Luminescent device with high light color uniformity

Abstract

The utility model relates to the technical field of LED chips, in particular to a luminescent device with high light color uniformity. The light-emitting device with high light color uniformity specifically comprises a substrate, at least one chip is fixedly arranged on the substrate, the chips are arranged in series or in parallel, a lens is laid above the chips, the chips and the lens form a light-emitting unit, a light conversion layer, a transparent adhesive layer and a diffusion layer sequentially cover the substrate, and the light conversion layer is arranged around the light-emitting unit. The light-emitting device has the advantages that the overall thickness of the light-emitting device is small, no obvious light color difference exists at the area light source, and the light color is uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chips, in particular to a light-emitting device with high light color uniformity. Background Art

[0002] With the development of the automotive industry, more and more car lights use LED as the light source. Traditional car light LED light sources are point light sources. On multiple direct-emitting or side-emitting LED modules, there is a problem of obvious bright spots in the limited space of the side-emitting LED modules. In order to achieve the effect of uniform surface light emission and reduce the LED graininess and glare, it is usually necessary to use an optical lens or a light diffusion plate. Since the optical lens or diffusion plate is thick, although this process improves uniformity, the overall thickness of the product will increase, which is contrary to the existing development of thin and light car lights.

[0003] Therefore, in view of the shortcomings of the prior art, a light emitting device with high light color uniformity is provided. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a light emitting device with high light color uniformity, which solves the problems of thick overall thickness of the light emitting device, color difference of the surface light source, and low light color uniformity.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A light-emitting device with high light color uniformity, characterized in that it includes: a substrate, on which at least one chip is fixed, at least one of the chips is arranged in series or in parallel, a lens is laid above the chip, the chip and the lens constitute a light-emitting unit, and the substrate is covered with a light conversion layer, a transparent adhesive layer and a diffusion layer in sequence, and the light conversion layer is arranged around the light-emitting unit.

[0007] As a further improvement of the technical solution of the utility model, a light conversion layer is provided around the chip, the transparent adhesive layer is laid on the light conversion layer, and the transparent adhesive layer covers the lens.

[0008] As a further improvement of the technical solution of the utility model, the light conversion layer covers the chip and the lens.

[0009] As a further improvement of the technical solution of the utility model, the light conversion layer includes uniformly distributed phosphors, and a number of the chips excite the phosphors in the light conversion layer to form a regionally luminous white light surface light source.

[0010] As a further improvement of the technical solution of the utility model, the phosphor is a powdery material;

[0011] The phosphor includes at least one group selected from Y, Lu, Sc, La, Gd and Sm and at least one group selected from Al, Ga and In.

[0012] As a further improvement of the technical solution of the utility model, a plurality of the chips are arranged in a matrix.

[0013] As a further improvement of the technical solution of the utility model, the pitch value of the chip is 1-4 times the length of the chip.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] In the light-emitting device with high light color uniformity of the utility model, by arranging chips in series or in parallel on the substrate, and laying lenses on the chips to form light-emitting units, it is beneficial to reduce the overall thickness of the light-emitting device and realize the light-weight and thinning of the car lights. The light conversion layer, transparent adhesive layer and diffusion layer are sequentially covered on the substrate, and the light conversion layer covers all or part of the light-emitting unit. Under the joint action of the lens, light conversion layer, transparent adhesive layer and diffusion layer, a light-emitting effect with high light color uniformity is achieved. When testing the light color uniformity, the average brightness difference of any two points on the surface light source does not exceed 20%. The light-emitting device with high light color uniformity has the characteristics of thin overall thickness of the light-emitting device, no obvious light color difference at the surface light source, and uniform light color. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technology of the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0017] Figure 1 This is a schematic diagram of the structure of Example 1 of the light-emitting device with high light color uniformity of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of Example 1 of the light-emitting device with high light color uniformity of the utility model;

[0019] Figure 3 This is a schematic diagram of the position of the chip arranged on the substrate in the light-emitting device with high light color uniformity of the utility model;

[0020] Figure 4 This is a relative brightness comparison diagram of the surface light source in the light-emitting device with high light color uniformity of the utility model and the ordinary surface light source;

[0021] Figure 5 This is a schematic diagram of the light emission of a surface light source in a light emitting device with high light color uniformity of the utility model;

[0022] Figure 6 It is a schematic diagram of the light emission of a surface light source in a common light-emitting device.

[0023] In the figure:

[0024] 1. Substrate; 2. Chip; 3. Light conversion layer; 4. Transparent adhesive layer; 5. Diffusion layer; 6. Lens. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the utility model, so as to fully understand the purpose, scheme and effect of the utility model. It should be noted that the embodiments and features in the embodiments in this application can be combined with each other without conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0026] Reference Figures 1 to 6 , a light emitting device with high light color uniformity, comprising a substrate 1, a chip 2, a lens 6, a light conversion layer 3, a transparent adhesive layer 4 and a diffusion layer 5;

[0027] In one embodiment, at least one chip 2 is fixed on the substrate 1, and at least one chip 2 is arranged in series or in parallel. A lens 6 is laid on the chip 2, and the chip 2 and the lens 6 constitute a light-emitting unit. The substrate 1 is sequentially covered with a light conversion layer 3, a transparent adhesive layer 4 and a diffusion layer 5, and the light conversion layer 3 is arranged around the light-emitting unit. The lens 6 is located above the chip 2, and the lens 6 has a different refractive index from the surrounding light conversion layer 3 or transparent adhesive layer 4, which has the effect of diffusing the divergence angle of the light of the chip 2.

[0028] Among them, by arranging the chip 2 in series or in parallel on the substrate 1, laying the lens 6 on the chip 2 to form a light-emitting unit, it is beneficial to reduce the overall thickness of the light-emitting device and realize the light-weight and thinning of the car lamp. The light conversion layer 3, the transparent adhesive layer 4 and the diffusion layer 5 are sequentially covered on the substrate 1. The light conversion layer 3 covers the light-emitting unit in whole or in part. Under the joint action of the lens 6, the light conversion layer 3, the transparent adhesive layer 4 and the diffusion layer 5, a light-emitting effect with high light color uniformity is achieved. When testing the light color uniformity, any two points on the surface light source are taken, and the average brightness difference does not exceed 20%. The light-emitting device with high light color uniformity has the characteristics of thin overall thickness of the light-emitting device, no obvious light color difference at the surface light source, and uniform light color.

[0029] In one embodiment, the light conversion layer 3 includes uniformly distributed phosphors, and a plurality of chips 2 excite the phosphors in the light conversion layer 3 to form a white light surface light source that emits regional light. The light conversion layer 3 is composed of a light-transmitting resin or silica gel, and the phosphor is a luminous powder material; the phosphor includes at least one group of Y, Lu, Sc, La, Gd and Sm and at least one group of Al, Ga, and In. The concentration of the phosphor in the light conversion layer 3 in the light-transmitting resin or silica gel gradually increases from the light conversion layer 3 to the substrate 1, and the overall thickness of the light conversion layer 3 ranges from 1 mm to 5 mm.

[0030] In one embodiment, the diffusion layer 5 is composed of a light-transmitting resin or silica gel, and diffusion particles are arranged in the diffusion layer 5, including but not limited to silicon dioxide and titanium dioxide. The diffusion particles are used to further scatter the light; the concentration of the diffusion particles is uniformly or stepped. The light emitted by the chip 2 is reflected and scattered in the diffusion layer 5, which has the effect of improving the uniformity of the light color. The overall thickness of the diffusion layer 5 ranges from 0.05 mm to 1 mm.

[0031] In one embodiment, referring to Figure 3 As shown, chip 2 can be a face-up, flip-down, or vertical gallium nitride blue light chip 2. There are N rows and M columns between multiple blue light chips 2, forming an M*N matrix arrangement. Several chips 2 are arranged in a matrix. The pitch value of chip 2 is 1-4 times the length of chip 2. Similarly, chip 2 pitch refers to the distance between different components in chip 2, such as the distance between different transistors in chip 2, the distance between different capacitors, etc. The smaller the distance between these components, the higher the integration of chip 2 and the better the performance. Therefore, the minimum tolerance range of chip 2 pitch is one of the important indicators for measuring the quality and performance of chip 2.

[0032] In one embodiment, the overall thickness of the light emitting device does not exceed 5 mm.

[0033] In Example 1, referring to Figure 1 As shown, a light conversion layer 3 is disposed around the chip 2 , a transparent adhesive layer 4 is laid on the light conversion layer 3 , and the transparent adhesive layer 4 covers the lens 6 .

[0034] The packaging of the light emitting device in Embodiment 1 includes the following steps:

[0035] A1. Fix the chip matrix on the substrate;

[0036] A2. Apply glue on the chip to form a lens;

[0037] A3. Dispense glue on the substrate to form a light conversion layer, the height of which is no higher than the height of the chip;

[0038] A4. Dispense glue on the light conversion layer to form a transparent glue layer;

[0039] A5. Apply glue on the transparent glue layer to form a diffusion layer.

[0040] In Example 2, referring to Figure 2 As shown, the light conversion layer covers the chip and the lens.

[0041] The packaging of the light emitting device in Embodiment 2 includes the following steps:

[0042] B1. Fix the chip matrix on the substrate;

[0043] B2. Apply glue on the chip to form a lens;

[0044] B3. Dispense glue on the substrate to form a light conversion layer, wherein the height of the light conversion layer is not higher than the height of the lens;

[0045] B4. Dispense glue on the light conversion layer to form a transparent glue layer;

[0046] B5. Apply glue on the transparent glue layer to form a diffusion layer.

[0047] A test method for a light emitting device with high light color uniformity, referring to Figure 6 As shown, the light emitting device suitable for the above-mentioned high light color uniformity includes the following steps:

[0048] S1: Use an imaging colorimeter to select circular measurement points on the surface light source of the light-emitting device. The size of the circular measurement points is equal to the size of the long side of the chip. The circular measurement points are arranged in a matrix according to the chip position.

[0049] S2: Measure the brightness of the surface area above the chip and the brightness of the surface area between the chips respectively, collect the statistical results and make a relative brightness diagram of the surface light source;

[0050] S3: Take the average brightness in the relative brightness map of the surface light source and calculate the relative brightness of different points on the entire surface light source.

[0051] In one embodiment, step S2, referring to Figure 4-Figure 5 As shown, the surface brightness above the chip does not have a peak value that exceeds 20% of the average brightness of the entire LED, and the surface brightness above the chip spacing does not have a valley value that exceeds 20% of the average brightness of the entire LED.

[0052] In one embodiment, in step S3, the difference between the maximum value and the minimum value of the relative brightness of the circular measurement points is less than 20%, and the relative brightness difference between any two points does not exceed 20%.

[0053] In one embodiment, referring to Figure 4 As shown in the relative brightness diagram of the surface light source, the relative brightness is the surface brightness and color temperature, the ordinate is the relative brightness, the solid triangle curve is the surface light source of the utility model, and the solid square is the ordinary surface light source.

[0054]

[0055] For other contents of the light-emitting device with high light color uniformity described in the present invention, please refer to the prior art and will not be described in detail here.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0058] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0060] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0061] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A light emitting device with high light color uniformity, characterized in that: include: A substrate, wherein at least one chip is fixedly mounted on the substrate, wherein at least one of the chips is arranged in series or in parallel, wherein a lens is laid on the chip, wherein the chip and the lens constitute a light-emitting unit, wherein a light-conversion layer, a transparent adhesive layer and a diffusion layer are sequentially covered on the substrate, wherein the light-conversion layer is arranged around the light-emitting unit; A light conversion layer is arranged around the chip, the transparent adhesive layer is laid on the light conversion layer, and the transparent adhesive layer covers the lens; or, The light conversion layer covers the chip and the lens.

2. A light emitting device with high light color uniformity according to claim 1, characterized in that: The light conversion layer includes uniformly distributed phosphors, and a plurality of the chips excite the phosphors in the light conversion layer to form a white light surface light source that emits regional light.

3. A light emitting device with high light color uniformity according to claim 2, characterized in that: The phosphor is a powdery material.

4. The light emitting device with high light color uniformity according to claim 1, characterized in that: The chips are arranged in a matrix.

5. The light emitting device with high light color uniformity according to claim 1, characterized in that: The pitch value of the chip is 1-4 times the length of the chip.

Images