Jig for correcting warping of ball grid array packaging product
By designing a jig for BGA products, using the cooperation of the base, cover plate and mechanical structure, extrusion and baking to correct the warpage of the product, the problem of poor welding caused by warpage during the packaging process of BGA products is solved and the problem is achieved. Product stability and quality improvement.
Patent Information
- Application Number
- CN202420852219.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-04-23
AI Technical Summary
During the packaging process of BGA products, due to the inconsistent expansion and contraction ratio between Compound and the substrate, the product after packaging warping, and warping exceeds 80um can easily lead to poor welding of the SMT upper plate.
Design a jig for warping correction of ball grid array package products. By setting the base and cover plate, place the product IC between them, and use the cooperation of the rotating block, threaded pin and screw hole block to squeeze the cover plate and base , make the product IC compact, and then bake it at 125° to correct the warpage.
It effectively corrects the warpage of BGA products, prevents the problem of poor welding of SMT upper boards, and ensures the stability and quality of the packaging process.
Smart Images
Figure CN222372280U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of correction jigs, in particular to a jig used for warpage correction of ball grid array packaging products. Background Art
[0002] BGA is a process of making an array of solder balls at the bottom of the package substrate as the I / O end of the circuit to interconnect with the printed circuit board. The device packaged using this technology is a surface mount device.
[0003] At present, in the BGA product packaging process, the inconsistent expansion and contraction ratio between the compound and the base substrate during the molding and curing process will cause the packaged product to have warping problems. Warping exceeding 80um can easily lead to poor SMT board welding. Utility Model Content
[0004] The utility model proposes a warpage correction fixture for ball grid array package products to solve the problem that the packaged product may warp due to the inconsistent expansion and contraction ratio between the compound and the base substrate during the molding and curing process during the BGA product packaging process, and the problem that the warpage exceeds 80um and easily leads to poor SMT upper board welding.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a jig for warping correction of ball grid array packaging products, wherein a cover plate is provided on the top of the base, first card slots are symmetrically opened on both sides of the top of the base, second card slots are symmetrically opened on both sides of the top of the cover plate, the inner wall of the first card slot is rotatably connected with a rotating block, one side of the rotating block is fixedly connected with a threaded pin, the outer surface of the threaded pin is provided with a screw hole block, the outer surface of the threaded pin is threadedly inserted into the inner wall of the screw hole block, and the top of the cover plate is symmetrically opened with extension grooves, and the extension grooves are connected to the inner wall of the second card slot.
[0006] The effects achieved by the above components are: by setting the base and the cover plate, the product IC is placed on the top of the base, the cover plate is covered, the rotating block and the threaded pin are rotated so that the threaded pin enters the second slot and remains relatively vertical with the cover plate, the screw hole block is rotated so that the screw hole block moves on the threaded pin until one side of the screw hole block is completely in contact with one side of the inner wall of the extension groove, then the screw hole block will squeeze the cover plate, and make the cover plate and the base close to each other, and squeeze the product IC between the cover plate and the base, press the product IC tightly, and then bake it at 125° for two hours to correct the warping of the product IC.
[0007] Preferably, a plurality of grooves are evenly arranged on one side of the base.
[0008] The effect achieved by the above components is: by setting the groove, the product IC is placed on the inner wall of the groove, which is convenient for positioning and limiting the product IC and helps prevent the product IC from being easily displaced.
[0009] Preferably, protrusions are symmetrically arranged on the outer surface of the screw hole block, and the protrusions are in the shape of long strips.
[0010] The effect achieved by the above-mentioned components is that by providing the long strip-shaped protrusion, it is convenient to rotate the screw hole block, thereby facilitating the installation and removal of the correction fixture.
[0011] Compared with the prior art, the advantages and positive effects of the utility model are:
[0012] In the utility model, a base and a cover plate are provided, the product IC is placed between the base and the cover plate, the rotating block and the threaded pin are rotated to make the threaded pin enter the second slot, and then the screw hole block is rotated until one side of the screw hole block is completely abutted against one side of the inner wall of the extension slot, the screw hole block will squeeze the cover plate, so that the product IC between the cover plate and the base is squeezed, the product IC is pressed tightly, and then it is baked at 125° for two hours to correct the warping of the product IC, thereby preventing the problem of poor SMT upper board welding. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a three-dimensional structural schematic diagram of the main body of the utility model;
[0014] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure at point A;
[0015] Figure 3 This is a schematic diagram of the separation structure of the upper cover plate and the base of the utility model;
[0016] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure at B.
[0017] Legend: 1. Base; 2. Cover plate; 3. First slot; 4. Second slot; 5. Rotating block; 6. Threaded pin; 7. Screw hole block; 8. Extension slot; 9. Recess. DETAILED DESCRIPTION
[0018] Example 1, reference Figure 1-Figure 4As shown, this embodiment discloses a jig for warpage correction of ball grid array packaging products, including a base 1, a cover plate 2 is arranged on the top of the base 1, first card slots 3 are symmetrically opened on both sides of the top of the base 1, second card slots 4 are symmetrically opened on both sides of the top of the cover plate 2, a rotating block 5 is rotatably connected to the inner wall of the first card slot 3, a threaded pin 6 is fixedly connected to one side of the rotating block 5, a screw hole block 7 is arranged on the outer surface of the threaded pin 6, and the outer surface of the threaded pin 6 is threadedly inserted in the inner wall of the screw hole block 7, an extension groove 8 is symmetrically opened on the top of the cover plate 2, and the extension groove 8 is connected to the inner wall of the second card slot 4, by setting the base 1 and cover plate 2, place the product IC on the top of the base 1, cover the cover plate 2, rotate the rotating block 5 and the threaded pin 6, so that the threaded pin 6 enters the second slot 4 and keeps it relatively vertical with the cover plate 2, rotate the screw hole block 7, so that the screw hole block 7 moves on the threaded pin 6 until one side of the screw hole block 7 is completely in contact with one side of the inner wall of the extension groove 8, then the screw hole block 7 will squeeze the cover plate 2, and make the cover plate 2 and the base 1 close to each other, and squeeze the product IC between the cover plate 2 and the base 1, press the product IC tightly, and then bake it at 125° for two hours to correct the warping of the product IC.
[0019] Reference Figure 3 As shown, a plurality of grooves 9 are evenly formed on one side of the base 1. By providing the grooves 9, the product IC is placed on the inner wall of the grooves 9, which facilitates positioning and limiting the product IC and helps prevent the product IC from being easily displaced.
[0020] Reference Figure 1-Figure 4 As shown, the outer surface of the screw hole block 7 is symmetrically provided with protrusions, and the protrusions are in the shape of long strips. By providing the protrusions in the shape of long strips, it is convenient to rotate the screw hole block 7, thereby facilitating the installation and removal of the correction fixture.
[0021] Working principle: Place the product IC in the groove 9 on the base 1 to limit and position the product, cover the cover 2, rotate the rotating block 5 and the threaded pin 6, so that the threaded pin 6 enters the second slot 4 and remains relatively vertical with the cover 2, rotate the screw hole block 7, so that the screw hole block 7 moves on the threaded pin 6 until one side of the screw hole block 7 is completely in contact with one side of the inner wall of the extension groove 8, then the screw hole block 7 will squeeze the cover 2, and make the cover 2 and the base 1 close to each other, and squeeze the product IC between the cover 2 and the base 1, press the product IC tightly, and then bake it at 125° for two hours to correct the warping of the product IC.
Claims
1. A jig for warpage correction of ball grid array package products, comprising a base (1), characterized in that: A cover plate (2) is provided on the top of the base (1); first slots (3) are symmetrically provided on both sides of the top of the base (1); second slots (4) are symmetrically provided on both sides of the top of the cover plate (2); a rotating block (5) is rotatably connected to the inner wall of the first slot (3); a threaded pin (6) is fixedly connected to one side of the rotating block (5); a screw hole block (7) is provided on the outer surface of the threaded pin (6); the outer surface of the threaded pin (6) is threadedly inserted into the inner wall of the screw hole block (7); an extension slot (8) is symmetrically provided on the top of the cover plate (2); the extension slot (8) is communicated with the inner wall of the second slot (4).
2. The jig for warpage correction of ball grid array packaging products according to claim 1, characterized in that: A plurality of grooves (9) are evenly arranged on one side of the base (1).
3. The jig for warpage correction of ball grid array packaging products according to claim 1, characterized in that: The outer surface of the screw hole block (7) is symmetrically provided with protrusions, which are in the shape of long strips.