Circuit board backflow device

Abstract

The embodiment of the utility model belongs to the technical field of computing equipment assembly, and provides a circuit board backflow device. The circuit board backflow device comprises a device body, an adsorption assembly, a tray and a plurality of first magnetic pressing blocks, the adsorption assembly and the tray are both arranged in the device body, and the adsorption assembly can move relative to the device body; wherein a circuit board is placed on the tray; a plurality of first magnetic attraction parts are arranged on the tray, the first magnetic attraction parts are arranged on the edge area of the tray, the adsorption assembly is used for adsorbing and moving the first magnetic pressing block so as to press the first magnetic pressing block on the edge area of the circuit board and partially press the first magnetic pressing block on the tray, and the first magnetic pressing block and the first magnetic attraction parts are attracted. According to the circuit board backflow device provided by the embodiment of the invention, the efficiency of fixing the circuit board can be improved, and the deformation of the circuit board can be effectively reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of computing device assembly, and in particular to a circuit board reflow device. Background Art

[0002] The circuit board is a major component in a computing device. Various electronic components are arranged on the circuit board. These electronic components are mounted on the circuit board and soldered to the pads on the circuit board.

[0003] As the size of circuit boards becomes larger and larger, the circuit boards will be deformed by heat during the welding process of electronic components with the circuit boards. The deformation of the circuit boards will cause poor welding such as cold welding and cracks at the welding points between the circuit boards and electronic components, thereby affecting the electrical connection between the circuit boards and electronic components. In the related technology 1, after placing the circuit board on the support plate, the circuit board can be bonded to the support plate with high-temperature adhesive tape; in the related technology 2, the circuit board can be fixed in the support plate by fasteners such as screws, thereby reducing the thermal deformation of the circuit board during the welding process.

[0004] Fixing the circuit board by these fixing measures makes the circuit board fixing process inefficient and it is difficult to effectively reduce the deformation of the circuit board during the welding process. Utility Model Content

[0005] The embodiment of the present application provides a circuit board reflow device, which can improve the efficiency of fixing the circuit board and effectively reduce the deformation of the circuit board.

[0006] In the first aspect, an embodiment of the present application provides a circuit board reflow device, comprising: a device body, an adsorption component, a tray and a plurality of first magnetic pressing blocks; the adsorption component and the tray are both arranged in the device body, and the adsorption component can move relative to the device body; wherein a circuit board is placed on the tray; a plurality of first magnetic suction parts are arranged on the tray, and the first magnetic suction part is arranged in the edge area of ​​the tray, and the adsorption component is used to adsorb and move the first magnetic pressing block to press the first magnetic pressing block on the edge area of ​​the circuit board, and partially press the first magnetic pressing block on the tray, and the first magnetic pressing block is attracted to the first magnetic suction part.

[0007] The circuit board reflow device provided in the embodiment of the present application is provided with a device body, an adsorption component, a tray, and a plurality of first magnetic pressing blocks; the adsorption component and the tray are both provided in the device body, and the adsorption component can move relative to the device body; wherein a circuit board is placed on the tray; a plurality of first magnetic suction parts are provided on the tray, and the first magnetic suction part is provided in the edge area of ​​the tray, and the adsorption component is used to adsorb and move the first magnetic pressing block, so as to press the first magnetic pressing block part on the edge area of ​​the circuit board, and press the first magnetic pressing block part on the tray, and the first magnetic pressing block is attracted to the first magnetic suction part. By adsorbing the first magnetic pressing block by the adsorption component and pressing the first magnetic pressing block on the circuit board body and the tray, the efficiency of fixing the circuit board can be improved compared with manually fixing the circuit board. The first magnetic pressing block is attracted to the first magnetic suction part, which can effectively reduce the deformation of the circuit board.

[0008] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the first magnetic pressing block is a first magnetic member. That is, the first magnetic pressing block is entirely made of magnetic material, so that the structure of the first magnetic pressing block is simple and the attraction force between the first magnetic pressing block and the first magnetic attraction portion is relatively large.

[0009] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the first magnetic pressing block includes a first pressing block body and a first magnetic column disposed in the first pressing block body. By arranging the first magnetic column on the first pressing block body, the number of the first magnetic columns can be flexibly set according to the magnitude of the magnetic attraction required when the circuit board body is welded to the electronic components.

[0010] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the first magnetic attraction portion includes a second magnetic column, and the second magnetic column is arranged in a one-to-one correspondence with the first magnetic column. When the first magnetic pressing block is pressed on the first magnetic attraction portion, the first magnetic column and the second magnetic column are arranged in a one-to-one correspondence, so that the first magnetic column and the second magnetic column are attracted in a one-to-one correspondence.

[0011] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, one of the first magnetic pressing block and the first magnetic attraction portion has a first positioning post, and the other has a first positioning hole, and the first positioning post is inserted into the first positioning hole. By providing the first positioning post and the first positioning hole, the first magnetic pressing block can be limited in position during the placement of the first magnetic pressing block, and the first magnetic pressing block can be prevented from moving relative to the first magnetic attraction portion during the welding process between the circuit board body and the electronic components.

[0012] In a possible implementation, the circuit board reflow device provided in the embodiment of the present application further includes a second magnetic pressing block, and a plurality of second magnetic suction parts are further provided on the tray, and the second magnetic suction part is provided in the middle area of ​​the tray; the adsorption component is used to adsorb and move the second magnetic pressing block to press the second magnetic pressing block onto the connector or the castle board of the circuit board, and the second magnetic pressing block and the second magnetic suction part are provided in a one-to-one correspondence. Relying on the suction force of the second magnetic pressing block and the second magnetic suction part, pressure can be applied to the connector and the circuit board body, and pressure can be applied between the castle board and the circuit board body, thereby reducing the deformation of the connector, the castle board and the circuit board body.

[0013] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the second magnetic pressing block is a second magnetic member. That is, the second magnetic pressing block is entirely made of magnetic material, so that the structure of the second magnetic pressing block is simple and the attraction force between the second magnetic pressing blocks is relatively large.

[0014] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the second magnetic pressing block includes a second pressing block body and a third magnetic column arranged in the second pressing block body. By arranging the third magnetic column on the second pressing block body, the number of the third magnetic columns can be flexibly set according to the magnitude of the magnetic attraction required when the circuit board body is welded with the connector or the castle board.

[0015] In a possible implementation, in the circuit board reflow device provided in the embodiment of the present application, the second magnetic attraction portion includes a plurality of fourth magnetic columns, and the third magnetic columns are arranged in a one-to-one correspondence with the fourth magnetic columns. The third magnetic columns are arranged in a one-to-one correspondence with the fourth magnetic columns, so that the third magnetic columns are attracted in a one-to-one correspondence with the fourth magnetic columns.

[0016] In a possible implementation, the circuit board reflow device provided in the embodiment of the present application has a second positioning post on the second magnetic pressing block, and the second positioning post is used to be inserted into the second positioning hole of the circuit board. By providing the second positioning post, the second magnetic pressing block can be limited in position during the placement of the second magnetic pressing block, and the second magnetic pressing block can be prevented from moving relative to the second magnetic attraction portion during the welding of the connector or the castellated board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a structure in which a circuit board is fixed on a support plate by means of a high temperature adhesive tape;

[0018] Figure 2 A schematic diagram of a structure in which a circuit board is fixed to a support plate by fasteners;

[0019] Figure 3 A schematic diagram of the structure of a circuit board reflow device provided in an embodiment of the present application;

[0020] Figure 4 Schematic diagram of the structure of the adsorption component, the tray and the first magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 1 ;

[0021] Figure 5 The use state of the adsorption component, the tray and the first magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 1 ;

[0022] Figure 6 for Figure 5 A top view of

[0023] Figure 7 for Figure 5 Explosion hint Figure 1 ;

[0024] Figure 8 Schematic diagram of the structure in which the first magnetic attraction portion is pressed on the circuit board and the tray in the circuit board reflow device provided in the embodiment of the present application Figure 1 ;

[0025] Fig. 9 for Figure 5 Explosion hint Figure 2 ;

[0026] Fig.10 Schematic diagram of the structure in which the first magnetic attraction portion is pressed on the circuit board and the tray in the circuit board reflow device provided in the embodiment of the present application Figure 2 ;

[0027] Fig.11 The use state of the tray and the second magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 2 ;

[0028] Fig.12 for Fig.11 A top view of

[0029] Fig.13 for Fig.11 Explosion diagram of

[0030] Fig.14 A schematic diagram of the structure in which the second magnetic attraction portion of the circuit board reflow device provided in an embodiment of the present application is pressed onto a connector or a castle board.

[0031] Description of reference numerals:

[0032] 10. Circuit board; 11. Circuit board body; 12. Electronic components; 13. Connector; 14. Castle board; 15. Second positioning hole;

[0033] 20. Support plate;

[0034] 30. High temperature adhesive tape;

[0035] 40. Fasteners;

[0036] 100. Circuit board reflow device;

[0037] 110. Device body;

[0038] 120. Adsorption components;

[0039] 130. Pallet;

[0040] 131, a first magnetic attraction portion;

[0041] 1311, second magnetic column;

[0042] 1312, second mounting slot;

[0043] 132. Groove;

[0044] 1321, support beam;

[0045] 133, first positioning hole;

[0046] 134. A second magnetic attraction portion;

[0047] 1341, the fourth magnetic column;

[0048] 1342, fourth mounting slot;

[0049] 140, a first magnetic pressing block;

[0050] 141. A first pressing block body;

[0051] 1411, first installation slot;

[0052] 142, the first magnetic column;

[0053] 143. A first positioning column;

[0054] 150, a second magnetic pressing block;

[0055] 151, second pressing block body;

[0056] 1511, third installation slot;

[0057] 152, the third magnetic column;

[0058] 153. Second positioning column. DETAILED DESCRIPTION

[0059] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] The circuit board is a major component in a computing device. Various electronic components are arranged on the circuit board. These electronic components are mounted on the circuit board and soldered to the pads on the circuit board.

[0061] As the size of circuit boards increases, the circuit boards will be deformed by heat during the process of welding electronic components to the circuit boards. The deformation of the circuit boards will cause poor welding such as cold welding and cracks at the welding points between the circuit boards and electronic components, thus affecting the electrical connection between the circuit boards and electronic components.

[0062] Figure 1 This is a schematic diagram of the structure in which a circuit board is fixed to a support plate by means of high temperature tape.

[0063] See also Figure 1 As shown, in the related art 1, after the circuit board 10 is placed on the support plate 20, the circuit board 10 can be bonded to the support plate 20 with a high-temperature adhesive tape 30. The circuit board 10 is fixed to the support plate 20 by the adhesive force of the adhesive on the high-temperature adhesive tape 30, which can reduce the deformation of the circuit board 10 during the welding process. The high-temperature adhesive tape 30 is manually bonded. In order to reduce the deformation of the circuit board 10, multiple high-temperature adhesive tapes 30 need to be bonded, which makes the efficiency of fixing the circuit board 10 low. In addition, the high temperature during the welding process will reduce the viscosity of the adhesive in the high-temperature adhesive tape 30, so that the adhesive force of the high-temperature adhesive tape 30 is reduced, and the adhesive force is difficult to offset the stress of the circuit board 10, and it is difficult to effectively reduce the deformation of the circuit board 10 during the welding process.

[0064] Figure 2 The schematic diagram is a structural diagram of fixing a circuit board on a supporting plate by fasteners.

[0065] See also Figure 2 As shown, in the related art 2, after the circuit board 10 is placed on the support plate 20, the circuit board 10 can be bonded to the support plate 20 with a fastener 40. The fastener 40 can be a screw or a stud. The support plate 20 is provided with a corresponding threaded hole. The fastener 40 is tightened in the threaded hole. The circuit board 10 is fixed to the support plate 20 by the tightening force of the fastener 40, which can reduce the deformation of the circuit board 10 during the welding process. The fastener 40 is fixed manually. In order to reduce the deformation of the circuit board 10, a plurality of fasteners 40 need to be provided, which makes the efficiency of fixing the circuit board 10 low. In addition, in the process of manually fixing the fastener 40, the tightening force of the fastener 40 is different. If the tightening force is too small, the circuit board 10 is easy to loosen. When the tightening force is large, stress is easy to generate on the circuit board 10. The stress will also cause the circuit board 10 to deform. Therefore, it is difficult to effectively reduce the deformation of the circuit board 10 during the welding process.

[0066] Based on this, an embodiment of the present application provides a circuit board reflow device, which can improve the efficiency of fixing the circuit board and effectively reduce the deformation of the circuit board.

[0067] Figure 3 A schematic diagram of the structure of a circuit board reflow device provided in an embodiment of the present application; Figure 4 Schematic diagram of the structure of the adsorption component, the tray and the first magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 1 ; Figure 5 The use state of the adsorption component, the tray and the first magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 1 ; Figure 6 for Figure 5 A top view of Figure 7 for Figure 5 Explosion hint Figure 1 ,in, Figure 6 and Figure 7 The adsorption assembly 120 is omitted.

[0068] See also Figures 3 to 7 As shown, the circuit board reflow device 100 provided in the embodiment of the present application includes a device body 110, an adsorption component 120, a tray 130 and a plurality of first magnetic pressing blocks 140; the adsorption component 120 and the tray 130 are both arranged in the device body 110, and the adsorption component 120 can move relative to the device body 110; wherein, a circuit board 10 is placed on the tray 130; a plurality of first magnetic suction parts 131 are arranged on the tray 130, and the first magnetic suction parts 131 are arranged in the edge area of ​​the tray 130, and the adsorption component 120 is used to adsorb and move the first magnetic pressing block 140, so as to partially press the first magnetic pressing block 140 on the edge area of ​​the circuit board 10, and partially press the first magnetic pressing block 140 on the tray 130, and the first magnetic pressing block 140 is attracted to the first magnetic suction part 131.

[0069] The circuit board 10 includes a circuit board body 11 and electronic components 12 disposed on the circuit board body 11. The electronic components 12 are soldered on the circuit board body 11 through the circuit board reflow device 100 to form the circuit board 10. The circuit board body 11 can be rectangular, circular or other shapes. Figures 5 to 7 The circuit board body 11 shown in FIG. 1 is rectangular.

[0070] The reflow device 100 includes a reflow device body 110 and an adsorption assembly 120. The adsorption assembly 120 can be connected to the device body 110 through a three-axis travel mechanism so that the adsorption assembly 120 can move relative to the device body 110. The adsorption assembly 120 can include a vacuum adsorption head.

[0071] A carrying mechanism is provided in the reflow device body 110, and the tray 130 is placed in the carrying mechanism. The tray 130 has a groove 132 recessed from the surface, the contour of the groove 132 matches the contour of the circuit board body 11, and the depth of the groove 132 is the same as the thickness of the circuit board body 11, so that when the circuit board body 11 is placed in the groove 132, the surface of the circuit board body 11 is flush with the surface of the tray 130. A plurality of support beams 1321 are provided in the groove 132 for supporting the circuit board 10.

[0072] When soldering the circuit board body 11 and the electronic components 12, the circuit board body 11 is placed in the groove 132 of the tray 130, and the electronic components 12 are adsorbed by the adsorption assembly 120 and placed at corresponding positions on the circuit board body 11. The circuit board reflow device 100 is also provided with a heating device, which heats the solder on the circuit board body 11 to melt the solder, and the electronic components 12 can be soldered to the circuit board body 11 after the solder cools.

[0073] During the heating process, the circuit board body 11 may be deformed due to the heat. In the embodiment of the present application, the first magnetic pressing block 140 is provided to reduce the deformation of the circuit board body 11 during the welding process.

[0074] Specifically, the edge area of ​​the tray 130 refers to the side or top corner of the tray 130. The tray 130 is provided with a plurality of first magnetic attraction portions 131. Figure 6 In the illustrated embodiment, five first magnetic attraction portions 131 are shown. In other embodiments, the first magnetic attraction portions 131 may be arranged in other ways, as long as the first magnetic attraction portions 131 avoid the area on the circuit board body 11 where the electronic components 12 need to be soldered.

[0075] After the circuit board body 11 is placed in the groove 132 of the tray 130, the electronic component 12 is adsorbed by the adsorption assembly 120 and the electronic component 12 is placed at a corresponding position on the circuit board body 11, the adsorption assembly 120 adsorbs the first magnetic pressing block 140 and places the first magnetic pressing block 140 at a position corresponding to the first magnetic attraction portion 131.

[0076] Figure 8 Schematic diagram of the structure in which the first magnetic attraction portion is pressed on the circuit board and the tray in the circuit board reflow device provided in the embodiment of the present application Figure 1 .

[0077] See also Figure 8As shown, the first magnetic pressing block 140 is partially pressed on the edge area of ​​the circuit board body 11, and the first magnetic pressing block 140 is partially pressed on the first magnetic attraction portion 131, and the circuit board body 11 is fixed on the tray 130 by relying on the attraction force of the first magnetic pressing block 140 and the first magnetic attraction portion 131. It should be noted that the heating temperature of the heating device is usually in the range of 250°C-350°C, and the first magnetic pressing block 140 and the first magnetic attraction portion 131 are both high temperature resistant magnets, and their demagnetization temperature is about 700°C-900°C, that is, the heating process does not affect the attraction force of the first magnetic pressing block 140 and the first magnetic attraction portion 131.

[0078] By adsorbing the first magnetic pressing block 140 through the adsorption component 120 and pressing the first magnetic pressing block 140 onto the circuit board body 11 and the tray 130, the efficiency of fixing the circuit board 10 can be improved compared to manually fixing the circuit board 10. The first magnetic pressing block 140 is attracted to the first magnetic attraction portion 131, and the attraction force is larger than that of the high-temperature adhesive tape 30. Compared with the fixation of the fastener 40, the stress generated on the circuit board 10 can be reduced, thereby effectively reducing the deformation of the circuit board 10.

[0079] The circuit board reflow device 100 provided in the embodiment of the present application is provided with a device body 110, an adsorption assembly 120, a tray 130, and a plurality of first magnetic pressing blocks 140; the adsorption assembly 120 and the tray 130 are both provided in the device body 110, and the adsorption assembly 120 can move relative to the device body 110; wherein a circuit board 10 is placed on the tray 130; a plurality of first magnetic attraction portions 131 are provided on the tray 130, and the first magnetic attraction portions 131 are provided in the edge area of ​​the tray 130, and the adsorption assembly 120 is used to adsorb and move the first magnetic pressing block 140, so as to partially press the first magnetic pressing block 140 on the edge area of ​​the circuit board 10, and partially press the first magnetic pressing block 140 on the tray 130, and the first magnetic pressing block 140 is attracted to the first magnetic attraction portion 131. By adsorbing the first magnetic pressing block 140 by the adsorption assembly 120 and pressing the first magnetic pressing block 140 on the circuit board body 11 and the tray 130, the efficiency of fixing the circuit board 10 can be improved compared with manually fixing the circuit board 10. The first magnetic pressing block 140 is attracted to the first magnetic attraction portion 131 , which can effectively reduce the deformation of the circuit board 10 .

[0080] Please continue to see Figure 7 and Figure 8 As shown, in a possible implementation manner, the first magnetic pressing block 140 is a first magnetic member.

[0081] That is to say, the first magnetic pressing block 140 is entirely made of magnetic material, so that the structure of the first magnetic pressing block 140 is simple and the attraction force between the first magnetic pressing block 140 and the first magnetic attraction portion 131 is relatively large.

[0082] Fig. 9 for Figure 5 Explosion hint Figure 2 ; Fig.10 Schematic diagram of the structure in which the first magnetic attraction portion is pressed on the circuit board and the tray in the circuit board reflow device provided in the embodiment of the present application Figure 2 .

[0083] See also Fig. 9 and Fig.10 As shown, in a possible implementation manner, the first magnetic pressing block 140 includes a first pressing block body 141 and a first magnetic column 142 disposed in the first pressing block body 141 .

[0084] The first pressing block body 141 can be made of a material with a relatively high density. A first mounting groove 1411 is provided on one side of the first pressing block body 141 facing the tray 130. The first magnetic column 142 is provided in the first mounting groove 1411. The first magnetic column 142 can be bonded to the side wall of the first mounting groove 1411 by an adhesive. The first magnetic column 142 can also be interference fit with the first mounting groove 1411 to connect the first magnetic column 142 to the first pressing block body 141. One first magnetic column 142 can be provided, or two or more first magnetic columns 142 can be provided. Fig. 9 and Fig.10 In the illustrated embodiment, two first magnetic pillars 142 are shown. The first pressing block body 141 is pressed on the first magnetic attraction portion 131, and the first magnetic pillar 142 is used to be attracted to the first magnetic attraction portion 131.

[0085] By arranging the first magnetic pillars 142 on the first pressing block body 141 , the number of the first magnetic pillars 142 can be flexibly set according to the magnitude of the magnetic attraction force required when the circuit board body 11 and the electronic component 12 are welded.

[0086] Please continue to see Figures 7 to 10 As shown, the first magnetic attraction portion 131 includes a second magnetic column 1311 , and the second magnetic column 1311 is disposed in a one-to-one correspondence with the first magnetic column 142 .

[0087] Specifically, a second mounting groove 1312 is provided in a side of the first magnetic attraction portion 131 facing the first pressing block body 141, and a second magnetic column 1311 is provided in the second mounting groove 1312. The second magnetic column 1311 can be bonded to the side wall of the second mounting groove 1312 by an adhesive, and the second magnetic column 1311 can also be interference fit with the second mounting groove 1312, so that the second magnetic column 1311 is connected to the first magnetic attraction portion 131. One second magnetic column 1311 can be provided, or two or more second magnetic columns 1311 can be provided. Figures 8 to 10 In the illustrated embodiment, two second magnetic pillars 1311 are shown.

[0088] When the first magnetic pressing block 140 is pressed onto the first magnetic attraction portion 131 , the first magnetic pillars 142 and the second magnetic pillars 1311 are disposed in a one-to-one correspondence, so that the first magnetic pillars 142 and the second magnetic pillars 1311 are attracted in a one-to-one correspondence.

[0089] One of the first magnetic pressing block 140 and the first magnetic attraction portion 131 has a first positioning post 143 , and the other has a first positioning hole 133 . The first positioning post 143 is inserted into the first positioning hole 133 .

[0090] Please continue to see Figures 7 to 10 As shown, in a possible implementation, the first magnetic pressing block 140 has a first positioning post 143, and the first magnetic attraction portion 131 has a first positioning hole 133. When the first magnetic pressing block 140 is placed on the corresponding first magnetic attraction portion 131, the first positioning post 143 is inserted into the first positioning hole 133. By providing the first positioning post 143 and the first positioning hole 133, the first magnetic pressing block 140 can be limited in position during the placement of the first magnetic pressing block 140, and the first magnetic pressing block 140 can be prevented from moving relative to the first magnetic attraction portion 131 during the welding process of the circuit board body 11 and the electronic component 12.

[0091] In other embodiments, the first positioning column may be disposed on the first magnetic attraction portion 131 , and the first positioning hole may be disposed on the first magnetic pressing block 140 .

[0092] Fig.11 The use state of the tray and the second magnetic pressing block in the circuit board reflow device provided in the embodiment of the present application Figure 2 ; Fig.12 for Fig.11 A top view of Fig.13 for Fig.11 Schematic diagram of the explosion.

[0093] See also Figures 11 to 13 As shown, the circuit board reflow device 100 also includes a second magnetic pressing block 150, and a plurality of second magnetic attraction portions 134 are also provided on the tray 130, and the second magnetic attraction portion 134 is arranged in the middle area of ​​the tray 130; the adsorption component 120 is used to adsorb and move the second magnetic pressing block 150 to press the second magnetic pressing block 150 onto the connector 13 or the castle board 14 of the circuit board 10, and the second magnetic pressing block 150 and the second magnetic attraction portion 134 are arranged one by one.

[0094] The electronic components 12 may include a connector 13 or a castellated board 14, wherein the castellated board 14 is a sub-board arranged on the circuit board body 11, and other electronic components may also be arranged on the castellated board 14, thereby improving the space utilization of the electronic device.

[0095] Among them, the volume of the connector 13 or the castle board 14 is relatively large. During the welding process, if the circuit board body 11, the connector 13 or the castle board 14 is slightly deformed, it will cause the risk of poor welding such as cold soldering and cracks between the connector 13 and the circuit board body 11 or between the castle board 14 and the circuit board body 11.

[0096] In the embodiment of the present application, the second magnetic pressing block 150 is provided to reduce the deformation of the circuit board body 11 at the position where the connector 13 or the castellated board 14 is provided.

[0097] Specifically, a plurality of second magnetic attraction portions 134 are disposed in the middle area of ​​the tray 130. Fig.13 In the illustrated embodiment, four second magnetic attraction portions 134 are shown, wherein one second magnetic attraction portion 134 is located in an area on the circuit board body 11 for welding the castellated board 14, and the other three second magnetic attraction portions 134 are located in an area on the circuit board body 11 for welding the connector 13 (three connectors 13 are schematically shown on the circuit board 10).

[0098] After the circuit board body 11 is placed in the groove 132 of the tray 130, the connector 13 or the castellated board 14 is adsorbed by the adsorption component 120 and the connector 13 or the castellated board 14 is placed at the corresponding position on the circuit board body 11, the adsorption component 120 adsorbs the second magnetic pressing block 150 and places the second magnetic pressing block 150 on the connector 13 or the castellated board 14. Relying on the attraction force of the second magnetic pressing block 150 and the second magnetic attraction part 134, pressure can be applied to the connector 13 and the circuit board body 11, and pressure can be applied between the castellated board 14 and the circuit board body 11, thereby reducing the deformation of the connector 13, the castellated board 14 and the circuit board body 14.

[0099] In a possible implementation manner, the second magnetic pressing block 150 is a second magnetic member.

[0100] That is to say, the second magnetic pressing block 150 is entirely made of magnetic material, so that the structure of the second magnetic pressing block 150 is simple and the attraction force between the second magnetic pressing blocks 150 is relatively large.

[0101] Fig.14 A schematic diagram of the structure in which the second magnetic attraction portion of the circuit board reflow device provided in an embodiment of the present application is pressed onto a connector or a castle board.

[0102] See also Fig.13 and Fig.14 As shown, the second magnetic pressing block 150 includes a second pressing block body 151 and a third magnetic column 152 disposed in the second pressing block body 151 .

[0103] The second pressing block body 151 can be made of a material with a relatively high density. A third mounting groove 1511 is provided on one side of the second pressing block body 151 facing the tray 130. The third magnetic column 152 is provided in the third mounting groove 1511. The third magnetic column 152 can be bonded to the side wall of the third mounting groove 1511 by an adhesive. The third magnetic column 152 can also be interference fit with the third mounting groove 1511 to connect the third magnetic column 152 to the second pressing block body 151. One third magnetic column 152 can be provided, or two or more third magnetic columns 152 can be provided. Fig.13 In the embodiment shown, two third magnetic columns 152 are arranged on the second pressing block body 151 for pressing on the connector 13, and four third magnetic columns 152 are arranged on the second pressing block body 151 for pressing on the castle plate 14. The second pressing block body 151 is pressed on the connector 13 or the castle plate 14, and the third magnetic columns 152 are used to attract the second magnetic attraction portion 134.

[0104] By arranging the third magnetic columns 152 on the second pressing block body 151 , the number of the third magnetic columns 152 can be flexibly set according to the magnitude of the magnetic attraction force required when the circuit board body 11 is welded with the connector 13 or the castellated board 14 .

[0105] Please continue to see Fig.13 and Fig.14 As shown, the second magnetic attraction portion 134 includes a plurality of fourth magnetic pillars 1341 , and the third magnetic pillars 152 are disposed in a one-to-one correspondence with the fourth magnetic pillars 1341 .

[0106] A fourth mounting groove 1342 is provided in one side of the second magnetic attraction portion 134 facing the second pressing block body 151, and a fourth magnetic column 1341 is provided in the fourth mounting groove 1342. The fourth magnetic column 1341 can be bonded to the side wall of the fourth mounting groove 1342 by an adhesive, and the fourth magnetic column 1341 can also be interference fit with the fourth mounting groove 1342, so that the fourth magnetic column 1341 is connected to the second magnetic attraction portion 134. One fourth magnetic column 1341 can be provided, and two or more fourth magnetic columns 1341 can also be provided.

[0107] The third magnetic pillars 152 and the fourth magnetic pillars 1341 are arranged in a one-to-one correspondence, so that the third magnetic pillars 152 and the fourth magnetic pillars 1341 are attracted in a one-to-one correspondence.

[0108] Please continue to see Fig.13 and Fig.14 As shown, the second magnetic pressing block 150 has a second positioning column 153 , and the second positioning column 153 is used to be inserted into the second positioning hole 15 of the circuit board 10 .

[0109] The circuit board body 11 is provided with a second positioning hole 15 corresponding to the second positioning post 153. When the second magnetic pressing block 150 is placed on the corresponding second magnetic attraction portion 134, the second positioning post 153 is inserted into the second positioning hole 15 of the circuit board body 11. By providing the second positioning post 153, the second magnetic pressing block 150 can be limited in position during the placement of the second magnetic pressing block 150, and the second magnetic pressing block 150 can be prevented from moving relative to the second magnetic attraction portion 134 during the welding of the connector 13 or the castellated board 14.

[0110] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board reflow device, characterized in that: The device comprises a device body, an adsorption component, a tray and a plurality of first magnetic pressing blocks; the adsorption component and the tray are both arranged in the device body, and the adsorption component can move relative to the device body; wherein a circuit board is placed on the tray; A plurality of first magnetic attraction parts are arranged on the tray, and the first magnetic attraction parts are arranged in the edge area of ​​the tray. The adsorption component is used to adsorb and move the first magnetic pressing block to press the first magnetic pressing block on the edge area of ​​the circuit board and partially press the first magnetic pressing block on the tray, and the first magnetic pressing block is attracted to the first magnetic attraction part.

2. The circuit board reflow device according to claim 1, characterized in that: The first magnetic pressing block is a first magnetic member.

3. The circuit board reflow device according to claim 1, characterized in that: The first magnetic pressing block includes a first pressing block body and a first magnetic column disposed in the first pressing block body.

4. The circuit board reflow device according to claim 3, characterized in that: The first magnetic attraction portion includes a second magnetic column, and the second magnetic column is arranged in a one-to-one correspondence with the first magnetic column.

5. The circuit board reflow device according to claim 1, characterized in that: One of the first magnetic pressing block and the first magnetic attraction portion has a first positioning column, and the other has a first positioning hole, and the first positioning column is inserted into the first positioning hole.

6. The circuit board reflow device according to any one of claims 1 to 5, characterized in that: The circuit board reflow device further includes a second magnetic pressing block, and the tray is further provided with a plurality of second magnetic attraction portions, wherein the second magnetic attraction portions are provided in a middle area of ​​the tray; The adsorption component is used to adsorb and move the second magnetic pressing block to press the second magnetic pressing block onto the connector or the castle board of the circuit board, and the second magnetic pressing block is arranged in a one-to-one correspondence with the second magnetic attraction part.

7. The circuit board reflow device according to claim 6, characterized in that: The second magnetic pressing block is a second magnetic member.

8. The circuit board reflow device according to claim 6, characterized in that: The second magnetic pressing block includes a second pressing block body and a third magnetic column arranged in the second pressing block body.

9. The circuit board reflow device according to claim 8, characterized in that: The second magnetic attraction portion includes a plurality of fourth magnetic columns, and the third magnetic columns are arranged in a one-to-one correspondence with the fourth magnetic columns.

10. The circuit board reflow device according to claim 6, characterized in that: The second magnetic pressing block has a second positioning column, and the second positioning column is used to be inserted into the second positioning hole of the circuit board.

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