Power electronic equipment and power system
By using connectors to fix the circuit board outside the first housing of the power electronic device, a thermal conductivity path is formed and the assembly process is simplified, the problems of cumbersome assembly and heat dissipation performance are solved, and assembly efficiency and space utilization are improved.
Patent Information
- Application Number
- CN202420778014.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-15
Smart Images

Figure CN222339841U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electrical technology, and in particular to a power electronic device and a power system. Background Art
[0002] The housing structure of power electronic devices such as inverters usually includes a first housing and a second housing, which together form an installation cavity, and the circuit board assembly of the power electronic device is installed in the installation cavity. At present, when assembling power electronic devices, fasteners are usually used to press the circuit board assembly onto the first housing at the side of the circuit board assembly away from the first housing, and the power device of the circuit board assembly is close to the area where the heat dissipation structure on the first housing is located, so as to facilitate heat dissipation of the power device, and then another fastener is used to connect the second housing and the first housing together.
[0003] However, with this arrangement, when installing the circuit board assembly, there is a need for the fasteners and their corresponding operating equipment to avoid or prevent collision with the second shell. Specifically, the second shell must be removed first, and after the fasteners are connected to the circuit board assembly and the first shell, the second shell is moved to cover the side of the circuit board assembly away from the first shell, and the second shell is connected to the first shell. The installation process of the circuit board assembly is relatively cumbersome, resulting in low assembly efficiency of the power electronic device, and it is difficult to take into account both the heat dissipation requirements of the power devices and the installation convenience requirements of the circuit board assembly. Utility Model Content
[0004] The utility model aims to solve the problem in the related art of how to take into account the heat dissipation requirements of power devices on a circuit board assembly in a power electronic device and the installation convenience requirements of the circuit board assembly to a certain extent.
[0005] In order to at least solve at least one aspect of the above-mentioned problems to a certain extent, in a first aspect, the utility model provides a power electronic device, comprising a first shell, a second shell, a circuit board assembly and a first connecting member; the first shell is provided with a heat dissipation structure, the first shell and the second shell are together formed to form an installation cavity, the circuit board assembly is accommodated in the installation cavity, the circuit board assembly comprises a circuit board and a power device installed on the circuit board, the first connecting member passes through the first shell from the outside to the inside and is connected to the circuit board to fix the circuit board on the inner side of the first shell, when the circuit board is fixed on the inner side of the first shell, the first shell contacts the circuit board assembly in the area corresponding to the power device, and the heat dissipation structure at least covers the area of the first shell corresponding to the power device.
[0006] Optionally, in the thickness direction of the circuit board, the power device is mounted on a side of the circuit board facing the first shell.
[0007] Optionally, the first connector includes at least one of a first setting connector and a second setting connector, the projection of the first setting connector on the circuit board is located at the circumferential outer edge of the projection of the power device on the circuit board, and the second setting connector is arranged corresponding to the circumferential edge of the circuit board.
[0008] Optionally, a supporting structure is provided on the inner side of the first shell, and the first shell supports the circuit board through the supporting structure; the supporting structure includes at least one of a first supporting structure and a second supporting structure, the projection of the first supporting structure on the circuit board is located at the circumferential outer edge of the projection of the power device on the circuit board, and the second supporting structure is arranged corresponding to the circumferential edge of the circuit board.
[0009] Optionally, the first support structure includes at least one of a first support column and a first support plate, and the first support plate is extended along the circumference of the power device; and / or the second support structure includes a second support column.
[0010] Optionally, when the first connecting member includes the first setting connecting member, and the supporting structure includes the first supporting structure and the second supporting structure, the distance from the end face of the first supporting structure to the second shell is greater than or equal to the distance from the end face of the second supporting structure to the second shell.
[0011] Optionally, at least one supporting structure is provided with a first connecting hole structure for the first connecting member to pass through.
[0012] Optionally, the circuit board includes a circuit board body and a reinforcement structure connected to the circuit board body, and at least one of the circuit board body and the reinforcement structure is connected to the first connecting member.
[0013] Optionally, the reinforcement structure includes a reinforcement plate, the reinforcement plate and the power device are respectively located on different sides of the circuit board body along the thickness direction, and the projection of the power device on the circuit board body falls within the projection range of the reinforcement plate on the circuit board body.
[0014] Optionally, the first shell and the second shell are connected by snap-fitting;
[0015] And / or, the power electronic device further includes a second connecting member, and the first housing and the second housing are connected via the second connecting member.
[0016] Optionally, when the power electronic device includes the second connecting member, the second connecting member passes through the first shell and is connected to the second shell; wherein the second shell is provided with a through hole for connecting to the second connecting member, or a blind hole structure for connecting to the second connecting member is provided on the inner side of the second shell.
[0017] Optionally, the power electronic device further includes a plug-in positioning structure; the plug-in positioning structure is arranged between the first shell and the circuit board, and / or the plug-in positioning structure is arranged between the first shell and the second shell.
[0018] Optionally, the plug-in positioning structure includes a positioning pin and a positioning hole; the first shell, the circuit board and the second shell are all provided with the positioning holes, and the positioning pin is inserted into the positioning holes of at least two of the first shell, the circuit board and the second shell.
[0019] Optionally, the heat dissipation structure includes at least one of a heat sink and a heat dissipation channel, and a plurality of the heat sinks are connected to the outer surface of the first shell;
[0020] And / or, the first connecting member is any one of a threaded connecting member and a clamping connecting member;
[0021] And / or, the second shell includes a first plate body and a second plate body, the first plate body is arranged opposite to the circuit board, the second plate body is located at one end of the first plate body, and the second plate body is provided with an installation hole for installing the wiring harness assembly.
[0022] In a second aspect, the utility model provides a power system, comprising the power electronic device as described in the first aspect above.
[0023] Compared with the related prior art, in the power electronic device and power system of the utility model, the circuit board assembly is fixed by the first connector on the outside of the first shell provided with the heat dissipation structure. Under the action of the first connector, the first shell and the circuit board assembly form a heat conduction path by contact in the area corresponding to the power device, and the heat conduction path can ensure the heat dissipation performance of the power device of the circuit board assembly; at the same time, it can also avoid connecting the circuit board assembly on the inside of the first shell, and can reduce the possibility of collision with the second shell when connecting the first shell and the circuit board assembly. For example, there is no need to remove the second shell and connect the circuit board assembly and the first shell on the side of the circuit board assembly away from the first shell in the thickness direction, which is convenient for the subsequent rapid connection of the first shell and the second shell. For example, after the relative position positioning of the first shell, the circuit board assembly and the second shell is realized, the connection operation of the first shell and the circuit board assembly and the connection operation of the first shell and the second shell can be quickly carried out. For example, the first shell and the second shell can be connected by clamping or by the second connector. The utility model can take into account the heat dissipation requirements of the power device on the circuit board assembly and the installation convenience requirements of the circuit board assembly in the power electronic device. In addition, this arrangement is also beneficial to reduce the need for reserved operating space on the side of the circuit board assembly away from the first shell in the thickness direction (reserved operating space for connecting the circuit board assembly and the first shell), which is beneficial to the compact structural design of the circuit board assembly and improves the space utilization of power electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the explosion structure of the power electronic device in the embodiment of the utility model;
[0025] Figure 2 is another structural schematic diagram of a power electronic device in an embodiment of the utility model;
[0026] Figure 3 It is another structural schematic diagram of a power electronic device in an embodiment of the utility model;
[0027] Figure 4 for Figure 3 Schematic cross-sectional view at the AA section;
[0028] Figure 5 for Figure 3 A schematic cross-sectional view at the middle BB section;
[0029] Figure 6 This is a schematic diagram of an explosion structure of a power electronic device when the reinforcement structure is a reinforcement plate in another embodiment of the utility model;
[0030] Figure 7 for Figure 6A schematic structural diagram of the connection between the first connecting member and the reinforcing plate in the corresponding embodiment.
[0031] Description of reference numerals:
[0032] 1-first shell; 11-first connecting hole structure; 12-third connecting hole structure; 13-first supporting structure; 14-second supporting structure; 15-hanging ear structure; 16-heat dissipation structure; 2-second shell; 21-first plate body; 22-second plate body; 23-mounting hole; 24-fourth connecting hole structure; 3-circuit board assembly; 31-circuit board; 311-circuit board body; 312-reinforcement plate; 32-power device; 33-second connecting hole structure; 34-T-shaped structure; 4-first connecting piece; 41-first setting connecting piece; 42-second setting connecting piece; 5-second connecting piece; 6-plug-in positioning structure; 61-positioning pin; 62-positioning hole; 7-wiring harness assembly. DETAILED DESCRIPTION
[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.
[0036] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.
[0037] In the accompanying drawings, the Z axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis (that is, the direction of the arrow of the Z axis) represents the up, and the negative direction of the Z axis represents the down; the X axis in the accompanying drawings represents the front and back position, and the positive direction of the X axis (that is, the direction of the arrow of the X axis) represents the front side, and the negative direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the horizontal direction and is designated as the left and right position, and the positive direction of the Y axis (that is, the direction of the arrow of the Y axis) represents the right side, and the negative direction of the Y axis represents the left side; it should be noted that the aforementioned Z axis, Y axis and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.
[0038] like Figures 1 to 5 As shown, an embodiment of the utility model provides a power electronic device, including a first shell 1, a second shell 2, a circuit board assembly 3 and a first connecting member 4; the first shell 1 is provided with a heat dissipation structure 16, the first shell 1 and the second shell 2 are surrounded to form an installation cavity, the circuit board assembly 3 is accommodated in the installation cavity, the circuit board assembly 3 includes a circuit board 31 and a power device 32 installed on the circuit board 31, the first connecting member 4 passes through the first shell 1 from the outside to the inside and is connected to the circuit board 31 to fix the circuit board 31 on the inner side of the first shell 1, when the circuit board 31 is fixed on the inner side of the first shell 1, the first shell 1 is in contact with the circuit board assembly 3 in the area corresponding to the power device 32, and the heat dissipation structure 16 at least covers the area of the first shell 1 corresponding to the power device 32.
[0039] It should be noted that, in this embodiment, the first shell 1 and the second shell 2 are distributed along the Z-axis direction, and the two together enclose the installation cavity and form a relatively complete shell structure. The circuit board assembly 3 is installed in the installation cavity, and the sealing structure between the first shell 1 and the second shell 2 is determined according to the specific protection level requirements. In actual use, the X-axis, Y-axis and Z-axis in this specification are only used to illustrate the structural composition of the power electronic device, and do not represent the installation orientation of the power electronic device when it is put into use. For example, when the power electronic device is put into use, the positive direction of the Y-axis can point upward in the actual space.
[0040] Specifically, the first connector 4 is passed through the first shell 1 from the outside to the inside and connected to the circuit board 31 on the outside of the first shell 1, so that the position of the circuit board 31 on the inside of the first shell 1 is fixed. The force applied by the first connector 4 to the first shell 1 and the circuit board 31, such as a pulling force, makes the first shell 1 contact with the circuit board assembly 3 in the area corresponding to the power device 32. That is to say, under the action of the first connector 4, the first shell 1 and the circuit board assembly 3 form a heat conduction path through contact, and the heat conduction path is used to conduct heat between the first shell 1 and the power device 32, so as to ensure the thermal conductivity between the circuit board assembly 3 and the first shell 1 at the power device 32; at the same time, the heat dissipation structure 16 is set to at least cover the area of the first shell 1 corresponding to the power device 32, so that heat conduction between the power device 32 and the heat dissipation structure 16 of the first shell 1 can be achieved through the above-mentioned heat conduction path, so as to ensure the heat dissipation performance of the power device 32 of the circuit board assembly 3 through the heat dissipation structure 16 of the first shell 1.
[0041] In this way, the utility model fixes the circuit board assembly 3 on the outer side of the first shell 1 provided with the heat dissipation structure 16 through the first connecting member 4. Under the action of the first connecting member 4, the first shell 1 and the circuit board assembly 3 form a heat conduction path by contact in the area corresponding to the power device 32, and the heat conduction path can ensure the heat dissipation performance of the power device 32 of the circuit board assembly 3; at the same time, it can also avoid connecting the circuit board assembly 3 on the inner side of the first shell 1, and can reduce the possibility of collision with the second shell 2 when connecting the first shell 1 and the circuit board assembly 3. For example, there is no need to remove the second shell 2 and connect the circuit board assembly 3 and the first shell 1 on the side of the circuit board assembly 3 away from the first shell 1 in the thickness direction, which is convenient for the subsequent rapid connection of the first shell 1 and the second shell 2. For example, after the relative position positioning of the first shell 1, the circuit board assembly 3 and the second shell 2 is achieved, the connection operation of the first shell 1 and the circuit board assembly 3 and the connection operation of the first shell 1 and the second shell 2 can be quickly performed. For example, the first shell 1 and the second shell 2 can be connected by snapping or by the second connecting member 5. The utility model can take into account the heat dissipation requirements of the power device 32 on the circuit board assembly 3 in the power electronic device and the installation convenience requirements of the circuit board assembly 3. In addition, this arrangement is also conducive to reducing the requirements for the reserved operating space of the circuit board assembly 3 on the side away from the first housing 1 in the thickness direction (the reserved operating space for connecting the circuit board assembly 3 and the first housing 1), which is conducive to the compact design of the structure of the circuit board assembly 3 and improves the space utilization rate of the power electronic device.
[0042] like Figure 1 As shown, optionally, in the thickness direction of the circuit board 31 , the power device 32 is installed on a side of the circuit board 31 facing the first housing 1 .
[0043] like Figure 1 As shown, the power device 32 is installed on the upper side of the circuit board 31 , so that the upper side wall of the power device 32 (ie, the side wall facing away from the circuit board 31 ) can be pressed against the inner side of the first shell 1 through the connection operation of the first connecting member 4 .
[0044] Specifically, the side wall of the power device 32 facing away from the circuit board 31 may abut against the first shell 1 , for example, abut against the inner wall of the first shell 1 in a fitted manner, so that the first shell 1 achieves contact heat transfer to the power device 32 .
[0045] Of course, a heat-conducting structure such as a heat-conducting insulating glue can be set between the side wall of the power device 32 facing away from the circuit board 31 and the first shell 1, and a heat-conducting structure with a certain elasticity, such as a heat-conducting insulating pad, can also be set to avoid the power device 32 being crushed due to excessive force applied by the first connecting member 4.
[0046] It should be understood that in other embodiments, the power device 32 can also be installed on the side of the circuit board 31 away from the first shell 1. In this case, a avoidance hole can be set on the circuit board 31 corresponding to the heating area of the power device 32, and the heat conductive structure is accommodated in the avoidance hole, with one end being in contact with the inner wall of the first shell 1 and the other end being in contact with the heating area of the power device 32.
[0047] In this way, compared with the power device 32 being installed on the side of the circuit board 31 away from the first housing 1 , the path length of the heat conduction path corresponding to the power device 32 can be reduced, thereby improving the heat dissipation performance of the power device 32 .
[0048] like Figures 1 to 5 As shown, optionally, the first connecting member 4 is any one of a threaded connecting member and a snap-on connecting member.
[0049] like Figure 4 As shown, specifically, the first shell 1 is provided with a first connecting hole structure 11, the circuit board assembly 3 is provided with a second connecting hole structure 33, and the first connecting member 4 passes through the first connecting hole structure 11 from the outside to the inside from the outside of the first shell 1 (the side where the positive direction of the Z axis is located in the figure) and is connected to the second connecting hole structure 33.
[0050] Exemplarily, when the first connecting member 4 is a threaded connecting member, it passes through the first connecting hole structure 11 and is threadedly connected to the second connecting hole structure 33. At this time, the second connecting hole structure 33 can be set as a threaded blind hole or a threaded through hole. Figure 4 The case where the second connection hole structure 33 is a threaded through hole is shown, and the content of the utility model will be explained later using this as an example.
[0051] The second connection hole structure 33 may be formed in a T-shaped structure 34 disposed on the circuit board 31 , and a small end of the T-shaped structure 34 is disposed in the circuit board 31 from a side of the circuit board 31 away from the first housing 1 .
[0052] Exemplarily, when the first connecting member 4 is a snap-on connecting member, a snap tongue is provided at both ends thereof. After the first connecting member 4 passes through the first connecting hole structure 11 and extends into the second connecting hole structure 33, the snap tongues at both ends of the first connecting member 4 snap into the first connecting hole structure 11 and the second connecting hole structure 33 respectively. For example, the first connecting hole structure 11 and the second connecting hole structure 33 are both set as through holes, and the snap tongue abuts against the outer end surface of the through hole, thereby realizing the relative position fixation of the circuit board assembly 3 and the first shell 1 (not shown in this scheme figure).
[0053] like Figure 1 , Figures 3 to 5 As shown, optionally, the first connector 4 includes at least one of a first setting connector 41 and a second setting connector 42, the first connector 4 includes at least one of a first setting connector 41 and a second setting connector 42, the projection of the first setting connector 41 on the circuit board 31 is located at the circumferential outer edge of the projection of the power device 32 on the circuit board 31, and the second setting connector 42 is arranged corresponding to the circumferential edge of the circuit board 31.
[0054] That is to say, at least one first connector 4 is a first setting connector 41, and / or, at least one first connector 4 is a second setting connector 42, and both the first setting connector 41 and the second setting connector 42 can be set to multiple as needed.
[0055] It should be understood that the first setting connection member 41 is mainly connected to the circuit board 31 at the peripheral side of the power device 32, so as to strengthen the pulling force on the circuit board assembly 3 at the power device 32. The minimum distance between the projection of the first setting connection member 41 on the circuit board 31 and the projection of the power device 32 on the circuit board 31 (the minimum value of the distance between two points located on different projection outer contours) is less than or equal to the first preset distance threshold, and the first preset distance threshold is determined according to actual needs, for example, the first preset distance threshold is 15 mm, 10 mm, and 5 mm.
[0056] The second setting connection member 42 is mainly used to provide a pulling force on the circuit board 31 at the circumferential edge of the circuit board 31. The minimum distance between the point of the second setting connection member 42 on the outer contour of the projection of the circuit board 31 and the circumferential outer end surface of the circuit board 31 is less than or equal to the second preset distance threshold, and the second preset distance threshold is determined according to actual needs, for example, the second preset distance threshold is 20 mm, 15 mm, and 5 mm.
[0057] Usually, the distance from the first setting connector 41 to the adjacent power device 32 is smaller than the distance from the second setting connector 42 to the power device 32; however, when one end of the power device 32 is arranged close to one end of the circuit board 31, one or more first connectors 4 corresponding to the end can obtain the function of the second connector 5, that is, they can apply tension to the circumferential edge of the circuit board 31 as well as to the circuit board 31 at the power device 32.
[0058] In this way, the circuit board assembly 3 and the first housing 1 can be connected near the power device 32 through the first setting connector 41, ensuring the contact performance between the circuit board assembly 3 and the first housing 1 at the power device 32, thereby ensuring the heat dissipation performance of the power device 32. The circuit board assembly 3 and the first housing 1 can be connected at the edge of the circuit board 31 through the second setting connector 42, ensuring the stability of the relative position of the circuit board assembly 3 and the first housing 1.
[0059] Optionally, a supporting structure is disposed inside the first shell 1 , and the first shell 1 supports the circuit board 31 through the supporting structure.
[0060] The support structure may be integrally formed on the inner side of the first shell 1 , and of course, may also be fixed to the first shell 1 by means of snap connection or the like.
[0061] The supporting structures are usually provided in multiple configurations, and the circuit board 31 is supported by the multiple supporting structures.
[0062] In this way, by supporting the circuit board 31 with the support structure, the tolerance requirements on other positions inside the first shell 1 can be reduced, making it easier to fix the circuit board 31.
[0063] like Figure 4 As shown, in a further solution of the support structure, the support structure includes a first support structure 13 , and the projection of the first support structure 13 on the circuit board 31 is located at the circumferential outer edge of the projection of the power device 32 on the circuit board 31 .
[0064] The minimum distance between the projection of the first support structure 13 on the circuit board 31 and the projection of the power device 32 on the circuit board 31 (the minimum distance between two points on different projection outer contours) is less than or equal to a third preset distance threshold. The third preset distance threshold is determined according to actual needs. For example, the third preset distance threshold is 15 mm, 10 mm, or 5 mm.
[0065] The length of the first supporting structure 13 is determined according to actual needs, usually to avoid crushing the power device 32 and the circuit board 31. For example, the distance between the inner surface of the first shell 1 at the power device 32 and the circuit board 31 is consistent with the length of the first supporting structure 13, or the length is slightly smaller than the distance. For example, the difference between the two is 0-1.5 mm, such as 0.2-1 mm, 0.3-0.6 mm, which is determined according to specific needs.
[0066] In this way, the first supporting structure 13 can support the circuit board 31 near the power device 32, ensuring the connection performance between the first housing 1 and the circuit board 31 near the power device 32. By designing the length of the first supporting structure 13, it is possible to avoid damage to the power device 32 and the circuit board 31 due to excessive pressure applied by the first connector 4.
[0067] In a further optional solution of the first support structure 13 , the first support structure 13 includes at least one of a first support column and a first support plate, and the first support plate is extended along the circumference of the power device 32 .
[0068] Figure 4 The figure shows the case where the first support structure 13 includes a first support column. When the first support structure 13 includes a first support plate, the first support plate can better support the circuit board 31 in the circumferential direction of the power device 32. In particular, when the power device 32 is installed on the side of the circuit board 31 facing the first shell 1 along the thickness direction, the first support plate can be arranged around one or several adjacent power devices 32. At this time, the first shell 1 substantially forms a accommodating cavity at the first support plate, and the power device 32 is accommodated in the accommodating cavity, thereby forming better protection for the power device 32 in the circumferential direction of the power device 32, and forming reliable support for the circuit board 31 on the peripheral side of the power device 32.
[0069] like Figure 5 As shown, in a further solution of the support structure, the support structure includes a second support structure 14 , and the second support structure 14 is arranged corresponding to the circumferential edge of the circuit board 31 .
[0070] The minimum distance between a point on the outer contour of the projection of the second support structure 14 on the circuit board 31 and the circumferential outer end surface of the circuit board 31 is less than or equal to a fourth preset distance threshold, and the fourth preset distance threshold is determined according to actual needs. For example, the fourth preset distance threshold is 20 mm, 15 mm, or 5 mm.
[0071] Usually, there are multiple second support structures 14 , and the multiple second support structures 14 are distributed circumferentially corresponding to the circuit board 31 . The second support structure 14 is usually configured as, for example, a second support column, which will not be described in detail here.
[0072] In a further optional scheme, when the first connecting member 4 includes a first setting connecting member 41, and the supporting structure includes a first supporting structure 13 and a second supporting structure 14, the distance from the end face of the first supporting structure 13 to the second shell 2 is greater than or equal to the distance from the end face of the second supporting structure 14 to the second shell 2 (the distance may be the distance to the inner surface of the second shell 2, which is regarded as being in the XY plane).
[0073] When the previous distance is greater than the latter distance, damage to the circuit board 31 and the power device 32 should be avoided. The difference between the two distances is usually not too large and is usually determined based on actual conditions. For example, the difference is 0-1.5 mm, such as 0.2-1 mm, 0.3-0.6 mm.
[0074] That is to say, when the circuit board assembly 3 is connected to the first shell 1 through the first set connecting member 41, the first supporting structure 13 and the second supporting structure 14 respectively support the circuit board 31, and the tension applied to the circuit board 31 at the first supporting structure 13 may be greater than or less than the tension applied to the circuit board 31 at other positions, such as the second supporting structure 14. This can avoid the tension at the first supporting structure 13 being too small, resulting in a gap in the circuit board assembly 3 at the power device 32, thereby affecting the thermal conductivity of the circuit board assembly 3 between the power device 32 and the first shell 1.
[0075] When the distance from the end face of the first supporting structure 13 to the second shell 2 is greater than the distance from the end face of the second supporting structure 14 to the second shell 2, the circuit board 31 at the first supporting structure 13 is subjected to a greater pulling force, so that the circuit board 31 at the power device 32 is slightly deformed along the thickness direction toward the side close to the first shell 1 (i.e. upward), thereby ensuring that the circuit board assembly 3 at the power device 32 is in good contact with the first shell 1, and the thermal conductivity between the circuit board assembly 3 at the power device 32 and the first shell 1 is good.
[0076] In the above embodiment, optionally, at least one supporting structure is provided with a first connecting hole structure 11 for the first connecting member 4 to pass through.
[0077] like Figure 4 As shown, exemplarily, the first support structure 13 is provided with a first connection hole structure 11 for the first setting connection member 41 to pass through, and the second support structure 14 is provided with another first connection hole structure 11 for the second setting connection member 42 to pass through.
[0078] In this way, the supporting and connecting structure between the first housing 1 and the circuit board assembly 3 is relatively compact, simple in structure and highly practical.
[0079] In the above embodiment, optionally, the circuit board 31 includes a circuit board body 311 and a reinforcement structure connected to the circuit board body 311 , and at least one of the circuit board body 311 and the reinforcement structure is connected to the first setting connector 41 .
[0080] The specific structure and arrangement of the reinforcement structure are not limited, and it can reinforce the circuit board body 311 to prevent the circuit board body 311 from being damaged by the pulling force of the first connecting member 4. The reinforcement structure and the circuit board body 311 can be connected by bonding, clamping, etc.
[0081] Furthermore, the circuit board body 311 is provided with a reinforcement structure at least in the area corresponding to the power device 32 , so as to specifically reinforce the area where the power device 32 is located.
[0082] like Figure 6 and Figure 7 As shown, further, the reinforcement structure includes a reinforcement plate 312 , the reinforcement plate 312 and the power device 32 are respectively located on different sides of the circuit board body 311 , and the projection of the power device 32 on the circuit board body 311 falls within the projection range of the reinforcement plate 312 on the circuit board body 311 .
[0083] Exemplarily, the power device 32 is installed on the side of the circuit board body 311 facing the first shell 1 along the thickness direction, the reinforcement plate 312 is located on the side of the circuit board body 311 away from the first shell 1 along the thickness direction, and the first connecting member 4 passes through the first shell 1 and the circuit board body 311 in sequence and is connected to the reinforcement plate 312.
[0084] In this way, the possibility of mutual interference between the power device 32 and the reinforcing plate 312 can be reduced, and the reinforcing effect on the reinforcing plate 312 body can be ensured.
[0085] It should be understood that, when necessary, the reinforcing structure, such as the reinforcing plate 312, should be provided with an avoidance structure to avoid the components on the circuit board body 311, which will not be described in detail here.
[0086] Optionally, the first shell 1 and the second shell 2 are connected by snap-fitting.
[0087] Exemplarily, a snap connection is provided on the inner side of the first housing 1, a bayonet structure is provided on the inner side of the second housing 2, and the end of the snap connector extends into the bayonet structure and is connected to the bayonet structure, thereby achieving the connection between the first housing 1 and the second housing 2. This scheme is not shown in the figure and will not be described in detail later.
[0088] like Figure 1 As shown, optionally, the power electronic device further includes a second connecting member 5 , and the first housing 1 and the second housing 2 are connected via the second connecting member 5 .
[0089] Specifically, the first shell 1 is provided with a third connection hole structure 12, the second shell 2 is provided with a fourth connection hole structure 24, and the second connecting member 5 passes through one of the third connection hole structure 12 and the fourth connection hole structure 24 and is connected to the other of the third connection hole structure 12 and the fourth connection hole structure 24.
[0090] In this way, the relative positions of the first shell 1 and the second shell 2 can be fixed, and the fixing structure of the first shell 1 and the second shell 2 is relatively simple and highly practical.
[0091] like Figure 1 As shown, in an optional solution of the second connecting member 5 , the second connecting member 5 passes through the first shell 1 and is connected to the second shell 2 .
[0092] Specifically, the second connecting member 5 passes through the third connecting hole structure 12 from the outside to the inside from the outside of the first housing 1 (the side where the positive direction of the Z axis is located in the figure) and is connected to the fourth connecting hole structure 24.
[0093] In this way, when the power electronic device is assembling the circuit board assembly 3, the first shell 1 and the second shell 2, the first connecting member 4 and the second connecting member 5 can be connected separately on the outside of the first shell 1 (the side where the positive direction of the Z axis is located in the figure), so that the connection operation between the first shell 1 and the circuit board assembly 3 is realized through the first connecting member 4, and the connection operation between the second shell 2 and the first shell 1 is realized through the second connecting member 5, avoiding the connection operation of the first connecting member 4 and the second connecting member 5 on the outside of the first shell 1 and the outside of the second shell 2, respectively, which facilitates the assembly of the circuit board assembly 3, the first shell 1 and the second shell 2, and has high assembly efficiency and strong practicality.
[0094] In a further optional solution of the second connecting member 5 , a blind hole structure is provided on the inner side of the second shell 2 , and is connected to the second connecting member 5 via the blind hole structure.
[0095] Specifically, the fourth connection hole structure 24 is the blind hole structure, which is disposed on the inner side of the second housing 2. The second housing 2 does not need to have an opening on the outer surface due to the fourth connection hole structure 24 (see Figure 2 ,), that is, to avoid destroying the flatness of the surface of the second shell 2 located in the negative direction of the Z axis in the figure.
[0096] In this way, the flatness of the outer surface of the second shell 2 can be prevented from being damaged due to the connection with the second connecting member 5 , which is beneficial to ensuring the visual beauty of the outer surface of the second shell 2 .
[0097] In this case, when the power electronic device is put into use, the first shell 1 can be located on the back of the power electronic device, and the second shell 2 can be located on the front of the power electronic device. For example, when the power electronic device is a micro inverter, which is hung and installed on the mounting frame of the photovoltaic component through the hanging ear structure 15 of the first shell 1 located in the positive direction of the Y-axis, the second shell 2 is located on the side away from the power electronic device away from the mounting frame, that is, on the front of the power electronic device. When the first shell 1, the circuit board assembly 3 and the second shell 2 are connected, there is no need to open a through hole on the outer surface of the second shell 2 for connecting with the second connecting member 5, which can improve the cleanliness of the outer surface of the second shell 2 and improve the aesthetics of the front of the power electronic device.
[0098] Similarly, the first shell 1 and the second shell 2 may both be provided with support columns corresponding to the second connecting member 5, which will not be described in detail here.
[0099] like Figure 5 As shown, optionally, the power electronic device further includes a plug-in positioning structure 6 ; a plug-in positioning structure 6 is provided between the first shell 1 and the circuit board 31 , and / or a plug-in positioning structure 6 is provided between the first shell 1 and the second shell 2 .
[0100] The specific structure of the plug-in positioning structure 6 is not limited. The plug-in positioning between the first housing 1 and the circuit board 31, and the plug-in structure between the first housing 1 and the second housing 2, can adopt similar structures or different structures. Taking the plug-in positioning structure 6 between the first housing 1 and the circuit board 31 as an example, the parts of the plug-in positioning structure 6 arranged on the first housing 1 and the circuit board 31 can be smoothly connected to achieve the relative position positioning of the first housing 1 and the circuit board 31.
[0101] In this way, it is convenient to organize the power electronic device after the relative positions of the first shell 1, the circuit board 31 and the second shell 2 are positioned by the plug-in positioning structure 6. For example, the second shell 2, the circuit board assembly 3 and the first shell 1 can be placed in place from bottom to top. After the relative positions of the three are positioned, the first connector 4 and the second connector 5 can be connected from above, which can realize the rapid assembly of the power electronic device. In an automated production line, for example, the complexity of the assembly equipment of the power electronic device can be reduced, thereby improving the assembly efficiency of the power electronic device.
[0102] like Figure 5 As shown, in a further optional solution of the plug-in positioning structure 6 , the plug-in positioning structure 6 includes a positioning pin 61 and a positioning hole 62 .
[0103] Further, when a plug-in positioning structure 6 is provided between the first shell 1 and the circuit board 31, and a plug-in positioning structure 6 is provided between the first shell 1 and the second shell 2, the first shell 1, the circuit board 31 and the second shell 2 are all provided with positioning holes 62, and the positioning pin 61 is inserted into at least two of the positioning holes 62 in the first shell 1, the circuit board 31 and the second shell 2.
[0104] like Figure 5 As shown, it shows that the positioning pin 61 is inserted into the positioning hole 62 of the first housing 1, the circuit board 31 and the second housing 2, that is, it shows that the relative positions of the first housing 1, the circuit board 31 and the second housing 2 are positioned by the same positioning pin 61. Its positioning structure is simple and practical.
[0105] In the above embodiment, optionally, the heat dissipation structure 16 includes heat dissipation fins, and a plurality of heat dissipation fins are connected to the outer surface of the first housing 1 .
[0106] Optionally, the heat dissipation structure 16 includes a heat dissipation channel. For example, a coolant is arranged in the heat dissipation channel, and the power device 32 of the circuit board assembly 3 is cooled by the flow of the coolant.
[0107] In the above embodiment, optionally, the second shell 2 includes a first plate body 21 and a second plate body 22, the first plate body 21 is arranged opposite to the circuit board 31, the second plate body 22 is located at one end of the first plate body 21, and the second plate body 22 is provided with an installation hole 23 for installing the wiring harness assembly 7, and the wiring harness assembly 7 is used to be connected to the circuit board 31.
[0108] Specifically, the wire harness assembly 7 extends into the installation cavity through the installation hole 23 of the second housing 2 and is connected to the circuit board 31 .
[0109] Therefore, when organizing the power electronic device, the inner side of the second shell 2 can be facing upwards, and after the wiring harness assembly 7 is connected to the circuit board 31, the relative positions of the first shell 1, the circuit board assembly 3 and the second shell 2 can be positioned by the plug-in positioning structure 6, and then the first connector 4 and the second connector 5 can be connected from above, so as to improve the organizational efficiency of the power electronic device.
[0110] Another embodiment of the present invention provides a power system, which includes the power electronic device of the above embodiment. For example, the power system is a photovoltaic system.
[0111] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.
Claims
1. A power electronic device, characterized in that: The invention comprises a first shell (1), a second shell (2), a circuit board assembly (3) and a first connecting member (4); the first shell (1) is provided with a heat dissipation structure (16); the first shell (1) and the second shell (2) are combined to form an installation cavity; the circuit board assembly (3) is accommodated in the installation cavity; the circuit board assembly (3) comprises a circuit board (31) and a power device (32) installed on the circuit board (31); the first connecting member (4) passes through the first shell (1) from the outside to the inside and is connected to the circuit board (31) so as to fix the circuit board (31) on the inner side of the first shell (1); when the circuit board (31) is fixed on the inner side of the first shell (1), the first shell (1) contacts the circuit board assembly (3) in an area corresponding to the power device (32); and the heat dissipation structure (16) at least covers an area of the first shell (1) corresponding to the power device (32).
2. The power electronic device according to claim 1, characterized in that In the thickness direction of the circuit board (31), the power device (32) is mounted on a side of the circuit board (31) facing the first housing (1).
3. The power electronic device according to claim 1 or 2, characterized in that: The first connecting member (4) comprises at least one of a first setting connecting member (41) and a second setting connecting member (42), wherein the projection of the first setting connecting member (41) on the circuit board (31) is located at the circumferential outer edge of the projection of the power device (32) on the circuit board (31), and the second setting connecting member (42) is arranged corresponding to the circumferential edge of the circuit board (31).
4. The power electronic device according to claim 3, characterized in that A support structure is arranged on the inner side of the first shell (1), and the first shell (1) supports the circuit board (31) through the support structure; the support structure comprises at least one of a first support structure (13) and a second support structure (14); the projection of the first support structure (13) on the circuit board (31) is located at the circumferential outer edge of the projection of the power device (32) on the circuit board (31), and the second support structure (14) is arranged corresponding to the circumferential edge of the circuit board (31).
5. The power electronic device according to claim 4, characterized in that The first support structure (13) comprises at least one of a first support column and a first support plate, wherein the first support plate is arranged to extend along the circumference of the power device (32); and / or the second support structure (14) comprises a second support column.
6. The power electronic device according to claim 4, characterized in that When the first connecting member (4) includes the first setting connecting member (41), and the supporting structure includes the first supporting structure (13) and the second supporting structure (14), the distance from the end face of the first supporting structure (13) to the second shell (2) is greater than or equal to the distance from the end face of the second supporting structure (14) to the second shell (2).
7. The power electronic device according to claim 3, characterized in that At least one supporting structure is provided with a first connecting hole structure (11) for the first connecting member (4) to pass through.
8. The power electronic device according to claim 1 or 2, characterized in that: The circuit board (31) comprises a circuit board body (311) and a reinforcement structure connected to the circuit board body (311), and at least one of the circuit board body (311) and the reinforcement structure is connected to the first connecting member (4).
9. The power electronic device according to claim 8, characterized in that The reinforcement structure comprises a reinforcement plate (312), wherein the reinforcement plate (312) and the power device (32) are respectively located on different sides of the circuit board body (311) along the thickness direction, and the projection of the power device (32) on the circuit board body (311) falls within the projection range of the reinforcement plate (312) on the circuit board body (311).
10. The power electronic device according to claim 1 or 2, characterized in that: The first shell (1) and the second shell (2) are connected by snapping; And / or, the power electronic device further comprises a second connecting member (5), and the first housing (1) and the second housing (2) are connected via the second connecting member (5).
11. The power electronic device according to claim 10, characterized in that When the power electronic device comprises the second connecting member (5), the second connecting member (5) passes through the first housing (1) and is connected to the second housing (2); wherein the second housing (2) is provided with a through hole for connecting to the second connecting member (5), or the inner side of the second housing (2) is provided with a blind hole structure for connecting to the second connecting member (5).
12. The power electronic device according to claim 1 or 2, characterized in that: It also includes a plug-in positioning structure (6); the plug-in positioning structure (6) is arranged between the first shell (1) and the circuit board (31), and / or the plug-in positioning structure (6) is arranged between the first shell (1) and the second shell (2).
13. The power electronic device according to claim 12, characterized in that The plug-in positioning structure (6) comprises a positioning pin (61) and a positioning hole (62); the first shell (1), the circuit board (31) and the second shell (2) are all provided with the positioning hole (62), and the positioning pin (61) is inserted into at least two of the positioning holes (62) of the first shell (1), the circuit board (31) and the second shell (2).
14. The power electronic device according to claim 1 or 2, characterized in that: The heat dissipation structure (16) comprises at least one of a heat dissipation fin and a heat dissipation channel, and a plurality of the heat dissipation fins are connected to the outer surface of the first shell (1); And / or, the first connecting member (4) is any one of a threaded connecting member and a snap-fit connecting member; And / or, the second shell (2) comprises a first plate body (21) and a second plate body (22), the first plate body (21) being arranged opposite to the circuit board (31), the second plate body (22) being located at one end of the first plate body (21), and the second plate body (22) being provided with a mounting hole (23) for mounting the wiring harness assembly (7).
15. A power system, characterized in that: Comprising a power electronic device as claimed in any one of claims 1 to 14.