Heating mechanism of semiconductor heat treatment equipment

Abstract

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a heating mechanism of semiconductor heat treatment equipment, which comprises a furnace body, a furnace door is arranged on the front surface of the furnace body, and a mounting ring is fixedly arranged on the inner wall of the top of the furnace body. The threaded rod is rotated anticlockwise, the threaded rod drives the locking block to move in the direction away from the inner wall of the furnace body, when the threaded rod is separated from the inner wall of the furnace body, the locking structure is lifted upwards, the locking structure can be disassembled, then the lower mounting ring is held to rotate anticlockwise, the lower mounting ring drives the upper mounting ring to rotate through the vertical rod, and the locking structure can be disassembled. The upper mounting ring drives the clamping block to move in the clamping groove through the clamping ring, when the clamping block moves to the longitudinal groove of the clamping groove, the heating assembly is pulled downwards, the heating assembly can be taken out and maintained or replaced, a traditional bolt fixing mode is replaced, the dismounting difficulty is reduced, and follow-up maintenance of equipment is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a heating mechanism of semiconductor heat treatment equipment. Background Art

[0002] Heat treatment refers to a metal thermal processing technology in which materials are heated, kept warm and cooled in solid state to obtain the expected structure and performance. Semiconductors need to be heat treated during reproduction and processing. The heat treatment process generally includes three processes: heating, keeping warm and cooling. Sometimes there are only two processes, heating and cooling. These processes are interconnected and cannot be interrupted. Heating is one of the important processes in heat treatment.

[0003] However, in the existing heat treatment equipment, the internal heating structure is fixed to the inner wall of the heating furnace by the cooperation of rivets and buckles, which is inconvenient for subsequent disassembly and maintenance. Therefore, a heating mechanism for semiconductor heat treatment equipment is proposed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a heating mechanism for semiconductor heat treatment equipment.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heating mechanism of a semiconductor heat treatment equipment, comprising a furnace body, a furnace door is provided on the front of the furnace body, a mounting ring is fixedly provided on the top inner wall of the furnace body, a plurality of slots are provided on the inner wall of the mounting ring, a heating assembly is provided on the bottom of the mounting ring, a material placement structure is provided on the top inner wall of the furnace body, and a plurality of locking structures are provided on the inner wall of the furnace body.

[0006] As a further description of the above technical solution:

[0007] The heating assembly includes a clamping ring fixedly installed with a mounting ring, a plurality of clamping blocks are fixedly provided on the outside of the clamping ring, the clamping blocks are adapted to the clamping grooves, an upper mounting ring is fixedly provided on the bottom of the clamping ring, a plurality of vertical rods are fixedly provided on the bottom of the upper mounting ring, a same lower mounting ring is fixedly provided on the bottom of the plurality of vertical rods, and heating wires are sleeved on the plurality of vertical rods.

[0008] As a further description of the above technical solution:

[0009] The number of the vertical rods is eight, and the eight vertical rods are arranged in a circular equidistant array.

[0010] As a further description of the above technical solution:

[0011] The material placement structure comprises three mounting rods fixedly connected to the inner wall of the top of the furnace body, and three placement plates are fixedly arranged on the three mounting rods, and the distances between the three placement plates are the same.

[0012] As a further description of the above technical solution:

[0013] The locking structure comprises a threaded rod fixedly connected to the inner wall of the furnace body, a guide plate is fixedly provided on one side of the threaded rod, and a locking block is movably provided on one side of the guide plate.

[0014] As a further description of the above technical solution:

[0015] A groove is provided on one side of the guide plate, a bearing is fixed in the groove, a rotating rod is fixed on one side of the locking block, the rotating rod and the inner ring of the bearing are fixedly connected, and an arc groove is provided on the bottom of the locking block, and the size of the arc groove is larger than the outer diameter of the lower mounting ring.

[0016] The utility model has the following beneficial effects:

[0017] 1. Compared with the prior art, the heating mechanism of the semiconductor heat treatment equipment is provided with a clamping ring, a mounting ring, a clamping block, a threaded rod, a guide plate and a locking block. When the heating component needs to be disassembled and maintained, the threaded rod is first rotated counterclockwise, and the threaded rod drives the locking block to move in the direction away from the inner wall of the furnace body. When the threaded rod is detached from the inner wall of the furnace body, the arc groove of the locking block is close to the side of the inner wall of the furnace body and fits with the lower mounting ring. Then the locking structure is pulled upward to realize the disassembly of the locking structure. Then, the lower mounting ring is held and rotated counterclockwise. The lower mounting ring drives the upper mounting ring to rotate through the vertical rod. The upper mounting ring drives the clamping ring, and the clamping ring drives the clamping block to move in the clamping groove again. When the clamping block moves to the longitudinal groove of the clamping groove, the heating component can be pulled downward to be taken out, and the heating component can be repaired or replaced. The traditional bolt fixing mode is replaced, the difficulty of disassembly is reduced, and the subsequent maintenance of the equipment is convenient.

[0018] 2. Compared with the prior art, the heating mechanism of the semiconductor heat treatment equipment is equipped with a mounting rod and a placement tray. During heating, the semiconductor material can be placed on the top of the placement tray. The arrangement of multiple placement trays can process multiple materials at the same time. The staggered distribution of the three placement trays can also classify and heat different semiconductor materials, which is convenient for subsequent collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a heating mechanism of a semiconductor heat treatment device proposed by the utility model;

[0020] Figure 2 This is a schematic diagram of the front cross-section structure of a heating mechanism of a semiconductor heat treatment device proposed by the utility model;

[0021] Figure 3 This is a three-dimensional schematic diagram of a heating component and a material placement structure in a heating mechanism of a semiconductor heat treatment device proposed by the utility model;

[0022] Figure 4 This is a three-dimensional structural schematic diagram of a mounting ring and a clamping ring in a heating mechanism of a semiconductor heat treatment device proposed by the utility model;

[0023] Figure 5 The utility model is a three-dimensional schematic diagram of a locking structure in a heating mechanism of a semiconductor heat treatment device.

[0024] Legend:

[0025] 1. Furnace body; 2. Furnace door; 3. Mounting ring; 4. Heating assembly; 401. Clamping ring; 402. Upper mounting ring; 403. Vertical rod; 404. Lower mounting ring; 405. Heating wire; 406. Clamping block; 5. Material placement structure; 501. Mounting rod; 502. Placement plate; 6. Locking structure; 601. Threaded rod; 602. Guide plate; 603. Locking block; 7. Slot. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Reference Figures 1 to 5 The utility model provides a heating mechanism for semiconductor heat treatment equipment: comprising a furnace body 1, a furnace door 2 is arranged on the front of the furnace body 1, a mounting ring 3 is fixedly arranged on the inner wall of the top of the furnace body 1, a plurality of card slots 7 are arranged on the inner wall of the mounting ring 3, a heating component 4 is arranged at the bottom of the mounting ring 3, the heating component 4 comprises a card ring 401 fixedly arranged with the mounting ring 3, a plurality of card blocks 406 are fixedly arranged on the outside of the card ring 401, the card blocks 406 are adapted to the card slots 7, an upper mounting ring 402 is fixedly arranged at the bottom of the card ring 401, a plurality of vertical rods 403 are fixedly arranged at the bottom of the upper mounting ring 402, the number of the vertical rods 403 is eight, the eight vertical rods 403 are in a circular equidistant array, the bottom of the plurality of vertical rods 403 is fixedly provided with the same lower mounting ring 404, and the plurality of vertical rods 403 are all sleeved with heating wires 405;

[0028] Reference Figure 3In order to achieve the purpose of heating multiple materials at the same time, a material placement structure 5 is provided on the top inner wall of the furnace body 1. The material placement structure 5 includes three mounting rods 501 fixedly connected to the top inner wall of the furnace body 1. Three placement trays 502 are fixedly provided on the three mounting rods 501. The three placement trays 502 have the same spacing. The arrangement of multiple placement trays 502 can process multiple materials at the same time. The staggered distribution of the three placement trays 502 can also classify and heat different semiconductor materials, which is convenient for subsequent collection.

[0029] Reference Figure 5 In order to lock the lower mounting ring 404, the inner wall of the furnace body 1 is provided with a plurality of locking structures 6, the locking structure 6 includes a threaded rod 601 fixedly connected to the inner wall of the furnace body 1, a guide plate 602 is fixedly provided on one side of the threaded rod 601, a locking block 603 is movably provided on one side of the guide plate 602, a groove is provided on one side of the guide plate 602, a bearing is fixedly provided in the groove, a rotating rod is fixedly provided on one side of the locking block 603, the rotating rod and the inner ring of the bearing are fixedly connected, an arc groove is provided at the bottom of the locking block 603, the size of the arc groove is larger than the outer diameter of the lower mounting ring 404, the locking block 603 is mobilized to move by rotating the threaded rod 601, and the inner wall of the arc groove at the bottom of the locking block 603 is fitted with the lower mounting ring 404, so that the positioning of the lower mounting ring 404 can be achieved, and the use of the clamping block 406 and the clamping groove 7 can be used to achieve rapid installation of the heating component 4, and also to achieve rapid disassembly of the heating component 4, which is convenient for subsequent maintenance.

[0030] Working principle: when it is necessary to heat the semiconductor material, the furnace door 2 is opened, and the semiconductor material is placed on the top of the placement tray 502. The arrangement of multiple placement trays 502 can process multiple materials at the same time. The staggered distribution of the three placement trays 502 can also classify and heat different semiconductor materials, which is convenient for subsequent collection. If the heating component 4 or part of the heating element needs to be repaired or replaced, the threaded rod 601 can be rotated counterclockwise first, and the threaded rod 601 drives the guide plate 602, and the guide plate 602 drives the locking block 603 to move away from the inner wall of the furnace body 1. When the threaded rod 601 is detached from the inner wall of the furnace body 1, the locking block 603 is locked. The arc-shaped groove of the tightening block 603 is in contact with the lower mounting ring 404 on one side close to the inner wall of the furnace body 1. The locking structure 6 can be disassembled by pulling the locking structure 6 upward, and the locking block 603 is separated from the lower mounting ring 404. Then, the lower mounting ring 404 is held and rotated counterclockwise. The lower mounting ring 404 drives the upper mounting ring 402 to rotate through the vertical rod 403. The upper mounting ring 402 drives the clamping ring 401, and the clamping ring 401 drives the clamping block 406 to move in the clamping groove 7. When the clamping block 406 moves to the longitudinal groove of the clamping groove 7, the heating component 4 can be pulled downward to be taken out, and the heating component 4 can be repaired or replaced.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heating mechanism for semiconductor heat treatment equipment, comprising a furnace body (1), characterized in that: The front of the furnace body (1) is provided with a furnace door (2), the top inner wall of the furnace body (1) is fixedly provided with a mounting ring (3), the inner wall of the mounting ring (3) is provided with a plurality of slots (7), the bottom of the mounting ring (3) is provided with a heating component (4), the top inner wall of the furnace body (1) is provided with a material placement structure (5), and the inner wall of the furnace body (1) is provided with a plurality of locking structures (6).

2. The heating mechanism of a semiconductor heat treatment equipment according to claim 1, characterized in that: The heating component (4) comprises a clamping ring (401) fixedly mounted on the mounting ring (3); a plurality of clamping blocks (406) are fixedly mounted on the outside of the clamping ring (401); the clamping blocks (406) are matched with the clamping grooves (7); an upper mounting ring (402) is fixedly mounted on the bottom of the clamping ring (401); a plurality of vertical rods (403) are fixedly mounted on the bottom of the upper mounting ring (402); a same lower mounting ring (404) is fixedly mounted on the bottom of the plurality of vertical rods (403); and a heating wire (405) is sleeved on each of the plurality of vertical rods (403).

3. The heating mechanism of a semiconductor heat treatment equipment according to claim 2, characterized in that: The number of the vertical rods (403) is eight, and the eight vertical rods (403) are arranged in a circular equidistant array.

4. The heating mechanism of a semiconductor heat treatment equipment according to claim 1, characterized in that: The material placement structure (5) comprises three mounting rods (501) fixedly connected to the inner wall of the top of the furnace body (1), and three placement plates (502) are fixedly arranged on the three mounting rods (501), and the three placement plates (502) are spaced at the same distance.

5. The heating mechanism of a semiconductor heat treatment equipment according to claim 2, characterized in that: The locking structure (6) comprises a threaded rod (601) fixedly connected to the inner wall of the furnace body (1), a guide plate (602) is fixedly provided on one side of the threaded rod (601), and a locking block (603) is movably provided on one side of the guide plate (602).

6. The heating mechanism of a semiconductor heat treatment equipment according to claim 5, characterized in that: A groove is provided on one side of the guide plate (602), a bearing is fixedly provided in the groove, a rotating rod is fixedly provided on one side of the locking block (603), the rotating rod is fixedly connected to the inner ring of the bearing, and an arc groove is provided on the bottom of the locking block (603), the size of the arc groove is larger than the outer diameter of the lower mounting ring (404).

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