Chip test heating tool and temperature control device using same

Abstract

The utility model relates to the technical field of chip performance test, in particular to a chip test heating tool and a temperature control device using the same. The tool comprises a metal base, and a chip placing mechanism is arranged above the metal base; the plurality of heating sheets are arranged on the metal base; the heat conduction pad covers the surface of the heating sheet, and a chip to be tested is placed on the heat conduction pad; the end face heat sensor is arranged on the heat conduction pad, the end face heat sensor is arranged in the chip placing mechanism, and the end face heat sensor is arranged close to a chip to be tested; the temperature control device comprises a temperature controller arranged on the outer side of the metal base; and a liquid nitrogen cooling mechanism. The utility model provides the chip test heating tool which has the advantages of high working efficiency, high test result precision, simplicity in operation, convenience in use and the like, and the temperature control device applying the heating tool.

Description

Technical Field

[0001] The utility model relates to the technical field of chip performance testing, in particular to a chip testing heating tool and a temperature control device using the heating tool. Background Art

[0002] The operation of the chip is greatly affected by the operating temperature. At too high or too low temperatures, the chip is prone to failure. In the fields of industrial regulation, automotive regulation, and aerospace, in order to ensure that the chip can maintain high stability in a large temperature range, it is necessary to add low temperature / high temperature testing in addition to normal temperature testing. With the growing demand for automotive and industrial chips, three-temperature testing is increasingly becoming the future development direction of the chip testing industry.

[0003] Chinese patent CN219456389U discloses a temperature control device for high and low temperature testing of chips, including a chip placement rack, the chip placement rack has a containing frame inside, and a plurality of positioning columns are arranged in the containing frame; a heating plate is closely attached to the lower surface of the chip placement rack; the upper surfaces of a plurality of semiconductor refrigerators are closely attached to the lower surface of the heating plate; a heat dissipation portion is arranged on the lower surface of the semiconductor refrigerator, and a water cooling pipeline is arranged in the heat dissipation portion, and the lower surface of the semiconductor refrigerator is closely attached to the water cooling pipeline. The utility model realizes switching of different temperatures of the chip by stacking the chip placement rack, the heating plate and a plurality of semiconductor refrigerators up and down, with low improvement cost and convenient operation. At the same time, a heat dissipation portion is added to dissipate the heat released from the lower surface of the semiconductor refrigerator, thereby improving the cooling effect of the semiconductor refrigerator, so that the chip switches quickly at different temperatures, thereby improving the efficiency of the test; the structure is miniaturized, meeting the use requirements of multiple scenarios.

[0004] However, the water cooling system of this technical solution is expensive, requires many accessories, has a complex structure, and is inconvenient to install. Since it involves the use of water, when the temperature is too high, the water will evaporate, resulting in a poor cooling effect. The coolant needs to be checked and replaced regularly to ensure the normal operation of the system. It is inconvenient to use, and the heat generated by the refrigerator will cause the installation site of the refrigerator to heat up. According to the exhaust port and the installation position of the machine, it is necessary to add heat dissipation holes on both sides and the top of the fuselage, thereby increasing the manufacturing cost of the machine. In places with higher temperatures, the production capacity of the refrigerator will be reduced, which will lead to slow and low efficiency in chip testing, and then lead to inaccurate chip test results and large errors. Utility Model Content

[0005] The purpose of the utility model is to provide a chip test heating tool and a temperature control device using the heating tool in view of the deficiencies in the prior art. The end surface thermal sensor is quickly heated to a specified temperature through a metal base and a heating plate to ensure that the temperature of the chip meets the test requirements. The temperature of the tool is then controlled by combining a temperature controller and a liquid nitrogen cooling mechanism, thereby realizing the function of quickly and accurately adjusting the temperature of the chip, thereby solving the problem of poor cooling effect in the prior art.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A chip testing heating tool, comprising:

[0008] A metal base, on which a chip placement mechanism is arranged;

[0009] A plurality of heating plates are arranged on the metal base;

[0010] A thermal pad covering the surface of the heating plate, on which the chip to be tested is placed; and

[0011] The end surface thermal sensor is arranged on the thermal pad, the end surface thermal sensor is arranged inside the chip placement mechanism, and the end surface thermal sensor is arranged close to the chip to be tested.

[0012] Preferably, the metal base is provided with a plurality of mounting grooves adapted to the heating plate.

[0013] Preferably, the end surface thermal sensor is sealed in the sleeve using high temperature glue.

[0014] Preferably, the sleeve is cylindrical.

[0015] Preferably, the outer diameter of the sleeve is not greater than 5 mm.

[0016] A chip testing temperature control device comprises: the above-mentioned chip testing heating tool, and also comprises: a temperature controller arranged on the outside of the metal base; and a liquid nitrogen cooling mechanism.

[0017] Preferably, the liquid nitrogen cooling mechanism is connected to the temperature controller via a first connecting piece, and the liquid nitrogen cooling mechanism is connected to the metal base via a pipeline.

[0018] Preferably, the temperature controller is connected to the heating plate via a first wire, and the first wire is connected to the temperature controller via a second connecting piece.

[0019] Preferably, the temperature controller is connected to the end surface thermal sensor via a second wire, the second wire is connected to the temperature controller via a third connector, and both the second connector and the third connector are aviation plugs.

[0020] Preferably, flame-retardant wire tubes are provided on the outer peripheries of the first conductive wire and the second conductive wire.

[0021] Preferably, a sleeve is packaged on the outer periphery of the end face thermal sensor, the sleeve is cylindrical, and the outer diameter of the sleeve is not greater than 5 mm.

[0022] Preferably, the material of the end surface thermal sensor is PT100, the material of the heating plate is aluminum nitride, and the material of the metal base is copper.

[0023] The beneficial effects of the utility model are:

[0024] (1) The utility model heats the metal base and then transfers the heat to the heating plate, which then heats the end surface thermal sensor. The chip is arranged close to the end surface thermal sensor, which ensures that the chip can be heated quickly. At this time, only the temperature of the end surface thermal sensor needs to be measured to obtain the real-time temperature of the chip. It is easy to use and does not need to directly measure the temperature of the chip, thus avoiding the inconvenience of directly measuring the chip temperature. The tooling has good thermal conductivity and a fast heating rate, which improves the heating efficiency of the chip and thus improves the test efficiency.

[0025] (2) The utility model measures the real-time temperature of the end face thermal sensor and feeds it back to the temperature controller. Then the temperature controller issues instructions to the liquid nitrogen cooling mechanism according to the temperature change. If cooling is required, the liquid ammonia cooling mechanism will start to work to cool the chip. The whole process is simple to operate and can timely perform corresponding heating or cooling operations on the chip according to the temperature change. It is easy to use.

[0026] (3) The present invention uses liquid nitrogen for cooling because it is chemically inert and can protect the chip from damage. It has a good cooling effect and can cool quickly with high efficiency, thereby ensuring that the temperature change of the chip can remain stable, making the measurement result more accurate.

[0027] In summary, the utility model has the advantages of high working efficiency, high test result accuracy, simple operation and convenient use. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the utility model;

[0029] Figure 2 This is an exploded view of the first embodiment of the present utility model;

[0030] Figure 3 This is a schematic diagram of the overall structure of the second embodiment of the present utility model;

[0031] Figure 4 This is a structural schematic diagram of the second embodiment of the utility model without the chip placement mechanism;

[0032] Figure 5 for Figure 4 A magnified image of point A;

[0033] Figure 6 This is an exploded view of the components of the heating plate and the end surface thermal sensor of the second embodiment of the utility model;

[0034] Figure 7 This is a schematic diagram of the structure of the end surface thermal sensor of the second embodiment of the utility model;

[0035] Figure 8 It is a cross-sectional view of the end surface thermal sensor of the second embodiment of the utility model;

[0036] Fig. 9 This is a cross-sectional view of the wire of the second embodiment of the utility model.

[0037] Figure numerals: 1-metal base; 11-mounting slot; 2-heating plate; 3-thermal pad; 4-end face thermal sensor; 41-copper block; 42-fastener; 43-sleeve; 5-temperature controller; 51-first wire; 52-second connecting piece; 53-second wire; 54-third connecting piece; 55-flame retardant wire tube; 6-liquid nitrogen cooling mechanism; 61-first connecting piece; 62-pipeline; 7-chip placement mechanism. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0039] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0040] Embodiment 1

[0041] like Figure 1 and Figure 2 As shown, this embodiment provides a chip test heating tool, including: a metal base 1, a plurality of heating plates 2 arranged on the metal base 1, a thermal pad 3 covering the surface of the heating plate 2, and an end surface thermal sensor 4 arranged on the thermal pad 3. A chip placement mechanism 7 is arranged above the metal base 1, and the end surface thermal sensor 4 is arranged inside the chip placement mechanism 7, and the end surface thermal sensor 3 is arranged close to the chip to be tested. It is only necessary to measure the real-time temperature of the top of the end surface thermal sensor 4 to indirectly obtain the temperature of the chip, and there is no need to directly measure the temperature of the chip, thereby avoiding the problem of inconvenience in directly measuring the chip temperature. The end surface thermal sensor 4 is used mainly because of its high measurement accuracy, stable temperature characteristics, good reproducibility, and can be reused, thereby ensuring the accuracy of chip temperature measurement. In addition, the metal base 1, the heating plate 2 and other components have good thermal conductivity and a fast heating rate, thereby greatly improving the heating efficiency of the chip.

[0042] Among them, the metal base 1 is provided with a plurality of mounting grooves 11 adapted to the heating plate 2, that is, the heating plate 2 is embedded in the metal base 1, which can prevent the heating plate 2 from sliding out of the metal base 1, making the heating plate 2 more stable and firm, so that the chip will not slide easily during testing and is always in a stable state, thereby ensuring the accuracy of the test results.

[0043] At the same time, the end face thermal sensor 4 is fixedly connected to the metal base 1 through a copper block 41, and a fastener 42 is provided on the copper block 41, that is, the fastener 42 cooperates with the copper block 41 to firmly fix the end face thermal sensor 4 on the metal base 1, so that it will not move easily, thereby ensuring the stability of the end face thermal sensor 4, so that the end face thermal sensor 4 can more directly measure the temperature of the metal base 1, avoiding temperature drift or inaccurate measurement, and the overall structure of the tooling is simple and easy to disassemble and assemble.

[0044] Embodiment 2

[0045] like Figure 3-9 As shown, this embodiment provides a chip test temperature control device, including: a chip test heating tool as described in Example 1, and also including: a temperature controller 5 and a liquid nitrogen cooling mechanism 6 arranged on the outside of the metal base 4, by measuring the temperature of the end surface thermal sensor 4 and directly feeding back to the temperature controller 5, and then the temperature controller 5 adjusts the temperature of the metal base 1 according to the use requirements. After the adjustment, the temperature controller 5 transmits the signal to the liquid nitrogen cooling mechanism 6, and cools the metal base 1. The whole process is simple to operate and easy to use. Liquid nitrogen is used because it is chemically inert and can protect the chip from damage. Liquid nitrogen has a good cooling effect, can cool quickly, and is highly efficient.

[0046] In this embodiment, the liquid nitrogen cooling mechanism 6 is connected to the temperature controller 5 via a first connecting member 61. The first connecting member 61 serves to transmit signals, so that the temperature controller 5 can directly control the start and stop of the liquid nitrogen cooling mechanism 6, which is convenient to use.

[0047] In this embodiment, the liquid nitrogen cooling mechanism 6 is connected to the metal base 1 through a pipe 62, and the pipe 62 is arranged to align with the metal base 1, so that the liquid nitrogen in the liquid nitrogen cooling mechanism 6 can cover the entire metal base 1 and cool it in all directions, so that the heating plate 2 can be cooled quickly, thereby reducing the temperature of the chip.

[0048] In this embodiment, the temperature controller 5 is connected to the heating plate 2 via a first wire 51, the first wire 51 is connected to the temperature controller 5 via a second connector 52, the temperature controller 5 is connected to the end face thermal sensor 4 via a second wire 53, and the second wire 53 is connected to the temperature controller 5 via a third connector 54. The overall structure is simple, easy to operate, and easy to assemble and disassemble.

[0049] In this embodiment, a flame retardant wire tube 55 is provided on the periphery of the first wire 51 and the second wire 53 to protect the first wire 51 and the second wire 53 from being damaged by external objects and to prevent the wires from aging. The tube has good insulation, corrosion resistance, and stamping resistance, as well as good flame retardant performance. The flame will be extinguished immediately when away from the fire, which is safer and avoids the problem of performance failure of the metal base 1 due to excessive temperature, thereby ensuring the normal progress of chip testing.

[0050] In this embodiment, the second connector 52 and the third connector 54 are both aviation plugs. Aviation plugs are safe and reliable when connected and can withstand extreme environmental conditions such as temperature changes to ensure that chip testing can proceed normally. Aviation plugs are made of high-quality materials, can withstand daily wear and tear and pressure during use, and have a long service life.

[0051] Of course, the end face thermal sensor 4 is sealed in the sleeve 43 by high-temperature glue. The sleeve 43 is cylindrical, and the outer diameter of the sleeve 43 is not more than 5mm, which can quickly transfer heat to the chip to improve efficiency. The material of the sleeve 43 is preferably copper, which has better thermal conductivity and further improves the efficiency of heat transfer. The end face thermal sensor 4 and the sleeve 43 are preferably filled with hot melt glue, mainly because of its stable chemical properties, high bonding strength, good fixing effect, and can ensure the stability of heat transfer.

[0052] In addition, the material of the end face thermal sensor 4 is preferably PT100, the voltage selection is preferably 220V, the resistance is preferably 50Ω~100Ω, and the heating rate is fast, so that the chip can quickly reach the set temperature and reduce the test cycle. It is a platinum resistor, and its resistance value will change with the change of temperature. It has a wide temperature range and can be used for measurements in various temperature environments. It has high measurement accuracy and is stable and reliable. The material of the heating plate 2 is preferably aluminum nitride, mainly because it has good thermal conductivity, can adapt to extreme temperature environments, can significantly improve the chip heating rate, thereby reducing the chip test time, and is easy to use. The material of the metal base 1 is preferably copper, which has good thermal conductivity, low cost, and can be widely used.

[0053] The working process of this embodiment is as follows: first, the chip is placed on the chip placement mechanism 7, and then the heating plate 2 is started to start heating, the thermal pad 3 starts to conduct heat and transfers heat to the end surface thermal sensor 4, the end surface thermal sensor 4 will respond to the temperature of the metal base 1 in real time and feed back to the temperature controller 5, when the chip needs to be heated, the temperature controller 5 is powered on, the metal base 1 starts to heat up, when the temperature rises to close to the set temperature, the temperature sensor reduces the voltage, so that the heating rate of the metal base 1 is reduced, when the temperature of the metal base 1 is higher than the set temperature, the temperature controller 5 is disconnected from the power supply, if the chip needs to be cooled at this time, the temperature controller 5 will automatically control to open the liquid nitrogen cooling mechanism 6, the liquid nitrogen inside it flows to the metal base 1 through the pipeline 62, cools the metal base 1, and then reduces the temperature of the chip, when the temperature drops to close to the set temperature, the temperature controller 5 adjusts the amount of liquid nitrogen entering, so that the cooling rate of the liquid nitrogen cooling mechanism 6 is reduced, thereby achieving a constant temperature and stable effect.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip testing heating tool, characterized in that: include: A metal base, on which a chip placement mechanism is arranged; A plurality of heating plates are arranged on the metal base; A thermal pad covering the surface of the heating plate; as well as An end surface thermal sensor is arranged on the thermal pad, the end surface thermal sensor is arranged inside the chip placement mechanism, and the end surface thermal sensor is arranged close to the chip to be tested; The thermal sensor chip is sealed with high temperature glue in a copper sleeve with a diameter not greater than 5 mm.

2. A chip testing heating tool according to claim 1, characterized in that: The metal base is provided with a plurality of mounting grooves adapted to the heating plate.

3. A chip testing heating tool according to claim 1, characterized in that: The end surface thermal sensor is sealed in the sleeve by using high temperature glue.

4. A chip testing heating tool according to claim 3, characterized in that: The sleeve is cylindrical.

5. The chip testing heating tool according to claim 3, characterized in that: The outer diameter of the sleeve is not greater than 5 mm.

6. A chip testing temperature control device, characterized in that: It comprises a chip testing heating tool as described in any one of claims 1-5, and also comprises a temperature controller arranged on the outside of the metal base; and a liquid nitrogen cooling mechanism.

7. A chip testing temperature control device according to claim 6, characterized in that: The liquid nitrogen cooling mechanism is connected to the temperature controller via a first connecting piece; the liquid nitrogen cooling mechanism is connected to the metal base via a pipeline.

8. A chip testing temperature control device according to claim 6, characterized in that: The temperature controller is connected to the heating plate via a first wire, and the first wire is connected to the temperature controller via a second connecting piece.

9. A chip testing temperature control device according to claim 8, characterized in that: The temperature controller is connected to the end surface thermal sensor via a second wire, the second wire is connected to the temperature controller via a third connector, and both the second connector and the third connector are aviation plugs.

10. A chip testing temperature control device according to claim 9, characterized in that: Flame-retardant wire tubes are provided on the outer peripheries of the first wire and the second wire.

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