Apparatus for flipping printed circuit board

Abstract

A device for turning over a printed circuit board, the printed circuit board comprising a first surface and a second surface opposite to the first surface, the device comprising a turning element, a first conveying wheel set and a second conveying wheel set. The overturning element comprises a rotating body extending in the axial direction, a plurality of adsorption units arranged on an outer ring face of the rotating body and a vacuum unit. The rotating body is provided with an upstream end for receiving the printed circuit board and a downstream end for releasing the printed circuit board. The first conveying wheel set comprises a first conveying face which bears the printed circuit board and is connected with the upstream end of the rotating body. The second conveying wheel set comprises a second conveying face which bears the printed circuit board and is connected with the downstream end of the rotating body.

Description

Technical Field

[0001] The utility model relates to a mechanical device, in particular to a device for turning over a printed circuit board. Background Art

[0002] Printed circuit boards are used in various electronic products, such as televisions, computers, mobile phones, electronic measuring instruments, etc. With the advancement of technology, printed circuit boards tend to be designed in a miniature and high-density direction, making the processing technology complicated. Some processes even require processing on both sides of the printed circuit board. The existing method of flipping a printed circuit board is to use a multi-axis robotic arm to perform the steps of taking, placing, and flipping to achieve the purpose of flipping the printed circuit board. However, the cost of using a multi-axis robotic arm is high, and the mechanism is complex and difficult to maintain. Utility Model Content

[0003] The main purpose of the utility model is to solve the problems of the existing method for turning over the printed circuit board, which is high in cost and difficult to maintain.

[0004] To achieve the above-mentioned purpose, the utility model provides a device for flipping a printed circuit board, the printed circuit board includes a first surface and a second surface opposite to the first surface, the device includes a flip element, a first conveying wheel group and a second conveying wheel group. The flip element includes a rotating body extending along an axial direction, a plurality of adsorption units arranged on an outer ring surface of the rotating body and a vacuum unit, the rotating body has an upstream end for receiving the printed circuit board and a downstream end for releasing the printed circuit board, the vacuum unit is connected to the adsorption unit and can switchably provide a suction force through the adsorption unit to allow the printed circuit board to be adsorbed on the adsorption unit or detached from the adsorption unit. The first conveying wheel group includes a first conveying surface that carries the printed circuit board and connects to the upstream end of the rotating body, the first conveying surface is substantially coplanar with a first tangent plane of the outer ring surface of the rotating body, so that the printed circuit board is adsorbed by the adsorption unit from the first conveying wheel group through the upstream end along a conveying direction and rotates on the rotating body. The second conveying wheel set includes a second conveying surface that carries the printed circuit board and connects to the downstream end of the rotating body. The second conveying surface is substantially coplanar with a second tangent plane of the outer annular surface of the rotating body, so that the printed circuit board moves from the adsorption unit on the rotating body through the downstream end to the second conveying surface along a departure direction and moves on the second conveying wheel set. The printed circuit board is transferred from the first conveying wheel set to the flip element and rotates with the rotating body with the first surface facing upward, and when the printed circuit board rotates with the rotating body and detaches from the adsorption unit and transfers to the second conveying wheel set, it moves on the second conveying surface with the first surface facing upward.

[0005] In one embodiment, the rotating body has a first rotation direction rotating around the axial direction and a second rotation direction opposite to the first rotation direction. When the printed circuit board is transferred from the first conveying wheel set to the flip element, the rotating body rotates in the first rotation direction. When the printed circuit board is transferred from the flip element to the second conveying wheel set, the rotating body rotates in the second rotation direction.

[0006] In one embodiment, the first rotation direction is counterclockwise, and the second rotation direction is clockwise.

[0007] In one embodiment, the first conveying wheel set is located above the axial direction of the rotating body, and the second conveying wheel set is located below the axial direction of the rotating body.

[0008] In one embodiment, the first conveying wheel set is located directly above the rotating body, and the second conveying wheel set is located directly below the rotating body.

[0009] In one embodiment, the adsorption unit is disposed along a circumference of the rotating body.

[0010] In one embodiment, the first cut surface is coplanar with the second surface of the printed circuit board.

[0011] In one embodiment, the second cut surface is coplanar with the first surface of the printed circuit board.

[0012] In one embodiment, the first conveying surface of the first conveying wheel assembly is extended and disposed on an upper tangent plane of the rotating body.

[0013] In one embodiment, a distance between the second conveying surface of the second conveying wheel assembly and a lower cut surface of the rotating body is greater than a thickness of the printed circuit board.

[0014] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figures 1 to 4 , is a schematic diagram of a device for flipping a printed circuit board according to an embodiment of the utility model.

[0016] Among them, the reference numerals

[0017] 1: Device

[0018] 10: Flip component

[0019] 11: Rotate the body

[0020] 11a: Upstream end

[0021] 11b: Downstream end

[0022] 111: Outer ring

[0023] 12: Adsorption unit

[0024] 13: Vacuum unit

[0025] 131: Pipeline

[0026] 20: First conveyor wheel set

[0027] 21: First roller

[0028] 22: First conveying surface

[0029] 30: Second conveyor wheel set

[0030] 31: Second roller

[0031] 32: Second conveying surface

[0032] A: Axial

[0033] P: Printed Circuit Board

[0034] P1: First side

[0035] P2: Second side

[0036] P3: Headend

[0037] P4: Tail end

[0038] R1: First rotation direction

[0039] R2: Second rotation direction

[0040] D: Conveying direction

[0041] d: diameter

[0042] t: thickness

[0043] h: spacing distance

[0044] t1: first section

[0045] t2: Second section DETAILED DESCRIPTION

[0046] The structural principle and working principle of the utility model are described in detail below in conjunction with the accompanying drawings:

[0047] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Unless the context indicates otherwise, the singular forms "a", "an" and "the" used herein may also include plural forms.

[0048] Directional terms used herein, such as up, down, left, right, front, back and their derivatives or synonyms, refer to the orientation of elements in the drawings and are not intended to limit the present invention unless the context clearly states otherwise.

[0049] See also Figures 1 to 4 The utility model discloses a device 1 for flipping a printed circuit board. The device 1 includes a flipping element 10, a first conveying wheel set 20 and a second conveying wheel set 30, and is used for flipping a printed circuit board P.

[0050] The flip element 10 includes a rotating body 11, a plurality of adsorption units 12, and a vacuum unit 13. The rotating body 11 extends along an axial direction A and has a first rotation direction R1 and a second rotation direction R2 rotating around the axial direction A. The first rotation direction R1 is opposite to the second rotation direction R2. In this embodiment, the first rotation direction R1 is counterclockwise rotation, and the second rotation direction R2 is clockwise rotation. In other examples, the first rotation direction R1 can be clockwise rotation, and the second rotation direction R2 can be counterclockwise rotation. A diameter d of the rotating body 11 is between 60 cm and 100 cm, for example, 70 cm. A rotation speed of the rotating body 11 is between 5 RPM and 7 RPM, for example, 5 RPM.

[0051] The rotating body 11 has an upstream end 11a and a downstream end 11b. The upstream end 11a receives the printed circuit board P, and the downstream end 11b releases the printed circuit board P. In this embodiment, the upstream end 11a is located at a first section t1 of the rotating body 11, and the downstream end 11b is located at a second section t2 of the rotating body 11.

[0052] A plurality of the adsorption units 12 are arranged along a circumference of the rotating body 11. The adsorption units 12 are arranged on an outer ring surface 111 of the rotating body 11, and a surface area of ​​the outer ring surface 111 is larger than a surface area of ​​the printed circuit board P so that the printed circuit board P can be completely attached to the outer ring surface 111, and the printed circuit board P is adsorbed by the adsorption units 12. The vacuum unit 13 is connected to the plurality of the adsorption units 12 through a plurality of pipes 131 to provide the adsorption units 12 with a vacuum attraction to adsorb the printed circuit board P. In one example, the adsorption units 12 are arranged in an array on the outer ring surface 111, and the adsorption units 12 can also be arranged in a honeycomb pattern on the outer ring surface 111, so that the vacuum attraction is evenly distributed on the surface of the printed circuit board P, so as to avoid the vacuum attraction being too concentrated and causing damage to the printed circuit board P.

[0053] The first conveying wheel set 20 is located above the axial direction A of the rotating body 11, and the second conveying wheel set 30 is located below the axial direction A of the rotating body 11. In one example, the first conveying wheel set 20 is located directly above the rotating body 11, and the second conveying wheel set 30 is located directly below the rotating body 11.

[0054] The first conveying wheel set 20 includes a plurality of first rollers 21, and the first conveying wheel set 20 forms a first conveying surface 22 on the plurality of first rollers 21, the first conveying surface 22 is connected to the upstream end 11a of the rotating body 11, and the first conveying surface 22 is used to carry the printed circuit board P and drive the printed circuit board P to move to the upstream end 11a with a first surface P1 facing upward along a conveying direction D. In this example, the first conveying surface 22 of the first conveying wheel set 20 is extended and arranged on the first section t1 of the outer ring surface 111 of the rotating body 11, and the first section t1 is coplanar with the second surface P2 of the printed circuit board P. The second conveying wheel set 30 includes a plurality of second rollers 31, and the second conveying wheel set 30 forms a second conveying surface 32 on the plurality of second rollers 31, and the second conveying surface 32 is connected to the downstream end 11b of the rotating body 11. In this example, the second conveying surface 32 of the second conveying wheel set 30 and the second tangent surface t2 of the outer ring surface 111 of the rotating body 11 have a distance greater than a thickness t of the printed circuit board P. The second conveying surface 32 receives and carries the printed circuit board P from the downstream end 11b to move upward along the conveying direction D with a second surface P2. The first surface P1 is opposite to the second surface P2. In one example, the first surface P1 is an upper surface of the printed circuit board P, and the second surface P2 is a lower surface of the printed circuit board P. The second tangent surface t2 is coplanar with the first surface P1 of the printed circuit board P.

[0055] In the present invention, the first conveying surface 22 is substantially coplanar with the first section t1 of the outer ring surface 111 of the rotating body 11, and the second conveying surface 32 is substantially coplanar with the second section t2 of the outer ring surface 111 of the rotating body 11. Substantially coplanar may mean that there is a spacing distance h between the first conveying surface 22 and the first section t1 or between the second conveying surface 32 and the second section t2, and the spacing distance h matches the thickness t of the printed circuit board P.

[0056] In the present invention, connection may refer to that a cut end of the flip element 10 and a receiving end of the first conveying wheel set 20 or the second conveying wheel set 30 are connected and fixed to each other, and the two may be directly connected or indirectly connected via other elements. Connection may also refer to that the printed circuit board P on the first conveying wheel set 20 can be moved to a connection state of the flip element 10 or the printed circuit board P on the flip element 10 can be moved to a connection state of the second conveying wheel set 30. For example, there is a gap between a part of the first conveying wheel set 20 used to carry the printed circuit board P and the flip element 10, but the printed circuit board P can still be moved from the first conveying wheel set 20 to the flip element 10, and the two are also considered to be in a connection relationship.

[0057] In this embodiment, the flip element 10, the first conveying wheel set 20 and the second conveying wheel set 30 of the device 1 are configured to perform:

[0058] The first rollers 21 of the first conveying wheel assembly 20 are started (eg Figure 1 ), driving the first conveying surface 22 to convey the printed circuit board P to the upstream end 11a of the rotating body 11 along the conveying direction D, the rotating body 11 rotates along the first rotating direction R1, the vacuum unit 13 is turned on to allow the adsorption unit 12 to sequentially receive and adsorb the printed circuit board P from the first conveying surface 22 with a head end P3 of the printed circuit board P (as shown in FIG. Figure 2 As shown in FIG. 1 ), the second surface P2 of the printed circuit board P is adsorbed by the vacuum suction of the adsorption unit 12 and attached to the outer annular surface 111, and the rotating body 11 rotates along the first rotation direction R1 until a tail end P4 of the printed circuit board P faces the conveying direction D (as shown in FIG. 1 ). Figure 3 shown).

[0059] Then, the rotating body 11 rotates along the second rotating direction R2 (eg Figure 4 ), the vacuum unit 13 sequentially shuts off the pipeline 131 along the second rotation direction R2 to release the suction unit 12 sucking the printed circuit board P from the tail end P4 in sequence, and the second conveying surface 32 receives the tail end P4 and the printed circuit board P moves with the second surface P2 facing upward in the conveying direction D. In one example, when the rotating body 11 rotates in the second rotation direction R2 and the suction unit 12 rotates to the downstream end 11b (the second section t2 of the rotating body 11), the vacuum unit 13 shuts off the pipeline 131 connected to the suction unit 12 corresponding to the second section t2, so that the suction unit 12 releases the printed circuit board P.

[0060] In summary, the present invention can adsorb the printed circuit board with the first side facing upward to the outer ring surface of the rotating body through the adsorption unit and the vacuum unit of the flip element, and rotate until the tail end of the printed circuit board faces the conveying direction, and then rotate in the opposite direction and the adsorption unit gradually releases the printed circuit board, and the second conveying wheel group conveys the printed circuit board with the second side facing upward.

[0061] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field can make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A device for flipping a printed circuit board, the printed circuit board comprising a first surface and a second surface opposite to the first surface, characterized in that: The device includes: A flip element, comprising a rotating body extending along an axial direction, a plurality of adsorption units disposed on an outer annular surface of the rotating body, and a vacuum unit, wherein the rotating body has an upstream end for receiving the printed circuit board and a downstream end for releasing the printed circuit board, and the vacuum unit is connected to the adsorption unit and can switchably provide a suction force through the adsorption unit to allow the printed circuit board to be adsorbed on or detached from the adsorption unit; a first conveying wheel assembly, comprising a first conveying surface that carries the printed circuit board and engages with the upstream end of the rotating body, the first conveying surface being substantially coplanar with a first tangent plane of the outer annular surface of the rotating body, so that the printed circuit board is adsorbed by the adsorption unit from the first conveying wheel assembly through the upstream end and rotates on the rotating body along a conveying direction; and a second conveying wheel assembly, comprising a second conveying surface that carries the printed circuit board and engages the downstream end of the rotating body, the second conveying surface being substantially coplanar with a second tangent surface of the outer annular surface of the rotating body, so that the printed circuit board moves along a departure direction from the adsorption unit on the rotating body through the downstream end to the second conveying surface and moves on the second conveying wheel assembly; The printed circuit board is transferred from the first conveying wheel set to the flip element and rotates with the rotating body with the first surface facing upward, and when the printed circuit board rotates with the rotating body and detaches from the adsorption unit and transfers to the second conveying wheel set, it moves on the second conveying surface with the second surface facing upward.

2. The device for flipping a printed circuit board according to claim 1, characterized in that: The rotating body has a first rotation direction rotating around the axial direction and a second rotation direction opposite to the first rotation direction. When the printed circuit board is transferred from the first conveying wheel set to the flip element, the rotating body rotates in the first rotation direction. When the printed circuit board is transferred from the flip element to the second conveying wheel set, the rotating body rotates in the second rotation direction.

3. The device for flipping a printed circuit board according to claim 2, characterized in that: The first rotation direction is counterclockwise, and the second rotation direction is clockwise.

4. The device for flipping a printed circuit board according to claim 1, characterized in that: The first conveying wheel set is located above the axial direction of the rotating body, and the second conveying wheel set is located below the axial direction of the rotating body.

5. The device for flipping a printed circuit board according to claim 4, characterized in that: The first conveying wheel set is located right above the rotating body, and the second conveying wheel set is located right below the rotating body.

6. The device for flipping a printed circuit board according to claim 1, characterized in that: The adsorption unit is arranged along a circumference of the rotating body.

7. The device for flipping a printed circuit board according to claim 1, characterized in that: The first cut surface is coplanar with the second surface of the printed circuit board.

8. The device for flipping a printed circuit board according to claim 1, characterized in that: The second cut surface is coplanar with the first surface of the printed circuit board.

9. The device for flipping a printed circuit board according to claim 1, characterized in that: The first conveying surface of the first conveying wheel assembly is extended and disposed on an upper tangent plane of the rotating body.

10. The device for flipping a printed circuit board according to claim 1, characterized in that: The second conveying surface of the second conveying wheel set and a lower cut surface of the rotating body have a distance greater than a thickness of the printed circuit board.

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