Printed circuit board power supply module

Abstract

The utility model discloses a printed circuit board power supply module, which comprises an insulating layer, a first conductive layer, a second conductive layer and a power supply magnetic core, and is characterized in that a first conductive winding is etched on the upper surface of the first conductive layer, and a second conductive winding is etched on the lower surface of the second conductive layer; the position of the first conductive winding on the first conductive layer is the same as that of the second conductive winding on the second conductive layer; a first magnetic core hole penetrates through the center of the first conductive winding, a second magnetic core hole and a third magnetic core hole penetrate through the outer ring of the first conductive winding, and the power supply magnetic core penetrates through the first magnetic core hole, the second magnetic core hole and the third magnetic core hole; the upper surface of the first conductive layer and the lower surface of the second conductive layer are coated with solder resist paint except the positions where the first conductive winding and the second conductive winding are etched. According to the printed circuit board power supply module provided by the invention, when the coil current is expanded, the printed circuit board and the circuit board mainboard can be easily fused together, and the purpose of increasing the current can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of switching power supplies, and in particular to a printed circuit board power supply module. Background Art

[0002] A switching power supply is a power supply device that converts electrical energy from one circuit to another. It is usually used to convert high-voltage, low-current alternating current into low-voltage, high-current direct current. Compared with traditional linear regulated power supplies, switching power supplies have the advantages of high efficiency, small size, light weight, and high reliability. Therefore, they are widely used in electronic devices.

[0003] Traditional switching power supplies and DC-DC converters require large discrete magnetic components, such as transformers and inductors, which have inherent losses, heat generation, electromagnetic interference (EMI) emission, and high manufacturing costs. With the demand for miniaturization, smaller magnetic components and transformers have been developed, which are directly manufactured on substrates such as printed circuit boards (PCBs) or silicon substrates. Manufacturing the transformer coil directly on the printed circuit board has the following advantages: 1. The variable frequency state of the copper foil of the printed circuit board is conducive to overcoming the skin effect of the conductor; 2. The switching power supply module can be integrated with the circuit board motherboard.

[0004] When manufacturing the transformer coil directly on the printed circuit board, the distance between the center opening of the magnetic core and the upper and lower openings on the printed circuit board is limited. Therefore, when the coil current is to be expanded, more layers of printed circuit boards can be used to make multiple coils in parallel to achieve current expansion. This method makes it difficult to integrate it with the main circuit board on a single circuit board, and the current of the entire power module is also small. Summary of the invention

[0005] To this end, the present application provides a printed circuit board power module to solve the problem in the prior art that it is difficult to integrate with the circuit board mainboard when expanding the coil current and the current is small.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A printed circuit board power module comprises an insulating layer, a first conductive layer, a second conductive layer and a power magnetic core, wherein the first conductive layer is located on an upper surface of the insulating layer, and the second conductive layer is located on a lower surface of the insulating layer;

[0008] A first conductive winding is etched on the upper surface of the first conductive layer, and a second conductive winding is etched on the lower surface of the second conductive layer, and the position of the first conductive winding on the first conductive layer is the same as the position of the second conductive winding on the second conductive layer;

[0009] The center of the first conductive winding passes through the first conductive layer, the insulating layer and the second conductive layer to form a first magnetic core hole, the outer circle of the first conductive winding passes through the first conductive layer, the insulating layer and the second conductive layer to form a second magnetic core hole and a third magnetic core hole, the first magnetic core hole, the second magnetic core hole and the third magnetic core hole are on the same straight line, and the second magnetic core hole and the third magnetic core hole are symmetrically arranged relative to the first magnetic core hole, and the power supply magnetic core is arranged through the first magnetic core hole, the second magnetic core hole and the third magnetic core hole;

[0010] The upper surface of the first conductive layer and the lower surface of the second conductive layer are coated with solder resist paint except for the positions where the first conductive winding and the second conductive winding are etched.

[0011] Preferably, the first conductive layer and the second conductive layer are both copper foils.

[0012] Preferably, the power supply core is E-type.

[0013] Preferably, the core material of the power supply core is nickel-zinc ferrite.

[0014] Preferably, the solder resist paint is epoxy resin or polyester resin.

[0015] Compared with the prior art, this application has at least the following beneficial effects:

[0016] The present application provides a printed circuit board power module, comprising an insulating layer, a first conductive layer, a second conductive layer and a power core, wherein a first conductive winding is etched on the upper surface of the first conductive layer, a second conductive winding is etched on the lower surface of the second conductive layer, and the position of the first conductive winding on the first conductive layer is the same as the position of the second conductive winding on the second conductive layer; a first core hole is formed in the center of the first conductive winding through the first conductive layer, the insulating layer and the second conductive layer, a second core hole and a third core hole are formed in the outer circle of the first conductive winding through the first conductive layer, the insulating layer and the second conductive layer, and the power core passes through the first core hole, the second core hole and the third core hole; the upper surface of the first conductive layer and the lower surface of the second conductive layer are coated with solder resist paint except for the positions where the first conductive winding and the second conductive winding are etched. The printed circuit board power module provided in the present application no longer coats solder resist paint at the positions where the first conductive winding and the second conductive winding are etched, thereby facilitating the fusion of the printed circuit board and the circuit board mainboard when expanding the coil current. Furthermore, since the first conductive winding and the second conductive winding are in a "bare copper" state, liquid solder can be coated together with other component pads. After the liquid solder is heated, the copper foil at the original coil is thickened, thereby achieving the purpose of increasing the current. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more intuitively illustrate the prior art and the present application, exemplary drawings are given below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing the present application; for example, those skilled in the art are capable of easily making conventional adjustments or further optimizations to the addition / reduction / attribution division, specific shapes, positional relationships, connection methods, dimensional ratios, etc. of certain units (components) based on the technical concepts and exemplary drawings disclosed in the present application.

[0018] Figure 1 A schematic diagram of the front structure of a printed circuit board power module provided in this application;

[0019] Figure 2 A schematic diagram of the reverse structure of a printed circuit board power module provided in this application.

[0020] Description of reference numerals:

[0021] 1. First conductive layer; 2. Second conductive layer; 3. Power supply core; 4. First conductive winding; 5. Second conductive winding; 6. First core hole; 7. Second core hole; 8. Third core hole. DETAILED DESCRIPTION

[0022] The present application is further described below in detail through specific embodiments in conjunction with the accompanying drawings.

[0023] In the description of this application: unless otherwise specified, the meaning of "plurality" is two or more. The terms "first", "second", "third", etc. in this application are intended to distinguish the objects referred to, and do not have special meanings in terms of technical connotations (for example, they should not be understood as emphasizing the importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0024] The terms such as "upper", "lower", "left", "right", "middle", etc. cited in this application are usually used to indicate the general relative position relationship for the purpose of intuitive understanding by referring to the drawings, and are not absolute limitations on the position relationship in the actual product.

[0025] See also Figure 1 and Figure 2 , the present application provides a printed circuit board power module, comprising an insulating layer, a first conductive layer 1, a second conductive layer 2 and a power core 3, wherein the first conductive layer 1 is located on the upper surface of the insulating layer, and the second conductive layer 2 is located on the lower surface of the insulating layer, wherein the insulating layer, the first conductive layer 1 and the second conductive layer 2 constitute a printed circuit board;

[0026] A first conductive winding 4 is etched on the upper surface of the first conductive layer 1, and a second conductive winding 5 is etched on the lower surface of the second conductive layer 2. The position of the first conductive winding 4 on the first conductive layer 1 is the same as the position of the second conductive winding 5 on the second conductive layer 2.

[0027] The center of the first conductive winding 4 passes through the first conductive layer 1, the insulating layer and the second conductive layer 2 to form a first magnetic core hole 6, the outer circle of the first conductive winding 4 passes through the first conductive layer 1, the insulating layer and the second conductive layer 2 to form a second magnetic core hole 7 and a third magnetic core hole 8, the first magnetic core hole 6, the second magnetic core hole 7 and the third magnetic core hole 8 are located on the same straight line, and the second magnetic core hole 7 and the third magnetic core hole 8 are symmetrically arranged relative to the first magnetic core hole 6, and the power supply magnetic core 3 is arranged through the first magnetic core hole 6, the second magnetic core hole 7 and the third magnetic core hole 8;

[0028] The upper surface of the first conductive layer 1 and the lower surface of the second conductive layer 2 are coated with solder resist paint except for the positions where the first conductive winding 4 and the second conductive winding 5 are etched.

[0029] Specifically, in the printed circuit board power module of the present application, the first conductive layer 1 and the second conductive layer 2 are both copper foils.

[0030] Specifically, in the printed circuit board power module provided in the present application, the power core 3 is E-shaped, and the core material of the power core 3 is preferably nickel-zinc ferrite.

[0031] Specifically, the solder resist paint in the printed circuit board power module provided by the present application is epoxy resin or polyester resin, both of which have good adhesion and chemical resistance, can effectively protect the conductive layer and provide insulation and corrosion protection functions. During the manufacturing process, the solder resist paint will be coated on the surface of the PCB board, and then cured by ultraviolet exposure or thermal curing process to form a solid protective layer.

[0032] The printed circuit board power module provided in the present application no longer coats solder resist paint at the positions where the first conductive winding and the second conductive winding are etched, thereby facilitating the fusion of the printed circuit board and the circuit board mainboard when expanding the coil current. Furthermore, since the first conductive winding and the second conductive winding are in a "bare copper" state, liquid solder can be coated together with other component pads. After the liquid solder is heated, the copper foil at the original coil is thickened, thereby achieving the purpose of increasing the current, that is, achieving the purpose of increasing the conductivity of the copper foil.

[0033] In this application, the thickness of the tinning can be controlled by the process to be 50-200um. For a general printed circuit board, the copper foil thickness is 35um. If 50um thick solder is added to its surface, the current can basically be expanded by 1 times (due to the heat dissipation problem, the current density is positively correlated with the copper foil thickness and is proportional). By controlling the copper foil thickness in the process, the current expansion multiple can be determined.

[0034] The technical features of the above embodiments may be arbitrarily combined (as long as there is no contradiction in the combination of these technical features). To make the description concise, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A printed circuit board power module, characterized in that: It includes an insulating layer, a first conductive layer, a second conductive layer and a power supply magnetic core, wherein the first conductive layer is located on the upper surface of the insulating layer, and the second conductive layer is located on the lower surface of the insulating layer; A first conductive winding is etched on the upper surface of the first conductive layer, and a second conductive winding is etched on the lower surface of the second conductive layer, and the position of the first conductive winding on the first conductive layer is the same as the position of the second conductive winding on the second conductive layer; The center of the first conductive winding passes through the first conductive layer, the insulating layer and the second conductive layer to form a first magnetic core hole, the outer circle of the first conductive winding passes through the first conductive layer, the insulating layer and the second conductive layer to form a second magnetic core hole and a third magnetic core hole, the first magnetic core hole, the second magnetic core hole and the third magnetic core hole are on the same straight line, and the second magnetic core hole and the third magnetic core hole are symmetrically arranged relative to the first magnetic core hole, and the power supply magnetic core is arranged through the first magnetic core hole, the second magnetic core hole and the third magnetic core hole; The upper surface of the first conductive layer and the lower surface of the second conductive layer are coated with solder resist paint except for the positions where the first conductive winding and the second conductive winding are etched.

2. The printed circuit board power module according to claim 1, characterized in that: The first conductive layer and the second conductive layer are both copper foils.

3. The printed circuit board power module according to claim 1, characterized in that: The power supply magnetic core is E-type.

4. The printed circuit board power module according to claim 1, characterized in that: The magnetic core material of the power supply magnetic core is nickel-zinc ferrite.

5. The printed circuit board power module according to claim 1, characterized in that: The solder resist paint is epoxy resin or polyester resin.

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