by setting a second glue layer through a glue dispensing process, or they can be connected by using fasteners in conjunction with the first threaded hole 210a and the second threaded hole 230a on the basis of setting the second glue dispensing layer.

[0090] The present application also provides an electronic device, which may be a mobile phone, a tablet computer or a laptop computer. The electronic device includes a middle frame provided in any embodiment of the present application, and the middle frame may be used to connect and fix other components in the electronic device.

[0091] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A middle frame, characterized in that: include: A composite metal frame, the composite metal frame comprising a metal outer frame, the metal outer frame being made of a first metal material; A non-metallic bottom plate, wherein the non-metallic bottom plate is made of a carbon fiber material, and a density of the carbon fiber material is lower than a density of the first metal material.

2. The middle frame according to claim 1, characterized in that: The composite metal frame further includes a metal skeleton made of a second metal material having a density less than that of the first metal material.

3. The middle frame according to claim 2, characterized in that: The metal skeleton is embedded in the metal outer frame.

4. The middle frame according to claim 2, characterized in that: The metal frame also includes cross beams and / or longitudinal beams and supporting parts connected to the cross beams and / or longitudinal beams.

5. The middle frame according to claim 1, characterized in that: A first glue dispensing layer is arranged between the composite metal frame and the non-metal bottom plate.

6. The middle frame according to claim 5, characterized in that: A first glue groove is provided on the surface of the composite metal frame facing the non-metallic bottom plate, and the first glue-dispensing layer is accommodated in the first glue groove.

7. The middle frame according to claim 2, characterized in that: A second glue dispensing layer is arranged between the metal outer frame and the metal skeleton.

8. The middle frame according to claim 7, characterized in that: A second glue groove is provided on the surface of the metal skeleton facing the metal outer frame, and the second glue-dispensing layer is accommodated in the second glue groove.

9. The middle frame according to claim 7, characterized in that: A first threaded hole is also provided on the surface of the metal outer frame, and a second threaded hole corresponding to the position of the first threaded hole is also provided on the surface of the metal skeleton facing the metal outer frame; the middle frame also includes a fastener, which passes through the first threaded hole and the second threaded hole to connect the metal outer frame and the metal skeleton.

10. The middle frame according to claim 1, characterized in that: A silver paste layer is also provided on the surface of the non-metallic bottom plate facing the composite metal frame, and a conductive adhesive layer is provided at a position of the composite metal frame corresponding to the silver paste layer, and the silver paste layer is in contact with the conductive adhesive layer.

11. The middle frame according to claim 1, characterized in that: A recessed area is provided on the surface of the non-metallic base plate, and the recessed area is used to accommodate at least one of a heat sink, a flexible circuit board FPC, an adhesive component or a conductive foam.

12. The middle frame according to any one of claims 1 to 11, characterized in that: The first metal material is aluminum alloy.

13. The middle frame according to any one of claims 2-4 or 7-9, characterized in that: The second metal material is a magnesium alloy.

14. The middle frame according to any one of claims 1 to 11, characterized in that: The surface of the metal outer frame has an anodized layer.

15. An electronic device, characterized in that: The invention comprises the middle frame according to any one of claims 1 to 14, wherein the middle frame is used to fix the parts of the electronic device.

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