Power module, power assembly and vehicle

Abstract

The utility model discloses a power module, a power assembly and a vehicle. The power module comprises a mainboard; the first lining plate and the second lining plate are respectively arranged on one side of the main plate in the thickness direction, and the first lining plate and the second lining plate are arranged at an interval; and the multiple substrates are arranged on the sides, away from the main board, of the first lining board and the second lining board correspondingly, and circuit layers are formed on the sides, away from the first lining board or the second lining board, of the substrates in the thickness direction. According to the power module provided by the utility model, the single lining plate is divided into the first lining plate and the second lining plate, and then the first lining plate and the second lining plate are respectively welded with the main board, so that the welding area of the lining plates is reduced, and the stress concentration risk caused by overlarge welding area in the welding process of the lining plates is reduced; and the substrates containing the circuit layers are arranged on the first lining plate and the second lining plate to replace etching circuits on the copper layers of the lining plates, so that the stress brittleness enhancement risk brought by the etching circuits to the lining plates is weakened, and the warping condition of the surfaces of the lining plates is improved.

Description

Technical Field

[0001] The utility model relates to the field of power modules, in particular to a power module, a power component and a vehicle. Background Art

[0002] In the related technology, the welding process of the power module mainly includes the primary welding of the chip and the liner, and the secondary welding of the liner and the main board. The secondary welding of the liner and the main board plays a crucial role in the entire process of the power module and the quality parameters of the module. As time goes by, the internal stress of the liner will gradually increase, and the liner is prone to positive warping and reverse warping. The abnormal increase in the warping of the liner makes it difficult to ensure the quality of the secondary welding. On the one hand, the warping of the liner makes it difficult to fit with the substrate, resulting in an increase in the void rate after sintering or solder stratification. On the other hand, the ceramic layer inside the liner will have the risk of cracks after welding, affecting the later reliability and aging performance test of the power module. Therefore, how to improve the warping of the liner itself has become a technical problem to be solved in this field. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a power module. According to the power module of the utility model, a single lining plate is divided into a first lining plate and a second lining plate, and then they are welded to the main board respectively, thereby reducing the welding area of ​​the lining plate, reducing the risk of stress concentration caused by excessive welding area during the welding process of the lining plate, and arranging a substrate containing a circuit layer on the first lining plate and the second lining plate instead of etching the circuit on the copper layer of the lining plate, thereby reducing the risk of stress brittleness enhancement caused by etching the circuit to the lining plate, and improving the warping of the lining plate surface.

[0004] The utility model also provides a power assembly having the power module.

[0005] The utility model also provides a vehicle with the power assembly.

[0006] According to the utility model, the power module includes: a main board; a first lining plate and a second lining plate, wherein the first lining plate and the second lining plate are respectively arranged on one side of the main board in the thickness direction, and the first lining plate and the second lining plate are spaced apart; a substrate, wherein the substrate is constructed in multiple pieces and respectively arranged on the side of the first lining plate and the second lining plate away from the main board, and a circuit layer is formed on the side of the substrate away from the first lining plate or the second lining plate in the thickness direction.

[0007] The power module according to the utility model divides the single lining plate in the traditional power module into a first lining plate and a second lining plate, and the first lining plate and the second lining plate are respectively welded to the main board, thereby reducing the welding area of ​​the lining plate, reducing the risk of stress concentration caused by the excessive welding area of ​​the lining plate during welding, and thus improving the lining plate warping problem caused by high welding stress. At the same time, a substrate containing a circuit layer is arranged on the first lining plate and the second lining plate to replace the circuit etching on the lining plate copper layer, thereby reducing the risk of stress brittleness enhancement brought by the etching circuit to the lining plate, and improving the warping of the lining plate surface.

[0008] According to some embodiments of the present invention, the circuit layer includes: a first circuit layer, which is arranged on the substrate; a second circuit layer, which is constructed into two and is respectively arranged on the substrate, and the second circuit layer is symmetrically arranged on both sides of the first circuit layer in the width direction.

[0009] According to some embodiments of the present invention, the first circuit layer has a symmetry center, the first circuit layer is symmetrical about the symmetry center, and the two second circuit layers are respectively symmetrical about the symmetry center.

[0010] According to some embodiments of the utility model, a plurality of the substrates are respectively disposed on the first lining plate and the second lining plate, the plurality of substrates are spaced apart in the length direction, and two adjacent substrates are connected by bonding wires.

[0011] According to some embodiments of the present invention, an upper bridge circuit is formed on the first substrate, and a lower bridge circuit is formed on the second substrate, and the upper bridge circuit and the lower bridge circuit are electrically connected via bonding wires.

[0012] According to some embodiments of the utility model, the power module further includes: a power chip, wherein the power chip is structured in multiple numbers, and the multiple power chips are respectively arranged on the first lining plate and the second lining plate and are electrically connected to the first circuit layer and the second circuit layer through the bonding wires.

[0013] According to some embodiments of the present invention, the power module further includes: a thermistor, which is disposed on the first liner and is suitable for detecting temperature changes of the power chip.

[0014] According to some embodiments of the present invention, the distance between the bottom edge of the first lining plate and the top edge of the second lining plate is d, and satisfies: 0.7mm≤d≤1.2mm.

[0015] The power assembly according to the utility model is briefly described below.

[0016] The power assembly according to the utility model is provided with a power module as described in any one of the above embodiments. Since the power assembly according to the utility model is provided with a power module as described in any one of the above embodiments, the power assembly according to the present application has good safety and high reliability.

[0017] The vehicle according to the present utility model is briefly described below.

[0018] The vehicle according to the utility model is provided with a power assembly as described in any one of the above embodiments. Since the vehicle according to the utility model is provided with a power assembly as described in any one of the above embodiments, the vehicle according to the present application has better safety and higher reliability during operation.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 is a schematic structural diagram of a power module according to an embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the first lining plate of a power module according to an embodiment of the utility model;

[0023] Figure 3 It is a schematic diagram of the second lining structure of a power module according to an embodiment of the utility model.

[0024] Reference numerals:

[0025] 100. Power module;

[0026] 11. first lining board; 12. second lining board; 13. substrate; 14. first circuit layer; 15. second circuit layer;

[0027] 21. Thermistor; 22. Bonding wire. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the related technology, the welding process of the power module mainly includes the primary welding of the chip and the liner, and the secondary welding of the liner and the main board. The secondary welding of the liner and the main board plays a crucial role in the entire process of the power module and the quality parameters of the module. As time goes by, the internal stress of the liner will gradually increase, and the liner is prone to positive warping and reverse warping. The abnormal increase in the warping of the liner makes it difficult to ensure the quality of the secondary welding. On the one hand, the warping of the liner makes it difficult to fit with the substrate, resulting in an increase in the void rate after sintering or solder stratification. On the other hand, the ceramic layer inside the liner will have the risk of cracks after welding, affecting the later reliability and aging performance test of the power module. Therefore, how to improve the warping of the liner itself has become a technical problem to be solved in this field.

[0030] Reference below Figure 1-Figure 3 A power module according to an embodiment of the present invention is described.

[0031] According to the utility model, the power module 100 includes: a main board, a first liner 11, a second liner 12 and a substrate 13. The first liner 11 and the second liner 12 are respectively arranged on one side of the main board in the thickness direction, and the first liner 11 and the second liner 12 are spaced apart; the substrate 13 is constructed into a plurality of substrates and are respectively arranged on the side of the first liner 11 and the second liner 12 away from the main board, and a circuit layer is formed on the side of the substrate 13 away from the first liner 11 or the second liner 12 in the thickness direction.

[0032] In some specific embodiments, the power module 100 is mainly composed of a main board, a first liner 11, a second liner 12 and a substrate 13. The first liner 11 and the second liner 12 are respectively arranged on the same side of the main board in the thickness direction. The first liner 11 and the second liner 12 are both made of metal conductive material, which can be copper, etc. The main board is made of insulating material, which can be ceramic, etc., and there is no restriction here. The first liner 11 and the second liner 12 are manufactured separately, and the structures and sizes of the first liner 11 and the second liner 12 are basically the same. The sum of the projection area of ​​the first liner 11 in the thickness direction and the projection area of ​​the second liner 12 in the thickness direction is the projection area of ​​the liner set in the traditional power module 100 in the thickness direction, that is, the present application divides the single liner in the traditional power module 100 into the first liner 11 and the second liner 12, and the first liner 11 and the second liner 12 are respectively welded to the main board, which reduces the welding area of ​​the liner, reduces the risk of stress concentration caused by excessive welding area of ​​the liner during welding, and thereby improves the liner warping problem caused by high welding stress.

[0033] In addition, the first liner plate 11 and the second liner plate 12 are spaced apart from each other to avoid direct electrical connection between the first liner plate 11 and the second liner plate 12 , thereby avoiding interference with the power circuit and improving the working stability of the power module 100 .

[0034] At the same time, a substrate 13 is arranged on the side of the first liner 11 and the second liner 12 away from the main board. The substrate 13 can be constructed as an IMS board. The substrate 13 is constructed in multiples, and each substrate 13 is formed with a circuit layer on the side away from the first liner 11 and the second liner 12 in the thickness direction. The circuit layer constitutes a driving circuit to carry the driving signal of the power module 100. In the present application, an IMS board is arranged at the position of the unprocessed circuit of the liner to replace the method of etching or laser making the circuit on the copper layer of the liner in the traditional power module 100. On the one hand, it optimizes the processing procedure of the liner material and saves the material cost. On the other hand, it reduces the risk of stress brittleness enhancement caused by etching the circuit on the copper layer of the liner, improves the warping of the liner surface, and further improves the quality of one-time welding.

[0035] According to the power module 100 of the utility model, a single liner in the traditional power module 100 is divided into a first liner 11 and a second liner 12. The first liner 11 and the second liner 12 are respectively welded to the main board, thereby reducing the welding area of ​​the liner, reducing the risk of stress concentration caused by the excessive welding area of ​​the liner during welding, thereby improving the liner warping problem caused by high welding stress. At the same time, a substrate 13 containing a circuit layer is arranged on the first liner 11 and the second liner 12 to replace the circuit etching on the liner copper layer, thereby reducing the risk of stress brittleness enhancement brought by the etching circuit to the liner, and improving the warping of the liner surface.

[0036] According to some embodiments of the present invention, the circuit layer includes: a first circuit layer 14 and a second circuit layer 15, the first circuit layer 14 is arranged on the substrate 13; the second circuit layer 15 is constructed into two and respectively arranged on the substrate 13, and the second circuit layer 15 is symmetrically arranged on both sides of the first circuit layer 14 in the width direction.

[0037] In some specific embodiments, the circuit layer is composed of a first circuit layer 14 and a second circuit layer 15. The first circuit layer 14 and the second circuit layer 15 can be respectively constructed as copper plates or other electrical plates, etc., which are not limited here. The substrate 13 is provided with a circuit installation area on one side in the thickness direction, and the circuit installation area is provided with a first circuit layer 14 and two second circuit layers 15. The two second circuit layers 15 are symmetrically arranged on both sides of the first circuit layer 14 in the width direction.

[0038] Since the first circuit layer 14 is suitable for being electrically connected to the Kelvin poles of multiple power chips, and the two second circuit layers 15 are respectively suitable for being electrically connected to the gates of multiple power chips, in the driving circuit, the current can enter from the second circuit layers 15 on both sides and exit from the first circuit layer 14, or the current can enter from the first circuit layer 14 and exit from the second circuit layers 15 on both sides, thereby achieving symmetry of the driving circuit and reducing the parasitic inductance parameters of the driving circuit.

[0039] According to some embodiments of the present invention, the first circuit layer 14 has a symmetry center, the first circuit layer 14 is symmetric about the symmetry center, and the two second circuit layers 15 are symmetric about the symmetry center.

[0040] In some specific embodiments, the first circuit layer 14 may be symmetrical about the symmetry center in the length or width direction, that is, the first circuit layer 14 may have a first symmetry center line in the length direction, the first circuit layer 14 is symmetrical about the first symmetry center line, and / or the first circuit layer 14 has a second symmetry center line in the width direction, the first circuit layer 14 is symmetrical about the second symmetry center line. Similarly, the two second circuit layers 15 may be symmetrical to each other about the second symmetry center line, and / or the two second circuit layers 15 may be symmetrical about the first center line respectively, and there is no limitation here. Therefore, through the above-mentioned setting, the consistency of resistance change in the driving circuit loop set on the substrate 13 can be better, thereby reducing the parasitic inductance parameters of the driving circuit.

[0041] According to some embodiments of the present invention, a plurality of substrates 13 are respectively disposed on the first liner 11 and the second liner 12 , and the plurality of substrates 13 are spaced apart in the length direction, and two adjacent substrates 13 on the first liner 11 or the second liner 12 are connected by bonding wires 22 .

[0042] In some specific embodiments, a plurality of substrates 13 are provided on the first liner 11, and a plurality of substrates 13 are provided on the second liner 12. The substrates 13 may be spaced apart in the length direction or spaced apart in the width direction. A driving circuit is provided on each substrate 13. A plurality of driving circuits are provided on the first liner 11 and the second liner 12. The driving circuits on two adjacent substrates 13 are connected by bonding wires 22. Different driving circuits may adopt different driving modes or parameter settings to meet different application requirements. Providing a plurality of driving circuits on the liner can conveniently switch between different driving modes or adjust parameter settings to optimize the driving effect and improve the performance and efficiency of the power module 100.

[0043] According to some embodiments of the utility model, an upper bridge circuit is formed on the first substrate 11, and a lower bridge circuit is formed on the second substrate 12. The upper bridge circuit and the lower bridge circuit are electrically connected via bonding wires 22, thereby realizing the conduction of gate and source drive signals, modulating the switching of the upper and lower tube chips, and driving the mutual switching of AC and DC current transmission directions, thereby realizing electrical control of the power module 100.

[0044] According to some embodiments of the present invention, the power module 100 further includes: a power chip, which is structured in multiples, and the multiple power chips are respectively arranged on the first liner 11 and the second liner 12 and electrically connected to the first circuit layer 14 and the second circuit layer 15 through bonding wires 22.

[0045] In some specific embodiments, a plurality of power chips are further arranged on the first lining plate 11 and the second lining plate 12, and the substrate 13 is located between the plurality of power chips. It can be understood that the plurality of power chips are respectively connected to the first circuit layer 14 and the second circuit layer 15 on the substrate 13 through bonding wires 22. The first circuit layer 14 and the second circuit layer 15 are respectively located between the plurality of power chips, which can shorten the length of the bonding wires 22, thereby facilitating the connection of the plurality of power chips with the first circuit layer 14 and the second circuit layer 15, respectively. At the same time, the use of the bonding wires 22 can be reduced, thereby reducing the production cost of the power module 100.

[0046] In addition, since the driving circuit of the present application is formed on the substrate 13, it is possible to avoid etching circuits on the first liner 11 and the second liner 12, that is, the integrity of the first liner 11 and the second liner 12 is high, which facilitates compatibility with power chips of different manufacturers and sizes.

[0047] According to some embodiments of the present invention, the power module 100 further includes: a thermistor 21 , which is disposed on the first liner 11 and is suitable for detecting temperature changes of the power chip.

[0048] In some specific embodiments, a thermistor 21 is further provided on the first liner 11. The thermistor 21 can be connected to the first liner 11 by silver sintering. The thermistor 21 is connected to the upper bridge circuit. The thermistor 21 is also called an NTC resistor and has a negative temperature coefficient characteristic. When the ambient temperature rises, the number of electrons and holes inside the thermistor 21 will increase, causing the resistance value to decrease. On the contrary, when the ambient temperature decreases, the number of electrons and holes will decrease, causing the resistance value to increase, thereby better reflecting the temperature changes of the power chip in the power module 100 circuit.

[0049] According to some embodiments of the present invention, the distance between the bottom edge of the first lining plate 11 and the top edge of the second lining plate 12 is d, and satisfies: 0.7mm≤d≤1.2mm.

[0050] In some specific embodiments, the distance between the bottom edge of the first lining plate 11 and the top edge of the second lining plate 12 is d, wherein d is set in the range of 0.7 mm≤d≤1.2 mm.

[0051] When d is set within the range of 0.7 mm ≤ d ≤ 1.2 mm, the first liner 11 and the second liner 12 have a sufficient distance from each other to avoid direct electrical connection between the first liner 11 and the second liner 12, thereby avoiding interference with the power circuit and improving the working stability of the power module 100.

[0052] The power assembly according to the utility model is briefly described below.

[0053] The power assembly according to the present invention is provided with a power module 100 as described in any one of the above embodiments. Since the power assembly according to the present invention is provided with a power module 100 as described in any one of the above embodiments, the power assembly according to the present application has good safety and high reliability.

[0054] The vehicle according to the present utility model is briefly described below.

[0055] The vehicle according to the utility model is provided with a power assembly as described in any one of the above embodiments. Since the vehicle according to the utility model is provided with a power assembly as described in any one of the above embodiments, the vehicle according to the present application has better safety and higher reliability during operation.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0057] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0058] In the description of the present invention, "plurality" means two or more.

[0059] In the description of the present invention, a first feature being “above” or “below” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact but are in contact with each other via another feature therebetween.

[0060] In the description of the present invention, a first feature “above”, “over” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0061] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0062] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power module, characterized in that: include: Motherboard; a first lining plate and a second lining plate, wherein the first lining plate and the second lining plate are respectively arranged on one side of the main plate in the thickness direction, and the first lining plate and the second lining plate are arranged at intervals; The substrate is constructed in multiple pieces and is respectively arranged on the side of the first lining plate and the second lining plate away from the main board. A circuit layer is formed on the side of the substrate away from the first lining plate or the second lining plate in the thickness direction.

2. The power module according to claim 1, characterized in that: The circuit layer comprises: a first circuit layer, wherein the first circuit layer is disposed on the substrate; The second circuit layer is structured into two and respectively arranged on the substrate, and the second circuit layer is symmetrically arranged on both sides of the first circuit layer in the width direction.

3. The power module according to claim 2, characterized in that: The first circuit layer has a symmetry center, the first circuit layer is symmetrical about the symmetry center, and the two second circuit layers are respectively symmetrical about the symmetry center.

4. The power module according to claim 3, characterized in that: A plurality of substrates are respectively disposed on the first liner and the second liner. The plurality of substrates are spaced apart in the length direction. Two adjacent substrates on the first liner or the second liner are connected by bonding wires.

5. The power module according to claim 4, characterized in that: An upper bridge circuit is formed on the first substrate, and a lower bridge circuit is formed on the second substrate. The upper bridge circuit and the lower bridge circuit are electrically connected via bonding wires.

6. The power module according to claim 5, characterized in that: Also includes: A power chip, wherein the power chip is structured in a plurality, and the plurality of power chips are respectively disposed on the first backing plate and the second backing plate and are electrically connected to the first circuit layer and the second circuit layer through the bonding wires.

7. The power module according to claim 6, characterized in that: Also includes: A thermistor is disposed on the first liner and is suitable for detecting a temperature change of the power chip.

8. The power module according to claim 1, characterized in that: The distance between the bottom edge of the first lining plate and the top edge of the second lining plate is d, and satisfies: 0.7mm≤d≤1.2mm.

9. A power assembly, characterized in that A power module comprising any one of claims 1 to 8.

10. A vehicle, characterized in that: Comprising the power assembly as claimed in claim 9.

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