High-luminous-efficiency flip-chip LED (light-emitting diode)

Abstract

The utility model discloses a high-luminous-efficiency flip LED (light-emitting diode), which comprises a substrate. According to the utility model, the flip chip is wedged in the mounting groove through the positioning groove and the positioning block, the light-emitting diode body is wedged in the wedging groove, and the substrate is clamped with the clamping block through the convex block and the second groove, so that the flip chip of the light-emitting diode body can be packaged in the through groove more stably and firmly; the light-emitting diodes irradiate towards the lower end through the through grooves, the reflecting pieces are fixedly installed on the inner sides of the through grooves, the reflecting pieces have the effect of reflecting light, the illumination intensity is improved, and the illumination efficiency and intensity of the light-emitting diode chips are improved by inversely installing the light-emitting diode chips and arranging the light intensifying structures in the light-emitting diode chips. And air in the shell circulates through the arranged heat dissipation holes, so that the heat dissipation effect of the equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of touch display, in particular to a high-light-efficiency flip-chip LED light-emitting diode component. Background Art

[0002] With the continuous advancement of LED technology, UV LEDs have also received great attention in recent years. UV LEDs have the advantages of energy saving, environmental protection, and high efficiency. In the fields of lighting, medical treatment, printing, and sterilization, they are increasingly being used to replace traditional mercury lamps. LED chip designs can generally be divided into top-mounted chips, flip-chip chips, and vertical structure chips.

[0003] Light emitting diodes are something that we often see in our daily lives. They have the characteristics of low energy consumption, low cost, small size, high reliability, and environmental protection. They are widely used in today's society. Traditional light emitting diodes have complex structural designs, low luminous efficiency, and insufficient use of light energy, resulting in the loss of light energy. This not only wastes energy, but also increases production costs. For this reason, we have proposed a high-efficiency flip-chip LED light emitting diode. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In order to solve the above problems, the utility model provides a high-light-efficiency flip-chip LED light-emitting diode device, thereby solving the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned problems, the specific technical solutions adopted by the utility model are as follows:

[0008] A high-light-efficiency flip-chip LED light-emitting diode device comprises a substrate, a mounting groove is provided on one side surface of the substrate, a positioning groove is provided in the mounting groove, a positioning block is provided in the positioning groove, and a flip-chip is connected to the positioning block, a silicone sleeve is provided on the top surface of the flip-chip, and a light-emitting diode body is provided on the top surface of the flip-chip, and a positive electrode and a negative electrode are connected to the bottom surface of the light-emitting diode body.

[0009] Furthermore, the top surface of the substrate is connected to a shell, and a card block is arranged in the shell, a second groove is opened on one side surface of the card block, and a through groove is opened in the second groove, a reflective sheet is arranged on the inner wall surface of the through groove, and a focusing sheet is connected to one end of the through groove, and the focusing sheet is arranged on one side surface of the shell.

[0010] Furthermore, a bump is disposed on the top surface of the substrate, and the bump is snapped into the second groove, and the inner diameter of the second groove is consistent with the size of the bump.

[0011] Furthermore, a heat dissipation hole is provided on a surface of one side of the shell, and the heat dissipation hole is connected to the first groove.

[0012] Furthermore, there are a plurality of mounting grooves, and the plurality of mounting grooves are arranged on one side surface of the substrate.

[0013] Furthermore, the positioning groove and the positioning block are matched in size.

[0014] (III) Beneficial effects

[0015] Compared with the prior art, the utility model provides a high-light-efficiency flip-chip LED light-emitting diode device, which has the following beneficial effects:

[0016] (1) The utility model adopts a reflective sheet, a focusing sheet, a clamping block, a through groove and a heat dissipation hole. In actual use, the flip chip fits in the installation groove through the positioning groove and the positioning block, and the light-emitting diode body fits in the fitting groove. At the same time, the substrate is clamped by the protrusion and the second groove and the clamping block, so that the flip chip of the light-emitting diode body can be more stable and secure when it is packaged in the through groove. The light-emitting diode is irradiated to the lower end through the through groove. The reflective sheet is fixedly installed on the inside of the through groove. The reflective sheet has the function of reflecting light and increasing the light intensity. By flipping the light-emitting diode chip and setting a light-enhancing structure inside, the irradiation efficiency and intensity of the light-emitting diode chip are enhanced. The air in the shell is circulated through the heat dissipation holes, thereby increasing the heat dissipation effect of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the structure of a high-light-efficiency flip-chip LED light-emitting diode device proposed by the utility model;

[0019] Figure 2 This is a schematic structural diagram of a high-light-efficiency flip-chip LED light-emitting diode device of the utility model;

[0020] Figure 3 It is a schematic diagram of the internal structure of the flip chip of the utility model;

[0021] Figure 4 It is a schematic diagram of the internal structure of the shell of the utility model.

[0022] In the figure:

[0023] 1. Substrate; 2. Flip chip; 3. Positioning block; 4. Mounting groove; 5. Positioning groove; 6. First groove; 7. Block; 8. Shell; 9. Bump; 10. Heat dissipation hole; 11. Positive electrode; 12. Negative electrode; 13. Light-emitting diode body; 14. Silicone sleeve; 15. Second groove; 16. Reflector; 17. Through groove; 18. Focusing sheet. DETAILED DESCRIPTION

[0024] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0025] According to an embodiment of the utility model, a high-light-efficiency flip-chip LED light-emitting diode device is provided.

[0026] The present invention is now further described in conjunction with the accompanying drawings and specific implementation methods. Figure 1-4 As shown, according to the embodiment of the utility model, the high-light-efficiency flip-chip LED light-emitting diode device includes a substrate 1, a mounting groove 4 is provided on one side surface of the substrate 1, and a positioning groove 5 is provided in the mounting groove 4, a positioning block 3 is arranged in the positioning groove 5, and the positioning block 3 is connected to the flip chip 2, a silicone sleeve 14 is arranged on the top surface of the flip chip 2, and a light-emitting diode body 13 is arranged on the top surface of the flip chip 2, and a positive electrode 11 and a negative electrode 12 are connected to the bottom surface of the light-emitting diode body 13, and the positioning groove 5 and the positioning block 3 are arranged to facilitate the fixed installation of the flip chip 2.

[0027] In one embodiment, the top surface of the substrate 1 is connected to a shell 8, and a card block 7 is arranged in the shell 8, a second groove 15 is opened on one side surface of the card block 7, and a through groove 17 is opened in the second groove 15, a reflective sheet 16 is arranged on the inner wall surface of the through groove 17, and a focusing sheet 18 is connected to one end of the through groove 17, and the focusing sheet 18 is arranged on one side surface of the shell 8, and the light effect can be increased by setting the reflective sheet 16.

[0028] In one embodiment, a bump 9 is provided on the top surface of the substrate 1, and the bump 9 is snapped into the second groove 15. The inner diameter of the second groove 15 is consistent with the size of the bump 9. By making the inner diameter of the second groove 15 consistent with the size of the bump 9, snapping is facilitated.

[0029] In one embodiment, a heat dissipation hole 10 is provided on one side surface of the housing 8 , and the heat dissipation hole 10 is connected to the first groove 6 , so that air circulation is increased through the heat dissipation hole 10 , thereby facilitating heat dissipation.

[0030] In one embodiment, a plurality of mounting grooves 4 are provided, and the plurality of mounting grooves 4 are provided on one side surface of the substrate 1 .

[0031] In one embodiment, the positioning groove 5 matches the positioning block 3 in size, and the flip chip 2 is easily limited by matching the positioning groove 5 with the positioning block 3 in size.

[0032] Working principle: the flip chip 2 fits inside the mounting groove 4 through the positioning groove 5 and the positioning block 3, and the LED body 13 fits inside the fitting groove. At the same time, the substrate 1 is clamped through the protrusion 9 and the second groove 15 and the clamping block 7, so that the flip chip 2 of the LED body 13 can be more stable and secure when encapsulated inside the through groove 17. The LED is irradiated to the lower end through the through groove 17. A reflector 16 is fixedly installed inside the through groove 17. The reflector 16 has the function of reflecting light to increase the light intensity. By flipping the LED chip and setting a light-enhancing structure inside, the irradiation efficiency and intensity of the LED chip are enhanced. The air in the housing 8 is circulated through the heat dissipation holes 10, thereby increasing the heat dissipation effect of the equipment.

[0033] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-light-efficiency flip-chip LED light-emitting diode device, comprising a substrate (1), characterized in that: A mounting groove (4) is provided on one side surface of the substrate (1), and a positioning groove (5) is provided in the mounting groove (4), a positioning block (3) is provided in the positioning groove (5), and the positioning block (3) is connected to a flip chip (2), a silicone sleeve (14) is provided on the top surface of the flip chip (2), and a light-emitting diode body (13) is provided on the top surface of the flip chip (2), and a positive electrode (11) and a negative electrode (12) are connected to the bottom surface of the light-emitting diode body (13).

2. The high light-efficiency flip-chip LED device according to claim 1, characterized in that: The top surface of the substrate (1) is connected to a housing (8), and a card block (7) is arranged in the housing (8); a second groove (15) is provided on one side surface of the card block (7), and a through groove (17) is provided in the second groove (15); a reflective sheet (16) is provided on the inner wall surface of the through groove (17), and a condenser sheet (18) is connected to one end of the through groove (17); and the condenser sheet (18) is arranged on one side surface of the housing (8).

3. The high light-efficiency flip-chip LED device according to claim 1, characterized in that: A protrusion (9) is provided on the top surface of the substrate (1), and the protrusion (9) is clamped in the second groove (15), and the inner diameter of the second groove (15) is consistent with the size of the protrusion (9).

4. The high light-efficiency flip-chip LED device according to claim 2, characterized in that: A heat dissipation hole (10) is provided on one side surface of the housing (8), and the heat dissipation hole (10) is connected to the first groove (6).

5. The high light-efficiency flip-chip LED device according to claim 1, characterized in that: A plurality of the mounting grooves (4) are provided, and the plurality of mounting grooves (4) are provided on a surface of one side of the base plate (1).

6. The high light-efficiency flip-chip LED device according to claim 1, characterized in that: The positioning groove (5) and the positioning block (3) are matched in size.

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