Plasma equipment combustion cavity for semiconductor tail gas treatment

Abstract

The utility model relates to the technical field of semiconductor tail gas treatment, in particular to a plasma equipment combustion cavity for semiconductor tail gas treatment, which comprises an upper ring, the top of the upper ring is provided with a combustor connecting seat, the bottom of the upper ring is fixedly connected with a combustion ring, and a combustion cavity is formed between the upper ring and the combustion ring. The upper ring is fixedly connected with tail gas inlet pipes, the bottom ends of the tail gas inlet pipes communicate with the combustion cavity, a fixing ring is fixedly connected to the interior of the combustion ring, a discharging pipe is fixedly connected to the interior of the fixing ring, and the discharging pipe is located under the combustor connecting base. According to the utility model, the tail gas and flame are not in the same channel during treatment, and the tail gas is extracted to the inevitable way when the tail gas is exhausted through negative pressure, so that the tail gas and the flame are fully contacted and combusted, and the tail gas can be conveniently treated by equipment.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor tail gas treatment, in particular to a plasma equipment combustion chamber for semiconductor tail gas treatment. Background Art

[0002] A large amount of toxic, corrosive, and flammable special gases, chemicals, organic solvents and other raw materials are used in the production of semiconductor processes. The exhaust gas generated by these substances may cause air duct blockage, pipeline corrosion, etc. during the lengthy exhaust process due to its gas properties, leading to gas leakage, fire, explosion and other accidents. The exhausted exhaust gas needs to be treated to avoid harm from the exhaust gas.

[0003] When applying for the utility model, the applicant found through searching that a Chinese patent disclosed "an oxygen-supplementing flange and a water-cooled semiconductor tail gas treatment combustion chamber", and its application number is "CN202122128143.9". The patent mainly uses an upper chamber and a lower chamber. The lower chamber includes an upper inner chamber, an upper insulation layer and an upper water-cooling layer from the inside to the outside, and the upper chamber includes a lower inner chamber, a lower insulation layer and a lower water-cooling layer from the inside to the outside. The upper chamber and the lower chamber are detachably connected to form a container with an open top. The upper water-cooling layer and the lower water-cooling layer are connected by a pipeline. The lower water-cooling layer is provided with a water inlet, the upper water-cooling layer is provided with a water outlet, and the upper chamber is provided with an oxygen-supplementing flange. The device reduces the input gas, and through the reaction of pure oxygen and tail gas, the explosion phenomenon is reduced. The device operates in a more static posture to avoid interfering with the previous device.

[0004] When the above-mentioned semiconductor exhaust gas treatment combustion equipment is in use, the exhaust gas is directly introduced into the combustion chamber composed of the upper inner cavity and the lower inner cavity for combustion. This will cause part of the exhaust gas to be carried out of the combustion chamber under the action of the combustion airflow, resulting in this part of the exhaust gas being unable to contact the flame, resulting in incomplete combustion of the exhaust gas, which is inconvenient for the equipment to treat the exhaust gas. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a plasma equipment combustion chamber for semiconductor tail gas treatment.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a combustion chamber of a plasma equipment for semiconductor exhaust gas treatment, comprising an upper ring, a burner connecting seat is arranged on the top of the upper ring, a combustion ring is fixedly connected to the bottom of the upper ring, a combustion chamber is formed between the upper ring and the combustion ring, an exhaust gas inlet pipe is fixedly connected to the upper ring, the bottom end of the exhaust gas inlet pipe is connected to the combustion chamber, there are multiple exhaust gas inlet pipes, a fixed ring is fixedly connected to the inside of the combustion ring, an exhaust pipe is fixedly connected to the inside of the fixed ring, and the exhaust pipe is located directly below the burner connecting seat.

[0007] As a further description of the above technical solution:

[0008] A sealing plate is fixedly connected to the top of the upper ring, a first cooling cavity is formed between the sealing plate and the upper ring, and the top end of the exhaust gas inlet pipe is located above the sealing plate.

[0009] As a further description of the above technical solution:

[0010] A first water inlet pipe is fixedly connected to the upper surface of the sealing plate, and the bottom end of the first water inlet pipe is connected to the first cooling cavity. A water outlet pipe is also fixedly connected to the upper surface of the sealing plate, and the bottom end of the water outlet pipe is connected to the first cooling cavity, and the water outlet pipe is located on one side of the first water inlet pipe.

[0011] As a further description of the above technical solution:

[0012] A thermometer mounting tube is fixedly connected to the upper surface of the sealing plate, and the bottom end of the thermometer mounting tube is communicated with the first cooling cavity.

[0013] As a further description of the above technical solution:

[0014] The bottom of the combustion ring is fixedly connected with a connecting ring, the bottom of the connecting ring is fixedly connected with a fixing tube, and the bottom of the fixing tube is fixedly connected with a bottom plate.

[0015] As a further description of the above technical solution:

[0016] The inner cylinder is fixedly connected to the interior of the bottom plate, and the inner cylinder is located inside the fixed cylinder, and the inner cylinder is located outside the discharge pipe.

[0017] As a further description of the above technical solution:

[0018] A second cooling cavity is formed between the inner cylinder and the fixed cylinder. A second water inlet pipe is fixedly connected to the fixed cylinder. One end of the second water inlet pipe is located inside the second cooling cavity, and the other end of the second water inlet pipe is located outside the fixed cylinder.

[0019] As a further description of the above technical solution:

[0020] The bottom of the inner cylinder is fixedly connected with a mounting ring.

[0021] The utility model has the following beneficial effects:

[0022] 1. Compared with the prior art, the combustion chamber of the plasma equipment for semiconductor exhaust treatment is provided with an upper ring, a burner connecting seat, an exhaust gas inlet pipe, a combustion ring and an exhaust pipe. When in use, the plasma burner is installed on the burner mounting seat, and then the plasma burner is ignited to generate a flame at the exhaust pipe. The flame will increase the temperature around the exhaust pipe and reduce the surrounding air pressure, so that the exhaust gas can be drawn from the exhaust gas inlet pipe to the exhaust pipe to contact with the flame and burn. Compared with the existing straight-cylinder combustion chamber, part of the exhaust gas will be brought out of the combustion chamber under the action of the combustion airflow, resulting in this part of the exhaust gas being unable to contact with the flame, resulting in incomplete combustion of the exhaust gas and inconvenience for the equipment to process the exhaust gas. The exhaust gas and the flame of the combustion chamber of the plasma equipment for semiconductor exhaust treatment are not in the same channel, and the exhaust gas is drawn to the necessary path for exhaust gas discharge through negative pressure, so that the exhaust gas and the flame are fully contacted and burned, which is convenient for the equipment to process the exhaust gas.

[0023] 2. Compared with the prior art, the combustion chamber of the plasma equipment for semiconductor exhaust treatment can cool the top and bottom of the equipment through the first cooling chamber and the second cooling chamber during use, thereby protecting the equipment and avoiding separation between the components of the equipment during long-term high-temperature operation, causing the combustion exhaust gas to leak from the separation gaps, thereby facilitating long-term use of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a combustion chamber of a plasma device for semiconductor tail gas treatment proposed by the utility model;

[0025] Figure 2 This is a cross-sectional view of the internal structure of a combustion chamber of a plasma device for semiconductor tail gas treatment proposed by the utility model from a first perspective;

[0026] Figure 3 The utility model provides a plasma equipment combustion chamber for semiconductor tail gas treatment. Figure 2 A magnified view of the structure at center;

[0027] Figure 4 This is a cross-sectional view of the internal structure of a combustion chamber of a plasma device for semiconductor tail gas treatment proposed by the utility model from a second perspective;

[0028] Figure 5 The utility model provides a plasma equipment combustion chamber for semiconductor tail gas treatment. Figure 4 Enlarged view of the structure at point B in the middle.

[0029] Legend:

[0030] 1. Upper ring; 2. Burner connecting seat; 3. Sealing plate; 4. Exhaust gas inlet pipe; 5. First water inlet pipe; 6. Water outlet pipe; 7. Combustion ring; 8. Fixed ring; 9. Discharge pipe; 10. Connecting ring; 11. Fixed cylinder; 12. Bottom plate; 13. Inner cylinder; 14. Second water inlet pipe; 15. Mounting ring; 16. Thermometer mounting pipe. DETAILED DESCRIPTION

[0031] Reference Figure 1-5 The utility model provides a plasma equipment combustion chamber for semiconductor tail gas treatment: comprising an upper ring 1, a burner connection seat 2 is arranged on the top of the upper ring 1, when in use, the plasma burner is mounted on the burner connection seat 2, and the plasma burner is ignited to generate flames to burn the tail gas, the bottom of the upper ring 1 is fixedly connected to a combustion ring 7, a combustion chamber is formed between the upper ring 1 and the combustion ring 7, the upper ring 1 is fixedly connected to an exhaust gas inlet pipe 4, the bottom end of the exhaust gas inlet pipe 4 is connected to the combustion chamber, and the number of exhaust gas inlet pipes 4 is There are multiple exhaust gas entering the combustion chamber from the exhaust gas inlet pipe 4. The interior of the combustion ring 7 is fixedly connected to a fixed ring 8, and the interior of the fixed ring 8 is fixedly connected to an exhaust pipe 9. The exhaust pipe 9 is located directly below the burner connecting seat 2. The flame generated by the plasma burner will be directly sprayed at the exhaust pipe 9, heating the air in the exhaust pipe 9, forming an air pressure difference with the air inside the combustion chamber, so that the exhaust gas inside the combustion chamber can flow to the exhaust pipe 9 under the action of the air pressure, and contact with the flame inside the exhaust pipe 9, and finally complete the combustion treatment of the exhaust gas.

[0032] A sealing plate 3 is fixedly connected to the top of the upper ring 1, and a first cooling chamber is formed between the sealing plate 3 and the upper ring 1. The top of the exhaust gas inlet pipe 4 is located above the sealing plate 3. A first water inlet pipe 5 is fixedly connected to the upper surface of the sealing plate 3, and the bottom end of the first water inlet pipe 5 is connected to the first cooling chamber. A water outlet pipe 6 is also fixedly connected to the upper surface of the sealing plate 3, and the bottom end of the water outlet pipe 6 is connected to the first cooling chamber, and the water outlet pipe 6 is located on one side of the first water inlet pipe 5. By adding cooling water into the first water inlet pipe 5, the cooling water is PCW cooling water. The water flow will be discharged from the water outlet pipe 6 after filling the first cooling chamber, cooling the upper part of the combustion chamber to protect the components, and at the same time reducing the temperature of the exhaust gas around the exhaust pipe 9, so as to form an air pressure difference around the exhaust pipe 9. A thermometer mounting tube 16 is fixedly connected to the upper surface of the sealing plate 3, and the bottom end of the thermometer mounting tube 16 is connected to the first cooling chamber, so as to detect the temperature of the water flow inside the first cooling chamber, thereby adjusting the water flow rate.

[0033] The bottom of the combustion ring 7 is fixedly connected with a connecting ring 10, the bottom of the connecting ring 10 is fixedly connected with a fixing cylinder 11, the bottom of the fixing cylinder 11 is fixedly connected with a bottom plate 12, the inside of the bottom plate 12 is fixedly connected with an inner cylinder 13, the inner cylinder 13 is located inside the fixing cylinder 11, and the inner cylinder 13 is located outside the discharge pipe 9, a gap is provided between the inner cylinder 13 and the combustion ring 7, a second cooling cavity is formed between the inner cylinder 13 and the fixing cylinder 11, a second water inlet pipe 14 is fixedly connected to the fixing cylinder 11, one end of the second water inlet pipe 14 is located inside the second cooling cavity, and water flows from the first cooling cavity to the second cooling cavity. The second water inlet pipe 14 is added to the inside of the second cooling chamber. After the inside of the second cooling chamber is filled, the water will flow out from the gap between the inner tube 13 and the combustion ring 7. The bottom of the combustion ring can be cooled by the water flow, and the outer wall of the discharge pipe 9 can also be cooled, so the discharge pipe 9 can be protected to avoid damage to the discharge pipe 9 due to long-term high temperature. The other end of the second water inlet pipe 14 is located on the outside of the fixed tube 11, and the bottom of the inner tube 13 is fixedly connected with a mounting ring 15, which is convenient for the plasma equipment combustion chamber mounting seat for semiconductor exhaust treatment and other equipment.

[0034] Working principle: When in use, install the plasma burner on the burner mounting base 2, and then ignite the plasma burner to generate a flame at the exhaust pipe 9. The flame will increase the temperature around the exhaust pipe and reduce the surrounding air pressure, so that the exhaust gas can be drawn from the exhaust gas inlet pipe 4 to the exhaust pipe 9 to contact and burn with the flame. The exhaust gas and the flame in the combustion chamber of the plasma equipment for semiconductor exhaust treatment are not in the same channel. The exhaust gas is drawn to the necessary path for exhaust discharge through negative pressure, allowing the exhaust gas to fully contact and burn with the flame, making it easier for the equipment to treat the exhaust gas.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A plasma combustion chamber for semiconductor tail gas treatment, comprising an upper ring (1), characterized in that: A burner connection seat (2) is arranged on the top of the upper ring (1), a combustion ring (7) is fixedly connected to the bottom of the upper ring (1), a combustion chamber is formed between the upper ring (1) and the combustion ring (7), an exhaust gas inlet pipe (4) is fixedly connected to the upper ring (1), the bottom end of the exhaust gas inlet pipe (4) is connected to the combustion chamber, the number of the exhaust gas inlet pipes (4) is plural, the combustion ring (7) is fixedly connected to a fixing ring (8), the fixing ring (8) is fixedly connected to an exhaust pipe (9), and the exhaust pipe (9) is located directly below the burner connection seat (2).

2. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 1, characterized in that: A sealing plate (3) is fixedly connected to the top of the upper ring (1), a first cooling cavity is formed between the sealing plate (3) and the upper ring (1), and the top end of the exhaust gas inlet pipe (4) is located above the sealing plate (3).

3. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 2, characterized in that: A first water inlet pipe (5) is fixedly connected to the upper surface of the sealing plate (3), and the bottom end of the first water inlet pipe (5) is connected to the first cooling chamber. A water outlet pipe (6) is also fixedly connected to the upper surface of the sealing plate (3), and the bottom end of the water outlet pipe (6) is connected to the first cooling chamber, and the water outlet pipe (6) is located on one side of the first water inlet pipe (5).

4. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 2, characterized in that: A thermometer mounting tube (16) is fixedly connected to the upper surface of the sealing plate (3), and the bottom end of the thermometer mounting tube (16) is in communication with the first cooling chamber.

5. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 1, characterized in that: The bottom of the combustion ring (7) is fixedly connected to a connecting ring (10), the bottom of the connecting ring (10) is fixedly connected to a fixing tube (11), and the bottom of the fixing tube (11) is fixedly connected to a bottom plate (12).

6. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 5, characterized in that: An inner cylinder (13) is fixedly connected to the interior of the bottom plate (12), and the inner cylinder (13) is located inside the fixed cylinder (11), and the inner cylinder (13) is located outside the discharge pipe (9).

7. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 6, characterized in that: A second cooling chamber is formed between the inner tube (13) and the fixed tube (11); a second water inlet pipe (14) is fixedly connected to the fixed tube (11); one end of the second water inlet pipe (14) is located inside the second cooling chamber, and the other end of the second water inlet pipe (14) is located outside the fixed tube (11).

8. The plasma equipment combustion chamber for semiconductor tail gas treatment according to claim 6, characterized in that: A mounting ring (15) is fixedly connected to the bottom of the inner cylinder (13).

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