Positioning dispensing device for silicon controlled rectifier chip processing
By designing a positioning dispensing device that includes multi-directional mobile positioning and automatic fixing functions, the problem of being unable to achieve precise positioning and automatic dispensing in the existing technology is solved, and the efficiency and stability of chip dispensing are improved.
Patent Information
- Application Number
- CN202421080843.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-17
AI Technical Summary
The prior art cannot achieve precise positioning and automatic dispensing of glue, and the chip cannot be automatically fixed.
A positioning dispensing device including a base, a placement table, a support column, a sliding block, an electric slide rail, a moving arm, a positioning dispensing component, a pressing component and a chip fixing component was designed. The device realizes multi-directional movement and positioning of the dispensing head through electric slide rails and hydraulic cylinders, and automatically fixes the chip through hydraulic cylinders and sliding blocks.
It achieves precise positioning and automatic dispensing, improving dispensing efficiency, and automatically fixes the chip during the dispensing process, improving stability and efficiency.
Smart Images

Figure CN222369482U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip processing and dispensing, and in particular to a positioning and dispensing device for thyristor chip processing. Background Art
[0002] Thyristors are widely used in AC contactless switches, household appliance control circuits, industrial control and other fields. Glue dispensing is required during the processing of thyristor chips, so a glue dispensing machine is needed to dispense glue on the chips.
[0003] The patent document with the announcement number CN211070709U discloses a dispensing positioning device, including a dispensing machine body, a first through hole is opened in the operating panel of the dispensing machine body, a guide rod is slidably connected in the first through hole, a flat plate is welded on the upper end of the guide rod, a bearing is welded on the lower surface of the flat plate through a hole, a first threaded rod is welded on the inner wall of the bearing, and the first threaded rod passes through the lower surface of the operating panel of the dispensing machine body through the threaded hole. The elevator for room decoration can effectively fix products of different sizes by setting a second crank, a first through hole, a bearing, a first crank, a first threaded rod, a guide rod, a flat plate, a thrust bearing, a second threaded rod, a fixing plate and a clamping plate, thereby ensuring the normal dispensing operation; by setting an elastic clamping block, an elastic clamping slot, a scratch plate and a trapezoidal groove, the scratch plate can be quickly disassembled and replaced, thereby effectively improving the efficiency of disassembly work.
[0004] However, the above-mentioned dispensing positioning device cannot achieve precise positioning and automatic dispensing of glue, and cannot automatically fix the chip. For this reason, we propose a positioning dispensing device for thyristor chip processing to solve the above problems. Utility Model Content
[0005] The utility model aims to solve the shortcomings of the prior art that accurate positioning and automatic glue dispensing and automatic chip fixation cannot be achieved, and a positioning glue dispensing device for thyristor chip processing is proposed.
[0006] The positioning glue dispensing device for thyristor chip processing provided in this application adopts the following technical solution:
[0007] A positioning glue dispensing device for processing a thyristor chip, comprising:
[0008] Base;
[0009] A placing table, fixedly connected to the top of the base;
[0010] A support column, fixedly connected to the top of the base, and two support columns are provided;
[0011] Sliding blocks, two of which are provided and are slidably mounted on two supporting columns respectively;
[0012] An electric slide rail, wherein two electric slide rails are provided and the two electric slide rails are respectively fixedly connected to one side of the two sliding blocks;
[0013] A movable arm is arranged between the two electric slide rails;
[0014] A positioning dispensing assembly is arranged on the moving arm;
[0015] A pressing component is arranged on the top of the base;
[0016] The chip fixing component is arranged on the top of the base.
[0017] Furthermore, the positioning dispensing assembly includes an electric slider, which is slidably mounted on the movable arm, the top of the electric slider is fixedly connected to a material box, and the top of the electric slider is fixedly connected to a material pump.
[0018] Furthermore, the pumping pump is provided with a pumping pipe and a conduit, the pumping pipe is fixedly connected to the material box, and the bottom of the electric slider is fixedly connected to a support frame.
[0019] Furthermore, a glue dispensing head is fixedly connected to the bottom of the support frame, and the catheter is fixedly connected to the glue dispensing head.
[0020] Furthermore, the pressing assembly includes two hydraulic cylinders, both hydraulic cylinders are provided with hydraulic rods, and both hydraulic rods are fixedly connected with fixed blocks.
[0021] Furthermore, the two fixed blocks are fixedly connected to the two sliding blocks respectively, and one side of the two sliding blocks is fixedly connected with a pressing rod.
[0022] Furthermore, the chip fixing assembly includes two shaft seats, and fixing plates are rotatably mounted on the two shaft seats. The bottoms of the two support columns are fixedly connected with torsion springs, and the two torsion springs are respectively connected to the two fixing plates.
[0023] In the utility model, the positioning glue dispensing device for processing thyristor chips has the following beneficial effects:
[0024] 1. It can realize precise positioning and automatic dispensing of glue, increasing the efficiency of dispensing.
[0025] 2. At the same time, the position of the chip is automatically fixed during the dispensing operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a front view structural schematic diagram of a positioning and dispensing device for processing a thyristor chip in an embodiment of the present application;
[0027] Figure 2It is a schematic diagram of the top view of the positioning and dispensing device for processing thyristor chips in an embodiment of the present application;
[0028] Figure 3 It is a front view structural schematic diagram mainly used to demonstrate the site glue component in the embodiment of the present application.
[0029] In the figure: 1. base; 2. placing table; 3. support column; 4. sliding block; 5. electric slide rail; 6. moving arm; 7. electric slider; 8. material box; 9. suction pump; 10. suction tube; 11. guide tube; 12. support frame; 13. dispensing head; 14. lower pressure rod; 15. shaft seat; 16. fixing plate; 17. torsion spring; 18. hydraulic cylinder. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0031] Embodiment 1
[0032] The following is combined with Figure 1-Figure 3 This application is described in further detail.
[0033] The positioning glue dispensing device for processing a thyristor chip described in the utility model comprises:
[0034] Base 1;
[0035] A placing table 2 is fixedly connected to the top of the base 1;
[0036] A support column 3 is fixedly connected to the top of the base 1, and two support columns 3 are provided;
[0037] Sliding block 4, two sliding blocks 4 are provided, and the two sliding blocks 4 are slidably installed on the two supporting columns 3 respectively;
[0038] An electric slide rail 5, wherein two electric slide rails 5 are provided, and the two electric slide rails 5 are respectively fixedly connected to one side of the two sliding blocks 4;
[0039] A movable arm 6 is disposed between the two electric slide rails 5;
[0040] A positioning dispensing assembly is arranged on the moving arm 6;
[0041] A pressing component is arranged on the top of the base 1;
[0042] The chip fixing component is arranged on the top of the base 1 .
[0043] The positioning dispensing assembly includes an electric slider 7, which is slidably mounted on the moving arm 6, a material box 8 is fixedly connected to the top of the electric slider 7, and a material pump 9 is fixedly connected to the top of the electric slider 7.
[0044] The material pump 9 is provided with a pumping pipe 10 and a guide tube 11 , the pumping pipe 10 is fixedly connected to the material box 8 , and the bottom of the electric slide block 7 is fixedly connected with a support frame 12 .
[0045] The bottom of the support frame 12 is fixedly connected to a glue dispensing head 13 , and the conduit 11 is fixedly connected to the glue dispensing head 13 .
[0046] The pressing assembly includes two hydraulic cylinders 18 , and both hydraulic cylinders 18 are provided with hydraulic rods, and both hydraulic rods are fixedly connected with fixed blocks.
[0047] The two fixed blocks are fixedly connected to the two sliding blocks 4 respectively, and one side of the two sliding blocks 4 is fixedly connected with a pressing rod 14 .
[0048] The chip fixing assembly includes two shaft seats 15 , on which fixing plates 16 are rotatably mounted, and the bottoms of the two support columns 3 are fixedly connected with torsion springs 17 , which are respectively connected to the two fixing plates 16 .
[0049] The implementation principle of the positioning dispensing device for thyristor chip processing in the embodiment of the present application is as follows: when in use, the chip is first placed on the top of the placement table 2, and then the y-axis direction of the dispensing head 13 can be adjusted by starting the two electric slide rails 5, and the electric slider 7 is started to slide on the support arm 6, so that the X-axis direction of the dispensing head 13 can be adjusted, and the position of the dispensing head 13 can be easily adjusted to achieve multi-directional mobile positioning of the dispensing head 13. After adjusting the position of the dispensing head 13, the two hydraulic cylinders 18 are started, so that the two hydraulic cylinders 18 respectively drive the two sliding blocks 4 to move downward, so that The two sliding blocks 4 drive the two electric sliders 7 and the support arm 6 to move downward, which can drive the dispensing head 13 to move downward. At the same time, the two sliding blocks 4 will respectively drive the two lower pressure rods 14 to move downward, so that the lower pressure rods 14 are connected to the two fixed plates 16, so that the two fixed plates 16 are deflected downward and the two torsion springs 17 are stretched. Then the two fixed plates 16 press and fix the two ends of the chip, which can improve the stability during dispensing. Then the dispensing head 13 moves downward. At this time, the extraction pump 9 is started, so that the extraction pump 9 extracts the glue in the material box 8, and then introduces the glue into the dispensing head 13, so as to perform the dispensing work.
[0050] Embodiment 2
[0051] The difference between this embodiment and the first embodiment is that a buffer layer is provided at one end of each of the two fixing plates 16 , and an anti-skid layer is provided on the buffer layer, which can provide buffering and shock absorption when fixing the chip, and increase friction to make the fixation more stable.
[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A positioning glue dispensing device for processing thyristor chips, characterized in that: include: Base (1); A placement table (2) fixedly connected to the top of the base (1); A support column (3) fixedly connected to the top of the base (1), wherein two support columns (3) are provided; A sliding block (4), wherein two sliding blocks (4) are provided, and the two sliding blocks (4) are respectively slidably mounted on the two supporting columns (3); An electric slide rail (5), wherein two electric slide rails (5) are provided, and the two electric slide rails (5) are respectively fixedly connected to one side of the two sliding blocks (4); A movable arm (6) is arranged between the two electric slide rails (5); A positioning glue dispensing component, arranged on the movable arm (6); A pressing component, arranged on the top of the base (1); The chip fixing component is arranged on the top of the base (1).
2. The positioning glue dispensing device for processing a thyristor chip according to claim 1, characterized in that: The positioning glue dispensing component comprises an electric slider (7), which is slidably mounted on the movable arm (6), the top of the electric slider (7) is fixedly connected to a material box (8), and the top of the electric slider (7) is fixedly connected to a material pump (9).
3. The positioning glue dispensing device for processing a thyristor chip according to claim 2, characterized in that: The material extraction pump (9) is provided with a extraction pipe (10) and a guide tube (11), the extraction pipe (10) is fixedly connected to the material box (8), and the bottom of the electric slide block (7) is fixedly connected to a support frame (12).
4. The positioning glue dispensing device for processing a thyristor chip according to claim 3, characterized in that: The bottom of the support frame (12) is fixedly connected to a glue dispensing head (13), and the catheter (11) is fixedly connected to the glue dispensing head (13).
5. The positioning glue dispensing device for processing a thyristor chip according to claim 2, characterized in that: The pressing assembly comprises two hydraulic cylinders (18), each of which is provided with a hydraulic rod, and each of which is fixedly connected to a fixing block.
6. The positioning glue dispensing device for processing thyristor chips according to claim 5, characterized in that: The two fixed blocks are respectively fixedly connected to the two sliding blocks (4), and one side of the two sliding blocks (4) is fixedly connected to a downward pressing rod (14).
7. The positioning glue dispensing device for processing a thyristor chip according to claim 6, characterized in that: The chip fixing assembly comprises two shaft seats (15), on which fixing plates (16) are rotatably mounted, and the bottoms of the two support columns (3) are fixedly connected to torsion springs (17), which are respectively connected to the two fixing plates (16).
Citation Information
Patent Citations
Dispensing positioning device
CN211070709U