Square silicon rod cutting and grinding all-in-one machine

Abstract

The utility model discloses a square silicon rod cutting and grinding all-in-one machine which comprises a machine base provided with a cutting area and a grinding area. The cutting device is used for vertically cutting the original square silicon rod horizontally placed at the cutting position so as to form a first square silicon rod and a second square silicon rod which are arranged in parallel along a second direction; the grinding device is used for carrying out surface grinding operation and / or chamfering operation related to cutting surfaces on the first square silicon rod and the second square silicon rod which are horizontally placed in the grinding area; and the silicon rod transferring device is used for transferring the first square silicon rod and the second square silicon rod located at the cutting area to the grinding area. By means of the square silicon rod cutting and grinding all-in-one machine, the integrated operation of multiple working procedures of half-and-half cutting and grinding of an original square silicon rod can be completed, and the production efficiency and the quality of product machining operation are improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to a square silicon rod cutting and grinding machine. Background Art

[0002] At present, with the society's emphasis on and openness to the use of green renewable energy, the photovoltaic solar power generation field has been increasingly valued and developed. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut from pulled or cast silicon ingots by multi-wire saws and subsequently processed.

[0003] The existing silicon wafer production process, taking single crystal silicon products as an example, generally, the approximate operating procedures may include: first, use a silicon rod cutting machine to cut a long silicon rod with a circular cross-section (the silicon rod is cylindrical as a whole) to form multiple short silicon rods; after the cutting is completed, use a silicon rod squarer to square the cut short silicon rods to form square silicon rods with a rectangular cross-section; then, grind, round / chamfer and other grinding operations are performed on the square silicon rods after square cutting, so that the surface shaping of the silicon rod meets the corresponding flatness and dimensional tolerance requirements; and then slice the square silicon rods to obtain silicon wafers.

[0004] The silicon wafers obtained by slicing can be used to make photovoltaic modules, which can convert light energy into electrical energy. With the development of solar cell technology, the demand for small silicon wafers is increasing, and the demand for thin wafers is also relatively large. The thickness of silicon wafers has been reduced from 180 microns to 150 microns, and the mass production process of 120 micron and 110 micron silicon wafers has been finalized. Even silicon wafers with a thickness of 100 microns and below are expected. However, the thinner the silicon wafer, the more difficult it is to cut, and the more difficult it is to ensure the cutting quality. For example, when slicing on a large square silicon rod, the cross-section of the silicon wafer is more prone to damage and defects. Summary of the invention

[0005] In view of the various deficiencies of the above-mentioned related technologies, the purpose of the present application is to disclose a square silicon rod cutting and grinding machine to solve the problems existing in the existing related technologies such as complex equipment, inconvenient operation, poor cutting quality and low efficiency.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application discloses a square silicon rod cutting and grinding machine, comprising: a machine base, having a silicon rod processing platform; the silicon rod processing platform is provided with a cutting position and a grinding position; a cutting device, arranged at the cutting position of the silicon rod processing platform, for vertically cutting the original square silicon rod horizontally placed at the cutting position to form a first square silicon rod and a second square silicon rod arranged in parallel along a second direction; the original square silicon rod is a silicon rod with a rectangular cross-section, and the axis of the original square silicon rod is consistent with the first direction; the second direction is perpendicular to the first direction and forms a horizontal plane with the first direction; a grinding device, arranged at the grinding position of the silicon rod processing platform, for performing grinding operations and / or chamfering operations related to the cutting surface on the first square silicon rod and the second square silicon rod horizontally placed at the grinding position; a silicon rod transfer device, for transferring the first square silicon rod and the second square silicon rod located at the cutting position to the grinding position.

[0007] The square silicon rod cutting and grinding machine disclosed in the present application comprises a machine base, a cutting device, a silicon rod transfer device and a grinding device, wherein the cutting device and the grinding device are separated on the left and the right. The cutting device can be used to vertically cut the horizontally placed original square silicon rod to form a first square silicon rod and a second square silicon rod parallel to the left and the right. The grinding device can be used to grind the first square silicon rod and the second square silicon rod formed after the vertical cutting, thereby completing the integrated operation of cutting the original square silicon rod in half and grinding multiple processes, thereby improving the production efficiency and the quality of product processing operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The specific features of the invention involved in this application are shown in the attached claims. The features and advantages of the invention involved in this application can be better understood by referring to the exemplary embodiments and drawings described in detail below. The drawings are briefly described as follows:

[0009] Figure 1 Shown is a schematic diagram of the state of the silicon rod cutting and grinding machine of the present application at a first viewing angle in one embodiment.

[0010] Figure 2 It is a schematic diagram showing the state of the silicon rod cutting and grinding machine of the present application at a second viewing angle in one embodiment.

[0011] Figure 3 It is a schematic diagram showing the state of the silicon rod cutting and grinding machine of the present application at a third viewing angle in one embodiment.

[0012] Figure 4 Shown is a schematic structural diagram of a silicon rod supporting and clamping device in one embodiment of the present application.

[0013] Figure 5 Shown is a schematic structural diagram of a cutting device in one embodiment of the present application.

[0014] Figure 6 Shown is a schematic structural diagram of a silicon rod transporting device in one embodiment of the present application.

[0015] Figure 7 It is a schematic diagram showing the state of the original square silicon rod being clamped by the silicon rod supporting and clamping device in the present application.

[0016] Figure 8 It is a schematic diagram showing the state of a cutting device in one embodiment of the present application cutting a raw silicon rod.

[0017] Fig. 9 It is a schematic diagram showing the state of a silicon rod transfer device in one embodiment of the present application transferring a square silicon rod to a grinding area.

[0018] Fig.10 It is a schematic diagram showing the state of grinding a square silicon rod in a grinding area in one embodiment of the present application.

[0019] Fig.11 It is a schematic diagram showing a state of chamfering a square silicon rod located in a grinding area in one embodiment of the present application. DETAILED DESCRIPTION

[0020] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0021] In the following description, with reference to the accompanying drawings, several embodiments of the present application are described. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only to describe specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0022] Although the terms first, second, etc. are used in some instances to describe various elements or parameters in this article, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter. For example, a first square silicon rod can be referred to as a second square silicon rod, and similarly, a second square silicon rod can be referred to as a first square silicon rod, and a first direction can be referred to as a second direction, and similarly, a second direction can be referred to as a first direction, without departing from the scope of the various described embodiments.

[0023] In order to improve the conversion efficiency of photovoltaic modules, shingled modules came into being. A shingled module refers to a plurality of cells connected in series in the form of front-to-back stacking. There is no gap between the cells, and no welding strips to block the cells. Therefore, more cells can be accommodated under the same area of ​​the module, expanding the effective power generation area. In the current related technology, in order to obtain silicon wafers for making shingled modules, it is necessary to first make silicon rods that can be sliced ​​into silicon wafers, and the silicon rods are usually made by re-cutting and grinding the square silicon rods made in the original process.

[0024] The relevant processing technology for silicon rods involves several processes such as square cutting, grinding, rounding / chamfering, etc.

[0025] Generally, most of the existing silicon rods are cylindrical structures. The silicon rods are squared and cut by silicon rod squaring equipment, so that the cross-section of the silicon rod after squaring is rectangular (including square), and the squared silicon rod is rectangular (also cube-like) as a whole. The rectangular includes a rectangle with adjacent sides orthogonal or an angle range within a predetermined angle, a rectangle with rounded corners between adjacent sides, a rectangle with connecting short sides between adjacent sides, etc.

[0026] Taking a single crystal silicon rod as an example, in some related technologies, the process of forming a single crystal silicon rod may include: first using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section. Among them, the specific implementation method of using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods can refer to patent disclosures such as CN105856445A and CN105946127A, and the specific implementation method of using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section can refer to patent disclosures such as CN105818285A. However, the process for forming a single crystal silicon rod is not limited to the aforementioned technology. In an optional example, the process for forming a single crystal silicon rod may also include: first using a full silicon rod squaring machine to square the original long silicon rod to form a long single crystal silicon rod with a rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to cut the squared long single crystal silicon rod to form a short silicon rod.

[0027] After the cylindrical single crystal silicon rod is cut into a silicon rod with a rectangular cross section by using a squaring device, the rectangular silicon rod can be ground, rounded, chamfered, etc. by using a grinding device. The specific implementation of the grinding, rounding, chamfering, etc. of the rectangular silicon rod by the grinding device can refer to patent disclosures such as CN105835247A.

[0028] With the development of battery technology, the demand for small silicon wafers is increasing, and the demand for thin wafers is also relatively large. The thinner the silicon wafer, the more difficult it is to cut, and the more difficult it is to ensure the cutting quality. For example, in the current technology, slicing operations are performed on large square silicon rods. If the thickness of the silicon wafer to be cut is thinner, it will undoubtedly increase the difficulty of slicing the silicon wafer. During the slicing process, the cross-section of the silicon wafer is more prone to damage and defects. In addition, for the slicing operation of large square silicon rods, in order to minimize the damage and defects of the silicon wafer, the slicing speed must be controlled, which reduces the slicing efficiency. Therefore, the industry has also proposed certain improvements to the current technology. For example, the existing large square silicon rods are first cut, for example, the large square silicon rods are cut in half to form two smaller square silicon rods, and then the smaller square silicon rods are subjected to subsequent processing such as grinding and slicing.

[0029] However, there is no good dedicated equipment for cutting and grinding original silicon rods in the prior art. In the existing equipment technology, the operations required for each process (such as cutting in half, grinding, etc.) are arranged independently, and the corresponding processing equipment is scattered in different production units or different production areas of production workshops. The conversion of workpieces for different process operations requires transportation and allocation, and pretreatment may be required before executing each process operation. In this way, the process is complicated and inefficient, and it is easy to affect the quality of silicon rod processing operations, requiring more manpower or transfer equipment, and there are great safety hazards. In addition, there are many flow links between the operating equipment of each process, which increases the risk of workpiece damage during the workpiece transfer process, and is prone to non-production factors. Unqualified products reduce the product qualification rate and the unreasonable losses caused by the existing processing methods.

[0030] In view of the various deficiencies of the prior art, the applicant has previously proposed a square silicon rod cutting and grinding machine, which is equipped with a cutting device and a grinding device. The cutting device can be used to cross-cut the horizontally placed original square silicon rod to form two smaller square silicon rods on the upper and lower sides. The grinding device can be used to grind the two square silicon rods formed after cross-cutting, thereby completing the integrated operation of cutting the original square silicon rod in half and grinding multiple processes, thereby improving production efficiency and product processing quality. The specific implementation method of the above-mentioned grinding equipment for cross-cutting and grinding large square silicon rods can be referred to patent disclosures such as CN115946248A and CN115871115A. However, in the above technical solution, a cutting device is used to perform a cross-cutting operation on the original square silicon rod to form two upper and lower square silicon rods. During the cross-cutting process, the positioning requirements for the upper square silicon rod are relatively high. If the upper half of the original square silicon rod is not positioned, then during the cross-cutting, especially when the cutting line is about to complete the cutting line, the upper silicon rod formed in the upper half will move relative to the lower silicon rod under the pull of the cutting line, which is prone to edge collapse. If the upper half of the original square silicon rod is positioned, the positioning mechanism or clamping mechanism for positioning may also cause certain interference to the cutting wire saw. In addition, during cutting, the cutting seam formed by the cutting wire saw when cutting the silicon rod will be sprayed with cutting liquid. During the cross-cutting operation, due to the self-weight of the square silicon rod above the cutting seam and other factors, the upper square silicon rod will squeeze the cutting seam, and the cutting seam will be very small. In addition, the cutting surface is a horizontal plane, and the cutting liquid cannot fully penetrate into the cutting seam, affecting the cutting effect and the cooling of the cutting wire saw. After the cutting is completed, the original cutting seam will be basically closed after the cutting wire saw completely passes through the square silicon rod (the two square silicon rods are attached together, especially under the self-weight of the upper silicon rod), which will cause great interference and inconvenience to the wire saw. In addition, the grinding wheel in the grinding device is used to grind the two square silicon rods in sequence after cutting, and the grinding efficiency is not high.

[0031] In view of this, the present application proposes a square silicon rod cutting and grinding machine, which includes a machine base, a cutting device, a silicon rod transfer device and a grinding device. The cutting device can be used to vertically cut the horizontally placed original square silicon rod to form a first square silicon rod and a second square silicon rod arranged in parallel on the left and right. The grinding device can be used to grind the first square silicon rod and the second square silicon rod formed after cross-cutting, thereby completing the integrated operation of half-cutting and grinding multiple processes of the original square silicon rod. The overall structure of the equipment is simple, which improves production efficiency and saves costs, and improves the quality of product processing operations.

[0032] In the embodiments provided in the present application, in order to clarify the definition of direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined. The first direction, the second direction, and the third direction are all straight directions and are perpendicular to each other. The first direction and the second direction can form a horizontal plane, and the third direction is an upright direction perpendicular to the horizontal plane, which can also be called a vertical direction, a weight line direction, an up and down direction, or a lifting direction.

[0033] In any embodiment provided in the present application, the original square silicon rod refers to a silicon rod with a rectangular cross section formed by cutting and squaring a silicon rod with a circular cross section (the silicon rod is cylindrical as a whole) and grinding it, and the rectangular cross section includes a rectangle with four right angles, a rectangle with folded edges or rounded corners, etc. The ends of the silicon rod refer to the two opposite ends along the length direction of the silicon rod axis, the end faces of the ends refer to the two opposite faces along the length direction of the silicon rod, and the side faces of the silicon rod refer to the other four faces of the silicon rod except the two end faces. For example, for the original square silicon rod, the end face of the original square silicon rod is rectangular, and the side faces of the original square silicon rod are rectangular.

[0034] In an embodiment, the silicon rod may be, for example, a single crystal silicon rod, which is a rod-shaped single crystal silicon grown from a melt by a direct pulling method or a floating zone melting method, such as a single crystal silicon rod with a length of approximately 5000 mm (for example, a specification of 5360 mm, etc.) or a single crystal silicon rod with a length of approximately 800 mm, etc., which is common in silicon rod processing. Polycrystalline silicon is a silicon rod in which silicon is precipitated on the surface of a silicon core wire by a precipitation technique such as chemical vapor deposition technology, but is not limited to this. In other possible embodiments of the present application, the square silicon rod cutting and grinding machine can also be used to cut single crystal silicon rods, or other long hard materials that need to be cut.

[0035] See also Figures 1 to 3 ,in, Figure 1 The schematic diagram of the state of the silicon rod cutting and grinding machine of the present application in a first viewing angle in one embodiment is shown; Figure 2 The figure shows a schematic diagram of the state of the silicon rod cutting and grinding machine of the present application at a second viewing angle in one embodiment; Figure 3 The figure shows the state of the silicon rod cutting and grinding machine of the present application at the third viewing angle in one embodiment. Figures 1 to 3 As shown, the silicon rod cutting and grinding machine of the present application comprises: a machine base 11, a cutting device 13, a grinding device 15, and a silicon rod transporting device 17.

[0036] The silicon rod cutting and grinding machine of the present application is described in detail below.

[0037] The machine base 11 is the main component of the square silicon rod cutting and grinding machine, and is used to provide a silicon rod processing platform. In practical applications, the machine base 11 is large in size and weight to provide a large mounting surface and a firm stability of the whole machine. It should be understood that the machine base 11 can be used as the base for different structures or components that perform processing operations in the square silicon rod cutting and grinding machine, and the specific structure of the machine base 11 can be changed based on different functional requirements or structural requirements. In some examples, the machine base 11 includes a fixed structure or a limiting structure such as a base, a column, a frame, etc. for receiving different components in the square silicon rod cutting and grinding machine, which are all the machine bases 11 described in this application. It should be understood that in some examples, the machine base 11 can be an integrated base, and in some examples, the machine base 11 can include multiple independent bases.

[0038] The machine base 11 has a silicon rod processing platform, and the silicon rod processing platform can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. For example, in some embodiments, the silicon rod processing platform includes a cutting area and a grinding area. In some embodiments, the silicon rod processing platform includes a loading area, a cutting area, a grinding area, and an unloading area. In some embodiments, the silicon rod processing platform includes a loading and unloading area, a cutting area, and a grinding area. It should be noted that in each example provided in the present application, the functional area is defined by the travel path and range of the processing device at the functional area. For example, the cutting device of the square silicon rod cutting and grinding machine is located at the cutting area, and the range of the cutting area is the range occupied by the cutting device in the process of completing the square cutting operation; similarly, the grinding device of the square silicon rod cutting and grinding machine is located at the grinding area, and the range of the grinding area is the range occupied by the grinding device in the process of completing the grinding operation. The shape of the silicon rod processing platform can be determined according to the machine base, or it can be determined jointly according to the processing needs of the machine base and the cutting device and the grinding device.

[0039] exist Figures 1 to 3 In the embodiment shown, the machine base 11 is provided with a silicon rod processing platform, and the silicon rod processing platform is provided with functional areas such as a loading area, a cutting area, a grinding area, and an unloading area. A cutting device is provided in the cutting area for vertically cutting the original square silicon rod located at the cutting area to form a first square silicon rod and a second square silicon rod arranged in parallel on the left and right. A grinding device is provided in the grinding area for grinding the silicon rod located at the grinding area.

[0040] exist Figure 1 and Figure 2In the illustrated embodiment, each functional area is arranged in parallel along the second direction, wherein, in the following description, the first direction refers to the length direction of the square silicon rod cutting and grinding machine, and the second direction is perpendicular to the first direction and refers to the width direction of the square silicon rod cutting and grinding machine. For example, when the square silicon rod cutting and grinding machine includes a cutting area and a grinding area, the cutting area and the grinding area are arranged in parallel along the second direction. When the square silicon rod cutting and grinding machine includes a loading area, a cutting area, a grinding area, and an unloading area, the loading area, the cutting area, the grinding area, and the unloading area are arranged in parallel along the second direction.

[0041] The cutting device 13 is disposed at the cutting area of ​​the silicon rod processing platform, and is used for vertically cutting the original square silicon rods placed horizontally at the cutting area to form first square silicon rods and second square silicon rods arranged in parallel along the second direction.

[0042] In the square silicon rod cutting and grinding machine of the present application, the workpiece to be processed is a square silicon rod (herein, in the following description, the square silicon rod to be processed is referred to as the original square silicon rod to distinguish it from the square silicon rod that has been subsequently cut and ground). The original square silicon rod has been formed by relevant squaring cutting and grinding operations, that is, the original square silicon rod (cylindrical as a whole) is a silicon rod with a rectangular cross-section, and the rectangular cross-section includes a rectangle with four right angles, a rectangle with folded edges or rounded corners, etc.

[0043] In the relevant processing technology for silicon rods, several processes such as squaring, grinding, rounding / chamfering are involved. Generally, most of the existing silicon rods are cylindrical structures. The silicon rods are squaring by silicon rod squaring equipment, so that the cross-section of the silicon rods after squaring is rectangular (including square), and the squared silicon rods are rectangular as a whole (may also include cube-like shapes). The quasi-rectangles include rectangles with orthogonal adjacent sides or angles within a predetermined angle, rectangles with rounded corners between adjacent sides, rectangles with connecting short sides between adjacent sides, etc.

[0044] Taking a single crystal silicon rod as an example, in some related technologies, the process of forming a single crystal silicon rod may include: first using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section. Among them, the specific implementation method of using a silicon rod cutter to cut the original long silicon rod to form multiple short silicon rods can refer to patent disclosures such as CN105856445A and CN105946127A, and the specific implementation method of using a silicon rod squarer to square the short silicon rod to form a single crystal silicon rod with a rectangular cross section can refer to patent disclosures such as CN105818285A. However, the process for forming a single crystal silicon rod is not limited to the aforementioned technology. In an optional example, the process for forming a single crystal silicon rod may also include: first using a full silicon rod squaring machine to square the original long silicon rod to form a long single crystal silicon rod with a rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to cut the squared long single crystal silicon rod to form a short silicon rod.

[0045] After the cylindrical single crystal silicon rod is cut into a silicon rod with a rectangular cross section by using a squaring device, the rectangular silicon rod can be ground, rounded, chamfered, etc. by using a grinding device. The specific implementation of the grinding, rounding, chamfering, etc. of the rectangular silicon rod by the grinding device can refer to patent disclosures such as CN105835247A.

[0046] In addition, the above-mentioned squaring and grinding operations of the silicon rods can also be completed in the same silicon rod processing equipment, and the silicon rod processing equipment can be, for example, a silicon rod cutting and grinding machine, and the silicon rod cutting machine can perform squaring and grinding operations on silicon rods with circular cross-sections at the same time, and finally form the original square silicon rods described in this application. For the specific implementation method of the silicon rod cutting and grinding machine performing squaring and grinding operations on silicon rods with circular cross-sections to form original square silicon rods with rectangular cross-sections, reference can be made to patent disclosures such as CN112297264A and CN112297263A.

[0047] Therefore, the original square silicon rod mentioned in this application has the following characteristics: the cross-section of the original square silicon rod is rectangular, the four side surfaces of the original square silicon rod have been polished, and the edge structures of the four side surfaces of the original square silicon rod (for example, corners, edge connecting surfaces, etc.) have been chamfered / rounded.

[0048] like Figure 1 As shown, in the present application, the original square silicon rod is placed horizontally at the cutting area of ​​the silicon rod processing platform, and when placed, the original square silicon rod is placed along the length of the square silicon rod cutting and grinding machine, that is, the axis of the original square silicon rod is consistent with the first direction.

[0049] In order to place the original square silicon rod stably in the cutting area, the square silicon rod cutting and grinding machine includes a silicon rod supporting and clamping device. Figures 1 to 3 In the illustrated embodiment, the silicon rod cutting and grinding machine of the present application includes a silicon rod supporting and clamping device 12, which is arranged at the cutting area of ​​the silicon rod processing platform and is used to support and clamp the original silicon rod 100 placed horizontally at the cutting area.

[0050] The silicon rod supporting and clamping device is intended to support and clamp the original silicon rod. In some embodiments, the silicon rod supporting and clamping device includes: a first silicon rod supporting and clamping member, a second silicon rod supporting and clamping member, and a supporting and clamping member driving mechanism. Figure 4 , Figure 4 The figure shows a schematic diagram of the structure of a silicon rod supporting and clamping device in one embodiment of the present application. Figures 1 to 4 In the illustrated embodiment, the silicon rod supporting and clamping device 12 comprises: a first silicon rod supporting and clamping member 121 , a second silicon rod supporting and clamping member 122 , and a supporting and clamping member driving mechanism 123 .

[0051] The first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 are arranged opposite to each other along the second direction, and a silicon rod receiving space is defined between the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 .

[0052] In some embodiments, the first silicon rod support member and the second silicon rod support member are symmetrically arranged, and the first silicon rod support member or the second silicon rod support member includes a base and side wings extending upward from the base, and the base and the side wings cooperate with each other to form a bearing and clamping structure, and the bearing and clamping structure has a bearing surface and a clamping surface. The first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 are arranged opposite to each other along the second direction, and the first bearing clamp structure in the first silicon rod supporting clamp 121 and the second bearing clamp structure in the second silicon rod supporting clamp 122 cooperate with each other to form a silicon rod storage space, wherein the bearing surface in the first bearing clamp structure of the first silicon rod supporting clamp 121 and the bearing surface in the second bearing clamp structure of the second silicon rod supporting clamp 122 are used to support the bottom surface of the original silicon rod together, and the clamping surface in the first bearing clamp structure of the first silicon rod supporting clamp 121 and the clamping surface in the second bearing clamp structure of the second silicon rod supporting clamp 122 are used to clamp the left and right sides of the original silicon rod respectively. In some embodiments, corresponding pads or protective strips can be added to the bearing surface and the clamping surface to protect the bottom and side of the original silicon rod to be supported and clamped from being damaged by collision.

[0053] The supporting clamp driving mechanism 123 is used to drive the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 to move toward or away from each other along the second direction. For example, the supporting clamp driving mechanism 123 is used to drive the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 to move away from each other along the second direction, thereby expanding the silicon rod storage space between the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122. The supporting clamp driving mechanism 123 is used to drive the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 to move toward each other along the second direction, thereby reducing the silicon rod storage space between the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122.

[0054] In certain embodiments, such as Figure 4 As shown, the supporting clamp driving mechanism 123 may include a clamping guide rail 1231 and a clamping driving unit 1232, wherein the clamping guide rail 1231 is arranged on the machine base along the second direction, and is used to set the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122, and the clamping driving unit 1232 is used to drive the first silicon rod supporting clamp 121 and the second silicon rod supporting clamp 122 to move along the clamping guide rail 1231.

[0055] In some embodiments, the clamping drive unit 1232 includes: a bidirectional screw and a driving source, wherein the bidirectional screw is arranged along the second direction, and the bidirectional screw is a left-handed screw, which has two sections of threads on the rod body, and the rotation directions of the two sections of threads are opposite, that is, one section of the thread is a left-handed thread, and the other section of the thread is a right-handed thread, wherein one section of the thread can be associated with the first silicon rod supporting clamp and the other section of the thread can be associated with the second silicon rod supporting clamp (for example, the left-handed thread is associated with the first silicon rod supporting clamp and the right-handed thread is associated with the second silicon rod supporting clamp; or, the right-handed thread is associated with the first silicon rod supporting clamp and the left-handed thread is associated with the second silicon rod supporting clamp), and the driving source is associated with the bidirectional screw, and is used to drive the bidirectional screw to rotate so that the associated first silicon rod supporting clamp and the second silicon rod supporting clamp move toward or away from each other along the clamping guide rail arranged in the second direction. In practical applications, for example, by using a driving source to drive the bidirectional screw to rotate forward (or drive the bidirectional screw to rotate reversely), the associated first silicon rod supporting clamp and the second silicon rod supporting clamp are driven to move toward each other (i.e., approach each other) along the clamping guide rail set in the second direction, thereby reducing the silicon rod storage space between the two. Alternatively, by using the driving source to drive the bidirectional screw to rotate reversely (or drive the bidirectional screw to rotate forward), the associated first silicon rod supporting clamp and the second silicon rod supporting clamp are driven to move away from each other (i.e., move away from each other) along the clamping guide rail set in the second direction, thereby increasing the silicon rod storage space between the two. The driving source may be, for example, a servo motor, located in the middle section or a terminal of the bidirectional screw.

[0056] Of course, the clamping drive unit can still adopt other structures. For example, the clamping drive unit includes a pair of moving screws and driving sources, that is, a first moving screw and a first driving source, a second moving screw and a second driving source, the first moving screw is associated with the first silicon rod supporting clamp, the first driving source is associated with the first moving screw, the second moving screw is associated with the second silicon rod supporting clamp, and the second driving source is associated with the second moving screw. In practical applications, the first driving source is used to drive the first moving screw to rotate forward and reverse to drive the associated first silicon rod supporting clamp to approach or move away from the second silicon rod supporting clamp along the clamping guide rail set in the second direction, and the second driving source is used to drive the second moving screw to rotate forward and reverse to drive the associated second silicon rod supporting clamp to approach or move away from the first silicon rod supporting clamp along the clamping guide rail set in the second direction, thereby reducing or increasing the silicon rod storage space between the first silicon rod supporting clamp and the second silicon rod supporting clamp.

[0057] In certain embodiments, the clamping drive unit may include: a pair of racks, a driving gear, and a driving source, wherein the pair of racks are parallel to each other and are both arranged along the second direction, one of the pair of racks is associated with the first silicon rod supporting clamp, and the other rack of the pair of racks is associated with the second silicon rod supporting clamp, and the driving gear is located between the pair of racks to engage with the pair of racks and is controlled by the driving source, so that the driving source drives the driving gear to rotate, driving the pair of racks and their associated first silicon rod supporting clamp and second silicon rod supporting clamp to move toward or away from each other along the clamping guide rail arranged in the second direction. For example, the driving source drives the driving gear to rotate forward (or drives the driving gear to rotate backward), and then drives the first silicon rod supporting clamp and the second silicon rod supporting clamp associated with the pair of racks to move toward each other (i.e., approach each other) along the clamping guide rail set in the second direction, thereby reducing the silicon rod storage space between the two. Alternatively, the driving source drives the driving gear to rotate backward (or drives the driving gear to rotate forward), and then drives the first silicon rod supporting clamp and the second silicon rod supporting clamp associated with the pair of racks to move away from each other (i.e., move away from each other) along the clamping guide rail set in the second direction, thereby increasing the silicon rod storage space between the two. The driving source may be, for example, a servo motor.

[0058] Of course, the clamping drive unit can still adopt other structures, for example, the clamping drive unit includes a pair of racks, drive gears, and drive sources, that is, a first rack, a first drive gear, and a first drive source, a second rack, a second drive gear, and a second drive source, the first rack is arranged along the second direction, the first drive gear is associated with the first silicon rod supporting clamp, the first drive source is associated with the first drive gear, the second rack is arranged along the second direction, the second drive gear is associated with the second silicon rod supporting clamp, and the second drive source is associated with the second drive gear. In practical applications, the first drive source is used to drive the first drive gear to rotate forward and reversely to drive the first rack arranged along the second direction of the associated first silicon rod supporting clamp to approach or move away from the second silicon rod supporting clamp, and the second drive source is used to drive the second drive gear to rotate forward and reversely to drive the second rack arranged along the second direction of the associated second silicon rod supporting clamp to approach or move away from the first silicon rod supporting clamp, thereby reducing or increasing the silicon rod storage space between the first silicon rod supporting clamp and the second silicon rod supporting clamp.

[0059] In the present application, a supporting clamp driving mechanism is used to drive the first silicon rod supporting clamp and the second silicon rod supporting clamp to move toward each other along the second direction, thereby increasing the silicon rod storage space between the first silicon rod supporting clamp and the second silicon rod supporting clamp; the original silicon rod to be cut is placed horizontally in the silicon rod storage space between the first silicon rod supporting clamp and the second silicon rod supporting clamp, and the first silicon rod supporting clamp and the second silicon rod supporting clamp jointly support the original silicon rod; the supporting clamp driving mechanism is used to drive the first silicon rod supporting clamp and the second silicon rod supporting clamp to move toward each other along the second direction, thereby decreasing the silicon rod storage space between the first silicon rod supporting clamp and the second silicon rod supporting clamp until the two sides of the original silicon rod are clamped by the first silicon rod supporting clamp and the second silicon rod supporting clamp. At the same time, the centering of the original silicon rod can be achieved by moving the first silicon rod supporting clamp and the second silicon rod supporting clamp toward each other and clamping, so that the axis of the original silicon rod is consistent with the center line of the cutting area.

[0060] In some embodiments, the silicon rod supporting and clamping device includes: a silicon rod pressing mechanism for pressing the top of the original silicon rod supported by the first silicon rod supporting and clamping member and the second silicon rod supporting and clamping member. Figures 1 to 3 In the illustrated embodiment, the silicon rod pressing mechanism includes a first pressing assembly 124 and a second pressing assembly 125, wherein the first pressing assembly 124 cooperates with the first silicon rod supporting clamp 121, includes a first pressing member and a first pressing driving unit for driving the first pressing member to actuate, and the second pressing assembly 125 cooperates with the second silicon rod supporting clamp 122, includes a second pressing member and a second pressing driving unit for driving the second pressing member to actuate.

[0061] The first pressing component 124 cooperates with the first silicon rod supporting clamp and can move along with the first silicon rod supporting clamp. The first pressing component in the first pressing component 124 moves relative to the first silicon rod supporting clamp in at least one direction under the drive of the first pressing driving unit. Figure 1 As shown, the first pressing member in the first pressing assembly 124 moves up and down in the vertical direction relative to the first silicon rod supporting clamp under the drive of the first pressing driving unit. The second pressing assembly 125 cooperates with the second silicon rod supporting clamp and can move along with the second silicon rod supporting clamp. The second pressing member in the second pressing assembly 125 moves in at least one direction relative to the second silicon rod supporting clamp under the drive of the second pressing driving unit. Figure 1 As shown, the second pressing member in the second pressing assembly 125 is driven by the second pressing driving unit to move up and down in the vertical direction relative to the second silicon rod supporting clamp. In practical applications, when the original silicon rod to be cut is horizontally placed on the first silicon rod supporting clamp and the second silicon rod supporting clamp in the silicon rod supporting clamp, the first pressing driving unit in the first pressing assembly 124 drives the first pressing member to move downward in the vertical direction relative to the first silicon rod supporting clamp to press the top of the horizontally placed original silicon rod, and the second pressing driving unit in the second pressing assembly 125 drives the second pressing member to move downward in the vertical direction relative to the second silicon rod supporting clamp to press the top of the horizontally placed original silicon rod.

[0062] The cutting device is used to vertically cut the original square silicon rods placed horizontally at the cutting position to form first square silicon rods and second square silicon rods arranged in parallel along the second direction.

[0063] The cutting device comprises a cutting frame and a cutting unit, wherein the cutting unit has at least one cutting wire saw. Figure 5 , which is a schematic diagram of the structure of the cutting device of the present application in one embodiment. Figure 1 and Figure 5 In the illustrated embodiment, the cutting device 13 comprises: a cutting frame 131 and a cutting unit, wherein the cutting unit comprises a plurality of cutting wheels 132 and a cutting wire 133, wherein the cutting wire 133 is wound around the plurality of cutting wheels 132 to form at least one cutting wire saw 134. The plurality of cutting wheels 132 are disposed on the cutting frame 131, and the cutting wire 133 is wound around the plurality of cutting wheels 132 to form at least one cutting wire saw. Figure 1 and Figure 5 In the illustrated embodiment, at least one cutting wire saw is located in a third direction (ie, vertical direction).

[0064] like Figure 5In the illustrated embodiment, the cutting unit includes a plurality of cutting wheels 132, for example, four cutting wheels 132, namely, a cutting wheel 132a, a cutting wheel 132b, a cutting wheel 132c, and a cutting wheel 132d. The wheel surfaces of the four cutting wheels 132 are all located in a vertical plane formed by the first direction and the third direction and form a quadrilateral (for example, a rectangle, a trapezoid, etc.) as a whole. The cutting wheels 132a and 132b are in front (relatively closer to the silicon rod supporting and clamping device) and are arranged along the third direction. The cutting wheels 132a, 132b, 132c, and 132d are arranged in parallel in the third direction, and the cutting wheels 132c and 132d are arranged in parallel in the third direction. The cutting wire 133 is wound around the cutting wheels 132a, 132b, 132c, and 132d to form at least one cutting wire saw 134 (for example, the cutting wire saw 134 is formed between the cutting wheels 132a and 132b), and the at least one cutting wire saw 134 is arranged in the third direction. In addition, in order for the at least one cutting wire saw 134 to effectively cut the original silicon rod 100 to be cut, the at least one cutting wire saw 134 must interfere with the original silicon rod 100 to be cut in the third direction.

[0065] In some embodiments, the cutting device includes a wire-retracting and -unloading unit. For example, the wire-retracting and -unloading unit may include a wire-reeling reel and a wire-retracting reel, and the wire-reeling reel and the wire-retracting reel may be arranged on a cutting frame or a machine base.

[0066] In some embodiments, the cutting line is wound between the cutting wheels in an end-to-end manner to form an annular cutting line (also referred to as a closed-loop cutting line). Figure 1 and Figure 5 In the illustrated embodiment, the cutting line 133 is wound around four cutting wheels 132 in an end-to-end manner to form an annular cutting line (also referred to as a closed-loop cutting line).

[0067] The multiple cutting wheels in the cutting unit are wound by a circular cutting wire. Figure 1 and Figure 5 In the embodiment shown, the cutting device can omit the wire storage drum, and the annular cutting wire can be driven by the cutting wire driving device to maintain high-speed operation. At the same time, the annular cutting wire can run in the same direction during the cutting operation (the traditional non-annular cutting wire with a wire storage drum runs alternately in forward and reverse directions). In this way, the cutting device can achieve high-precision cutting operations, avoiding problems such as ripples on the cutting surface caused by the reversal of the cutting wire operation or the running speed in the existing cutting method; at the same time, the annular cutting wire can effectively reduce the total length of the cutting wire required by the cutting device, thereby reducing production costs.

[0068] In some embodiments, the cutting line driving device is a motor having a power output shaft and the power output shaft is connected to a cutting wheel, so that the cutting line can be driven by the wound cutting wheel to run along the winding direction. Of course, in a specific implementation, the cutting line driving device can also be another driving source such as a hydraulic motor, as long as it can drive the cutting line to run, and this application does not limit it.

[0069] The cutting device in the present application may include a transition wheel (or a reversing wheel, a guide wheel), which is used to reverse or guide the cutting line, or the transition wheel can be used to adjust the tension of the cutting line. The number of the transition wheels can be one or more according to the layout requirements.

[0070] The transition wheel can guide and traction the cutting line and also serve as a tension wheel for adjusting the tension of the cutting line. The tension wheel is used to adjust the tension of the cutting line, which can reduce the probability of the cutting line breaking and reduce consumables.

[0071] like Figure 1 and Figure 5 As shown, for example, in some embodiments, the cutting unit includes a plurality of cutting wheels and a plurality of transition wheels, for example, a cutting wheel 132a, a cutting wheel 132b, a transition wheel 135a, and a transition wheel 135b, the wheel surfaces of the cutting wheel 132a, the cutting wheel 132b, the transition wheel 135a, and the transition wheel 135b are all located in a vertical plane formed by the first direction and the third direction and form a quadrilateral (for example, a rectangle, a trapezoid, etc.) as a whole, wherein the cutting wheel 132a and the cutting wheel 132b are in the front (relatively closer) The transition wheel 135a and the transition wheel 135b are arranged in parallel up and down along the third direction at the rear (relatively farther away from the silicon rod supporting and clamping device), and the cutting wire 133 is wound around the cutting wheel 132a, the cutting wheel 132b, the transition wheel 135b, and the transition wheel 135a to form at least one cutting wire saw 134 (for example, the cutting wire saw 134 is formed between the cutting wheel 132a and the cutting wheel 132b), and the at least one cutting wire saw 134 is arranged along the third direction. In addition, in order to enable the at least one cutting wire saw 134 to effectively cut the original silicon rod 100 to be cut, the at least one cutting wire saw 134 must interfere with the original silicon rod 100 to be cut in the third direction.

[0072] As described above, the cutting wire is wound around multiple cutting wheels or multiple cutting wheels and multiple transition wheels to form a cutting wire saw 134 between the cutting wheels (for example, between the cutting wheel 132a and the cutting wheel 132b). Therefore, to adjust the wire length of the cutting wire saw 134, it can be achieved by adjusting the spacing between the cutting wheel 132a and the cutting wheel 132b, and the implementation method includes changing the position of at least one of the cutting wheels 132a and the cutting wheel 132b.

[0073] In addition, the cutting wire saw can still have other changes. Figure 1 and Figure 5 In the illustrated embodiment, the cutting wheel 132a and the cutting wheel 132b are arranged in parallel along a third direction, and the cutting line 133 is wound around a plurality of cutting wheels 132 or a plurality of cutting wheels 132 and a plurality of transition wheels 135 to form a cutting wire saw 134 between the cutting wheels 132 (for example, between the cutting wheel 132a and the cutting wheel 132b). The cutting wire saw 134 is arranged along the third direction, but is not limited to this. In other embodiments, the cutting wire saw 134 may be located in a vertical plane and arranged at a cutting angle with respect to the third direction, and the vertical plane is composed of a first direction and a third direction, and the cutting angle is less than or equal to 45° (≤±45°), that is, the routing direction of the cutting wire saw 134 may be located in the same vertical plane as the third direction and form a cutting angle less than or equal to 45° (≤±45°) with the third direction. In this implementation, in the third direction, one of the cutting wheels 132a and 132b is in front and the other is in the back. For example, the cutting wheel 132a is in front and the cutting wheel 132b is in the back (the deflection angle between the cutting wire saw formed by the cutting wheel 132a in front and the cutting wheel 132b in the back and the third direction is referred to as a positive deflection angle), or the cutting wheel 132b is in front and the cutting wheel 132a is in the back (the cutting wire saw formed by the cutting wheel 132a in the back and the cutting wheel 132b in the front and the third direction is referred to as a positive deflection angle). The deflection angle formed is called a negative deflection angle). Thus, when performing a vertical cutting operation, the front part of the cutting wire saw 134 enters the original silicon rod 100 first and the rear part of the cutting wire saw 134 enters the original silicon rod 100 later during the advancement process, and the original silicon rod 100 is continuously cut. Finally, the front part of the cutting wire saw 134 exits the original silicon rod 100 first and the rear part of the cutting wire saw 134 exits later, until the original silicon rod 100 is divided into two and cut into a first square silicon rod 101 and a second square silicon rod 102. The cutting deflection angle can be changed according to the cutting process requirements and the size specifications of the original silicon rod to be cut. For example, the angle of the cutting deflection angle can be adjusted by changing the position of one or both of the cutting wheels 132a and 132b associated with the cutting wire saw 134.

[0074] In some embodiments, the cutting unit includes a tension adjustment mechanism. In the wire cutting process, the tension of the cutting wire affects the yield and processing accuracy of the cutting process. The tension adjustment mechanism detects the tension and adjusts the tension so that the tension of the cutting wire reaches a certain threshold value set and maintains a constant value during cutting or takes the constant value as a certain range allowed by the center of the value. In some embodiments, the tension adjustment mechanism is associated with a transition wheel. The transition wheel in the wire cutting unit serves as a tension wheel for adjusting the tension of the cutting wire while achieving the guiding and traction of the cutting wire.

[0075] The tension wheel is used to adjust the tension of the cutting wire, which can reduce the probability of the cutting wire breaking and reduce consumables. The cutting wire plays an important role in the cutting operation, but even the best cutting wire has limited elongation and wear resistance, which means that the cutting wire will gradually become thinner during continuous operation until it is finally broken. Therefore, current wire cutting devices generally have a cutting wire tension compensation mechanism to compensate for the elongation of the cutting wire during its reciprocating movement, and the use of a tension wheel is one means of implementation.

[0076] For example, in some embodiments, the tension adjustment mechanism can perform tension detection and adjust the tension according to the tension detection result. The method of adjusting the tension is not limited, for example, it can be achieved by adjusting the transition wheel. In some cases, when it is detected that the tension does not reach the set requirement, the position of at least one of the two transition wheels is adjusted, for example, the transition wheel is moved outward to expand the circumference surrounded by each cutting wheel and each transition wheel, and the tension is increased. In some cases, when it is detected that the tension exceeds the set requirement, the position of at least one of the two transition wheels is adjusted, for example, the transition wheel is moved inward to reduce the circumference surrounded by each cutting wheel and each transition wheel, and the tension is reduced.

[0077] The cutting device comprises: a cutting wheel adjustment mechanism for adjusting at least one of the plurality of cutting wheels. In some embodiments, the cutting wheel adjustment mechanism may include: at least one distance adjustment mechanism for driving the plurality of cutting wheels to move relative to the cutting mounting structure in a direction perpendicular to the cutting wheel surface.

[0078] The cutting unit can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the cutting wire saw (for example, in the second direction) to change the cutting position (or processing specifications) relative to the silicon rod. In practical applications, the distance adjustment mechanism may, for example, include: a screw, which is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected to the cutting wheel; a driving source for driving the screw to rotate. Alternatively, the distance adjustment mechanism may, for example, include: a telescopic member, which is arranged along the orthogonal direction of the cutting wheel surface and is associated with the cutting wheel; a driving source for driving the telescopic member to perform telescopic movement along the orthogonal direction of the cutting wheel surface. Alternatively, the distance adjustment mechanism may, for example, include: a rack, which is arranged on the cutting wheel along the orthogonal direction of the cutting wheel surface; a transmission gear, which is meshed with the rack; and a driving source for driving the transmission gear to rotate.

[0079] In the present application, when the original silicon rod is cut vertically, the cutting wire saw in the cutting device is driven to move relative to the silicon rod supporting and clamping device in the first direction so that the original silicon rod carried by the silicon rod supporting and clamping device is cut vertically. Therefore, in some embodiments, the cutting device is a mobile cutting device and the silicon rod supporting and clamping device is a fixed silicon rod supporting and clamping device. In some embodiments, the cutting device is a fixed cutting device and the silicon rod supporting and clamping device is a mobile silicon rod supporting and clamping device. In some embodiments, the cutting device is a mobile cutting device and the silicon rod supporting and clamping device is a mobile silicon rod supporting and clamping device.

[0080] Taking a mobile cutting device as an example, the cutting device includes a cutting frame travel mechanism, and the cutting frame and the cutting unit provided thereon are driven to move along a first direction by the cutting frame travel mechanism.

[0081] In some embodiments, the cutting frame travel mechanism includes: a cutting travel guide rail and a cutting travel drive unit, wherein the cutting travel guide rail is arranged on the machine base along a first direction, and the cutting travel drive unit is used to drive the cutting frame and its cutting unit to move along the cutting travel guide rail.

[0082] In some embodiments, the cutting travel drive unit includes a cutting travel rack, a driving gear, and a driving source. The cutting travel rack is arranged on the machine base along a first direction and is parallel to the cutting travel guide rail. The driving gear is arranged on the cutting frame (for example, the bottom of the cutting frame) and meshes with the cutting travel rack. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the cutting travel rack. Following the movement of the cutting travel rack, the cutting frame connected to the driving gear and the cutting unit provided thereon move along the cutting travel guide rail. The driving source is, for example, a driving motor.

[0083] In some embodiments, the cutting travel drive unit includes a cutting travel screw and a drive source, wherein the cutting travel screw is arranged along a first direction and is associated with a cutting frame, and the drive source is used to drive the cutting travel screw to rotate so that the associated cutting frame and the cutting unit provided therein move along the cutting travel guide rail. The drive source is, for example, a drive motor.

[0084] In some embodiments, the cutting frame travel mechanism includes: a cutting travel hanging rail and a cutting travel driving unit, wherein the cutting travel hanging rail is arranged above the machine base along a first direction (for example, a mounting frame or a hanging frame located above the machine base), and the cutting travel driving unit is used to drive the cutting frame and the cutting unit provided thereon to move along the cutting travel guide rail.

[0085] In some embodiments, the cutting travel drive unit includes a cutting travel rack, a driving gear, and a driving source. The cutting travel rack is arranged above the machine base (for example, a mounting frame or a hanging frame located above the machine base) along a first direction, parallel to the cutting travel guide rail. The driving gear is arranged on the cutting frame (for example, the top of the cutting frame) and meshes with the cutting travel rack. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the cutting travel rack. Following the movement of the cutting travel rack, the cutting frame connected to the driving gear and the cutting unit provided thereon move along the cutting travel guide rail. The driving source is, for example, a driving motor.

[0086] In some embodiments, the cutting travel drive unit includes a cutting travel screw and a drive source, wherein the cutting travel screw is arranged along a first direction and is associated with a cutting frame, and the drive source is used to drive the cutting travel screw to rotate so that the associated cutting frame and the cutting unit provided therein move along the cutting travel guide rail. The drive source is, for example, a drive motor.

[0087] When the original square silicon rod is cut vertically by the cutting device, the cutting wire driving device drives the cutting wire to run in the winding direction, and the cutting frame travel mechanism drives the cutting frame and the cutting unit provided thereon to move in the first direction so as to achieve relative feeding with the original square silicon rod supported and clamped by the silicon rod supporting and clamping device, so that the cutting wire saw in the cutting unit can vertically cut the original square silicon rod to form a first square silicon rod and a second square silicon rod arranged in parallel along the second direction.

[0088] Taking the movable silicon rod supporting and clamping device as an example, the silicon rod supporting and clamping device includes a supporting and clamping member moving mechanism for driving the first silicon rod supporting and clamping member and the second silicon rod supporting and clamping member to move along a first direction.

[0089] In some embodiments, the supporting and clamping member travel mechanism includes: a silicon rod travel guide rail and a silicon rod travel drive unit, wherein the silicon rod travel guide rail is arranged on the machine base along the first direction, and the silicon rod travel drive unit is used to drive the first silicon rod supporting and clamping member and the second silicon rod supporting and clamping member and the original silicon rods supported and clamped by them to move along the silicon rod travel guide rail.

[0090] In some embodiments, the silicon rod advancing driving unit includes a silicon rod advancing rack, a driving gear, and a driving source. The silicon rod advancing rack is arranged on the machine base along the first direction, parallel to the silicon rod advancing guide rail. The driving gear is arranged on the first silicon rod supporting clamp and the second silicon rod supporting clamp (for example, on the mounting seat body on which the first silicon rod supporting clamp and the second silicon rod supporting clamp are installed together), and meshes with the silicon rod advancing guide rail. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the silicon rod advancing guide rail. Following the movement of the silicon rod advancing guide rail, the first silicon rod supporting clamp and the second silicon rod supporting clamp connected to the driving gear and the original silicon rods supported and clamped therein move along the silicon rod advancing guide rail. The driving source is, for example, a driving motor.

[0091] In some embodiments, the silicon rod advancing drive unit includes a silicon rod advancing screw and a driving source, wherein the silicon rod advancing screw is arranged along a first direction and is associated with a first silicon rod supporting clamp and a second silicon rod supporting clamp (e.g., a mounting seat body on which the first silicon rod supporting clamp and the second silicon rod supporting clamp are mounted together), and the driving source is used to drive the silicon rod advancing screw to rotate so that the associated first silicon rod supporting clamp and the second silicon rod supporting clamp and the original silicon rods supported and clamped therein move along the silicon rod advancing guide rail. The driving source is, for example, a driving motor.

[0092] When the original square silicon rod is cut vertically by the cutting device, the cutting wire driving device drives the cutting wire to run in the winding direction, and the supporting and clamping member travel mechanism drives the first silicon rod supporting and clamping member and the second silicon rod supporting and clamping member and the original square silicon rod supported and clamped by them to move in the first direction to achieve relative feeding with the cutting device so that the cutting wire saw of the cutting unit in the cutting device can vertically cut the original square silicon rod to form the first square silicon rod and the second square silicon rod arranged in parallel along the second direction.

[0093] When the cutting device is used to vertically cut the original silicon rod, the nozzle of the spraying device (such as Figure 5 The nozzle 136 in the nozzle 136 sprays cutting liquid on the cutting seam formed when the cutting wire saw cuts the silicon rod. Due to the vertical cutting operation adopted, the cutting seam formed by the cutting wire saw cutting the original square silicon rod is located between the first square silicon rod and the second square silicon rod. The three are arranged in parallel along the second direction. The cutting seam can avoid being excessively squeezed by the first square silicon rod or the second square silicon rod (the cutting seam is opened by the inner cutting wire saw). The cutting liquid can effectively penetrate into the opened cutting seam and act on the cutting wire saw, which is not only conducive to cutting, but also improves the cutting efficiency and cutting quality, and can also effectively cool the cutting wire saw.

[0094] The grinding device is disposed in the grinding area of ​​the silicon rod processing platform, and is used to grind the first square silicon rod and the second square silicon rod placed horizontally in the grinding area. In some embodiments, the grinding operation includes a surface grinding operation. In some embodiments, the grinding operation includes a chamfering operation. In some embodiments, the grinding operation includes a surface grinding operation and a chamfering operation.

[0095] like Figures 1 to 3 As shown, in the present application, at the cutting position, the original square silicon rod is cut vertically by the cutting device to form a first square silicon rod and a second square silicon rod arranged in parallel along the second direction. Subsequently, the first square silicon rod and the second square silicon rod are placed in a horizontal manner at the grinding position of the silicon rod processing platform, and when placed, the first square silicon rod and the second square silicon rod are placed along their lengths, that is, the axis of the first square silicon rod is consistent with the first direction, and the axis of the second square silicon rod is consistent with the first direction.

[0096] In order to transfer the first and second square silicon rods from the cutting area to the grinding area, the square silicon rod cutting and grinding machine of the present application includes a silicon rod transfer device for transferring the first and second square silicon rods located at the cutting area to the grinding area.

[0097] In some embodiments, the silicon rod transfer device includes: a transfer mounting frame, a transfer fixture, a transfer translation mechanism, and a transfer lifting mechanism. Figure 6 , which is a schematic diagram of the structure of a silicon rod transfer device in one embodiment of the present application. Figure 1 and Figure 6 In the illustrated embodiment, the silicon rod transfer device 17 includes a transfer mounting frame 171 , a transfer fixture 173 , a transfer lifting mechanism 175 , and a transfer translation mechanism 177 .

[0098] The transfer mounting frame is mounted on the machine base. Figure 1 and Figure 2 In the illustrated embodiment, the transfer mounting frame 171 is straddled on the machine base 11 in the second direction, and the transfer mounting frame 171 may correspond to the entire width dimension of the machine base 11 to cover each position within the width of the machine base 11 .

[0099] The transfer fixture is used to clamp each workpiece, and the workpiece includes an original square silicon rod, a first square silicon rod, and a second square silicon rod. Figure 1 and Figure 6 In the illustrated embodiment, the transfer clamp 173 may further include: a clamping seat 1731, at least one pair of clamping arms 1733 arranged along the first direction on opposite sides of the clamping seat 1731, and a clamping arm driving mechanism 1732, wherein the at least one pair of clamping arms 1733 is provided with a clamping portion 1734 and a clamping portion rotating mechanism 1735.

[0100] The at least one pair of clamping arms are arranged on the clamping seat in a first direction opposite to each other through a clamping arm driving mechanism, and are used to clamp two end faces of a silicon rod (e.g., an original square silicon rod, a first square silicon rod, and a second square silicon rod), so that the clamped silicon rod is placed horizontally. Any one of the pair of clamping arms is provided with a clamping portion.

[0101] The clamp arm driving mechanism is used to drive at least one of the at least one pair of clamp arms to move along a horizontal line to adjust the clamping distance between the pair of clamp arms. In some embodiments, two clamp arms in the pair of clamp arms are arranged opposite to each other along a first direction, and the clamp arm driving mechanism can drive at least one of the pair of clamp arms to move along the first direction to adjust the clamping distance between the pair of clamp arms arranged opposite to each other. Figures 1 to 3 In the illustrated embodiment, two clamping arms in the pair of clamping arms are arranged opposite to each other along a first direction, and the clamping arm driving mechanism can drive the two clamping arms in the pair of clamping arms to move toward or away from each other along the first direction to adjust the clamping distance between the pair of clamping arms arranged opposite to each other.

[0102] In some embodiments, the clamp arm driving mechanism may include: an opening and closing guide rod and an opening and closing driving unit, wherein the opening and closing guide rod is arranged on the clamp seat along the first direction, and is used to set a pair of clamp arms, and the opening and closing driving unit is used to drive two clamp arms in the pair of clamp arms to move toward or away from each other along the opening and closing guide rod arranged in the first direction. In order to ensure the stability of the clamp arm in horizontal movement along the first direction, the number of the opening and closing guide rods can be multiple, for example, Figure 6 In the illustrated embodiment, there are two opening and closing guide rods. Of course, the opening and closing guide rods can also be other quantities, for example, three, five, six, or more. Taking three as an example, the three opening and closing guide rods can be arranged in the form of an isosceles triangle or an equilateral triangle.

[0103] In some embodiments, the opening and closing drive unit includes a horizontal telescopic rod and a telescopic cylinder, one end of the horizontal telescopic rod is associated with a certain clamping arm, and the other end of the horizontal telescopic rod is associated with the telescopic cylinder, and the telescopic cylinder is arranged on the clamping seat. In practical applications, the telescopic cylinder can drive the horizontal telescopic rod to extend and retract. For example, the telescopic cylinder drives the horizontal telescopic rod to retract inward, drives one of the pair of clamping arms to move toward the other clamping arm along the opening and closing guide rod set in the first direction, or drives the two clamping arms in the pair of clamping arms to move toward each other along the opening and closing guide rod set in the first direction, thereby reducing the clamping distance between the two clamping arms to clamp the silicon rod between the two clamping arms. Correspondingly, the telescopic cylinder can drive the horizontal telescopic rod to extend outward, drives one of the pair of clamping arms to move back toward the other clamping arm along the opening and closing guide rod set in the first direction, or drives the two clamping arms in the pair of clamping arms to move back toward each other along the opening and closing guide rod set in the first direction, thereby increasing the clamping distance between the two clamping arms to release the clamped silicon rod.

[0104] In some embodiments, the opening and closing drive unit includes a screw and an opening and closing motor, one end of the screw (for example, a threaded end) is associated with a certain clamp arm, and the other end of the screw is associated with an opening and closing motor, and the opening and closing motor is arranged on the clamp seat. In practical applications, the opening and closing motor can drive the screw to rotate. For example, the opening and closing motor drives the screw to rotate forward (or drives the screw to rotate reversely), drives one of the pair of clamp arms to move toward the other clamp arm along the opening and closing guide rod set in the first direction, or drives the two clamp arms in the pair of clamp arms to move toward each other along the opening and closing guide rod set in the first direction, thereby reducing the clamping distance between the two clamp arms to clamp the silicon rod between the two clamp arms. Correspondingly, the opening and closing motor drives the screw to rotate reversely (or drives the screw to rotate forward), drives one of the pair of clamp arms to move back to the other clamp arm along the opening and closing guide rod set in the first direction, or drives the two clamp arms in the pair of clamp arms to move back to each other along the opening and closing guide rod set in the first direction, thereby increasing the clamping distance between the two clamp arms to release the clamped silicon rod.

[0105] In some embodiments, the opening and closing drive unit includes a bidirectional screw and an opening and closing motor, wherein the bidirectional screw is arranged along a first direction, and the bidirectional screw is a left-handed screw, and two sections of threads are arranged on the rod body, and the rotation direction of the two sections of threads is opposite, that is, one section of the thread is a left-handed thread, and the other section of the thread is a right-handed thread, wherein one section of the thread can be associated with one clamping arm and the other section of the thread can be associated with another clamping arm (for example, the left-handed thread is associated with the first clamping arm and the right-handed thread is associated with the second clamping arm, or the right-handed thread is associated with the first clamping arm and the left-handed thread is associated with the second clamping arm), and the opening and closing motor is associated with the bidirectional screw, and is used to drive the bidirectional screw to rotate so that the associated first clamping arm and the second clamping arm move toward or away from each other along the opening and closing guide rod arranged in the first direction. In practical applications, for example, the opening and closing motor drives the bidirectional screw to rotate forward (or drives the bidirectional screw to rotate reversely), and then drives the two associated clamping arms to move toward each other (i.e., approach each other) along the opening and closing guide rod set in the first direction, and reduces the clamping distance between the two clamping arms to clamp the silicon rod between the two clamping arms; or, the opening and closing motor drives the bidirectional screw to rotate reversely (or drives the bidirectional screw to rotate forward), and then drives the two associated clamping arms to move away from each other (i.e., move away from each other) along the opening and closing guide rod set in the first direction, and increases the clamping distance between the two clamping arms to release the clamped silicon rod. The opening and closing motor can be arranged in the middle section or a terminal of the bidirectional screw.

[0106] In some embodiments, the clamping portion of the clamping arm is designed to be rotatable. Figure 1 and Figure 6 In the illustrated embodiment, the transport fixture 173 includes a clamping portion rotating mechanism 1735, which is used to drive the clamping portion 1734 on the clamping arm 1733 to rotate. In certain implementations, the clamping portion 1734 of the clamping arm 1733 rotates about the axis of the silicon rod under the drive of the clamping portion 1734 rotating mechanism, and the clamped silicon rod rotates about the axis of the silicon rod accordingly. In actual processing operations, the silicon rod is driven to rotate along its axis by the clamping portion 1734 rotating mechanism, and the positional relationship of the clamped silicon rod relative to the cutting device or the grinding device can be adjusted.

[0107] In some embodiments, the clamping portion is a multi-point contact clamping head. It is understandable that the contact method between the multi-point contact clamping head and the silicon rod end face is not limited to point contact. Figure 1 and Figure 6 In the embodiment shown, the clamping portion 1734 has, for example, a plurality of protrusions for contacting the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod. In one implementation, the protrusions of the clamping portion 1734 may also be connected to the main body of the clamping portion 1734 via a spring along a horizontal line, thereby forming a multi-point floating contact, so that the transport fixture can adapt to the flatness of the end surface of the silicon rod when clamping the end surface of the silicon rod to clamp the silicon rod.

[0108] In certain embodiments, the pair of clamping portions 1734 of the transfer fixture used to contact the silicon rod portion are configured as a rigid structure to prevent the clamped silicon rod from being disturbed during cutting and grinding operations and thus affecting processing accuracy.

[0109] In practical applications, the rotating mechanism of the clamping portion 1734 may include a rotatable structure disposed on two clamping portions 1734 in a pair of clamping arms 1733 and a driving source for driving at least one of the two rotatable structures to rotate.

[0110] In certain embodiments of the present application, the clamping portion 1734 of the clamping arm 1733 may be configured as a rotatable truncated cone, the circular plane of the truncated cone contacts the end face of the silicon rod, and remains relatively still with the end face of the silicon rod after being pressed against the end face of the silicon rod. The silicon rod clamping portion 1734 includes a locking structure, and the clamping portion 1734 of the clamping arm 1733 is in a locked state when grinding a selected plane. When switching between different grinding surfaces, the silicon rod clamping portion 1734 rotates along the center of the truncated cone driven by the rotating mechanism of the clamping portion 1734.

[0111] In some implementations, the clamping portion 1734 of the clamping arm 1733 includes a rotatable truncated cone and a series of protruding contacts arranged on the truncated cone, wherein each contact has a contact plane for contacting the clamped silicon rod, and the truncated cone rotates driven by the rotating mechanism of the clamping portion 1734. Regarding the contacts, in some implementations, the protruding length of the contacts, i.e., the position of the horizontal line, can be adjusted, so that in the process of clamping the silicon rod, for the silicon rod with a low end surface flatness, the protruding length of the contacts can be adjusted according to the end surface of the silicon rod, so that the contact surface of each contact is in a close contact state with the end surface of the silicon rod. The protruding length is the length of the horizontal line from the circular plane of the truncated cone to the contact plane of the contact.

[0112] The clamping portion 1734 rotation mechanism may be disposed on one of the pair of clamping arms 1733 to drive the clamping portion 1734 of the pair of clamping arms 1733 and the clamped silicon rod to rotate; or the clamping portion 1734 rotation mechanism may be disposed on both clamping arms of the pair of clamping arms 1733 to coordinate movement and control the two clamping portions 1734 of the pair of clamping arms 1733 to rotate at the same angle and direction. In some implementations, the driving source in the clamping portion 1734 rotation mechanism may be, for example, a driving motor.

[0113] Thus, in the embodiment of the present application, the transfer clamp configured in the silicon rod transfer device can clamp the silicon rod horizontally and drive the clamped silicon rod to rotate at a predetermined angle with its axis as the axis, wherein the axis of the silicon rod is a horizontal line.

[0114] The transfer lifting mechanism is used to drive the transfer fixture to be lifted vertically on the transfer mounting frame. Figure 1 and Figure 6 In the illustrated embodiment, the transfer lifting mechanism 175 includes: a vertical lifting guide rod 1751 and a vertical lifting drive unit 1752.

[0115] The vertical lifting guide rod can be arranged on the transport mounting frame in the vertical direction (i.e., the third direction). For example, a mounting structure (e.g., a mounting plate) is arranged on the transport mounting frame, and the vertical lifting guide rod can be arranged on the mounting structure in the vertical direction (i.e., the third direction). To ensure the stability of the transport fixture in the lifting and lowering movement along the vertical lifting guide rod, the number of the vertical lifting guide rods can be multiple, for example, Figure 1 and Figure 6 In the illustrated embodiment, there may be two vertical lifting guide rods 1751. Of course, the vertical lifting guide rods may also be other numbers, for example, three, five, six, or more. Taking three as an example, the three vertical lifting guide rods may be arranged in the form of an isosceles triangle or an equilateral triangle.

[0116] In certain embodiments, the vertical lifting drive unit includes a vertical telescopic rod and a telescopic cylinder, one end of the vertical telescopic rod is associated with the clamp seat, and the other end of the vertical telescopic rod is associated with the telescopic cylinder, and the telescopic cylinder is arranged on the transport mounting frame or the mounting structure. In practical applications, the telescopic cylinder can drive the vertical telescopic rod to extend and retract. For example, the telescopic cylinder drives the vertical telescopic rod to retract inward, and drives the vertical lifting guide rod arranged along the vertical direction of the transport fixture to rise. Correspondingly, the telescopic cylinder can drive the vertical telescopic rod to extend outward, and drive the vertical lifting guide rod arranged along the vertical direction of the transport fixture to descend.

[0117] In certain embodiments, the vertical lifting drive unit includes a vertical screw rod and a lifting motor, one end of the vertical screw rod is associated with the clamp seat, and the other end of the vertical screw rod is associated with the lifting motor, and the lifting motor is arranged on the transfer mounting frame or the mounting structure. In practical applications, the lifting motor can drive the vertical screw rod to rotate forward and backward. For example, the lifting motor drives the vertical screw rod to rotate forward (or drives the vertical screw rod to rotate reversely), and drives the vertical lifting guide rod set along the vertical direction of the transfer fixture to rise. Correspondingly, the lifting motor can drive the vertical screw rod to rotate reversely (or drives the vertical screw rod to rotate forward), and drives the vertical lifting guide rod set along the vertical direction of the transfer fixture to descend.

[0118] The transfer translation mechanism is used to drive the transfer fixture to move along the second direction on the transfer mounting frame. Figure 1 and Figure 6In the illustrated embodiment, the transfer translation mechanism comprises: a transfer translation guide rail 1771 and a translation drive unit. The transfer translation guide rail can be arranged on the transfer mounting frame along the second direction, and the translation drive unit is used to drive the transfer fixture to move along the transfer translation guide rail.

[0119] In some embodiments, the translation drive unit includes a transfer translation rack, a driving gear and a driving source. The transfer translation rack is arranged on the transfer mounting frame along the second direction and is parallel to the transfer translation guide rail. The driving gear is arranged on the mounting structure and meshes with the transfer translation rack. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the transfer translation rack. Following the movement of the transfer translation rack, the mounting frame connected to the driving gear and the transfer fixture provided thereon move along the transfer translation guide rail. The driving source is, for example, a driving motor.

[0120] In some embodiments, the cutting travel drive unit includes a transport translation screw and a drive source, wherein the transport translation screw is arranged along the second direction and is associated with the mounting structure, and the drive source is used to drive the transport translation screw to rotate so that the associated mounting structure and the transport fixture provided therein move along the transport translation guide rail. The drive source is, for example, a drive motor.

[0121] The silicon rod transfer device of the present application can clamp the two ends of the silicon rod (the original square silicon rod, the first square silicon rod and the second square silicon rod formed after vertical cutting, etc.) and drive the silicon rod to rotate, lift, and translate.

[0122] Back to the grinding device, in some embodiments, the silicon rod processing platform is provided with at least two grinding positions. For example, the cutting device can form a first square silicon rod and a second square silicon rod after vertical cutting of the original square silicon rod, then the silicon rod processing platform can be provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged in parallel along the second direction. For example, the cutting device can form at least three square silicon rods after multiple vertical cutting of the original square silicon rod (for example, three square silicon rods are formed after two vertical cuttings of the original square silicon rod; or four square silicon rods are formed after three vertical cuttings of the original square silicon rod, etc.), then the silicon rod processing platform can be provided with at least three grinding positions, and each grinding position is arranged in parallel along the second direction.

[0123] exist Figures 1 to 3In the illustrated embodiment, the silicon rod processing platform is provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged in parallel along the second direction. The first square silicon rod and the second square silicon rod to be ground are placed in a horizontal manner at the first grinding position and the second grinding position of the silicon rod processing platform, and when placed, the first square silicon rod and the second square silicon rod are placed along the length of the square silicon rod cutting and grinding machine, that is, the axis of the first square silicon rod and the second square silicon rod is consistent with the first direction.

[0124] In order to enable the original square silicon rod to be stably placed in the cutting position, a first square silicon rod supporting device 161 is provided at the first grinding position, and a second square silicon rod supporting device 162 is provided at the second grinding position. The first square silicon rod supporting device and the second square silicon rod supporting device are intended to support and clamp the first square silicon rod and the second square silicon rod. It should be noted that, here, the first square silicon rod, the second square silicon rod, the first square silicon rod supporting device, and the second square silicon rod supporting device are not specified, but are only generally described, that is, the first square silicon rod supporting device is not specified for carrying the first square silicon rod, and the second square silicon rod supporting device is not specified for carrying the second square silicon rod.

[0125] In some embodiments, the first square silicon rod supporting device and the second square silicon rod supporting device may have the same structure, and the two may be respectively arranged at the first grinding position and the second grinding position in the same manner, or the two may be respectively arranged at the first grinding position and the second grinding position in a symmetrical manner. In some embodiments, the first square silicon rod supporting device and the second square silicon rod supporting device may also have different structures.

[0126] The following description is made by taking the first silicon rod supporting device and the second silicon rod supporting device as an example in which the structures are the same.

[0127] The first square silicon rod supporting device comprises a first square silicon rod supporting platform and a first square silicon rod clamping mechanism, and the second square silicon rod supporting device comprises a second square silicon rod supporting platform and a second square silicon rod clamping mechanism.

[0128] The length of the first square silicon rod supporting platform may be related to the length of the first square silicon rod and the second square silicon rod, and the width of the first square silicon rod supporting platform may be related to the width of the first square silicon rod and the second square silicon rod.

[0129] The first square silicon rod clamping mechanism clamps the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting platform, so that the first square silicon rod or the second square silicon rod can be stably placed on the first square silicon rod supporting platform. In this way, when the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting platform is ground by the grinding device, the first square silicon rod clamping mechanism can be used to clamp the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting platform, so as to avoid relative displacement between the first square silicon rod or the second square silicon rod and the first square silicon rod supporting platform during the grinding operation, thereby affecting the grinding quality. In certain embodiments, the first square silicon rod clamping mechanism may include two rows of jaws or blocks arranged along the width direction (i.e., the second direction) of the first square silicon rod or the second square silicon rod and a driving source for driving the jaws or blocks, wherein each row of jaws or blocks may include one or more jaws or blocks arranged at intervals along the length direction (i.e., the first direction) of the first square silicon rod or the second square silicon rod. In actual applications, the placed first square silicon rod or the second square silicon rod is located in the placement space between the two rows of jaws or blocks, and the driving source is used to drive the two rows of jaws or blocks to move or actuate toward each other along the width direction of the first square silicon rod or the second square silicon rod, so as to clamp the first square silicon rod or the second square silicon rod located therebetween. Alternatively, the first square silicon rod clamping mechanism may include a backrest and a row of jaws or blocks arranged along the width direction (i.e., the second direction) of the first square silicon rod or the second square silicon rod, and a driving source for driving the jaws or blocks, wherein the row of jaws or blocks may include one or more jaws or blocks arranged at intervals along the length direction (i.e., the first direction) of the first square silicon rod or the second square silicon rod. In actual applications, the placed first square silicon rod or the second square silicon rod is located in the placement space formed by the backrest and the row of jaws or blocks, and the driving source is used to drive the jaws or blocks to move or actuate along the width direction of the edge skin rod toward the backrest, thereby clamping the first square silicon rod or the second square silicon rod located therebetween.

[0130] The length of the second square silicon rod supporting platform may be related to the length of the first square silicon rod and the second square silicon rod, and the width of the second square silicon rod supporting platform may be related to the width of the first square silicon rod and the second square silicon rod.

[0131] The second square silicon rod clamping mechanism clamps the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting platform, so that the first square silicon rod or the second square silicon rod can be stably placed on the second square silicon rod supporting platform. In this way, when the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting platform is ground by the grinding device, the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting platform can be clamped by the second square silicon rod clamping mechanism to avoid relative displacement between the first square silicon rod or the second square silicon rod and the second square silicon rod supporting platform during the grinding operation, thereby affecting the grinding quality. In certain embodiments, the second square silicon rod clamping mechanism may include two rows of jaws or blocks arranged along the width direction (i.e., the second direction) of the first square silicon rod or the second square silicon rod and a driving source for driving the jaws or blocks, wherein each row of jaws or blocks may include one or more jaws or blocks arranged at intervals along the length direction (i.e., the first direction) of the first square silicon rod or the second square silicon rod. In actual applications, the placed first square silicon rod or the second square silicon rod is located in the placement space between the two rows of jaws or blocks, and the driving source is used to drive the two rows of jaws or blocks to move or actuate toward each other along the width direction of the first square silicon rod or the second square silicon rod, so as to clamp the first square silicon rod or the second square silicon rod located therebetween. Alternatively, the second square silicon rod clamping mechanism may include a backrest and a row of jaws or blocks arranged along the width direction (i.e., the second direction) of the first square silicon rod or the second square silicon rod, and a driving source for driving the jaws or blocks, wherein the row of jaws or blocks may include one or more jaws or blocks arranged at intervals along the length direction (i.e., the first direction) of the first square silicon rod or the second square silicon rod. In actual applications, the placed first square silicon rod or the second square silicon rod is located in the placement space formed by the backrest and the row of jaws or blocks, and the driving source is used to drive the jaws or blocks to move or actuate along the width direction of the edge skin rod toward the backrest to clamp the first square silicon rod or the second square silicon rod located therebetween.

[0132] In some embodiments, corresponding pads or protective strips may be added to the table surface of the first square silicon rod support platform and the clamping surface of the clamping claw or clamping block in the first square silicon rod clamping mechanism, or the clamping surface of the backing, so as to protect the bottom and side of the first square silicon rod or the second square silicon rod to be supported and clamped. Corresponding pads or protective strips may be added to the table surface of the second square silicon rod support platform and the clamping surface of the clamping claw or clamping block in the second square silicon rod clamping mechanism, or the clamping surface of the backing, so as to protect the bottom and side of the first square silicon rod or the second square silicon rod to be supported and clamped.

[0133] As mentioned above, the silicon rod processing platform is provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged in parallel along a second direction. In some embodiments, the grinding device includes a grinding frame and a first grinding unit and a second grinding unit which are arranged on the grinding frame and correspond to the first grinding position and the second grinding position, respectively. Figures 1 to 3 In the illustrated embodiment, the grinding device 15 includes a grinding frame 151 and a first grinding unit 153 and a second grinding unit 154 disposed on the grinding frame 151, wherein the first grinding unit 153 corresponds to the first grinding position, and the first grinding unit 153 includes a first grinding support 155 disposed vertically and movably on the grinding frame 151 and at least one first grinding tool 157 disposed on the first grinding support 155, and the at least one first grinding tool 157 is used to grind the cut surface of the first square silicon rod or the second square silicon rod supported and clamped by the first square silicon rod supporting device 161. The second grinding unit 154 corresponds to the second grinding position, and the second grinding unit 154 includes a second grinding support 156 disposed vertically and movably on the grinding frame 151 and at least one second grinding tool 158 disposed on the second grinding support 156, and the at least one second grinding tool 158 is used to grind the cut surface of the first square silicon rod or the second square silicon rod supported and clamped by the second square silicon rod supporting device 162.

[0134] For the first grinding unit, the first grinding support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a first grinding support lifting mechanism. The first grinding support can be lifted and lowered relative to the grinding frame by using the first grinding support lifting mechanism. In some embodiments, the first grinding support lifting mechanism may include: a first grinding lifting guide rail and a first grinding lifting drive unit, wherein the first grinding lifting guide rail is arranged on the grinding frame in the vertical direction, and the first grinding lifting drive unit is used to drive the first grinding support and at least one first grinding surface abrasive tool arranged thereon to move up and down along the first grinding lifting guide rail. In some embodiments, the first grinding lifting drive unit may include a first grinding lifting screw and a driving source, wherein the first grinding lifting screw is arranged in the vertical direction and is associated with the first grinding support, and the driving source is used to drive the first grinding lifting screw to rotate so that the associated first grinding support and at least one first grinding surface abrasive tool arranged thereon can move up and down along the first grinding lifting guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the first grinding support lifting mechanism may include: a first grinding lifting rack, a driving gear and a driving source, wherein the first grinding lifting rack is vertically arranged on the grinding frame and is parallel to the first grinding lifting guide rail. The driving gear is arranged on the first grinding support (e.g., the bottom of the first grinding support) and is meshed with the first grinding lifting rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated first grinding support and at least one first grinding tool arranged thereon are lifted and lowered along the first grinding lifting guide rail. In some examples, the driving source may be, for example, a driving motor.

[0135] The first grinding tool includes at least one grinding wheel. For example, in some embodiments, the grinding device includes a first grinding tool, the first grinding tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the grinding device may include two first grinding tools arranged along the first direction, each of which includes a grinding wheel, for example, the first grinding tool in front includes a rough grinding wheel, and the first grinding tool in the back includes a fine grinding wheel. In some embodiments, the grinding device includes a first grinding tool, the first grinding tool includes a rough grinding wheel and a fine grinding wheel nested in each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0136] When the first grinding tool includes a rough grinding wheel and a fine grinding wheel, the first grinding tool can be used to perform rough grinding and fine grinding on the first square silicon rod or the second square silicon rod. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel can be provided with a telescopic drive mechanism, and when performing a rough grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform a rough grinding operation on the first square silicon rod or the second square silicon rod, and when performing a fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to contract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform a fine grinding operation on the first square silicon rod or the second square silicon rod.

[0137] Alternatively, when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism, and when performing the rough grinding operation, the telescopic drive mechanism is utilized to drive the fine grinding wheel to retract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform the rough grinding operation on the first square silicon rod or the second square silicon rod, and when performing the fine grinding operation, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform the fine grinding operation on the first square silicon rod or the second square silicon rod. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic drive mechanism. When performing rough grinding, the telescopic drive mechanism is utilized to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform rough grinding on the first square silicon rod or the second square silicon rod. When performing fine grinding, the telescopic drive mechanism is utilized to drive the rough grinding wheel to retract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform fine grinding on the first square silicon rod or the second square silicon rod.

[0138] Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism, and when performing rough grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to contract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform rough grinding on the first square silicon rod or the second square silicon rod, and when performing fine grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform fine grinding on the first square silicon rod or the second square silicon rod.

[0139] For the second grinding unit, the second grinding support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a second grinding support lifting mechanism. The second grinding support can be lifted and lowered relative to the grinding frame by means of the second grinding support lifting mechanism. In some embodiments, the second grinding support lifting mechanism may include: a second grinding lifting guide rail and a second grinding lifting drive unit, wherein the second grinding lifting guide rail is arranged on the grinding frame in the vertical direction, and the second grinding lifting drive unit is used to drive the second grinding support and at least one second grinding tool arranged thereon to move up and down along the second grinding lifting guide rail.

[0140] In some embodiments, the second grinding lifting drive unit may include a second grinding lifting screw and a driving source, wherein the second grinding lifting screw is arranged vertically and associated with the second grinding support, and the driving source is used to drive the second grinding lifting screw to rotate so that the associated second grinding support and at least one second grinding surface abrasive tool arranged thereon are lifted and moved along the second grinding lifting guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the second grinding support lifting mechanism may include: a second grinding lifting rack, a driving gear and a driving source, wherein the second grinding lifting rack is arranged vertically on the grinding frame and is parallel to the second grinding lifting guide rail. The driving gear is arranged on the second grinding support (for example, the bottom of the second grinding support) and meshes with the second grinding lifting rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated second grinding support and at least one second grinding surface abrasive tool arranged thereon are lifted and moved along the second grinding lifting guide rail. In some examples, the driving source may be, for example, a driving motor.

[0141] The second grinding tool includes at least one grinding wheel. For example, in some embodiments, the grinding device includes a second grinding tool, the second grinding tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the grinding device may include two second grinding tools arranged along the first direction, each second grinding tool includes a grinding wheel, for example, the front second grinding tool includes a rough grinding wheel, and the rear second grinding tool includes a fine grinding wheel. In some embodiments, the grinding device includes a second grinding tool, the second grinding tool includes a rough grinding wheel and a fine grinding wheel nested in each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0142] When the second grinding tool includes a rough grinding wheel and a fine grinding wheel, the second grinding tool can be used to perform rough grinding and fine grinding on the first square silicon rod or the second square silicon rod. Therefore, at least one of the rough grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the rough grinding wheel is nested in the fine grinding wheel, the rough grinding wheel can be provided with a telescopic drive mechanism, and when performing a rough grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform a rough grinding operation on the first square silicon rod or the second square silicon rod, and when performing a fine grinding operation, the telescopic drive mechanism is used to drive the rough grinding wheel to contract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform a fine grinding operation on the first square silicon rod or the second square silicon rod.

[0143] Alternatively, when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism, and when performing the rough grinding operation, the telescopic drive mechanism is utilized to drive the fine grinding wheel to retract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform the rough grinding operation on the first square silicon rod or the second square silicon rod, and when performing the fine grinding operation, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform the fine grinding operation on the first square silicon rod or the second square silicon rod. For example, when the fine grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic drive mechanism. When performing rough grinding, the telescopic drive mechanism is utilized to drive the rough grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding rough grinding wheel can be used to perform rough grinding on the first square silicon rod or the second square silicon rod. When performing fine grinding, the telescopic drive mechanism is utilized to drive the rough grinding wheel to retract and be recessed in the fine grinding wheel, so that the fine grinding wheel can be used to perform fine grinding on the first square silicon rod or the second square silicon rod.

[0144] Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism, and when performing rough grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to contract and be recessed in the rough grinding wheel, so that the rough grinding wheel can be used to perform rough grinding on the first square silicon rod or the second square silicon rod, and when performing fine grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform fine grinding on the first square silicon rod or the second square silicon rod.

[0145] In the silicon rod cutting and grinding machine of the present application, the grinding device includes a chamfering unit.

[0146] In certain embodiments, the grinding device includes a first chamfering unit and a second chamfering unit which are arranged on the grinding frame and correspond to the first grinding position respectively, the first chamfering unit includes a first chamfering support which is vertically movably arranged on the grinding frame and at least one pair of first chamfering grinding tools arranged on the first chamfering support, and the second chamfering unit includes a second chamfering support which is vertically movably arranged on the grinding frame and at least one pair of second chamfering grinding tools arranged on the second chamfering support.

[0147] For the first chamfering unit, the first chamfering support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a first chamfering support lifting mechanism. The first chamfering support can be lifted and lowered relative to the grinding frame by using the first chamfering support lifting mechanism. In some embodiments, the first chamfering support lifting mechanism may include: a first chamfering lifting guide rail and a first chamfering lifting drive unit, wherein the first chamfering lifting guide rail is arranged on the grinding frame in the vertical direction, and the first chamfering lifting drive unit is used to drive the first chamfering support and at least one pair of first chamfering grinding tools arranged thereon to move up and down along the first chamfering lifting guide rail.

[0148] In some embodiments, the first chamfer lifting drive unit may include a first chamfer lifting screw and a driving source, wherein the first chamfer lifting screw is arranged vertically and associated with the first chamfer support, and the driving source is used to drive the first chamfer lifting screw to rotate so that the associated first chamfer support and at least one pair of first chamfers arranged thereon are lifted and moved along the first chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the first chamfer support lifting mechanism may include: a first chamfer lifting rack, a driving gear and a driving source, wherein the first chamfer lifting rack is arranged vertically on the grinding frame and is parallel to the first chamfer lifting guide rail. The driving gear is arranged on the first chamfer support (for example, the bottom of the first chamfer support) and meshes with the first chamfer lifting rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated first chamfer grinding support and at least one first chamfering tool arranged thereon are lifted and moved along the first chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor.

[0149] The first chamfering unit includes at least one pair of first chamfering grinders. Taking a pair of first chamfering grinders as an example, the pair of first chamfering grinders may be set at an angle. For example, in a certain example, one of the first chamfering grinders in the pair of first chamfering grinders is inclined at 45° to the horizontal line or the vertical direction, and the other first chamfering grinder in the pair of first chamfering grinders is inclined at 45° to the horizontal line or the vertical direction. Of course, the above-mentioned inclination angle is not limited to this. In different embodiments, other angles may be selected. For example, the inclination angle may be any angle between 40° and 60°, and is not limited to integer degrees.

[0150] The first chamfering tool includes at least one grinding wheel. For example, in some embodiments, the first chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the first chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0151] For the second chamfering unit, the second chamfering support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a second chamfering support lifting mechanism. The second chamfering support can be lifted and lowered relative to the grinding frame by means of the second chamfering support lifting mechanism. In some embodiments, the second chamfering support lifting mechanism may include: a second chamfering lifting guide rail and a second chamfering lifting drive unit, wherein the second chamfering lifting guide rail is arranged on the grinding frame in the vertical direction, and the second chamfering lifting drive unit is used to drive the second chamfering support and at least one pair of second chamfering grinding tools arranged thereon to move up and down along the second chamfering lifting guide rail.

[0152] In some embodiments, the second chamfer lifting drive unit may include a second chamfer lifting screw and a driving source, wherein the second chamfer lifting screw is arranged vertically and associated with the second chamfer support, and the driving source is used to drive the second chamfer lifting screw to rotate so that the associated second chamfer support and at least one pair of second chamfers arranged thereon are lifted and moved along the second chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the second chamfer support lifting mechanism may include: a second chamfer lifting rack, a driving gear and a driving source, wherein the second chamfer lifting rack is arranged vertically on the grinding frame and is parallel to the second chamfer lifting guide rail. The driving gear is arranged on the second chamfer support (for example, the bottom of the second chamfer support) and meshes with the second chamfer lifting rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated second chamfer grinding support and at least one second chamfering tool arranged thereon are lifted and moved along the second chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor.

[0153] The second chamfering unit includes at least one pair of second chamfering grinders. Taking a pair of second chamfering grinders as an example, the pair of second chamfering grinders can be set at an angle. For example, in a certain example, one of the second chamfering grinders in the pair of second chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction, and the other second chamfering grinder in the pair of second chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction. Of course, the above-mentioned angle is not limited to this. In different embodiments, other angles can be selected. For example, the inclination angle can be any angle between 40° and 60°, and is not limited to integer degrees.

[0154] The second chamfering tool includes at least one grinding wheel. For example, in some embodiments, the second chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the second chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0155] In some embodiments, the grinding device includes a chamfering unit disposed on the grinding frame, and the chamfering unit includes a chamfering support disposed on the grinding frame and movable along the vertical direction and along the second direction, and at least one pair of first chamfering grinding tools disposed on the chamfering support. Figures 1 to 3 In the illustrated embodiment, the grinding device 15 includes a chamfering unit 152 , which includes a chamfering support 1521 movably disposed on the grinding frame 151 along the vertical direction and along the second direction, and at least one pair of chamfering grinding tools 1522 disposed on the chamfering support 1521 .

[0156] The chamfer support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) through a chamfer support lifting mechanism. The chamfer support can be lifted and lowered relative to the grinding frame by using the chamfer support lifting mechanism. In some embodiments, the chamfer support lifting mechanism may include: a chamfer lifting guide rail and a chamfer lifting drive unit, wherein the chamfer lifting guide rail is arranged on the grinding frame in the vertical direction, and the chamfer lifting drive unit is used to drive the chamfer support and at least one pair of chamfering tools arranged thereon to move up and down along the chamfer lifting guide rail. In some embodiments, the chamfer lifting drive unit may include a chamfer lifting screw and a driving source, wherein the chamfer lifting screw is arranged in the vertical direction and is associated with the chamfer support, and the driving source is used to drive the chamfer lifting screw to rotate so that the associated chamfer support and at least one pair of chamfers arranged thereon move up and down along the chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the chamfer support lifting mechanism may include: a chamfer lifting rack, a driving gear, and a driving source, wherein the chamfer lifting rack is vertically arranged on the grinding frame and is parallel to the chamfer lifting guide rail. The driving gear is arranged on the chamfer support (e.g., the bottom of the chamfer support) and is meshed with the chamfer lifting rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated chamfer grinding support and at least one chamfering grinding tool arranged thereon are moved up and down along the chamfer lifting guide rail. In some examples, the driving source may be, for example, a driving motor.

[0157] The chamfer support can be movably arranged on the grinding frame along the second direction through a chamfer support translation mechanism. By using the chamfer support translation mechanism, the chamfer support can be translated relative to the grinding frame so that at least one pair of chamfering tools provided on the chamfer support can be exchanged between the first grinding position and the second grinding position. In some embodiments, the chamfer support translation mechanism may include: a chamfering translation guide rail and a chamfering translation drive unit, wherein the chamfering translation guide rail is arranged on the grinding frame along the second direction, and the chamfering translation drive unit is used to drive the chamfer support and the at least one pair of chamfering tools provided thereon to translate along the chamfering translation guide rail. In some embodiments, the chamfering translation drive unit may include a chamfering translation screw and a driving source, wherein the chamfering translation screw is arranged along the second direction and is associated with the chamfer support, and the driving source is used to drive the chamfering translation screw to rotate so that the associated chamfer support and the at least one pair of chamfers provided thereon can translate along the chamfering translation guide rail. In some examples, the driving source may be, for example, a driving motor. In some embodiments, the chamfering support translation mechanism may include: a chamfering translation rack, a driving gear, and a driving source, wherein the chamfering translation rack is disposed on the grinding frame along the second direction and is parallel to the chamfering translation guide rail. The driving gear is disposed on the chamfering support (e.g., the bottom of the chamfering support) and is meshed with the chamfering translation rack. The driving source is associated with the driving wheel and is used to drive the driving wheel to rotate so that the associated chamfering grinding support and at least one chamfering grinding tool disposed thereon are translated along the chamfering translation guide rail. In some examples, the driving source may be, for example, a driving motor.

[0158] The chamfering unit includes at least one pair of chamfering grinders. Taking a pair of chamfering grinders as an example, the at least one pair of chamfering grinders may be arranged at an angle. For example, in a certain example, one of the pair of chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction, and the other chamfering grinder in the pair of chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction. Of course, the above-mentioned angle is not limited to this. In different embodiments, other angles may be selected. For example, the inclination angle may be any angle between 40° and 60°, and is not limited to integer degrees.

[0159] The chamfering tool includes at least one grinding wheel. For example, in some embodiments, the chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0160] In the present application, when the first square silicon rod or the second square silicon rod is subjected to a grinding operation, the grinding device is driven to relatively move the grinding device and the first square silicon rod supporting device or the second square silicon rod supporting device in the first direction so that the grinding device performs a grinding operation on the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device and the second square silicon rod supporting device. Therefore, in some embodiments, the grinding device is a mobile grinding device and the first square silicon rod supporting device and the second square silicon rod supporting device are fixed silicon rod supporting devices. In some embodiments, the grinding device is a fixed grinding device and the first square silicon rod supporting device and the second square silicon rod supporting device are mobile silicon rod supporting devices. In some embodiments, the grinding device is a mobile grinding device and the first square silicon rod supporting device and the second square silicon rod supporting device are mobile square silicon rod supporting devices.

[0161] Taking a mobile grinding device as an example, the grinding device includes a grinding frame travel mechanism, which drives the grinding frame and its first grinding unit and second grinding unit (also including a chamfering unit or a first chamfering unit and a second chamfering unit) to move along a first direction.

[0162] In some embodiments, the grinding frame travel mechanism includes: a grinding travel guide rail and a grinding travel drive unit, wherein the grinding travel guide rail is arranged on the machine base along a first direction, and the grinding travel drive unit is used to drive the grinding frame and the first grinding unit and the second grinding unit (also including the chamfering unit or the first chamfering unit and the second chamfering unit) arranged thereon to move along the grinding travel guide rail.

[0163] In some embodiments, the grinding travel drive unit includes a grinding travel rack, a driving gear, and a driving source. The grinding travel rack is arranged on the machine base along a first direction and is parallel to the grinding travel guide rail. The driving gear is arranged on the grinding frame (for example, the bottom of the grinding frame) and meshes with the grinding travel rack. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the grinding travel rack. Following the movement of the grinding travel rack, the grinding frame connected to the driving gear and the first grinding unit and the second grinding unit (also including the chamfering unit or the first chamfering unit and the second chamfering unit) provided therein move along the grinding travel guide rail. The driving source is, for example, a driving motor.

[0164] In some embodiments, the grinding travel drive unit includes a grinding travel screw and a drive source, wherein the grinding travel screw is arranged along a first direction and is associated with a grinding frame, and the drive source is used to drive the grinding travel screw to rotate so that the associated grinding frame and the first grinding unit and the second grinding unit (also including the chamfering unit or the first chamfering unit and the second chamfering unit) provided therein move along the grinding travel guide rail. The drive source is, for example, a drive motor.

[0165] When the grinding device is used to grind the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position, the grinding frame travel mechanism drives the grinding frame and the first grinding unit and the second grinding unit provided therein to move along the first direction so as to achieve relative movement with the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device at the first grinding position and the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting device at the second grinding position, so that the first grinding tool in the first grinding unit grinds the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device at the first grinding position, and the second grinding tool in the second grinding unit grinds the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting device at the second grinding position.

[0166] When the grinding device (single chamfering unit) is used to chamfer the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position, the grinding frame travel mechanism drives the grinding frame and the chamfering unit (assuming that the chamfering unit is currently located at the first grinding position) to move along the first direction to achieve relative movement with the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrying device at the first grinding position, so that the chamfering grinding tool in the chamfering unit can chamfer the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrying device at the first grinding position. Chamfering operation; after the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrying device completes the chamfering operation, the chamfering unit is driven to move along the second direction to switch the workstation, from the first grinding workstation to the second grinding workstation; the grinding frame travel mechanism drives the grinding frame and the chamfering unit provided thereon to move along the first direction to achieve relative movement with the first square silicon rod or the second square silicon rod carried by the second square silicon rod carrying device at the second grinding position so that the chamfering grinding tool in the chamfering unit chamfers the first square silicon rod or the second square silicon rod carried by the second square silicon rod carrying device at the second grinding position.

[0167] Alternatively, when a grinding device (double chamfering unit) is used to chamfer the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position, the grinding frame travel mechanism drives the grinding frame and the first chamfering unit and the second chamfering unit provided thereon to move in a first direction, and the first chamfering grinder in the first chamfering unit and the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrying device at the first grinding position are moved relative to each other to perform the chamfering operation, and the second chamfering grinder in the second chamfering unit chamfers the first square silicon rod or the second square silicon rod carried by the second square silicon rod carrying device at the second grinding position.

[0168] Taking the movable square silicon rod carrying device as an example, the first square silicon rod carrying device includes a first carrying platform travel mechanism, and the first carrying platform travel mechanism is used to drive the first square silicon rod carrying platform and the first square silicon rod or the second square silicon rod carried thereon to move along the first direction. The second square silicon rod carrying device includes a second carrying platform travel mechanism, and the second carrying platform travel mechanism is used to drive the second square silicon rod carrying platform and the first square silicon rod or the second square silicon rod carried thereon to move along the first direction.

[0169] In some embodiments, the first carrier platform travel mechanism includes: a first carrier platform travel guide rail and a first carrier platform travel drive unit, wherein the first carrier platform travel guide rail is arranged on the machine base along the first direction, and the first carrier platform travel drive unit is used to drive the first carrier platform and the first square silicon rod or the second square silicon rod carried by it to move along the first carrier platform travel guide rail. The second carrier platform travel mechanism includes: a second carrier platform travel guide rail and a second carrier platform travel drive unit, wherein the second carrier platform travel guide rail is arranged on the machine base along the first direction, and the second carrier platform travel drive unit is used to drive the second carrier platform and the first square silicon rod or the second square silicon rod carried by it to move along the second carrier platform travel guide rail.

[0170] In some embodiments, the first carrier platform travel drive unit includes a first carrier platform travel rack, a driving gear and a driving source. Among them, the first carrier platform silicon rod travel rack is arranged on the machine base along the first direction, parallel to the first carrier platform travel guide rail. The driving gear is arranged on the first square silicon rod carrier platform and meshes with the first carrier platform travel guide rail. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the first carrier platform travel guide rail. Following the movement of the first carrier platform travel guide rail, the first square silicon rod carrier platform connected to the driving gear and the first square silicon rod or the second square silicon rod carried by it move along the first carrier platform travel guide rail. The driving source is, for example, a driving motor.

[0171] Similarly, the second carrier platform travel drive unit includes two carrier platform travel racks, a driving gear and a driving source. Among them, the second carrier platform silicon rod travel rack is arranged on the machine base along the first direction and is parallel to the second carrier platform travel guide rail. The driving gear is arranged on the second square silicon rod carrier platform and meshes with the second carrier platform travel guide rail. The driving gear is driven to rotate by the driving source, and the gear teeth of the driving gear mesh with the second carrier platform travel guide rail. Following the movement of the second carrier platform travel guide rail, the second square silicon rod carrier platform connected to the driving gear and the first square silicon rod or the second square silicon rod carried by it move along the second carrier platform travel guide rail. The driving source is, for example, a driving motor.

[0172] In some embodiments, the first carrier platform travel drive unit includes a first carrier platform travel screw and a drive source, wherein the first carrier platform travel screw is arranged along a first direction and is associated with the first square silicon rod carrier platform, and the drive source is used to drive the first carrier platform travel screw to rotate so that the associated first square silicon rod carrier platform and the first square silicon rod or the second square silicon rod carried by it move along the first carrier platform travel guide rail. The drive source is, for example, a drive motor.

[0173] Similarly, the second carrier platform travel drive unit includes a second carrier platform travel screw and a drive source, wherein the second carrier platform travel screw is arranged along the first direction and is associated with the second square silicon rod carrier platform, and the drive source is used to drive the second carrier platform travel screw to rotate so that the associated second square silicon rod carrier platform and the first square silicon rod or the second square silicon rod carried by it move along the second carrier platform travel guide rail. The drive source is, for example, a drive motor.

[0174] When the grinding device is used to grind the first or second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position, the first carrier platform travel mechanism drives the first square silicon rod carrier platform and the first or second square silicon rod carried by it to move in the first direction to achieve relative movement with the first grinding unit in the grinding device so that the first grinding tool in the first grinding unit can grind the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrier device, and the second carrier platform travel mechanism drives the second square silicon rod carrier platform and the first square silicon rod or the second square silicon rod carried by it to move in the first direction to achieve relative movement with the second grinding unit in the grinding device so that the second grinding tool in the second grinding unit can grind the first square silicon rod or the second square silicon rod carried by the second square silicon rod carrier device.

[0175] When the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position are chamfered by the grinding device (single chamfering unit),

[0176] The first square silicon rod supporting platform and the first square silicon rod or the second square silicon rod carried by it are driven by the first supporting platform moving mechanism to move along the first direction to achieve relative movement with the chamfering unit in the grinding device (assuming that the chamfering unit is currently located in the first grinding position) so that the chamfering grinder in the chamfering unit can chamfer the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device; after the chamfering operation of the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device is completed, the chamfering unit is driven to move along the second direction to switch the workstation, from the first grinding workstation to the second grinding workstation; the second square silicon rod supporting platform and the first square silicon rod or the second square silicon rod carried by it are driven by the second supporting platform moving mechanism to move along the first direction to achieve relative movement with the chamfering unit in the grinding device so that the chamfering grinder in the chamfering unit can chamfer the first square silicon rod or the second square silicon rod carried by the second square silicon rod supporting device.

[0177] Alternatively, when a grinding device (double chamfering unit) is used to chamfer the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position, the first carrier platform travel mechanism drives the first square silicon rod carrier platform and the first square silicon rod or the second square silicon rod carried by it to move in the first direction so as to achieve relative movement with the first chamfering unit in the grinding device so that the first chamfering grinder in the first chamfering unit can chamfer the first square silicon rod or the second square silicon rod carried by the first square silicon rod carrier device, and the second carrier platform travel mechanism drives the second square silicon rod carrier platform and the first square silicon rod or the second square silicon rod carried by it to move in the first direction so as to achieve relative movement with the second chamfering unit in the grinding device so that the second chamfering grinder in the second chamfering unit can chamfer the first square silicon rod or the second square silicon rod carried by the second square silicon rod carrier device.

[0178] The structure and working principle of the above-mentioned grinding device are only exemplary, but are not limited to this.

[0179] In some embodiments, the silicon rod processing platform is provided with a first grinding position and a second grinding position, the first grinding position and the second grinding position are arranged in parallel along the second direction, and the square silicon rod cutting and grinding machine includes a first grinding device arranged at the first grinding position and a second grinding device arranged at the second grinding position. The first grinding device and the second grinding device are independent of each other, and can perform corresponding grinding operations on the first square silicon rod or the second square silicon rod on the first grinding position and the second grinding position, respectively.

[0180] In some embodiments, the first grinding device and the second grinding device may have the same structure, and the two may be respectively arranged at the first grinding position and the second grinding position in the same manner, or the two may be respectively arranged at the first grinding position and the second grinding position in a symmetrical manner. In some embodiments, the first grinding device and the second grinding device may also have different structures.

[0181] The following description will be made by taking the first grinding device and the second grinding device as an example in which the structures are the same.

[0182] The first grinding device includes a first grinding frame and a first grinding unit arranged on the first grinding frame, the first grinding unit includes a first grinding support vertically movably arranged on the first grinding frame and at least one first grinding tool arranged on the first grinding support, the at least one first grinding tool is used to grind the cut surface of the first square silicon rod or the second square silicon rod supported and clamped by the first square silicon rod supporting device.

[0183] The first grinding support can be arranged on the first grinding frame in the vertical direction (i.e., the third direction) by a first grinding support lifting mechanism. The first grinding support can be lifted and lowered relative to the first grinding frame by using the first grinding support lifting mechanism. In some embodiments, the first grinding support lifting mechanism may include: a first grinding lifting guide rail and a first grinding lifting drive unit, wherein the first grinding lifting guide rail is arranged on the first grinding frame in the vertical direction, and the first grinding lifting drive unit is used to drive the first grinding support and at least one first grinding tool arranged thereon to move up and down along the first grinding lifting guide rail. In some embodiments, the first grinding lifting drive unit may include a first grinding lifting screw and a driving source. For the structure and working principle of the first grinding lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the first grinding support lifting mechanism may include: a first grinding lifting rack, a driving gear and a driving source. For the structure and working principle of the first grinding lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0184] The first grinding tool includes at least one grinding wheel. For example, in some embodiments, the grinding device includes a first grinding tool, the first grinding tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the grinding device may include two first grinding tools arranged along the first direction, each of which includes a grinding wheel, for example, the first grinding tool in front includes a rough grinding wheel, and the first grinding tool in the back includes a fine grinding wheel. In some embodiments, the grinding device includes a first grinding tool, the first grinding tool includes a rough grinding wheel and a fine grinding wheel nested in each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0185] The second grinding device includes a second grinding frame and a second grinding unit arranged on the second grinding frame, the second grinding unit includes a second grinding support vertically movably arranged on the second grinding frame and at least one second grinding tool arranged on the second grinding support, and the at least one second grinding tool is used to grind the cut surface of the first square silicon rod or the second square silicon rod supported and clamped by the second square silicon rod supporting device.

[0186] The second grinding support can be arranged on the second grinding frame in the vertical direction (i.e., the third direction) by a second grinding support lifting mechanism. The second grinding support can be lifted and lowered relative to the second grinding frame by using the second grinding support lifting mechanism. In some embodiments, the second grinding support lifting mechanism may include: a second grinding lifting guide rail and a second grinding lifting drive unit, wherein the second grinding lifting guide rail is arranged on the second grinding frame in the vertical direction, and the second grinding lifting drive unit is used to drive the second grinding support and at least one second grinding tool arranged thereon to move up and down along the second grinding lifting guide rail. In some embodiments, the second grinding lifting drive unit may include a second grinding lifting screw and a driving source. For the structure and working principle of the second grinding lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the second grinding support lifting mechanism may include: a second grinding lifting rack, a driving gear and a driving source. For the structure and working principle of the second grinding lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0187] The second grinding tool includes at least one grinding wheel. For example, in some embodiments, the grinding device includes a second grinding tool, the second grinding tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the grinding device may include two second grinding tools arranged along the first direction, each second grinding tool includes a grinding wheel, for example, the front second grinding tool includes a rough grinding wheel, and the rear second grinding tool includes a fine grinding wheel. In some embodiments, the grinding device includes a second grinding tool, the second grinding tool includes a rough grinding wheel and a fine grinding wheel nested in each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0188] In the silicon rod cutting and grinding machine of the present application, the grinding device includes a chamfering unit.

[0189] In some embodiments, the first grinding device includes a first chamfering unit provided on the first grinding frame, the first chamfering unit includes a first chamfering support provided on the first grinding frame in a vertical direction and at least one pair of first chamfering grinding tools provided on the first chamfering support. The second grinding device includes a second chamfering unit provided on the second grinding frame, the second chamfering unit includes a second chamfering support provided on the second grinding frame in a vertical direction and at least one pair of second chamfering grinding tools provided on the second chamfering support.

[0190] For the first chamfering unit, the first chamfering support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a first chamfering support lifting mechanism. The first chamfering support can be lifted and lowered relative to the grinding frame by using the first chamfering support lifting mechanism. In some embodiments, the first chamfering support lifting mechanism may include: a first chamfering lifting guide rail and a first chamfering lifting drive unit, wherein the first chamfering lifting guide rail is arranged on the grinding frame in the vertical direction, and the first chamfering lifting drive unit is used to drive the first chamfering support and at least one pair of first chamfering grinding tools arranged thereon to move up and down along the first chamfering lifting guide rail. In some embodiments, the first chamfering lifting drive unit may include a first chamfering lifting screw and a driving source. For the structure and working principle of the first chamfering lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the first chamfering support lifting mechanism may include: a first chamfering lifting rack, a driving gear and a driving source. For the structure and working principle of the first chamfering lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0191] The first chamfering unit includes at least one pair of first chamfering grinders. Taking a pair of first chamfering grinders as an example, the pair of first chamfering grinders may be set at an angle. For example, in a certain example, one of the first chamfering grinders in the pair of first chamfering grinders is inclined at 45° to the horizontal line or the vertical direction, and the other first chamfering grinder in the pair of first chamfering grinders is inclined at 45° to the horizontal line or the vertical direction. Of course, the above-mentioned inclination angle is not limited to this. In different embodiments, other angles may be selected. For example, the inclination angle may be any angle between 40° and 60°, and is not limited to integer degrees.

[0192] The first chamfering tool includes at least one grinding wheel. For example, in some embodiments, the first chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the first chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0193] For the second chamfering unit, the second chamfering support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by a second chamfering support lifting mechanism. The second chamfering support can be lifted and lowered relative to the grinding frame by using the second chamfering support lifting mechanism. In some embodiments, the second chamfering support lifting mechanism may include: a second chamfering lifting guide rail and a second chamfering lifting drive unit, wherein the second chamfering lifting guide rail is arranged on the grinding frame in the vertical direction, and the second chamfering lifting drive unit is used to drive the second chamfering support and at least one pair of second chamfering grinding tools arranged thereon to move up and down along the second chamfering lifting guide rail. In some embodiments, the second chamfering lifting drive unit may include a second chamfering lifting screw and a driving source. For the structure and working principle of the first chamfering lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the second chamfering support lifting mechanism may include: a second chamfering lifting rack, a driving gear and a driving source. For the structure and working principle of the first chamfering lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0194] The second chamfering unit includes at least one pair of second chamfering grinders. Taking a pair of second chamfering grinders as an example, the pair of second chamfering grinders can be set at an angle. For example, in a certain example, one of the second chamfering grinders in the pair of second chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction, and the other second chamfering grinder in the pair of second chamfering grinders is at an angle of 45° to the horizontal line or the vertical direction. Of course, the above-mentioned angle is not limited to this. In different embodiments, other angles can be selected. For example, the inclination angle can be any angle between 40° and 60°, and is not limited to integer degrees.

[0195] The second chamfering tool includes at least one grinding wheel. For example, in some embodiments, the second chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the second chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0196] In some embodiments, the first grinding device and the second grinding device are mobile grinding devices.

[0197] The first grinding device includes a first grinding frame travel mechanism, and the first grinding frame and the first grinding unit (including the first chamfering unit) provided therein are driven to move along the first direction by the first grinding frame travel mechanism.

[0198] In some embodiments, the first grinding frame travel mechanism includes: a first grinding travel guide rail and a first grinding travel drive unit, wherein the first grinding travel guide rail is arranged on the machine base along the first direction, and the first grinding travel drive unit is used to drive the first grinding frame and the first grinding unit (also including the first chamfering unit) provided therein to move along the first grinding travel guide rail. In some embodiments, the first grinding travel drive unit includes a first grinding travel rack, a driving gear and a driving source. For the structure and working principle of the first grinding lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the first grinding travel drive unit includes a first grinding travel screw and a driving source. For the structure and working principle of the first grinding travel screw and the driving source, please refer to the above description, which will not be repeated here.

[0199] The second grinding device includes a second grinding frame travel mechanism, and the second grinding frame and the second grinding unit (including the second chamfering unit) provided therein are driven to move along the first direction by the second grinding frame travel mechanism.

[0200] In some embodiments, the second grinding frame travel mechanism includes: a second grinding travel guide rail and a second grinding travel drive unit, wherein the second grinding travel guide rail is arranged on the machine base along the first direction, and the second grinding travel drive unit is used to drive the second grinding frame and the second grinding unit (also including the second chamfering unit) provided thereto to move along the second grinding travel guide rail. In some embodiments, the second grinding travel drive unit includes a second grinding travel rack, a driving gear and a driving source. For the structure and working principle of the second grinding lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the second grinding travel drive unit includes a second grinding travel screw and a driving source. For the structure and working principle of the second grinding travel screw and the driving source, please refer to the above description, which will not be repeated here.

[0201] In some embodiments, the silicon rod processing platform is provided with a first grinding position and a second grinding position, the first grinding position and the second grinding position are arranged along a first direction, and the square silicon rod cutting and grinding machine includes a grinding device, and the grinding device is used to grind the first square silicon rod or the second square silicon rod at the first grinding position and the first square silicon rod or the second square silicon rod at the second grinding position.

[0202] In this embodiment, the grinding area and the cutting area are arranged in parallel along the second direction, wherein the first grinding area and the second grinding area in the grinding area are arranged front and back along the first direction.

[0203] In some embodiments, a first square silicon rod supporting device is provided at the first grinding position, and a second square silicon rod supporting device is provided at the second grinding position, that is, the first square silicon rod supporting device and the second square silicon rod supporting device are arranged front and back along the first direction.

[0204] In some embodiments, the first square silicon rod supporting device includes a first square silicon rod supporting platform and a first square silicon rod clamping mechanism, and the second square silicon rod supporting device includes a second square silicon rod supporting platform and a second square silicon rod clamping mechanism. The structures and working principles of the first square silicon rod supporting platform and the first square silicon rod clamping mechanism in the first square silicon rod supporting device and the second square silicon rod supporting platform and the second square silicon rod clamping mechanism in the second square silicon rod supporting device can be found in the above description and will not be repeated here.

[0205] In some embodiments, the first square silicon rod supporting device and the second square silicon rod supporting device are movable silicon rod supporting devices.

[0206] The first square silicon rod bearing device includes a first bearing platform travel mechanism, and the first bearing platform travel mechanism is used to drive the first square silicon rod bearing platform and the first square silicon rod or the second square silicon rod carried thereon to move along the first direction. The second square silicon rod bearing device includes a second bearing platform travel mechanism, and the second bearing platform travel mechanism is used to drive the second square silicon rod bearing platform and the first square silicon rod or the second square silicon rod carried thereon to move along the first direction.

[0207] In some embodiments, the first carrier platform travel mechanism includes: a first carrier platform travel guide rail and a first carrier platform travel drive unit, wherein the first carrier platform travel guide rail is arranged on the machine base along the first direction, and the first carrier platform travel drive unit is used to drive the first carrier platform and the first square silicon rod or the second square silicon rod carried by it to move along the first carrier platform travel guide rail. For the structure and working principle of the first carrier platform travel drive unit in the first carrier platform travel mechanism, please refer to the above description, which will not be repeated here.

[0208] Similarly. The second carrier platform travel mechanism includes: a second carrier platform travel guide rail and a second carrier platform travel drive unit, wherein the second carrier platform travel guide rail is arranged on the machine base along the first direction, and the second carrier platform travel drive unit is used to drive the second carrier platform and the first square silicon rod or the second square silicon rod carried by it to move along the second carrier platform travel guide rail. For the structure and working principle of the second carrier platform travel drive unit in the second carrier platform travel mechanism, please refer to the previous description, which will not be repeated here.

[0209] In some embodiments, the first loading platform travel guide rail in the first loading platform travel mechanism and the second loading platform travel guide rail in the second loading platform travel mechanism are a common structure.

[0210] In some embodiments, the grinding device includes a grinding frame and a grinding unit disposed on the grinding frame, and the grinding unit includes a grinding support vertically movably disposed on the grinding frame and at least one grinding tool disposed on the grinding support.

[0211] For the grinding unit, the grinding support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) by means of a grinding support lifting mechanism. The grinding support can be lifted and lowered relative to the grinding frame by means of the grinding support lifting mechanism. In some embodiments, the grinding support lifting mechanism may include: a grinding lifting guide rail and a grinding lifting drive unit, wherein the grinding lifting guide rail is arranged on the grinding frame in the vertical direction, and the grinding lifting drive unit is used to drive the grinding support and at least one grinding tool arranged thereon to be lifted and lowered along the grinding lifting guide rail.

[0212] In some embodiments, the grinding lifting drive unit may include a grinding lifting screw and a driving source. For the structure and working principle of the grinding lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the grinding support lifting mechanism may include: a grinding lifting rack, a driving gear and a driving source. For the structure and working principle of the grinding lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0213] The grinding tool includes at least one grinding wheel. For example, in some embodiments, the grinding device includes a grinding tool, the grinding tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the grinding device may include two grinding tools arranged along a direction, each grinding tool includes a grinding wheel, for example, the front grinding tool includes a rough grinding wheel, and the rear grinding tool includes a fine grinding wheel. In some embodiments, the grinding device includes a grinding tool, the grinding tool includes a rough grinding wheel and a fine grinding wheel nested in each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. Wherein, the abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0214] In the silicon rod cutting and grinding machine of the present application, the grinding device includes a chamfering unit.

[0215] In some embodiments, the grinding device includes a chamfering unit disposed on the grinding frame, and the chamfering unit includes a chamfering support movably disposed on the grinding frame in a vertical direction and at least one pair of chamfering grinding tools disposed on the chamfering support.

[0216] For the chamfering unit, the chamfering support can be arranged on the grinding frame in the vertical direction (i.e., the third direction) through a chamfering support lifting mechanism. The chamfering support can be lifted and lowered relative to the grinding frame by using the chamfering support lifting mechanism. In some embodiments, the chamfering support lifting mechanism may include: a chamfering lifting guide rail and a chamfering lifting drive unit, wherein the chamfering lifting guide rail is arranged on the grinding frame in the vertical direction, and the chamfering lifting drive unit is used to drive the chamfering support and at least one pair of chamfering grinding tools arranged thereon to move up and down along the chamfering lifting guide rail. In some embodiments, the chamfering lifting drive unit may include a chamfering lifting screw and a driving source. For the structure and working principle of the chamfering lifting screw and the driving source, please refer to the above description, which will not be repeated here. In some embodiments, the chamfering support lifting mechanism may include: a chamfering lifting rack, a driving gear and a driving source. For the structure and working principle of the chamfering lifting rack, the driving gear and the driving source, please refer to the above description, which will not be repeated here.

[0217] The chamfering unit includes at least one pair of chamfering grinders. Taking a pair of chamfering grinders as an example, the pair of chamfering grinders may be arranged at an angle. For example, in a certain example, one of the pair of chamfering grinders is inclined at 45° to the horizontal line or the vertical direction, and the other chamfering grinder in the pair of chamfering grinders is inclined at 45° to the horizontal line or the vertical direction. Of course, the above-mentioned inclination angle is not limited to this. In different embodiments, other angles may be selected. For example, the inclination angle may be any angle between 40° and 60°, and is not limited to integer degrees.

[0218] The chamfering tool includes at least one grinding wheel. For example, in some embodiments, the chamfering tool includes a grinding wheel, and the grinding wheel is a rough grinding wheel or a fine grinding wheel. In some embodiments, the chamfering tool includes a rough grinding wheel and a fine grinding wheel nested with each other, for example, the rough grinding wheel is nested in the fine grinding wheel, or, the fine grinding wheel is nested in the rough grinding wheel. The abrasive grain size of the fine grinding wheel is smaller than the abrasive grain size of the rough grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than the abrasive grain density of the rough grinding wheel.

[0219] The silicon rod cutting and grinding machine of the present application includes a feeding and conveying device, which is arranged at the loading area and is used to convey the original silicon rods to be processed. Figures 1 to 3 In the embodiment shown, the square silicon rod cutting and grinding machine may include a loading and conveying device 18, which may be, for example, a conveyor belt device, including a conveyor belt, which is wound around two conveyor rollers arranged opposite to each other in the front and rear, and at least one of the two conveyor rollers is connected to a loading drive source, which may be, for example, a servo motor. The loading and conveying device can be used to load the original square silicon rods, for example, to the cutting area.

[0220] The square silicon rod cutting and grinding machine of the present application includes a material unloading and conveying device, which is arranged at the unloading area and is used to convey the first square silicon rod and the second square silicon rod that have been processed. Figures 1 to 3 In the illustrated embodiment, the square silicon rod cutting and grinding machine may include a material unloading conveying device 19, which may be, for example, a conveyor belt device, including a conveyor belt, which is wound around two conveyor rollers arranged opposite to each other in the front and rear, and at least one of the two conveyor rollers is connected to a material unloading driving source, which may be, for example, a servo motor. The material unloading conveying device can be used to unload the first square silicon rod or the second square silicon rod that has completed the grinding operation from the grinding area.

[0221] In some embodiments, the loading conveying device and the unloading conveying device are a common structure.

[0222] Furthermore, in the square silicon rod cutting and grinding machine of the present application, a silicon rod cleaning device may also be included. The silicon rod cleaning device may be arranged on the machine base, and is used to clean the first square silicon rod and the second square silicon rod. With respect to the silicon rod cleaning device, generally, after the silicon rod undergoes the above-mentioned processing operation, the cutting debris generated during the operation will adhere to the surface of the first square silicon rod and the second square silicon rod. Therefore, when necessary, it is necessary to perform necessary cleaning on the first square silicon rod and the second square silicon rod. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device that cooperates with the cleaning brush head. During cleaning, the cleaning liquid spraying device sprays the cleaning liquid on the first square silicon rod or the second square silicon rod, and at the same time, the cleaning brush head is driven by a motor to act on the first square silicon rod or the second square silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid may be, for example, pure water, and the cleaning brush head may be, for example, a rotating brush head.

[0223] The following is a description of the execution process of the square silicon rod cutting and grinding machine in the above embodiment in conjunction with the accompanying drawings:

[0224] First, use the loading conveyor device 18 and the silicon rod transfer device 17 to transfer the original silicon rod 100 to be processed and place it on the first silicon rod supporting clamp and the second silicon rod supporting clamp in the silicon rod supporting clamp 12 at the cutting position (at this time, the first silicon rod supporting clamp and the second silicon rod supporting clamp are separated from each other). After the original silicon rod 100 is placed, the supporting clamp driving mechanism in the silicon rod supporting clamp 12 drives the first silicon rod supporting clamp and the second silicon rod supporting clamp to move toward each other (approach each other) to clamp the original silicon rod 100 therebetween. Among them, the axis of the original silicon rod 100 is consistent with the first direction. Forming Figure 7 The status shown, Figure 7 It is a schematic diagram showing the state of the original square silicon rod being clamped by the silicon rod supporting and clamping device in the present application.

[0225] The cutting device 13 is used to perform vertical cutting operation on the original silicon rod 100 at the cutting position. The cutting wire driving device drives the cutting wire to run along the winding direction. The cutting frame travel mechanism drives the cutting frame 131 and the cutting unit provided therein to move along the first direction toward the silicon rod supporting and clamping device 12 so that the cutting wire saw 134 in the cutting unit vertically cuts the original silicon rod 100 until the cutting wire saw 134 passes through the original silicon rod 100, so as to cut the original silicon rod 100 into a first square silicon rod 101 and a second square silicon rod 102 arranged in parallel along the second direction. Figure 8 The status shown, Figure 8 It is a schematic diagram showing the state of a cutting device in one embodiment of the present application cutting a raw silicon rod.

[0226] Among them, when the grinding device is used to perform vertical cutting operations on the original square silicon rod, the nozzle of the spray device sprays cutting liquid on the cutting seam formed when the cutting wire saw cuts the silicon rod. Due to the vertical cutting operation adopted, the cutting seam formed by the cutting wire saw cutting the original square silicon rod is located between the first square silicon rod and the second square silicon rod, and the three are arranged in parallel along the second direction. The cutting seam can avoid being excessively squeezed by the first square silicon rod or the second square silicon rod (the cutting seam is opened by the inner cutting wire saw), and the cutting liquid can effectively penetrate into the opened cutting seam and act on the cutting wire saw, which is not only conducive to cutting, but also improves cutting efficiency and cutting quality, and can also effectively cool the cutting wire saw.

[0227] Subsequently, the supporting clamp driving mechanism in the silicon rod supporting clamp device 12 drives the first silicon rod supporting clamp and the second silicon rod supporting clamp to move in opposite directions (away from each other), separates the first square silicon rod 101 supported by the first silicon rod supporting clamp and the second square silicon rod 102 supported by the second silicon rod supporting clamp, and drives the cutting frame 131 and its cutting unit to retreat in the first direction (move away from the silicon rod supporting clamp device 12) by the cutting frame travel mechanism. Since the first silicon rod supporting clamp and the first square silicon rod 101 supported by it and the second silicon rod supporting clamp and the second square silicon rod 102 supported by it are separated from each other, the cutting frame and its cutting unit (including the cutting wire saw) can retreat to the original position without hindrance.

[0228] The first square silicon rod 101 and the second square silicon rod 102 are transported to the first grinding area and the second grinding area respectively by the silicon rod transporting device 17, so that the first square silicon rod 101 and the second square silicon rod 102 on the first grinding area are supported and clamped by the first square silicon rod supporting device 161 at the first grinding area and the second square silicon rod supporting device 162 at the second grinding area. Fig. 9 The status shown, Fig. 9 It is a schematic diagram showing the state of a silicon rod transfer device in one embodiment of the present application transferring a square silicon rod to a grinding area.

[0229] Among them, taking the transfer of the first square silicon rod to the first grinding area as an example, the transfer translation mechanism is used to drive the transfer clamp to move on the transfer mounting frame along the second direction to the first silicon rod supporting clamp in the cutting area; the transfer lifting mechanism is used to drive the transfer clamp to descend vertically so that a pair of clamping arms of the transfer clamp are located at both ends of the first square silicon rod; the clamping arm driving mechanism is used to drive a pair of clamping arms to move toward each other to clamp the first square silicon rod; the transfer lifting mechanism and the transfer translation mechanism are then used to drive the transfer clamp and the first square silicon rod clamped therein to be transferred to the top of the first square silicon rod carrying device; the clamping portion rotation mechanism is used to drive The clamping portion on the clamping arm rotates (for example, 90° counterclockwise or clockwise), driving the first square silicon rod to rotate (for example, 90° counterclockwise or clockwise), so that the cut surface (vertical section) of the first square silicon rod turns from vertical to horizontal upward; the transport lifting mechanism is used to drive the transport fixture to descend vertically until the first square silicon rod is placed on the first square silicon rod supporting device, and the clamping arm driving mechanism is used to drive a pair of clamping arms to move back to back to release the first square silicon rod; the first square silicon rod clamping mechanism on the first square silicon rod supporting device is used to clamp the first square silicon rod carried by the first square silicon rod supporting platform.

[0230] The first square silicon rod located at the first grinding position and the second square silicon rod located at the second grinding position are ground by a grinding device, wherein the grinding operation includes grinding and chamfering of the cut surface. Fig.10 and Fig.11 The state shown, where Fig.10 It is a schematic diagram showing the state of grinding the square silicon rod in the grinding area in one embodiment of the present application. Fig.11 It is a schematic diagram showing a state of chamfering a square silicon rod located in a grinding area in one embodiment of the present application.

[0231] like Fig.10 As shown, when the first square silicon rod located in the first grinding position and the second square silicon rod located in the second grinding position are ground by the grinding device, the first square silicon rod supporting device 161 and the first square silicon rod or the second square silicon rod supported by it are driven, and the second square silicon rod supporting device 162 and the first square silicon rod or the second square silicon rod supported by it are driven to move toward the grinding device 15, so that the first grinding unit 153 in the grinding device 15 grinds the first square silicon rod supporting device 161 and the first square silicon rod or the second square silicon rod supported by it, and the second grinding unit 154 in the grinding device 15 grinds the second square silicon rod supporting device 162 and the first square silicon rod or the second square silicon rod supported by it.

[0232] like Fig.11As shown, when the grinding device is used to perform chamfering operations on the first square silicon rod located at the first grinding position and the second square silicon rod located at the second grinding position, assuming that the chamfering unit 152 is currently located at the first grinding position, the first square silicon rod supporting device 161 and the first square silicon rod or the second square silicon rod carried by it are driven to move toward the grinding device 15, and the chamfering unit 152 in the grinding device 15 performs chamfering operations on the first square silicon rod supporting device 161 and the first square silicon rod or the second square silicon rod carried by it; after completing the chamfering operation of the first square silicon rod or the second square silicon rod carried by the first square silicon rod supporting device 161, the chamfering unit 152 is driven to move along the second direction to transfer from the first grinding position to the second grinding position; the second square silicon rod supporting device 162 and the first square silicon rod or the second square silicon rod carried by it are driven to move toward the grinding device 15, so that the chamfering unit 152 in the grinding device 15 performs chamfering operations on the second square silicon rod supporting device 162 and the first or second square silicon rod carried by it.

[0233] In addition, while the grinding device 15 is used to grind the first square silicon rod 101 and the second square silicon rod 102 , the cutting device 13 can be used to vertically cut the new original square silicon rod 100 .

[0234] Finally, the first square silicon rod and the second square silicon rod after the grinding operation are transferred to the unloading conveying device by using the silicon rod transfer device and then unloaded.

[0235] The square silicon rod cutting and grinding machine disclosed in the present application comprises a machine base, a cutting device, a silicon rod transfer device and a grinding device, wherein the cutting device and the grinding device are separated on the left and the right. The cutting device can be used to vertically cut the horizontally placed original square silicon rod to form a first square silicon rod and a second square silicon rod parallel to the left and the right. The grinding device can be used to grind the first square silicon rod and the second square silicon rod formed after the vertical cutting, thereby completing the integrated operation of cutting the original square silicon rod in half and grinding multiple processes, thereby improving the production efficiency and the quality of product processing operations.

[0236] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes that are generally or at least accomplished by those skilled in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A square silicon rod cutting and grinding machine, characterized in that: include: The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a cutting area and a grinding area; A cutting device, arranged at a cutting area of ​​the silicon rod processing platform, for vertically cutting the original square silicon rod horizontally placed at the cutting area to form a first square silicon rod and a second square silicon rod arranged in parallel along a second direction; The original silicon rod is a silicon rod with a rectangular cross section, and the axis of the original silicon rod is consistent with the first direction; The second direction is perpendicular to the first direction and forms a horizontal plane with the first direction; A grinding device, disposed in a grinding area of ​​the silicon rod processing platform, for performing grinding operations and / or chamfering operations related to the cutting surface on the first square silicon rod and the second square silicon rod placed horizontally in the grinding area; as well as The silicon rod transfer device is used to transfer the first square silicon rod and the second square silicon rod located at the cutting position to the grinding position.

2. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The cutting device includes a cutting frame and a cutting unit arranged on the cutting frame, the cutting unit includes a plurality of cutting wheels and a cutting wire, the plurality of cutting wheels are arranged on the cutting frame, the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw, the at least one cutting wire saw has a cutting angle with the vertical, and the cutting angle is less than or equal to ±45°.

3. The square silicon rod cutting and grinding machine according to claim 2, characterized in that: The cutting wire is wound around the plurality of cutting wheels to form a closed loop cutting wire connected end to end.

4. The square silicon rod cutting and grinding machine according to claim 2, characterized in that: The cutting device comprises a cutting frame travel mechanism, including: A cutting travel guide rail is disposed on the machine base along a first direction; and The cutting travel driving unit is used to drive the cutting frame and the cutting unit provided thereon to move along the cutting travel guide rail.

5. The square silicon rod cutting and grinding machine according to claim 2, characterized in that: The invention comprises a silicon rod supporting and clamping device which is arranged at the cutting area of ​​the silicon rod processing platform and is used for supporting and clamping the original square silicon rod placed horizontally at the cutting area.

6. The square silicon rod cutting and grinding machine according to claim 5, characterized in that: The silicon rod supporting and clamping device comprises: A first silicon rod supporting clamp and a second silicon rod supporting clamp are arranged opposite to each other along a second direction; a silicon rod storage space is provided between the first silicon rod supporting clamp and the second silicon rod supporting clamp; and The supporting and clamping member driving mechanism is used to drive the first silicon rod supporting and clamping member and the second silicon rod supporting and clamping member to move toward or away from each other along the second direction.

7. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod processing platform is provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged in parallel along a second direction. The grinding device includes a grinding frame and a first grinding unit arranged on the grinding frame and corresponding to the first grinding position and a second grinding unit corresponding to the second grinding position respectively. The first grinding unit includes a first grinding support vertically movably arranged on the grinding frame and at least one first grinding surface grinding tool arranged on the first grinding support. The second grinding unit includes a second grinding support vertically movably arranged on the grinding frame and at least one second grinding surface grinding tool arranged on the second grinding support.

8. The square silicon rod cutting and grinding machine according to claim 7, characterized in that: The grinding device includes a first chamfering unit and a second chamfering unit which are arranged on the grinding frame and correspond to the first grinding position respectively, the first chamfering unit includes a first chamfering support which is vertically movably arranged on the grinding frame and at least one pair of first chamfering grinding tools arranged on the first chamfering support, and the second chamfering unit includes a second chamfering support which is vertically movably arranged on the grinding frame and at least one pair of second chamfering grinding tools arranged on the second chamfering support.

9. The square silicon rod cutting and grinding machine according to claim 7, characterized in that: The grinding device comprises a chamfering unit arranged on the grinding frame, and the chamfering unit comprises a chamfering support arranged on the grinding frame and movable along the vertical direction and along the second direction, and at least one pair of chamfering grinding tools arranged on the chamfering support.

10. The square silicon rod cutting and grinding machine according to claim 7, characterized in that: The grinding device comprises a grinding frame travel mechanism, including: A grinding travel guide rail is disposed on the machine base along a first direction; and The grinding travel driving unit is used to drive the grinding frame and the first grinding unit and the second grinding unit provided thereon to move along the grinding travel guide rail.

11. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod processing platform is provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged in parallel along the second direction. The square silicon rod cutting and grinding machine includes a first grinding device arranged at the first grinding position and a second grinding device arranged at the second grinding position. The first grinding device includes a first grinding frame and a first grinding unit arranged on the first grinding frame. The first grinding unit includes a first grinding support vertically movable on the first grinding frame and at least one first grinding surface grinding tool arranged on the first grinding support. The second grinding device includes a second grinding frame and a second grinding unit arranged on the second grinding frame. The second grinding unit includes a second grinding support vertically movable on the second grinding frame and at least one second grinding surface grinding tool arranged on the second grinding support.

12. The square silicon rod cutting and grinding machine according to claim 11, characterized in that: The first grinding device includes a first chamfering unit arranged on the first grinding frame, the first chamfering unit includes a first chamfering support vertically movably arranged on the first grinding frame and at least one pair of first chamfering grinding tools arranged on the first chamfering support, and the second grinding device includes a second chamfering unit arranged on the second grinding frame, the second chamfering unit includes a second chamfering support vertically movably arranged on the second grinding frame and at least one pair of second chamfering grinding tools arranged on the second chamfering support.

13. The square silicon rod cutting and grinding machine according to claim 11, characterized in that: The first grinding device includes a first grinding frame travel mechanism, including: a first grinding travel guide rail, which is arranged on the machine base along the first direction; a first grinding travel drive unit, which is used to drive the first grinding frame and the first grinding unit provided thereon to move along the first grinding travel guide rail; the second grinding device includes a second grinding frame travel mechanism, including: a second grinding travel guide rail, which is arranged on the machine base along the first direction; a second grinding travel drive unit, which is used to drive the second grinding frame and the second grinding unit provided thereon to move along the second grinding travel guide rail.

14. The square silicon rod cutting and grinding machine according to claim 7 or 11, characterized in that: It comprises a first square silicon rod supporting device arranged at a first grinding area and a second square silicon rod supporting device arranged at a second grinding area.

15. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod processing platform is provided with a first grinding position and a second grinding position, and the first grinding position and the second grinding position are arranged along a first direction. The square silicon rod cutting and grinding machine includes a grinding device, and the grinding device includes a grinding frame and a grinding unit arranged on the grinding frame. The grinding unit includes a grinding support vertically movably arranged on the grinding frame and at least one grinding tool arranged on the grinding support.

16. The square silicon rod cutting and grinding machine according to claim 15, characterized in that: The grinding device comprises a chamfering unit arranged on the grinding frame, and the chamfering unit comprises a chamfering support movably arranged on the grinding frame along the vertical direction and at least one pair of chamfering grinding tools arranged on the chamfering support.

17. The square silicon rod cutting and grinding machine according to claim 15, characterized in that: The grinding device comprises a grinding frame travel mechanism, including: a grinding travel guide rail, which is arranged on the machine base along a first direction; and a grinding travel driving unit, which is used to drive the grinding frame and the grinding unit arranged thereon to move along the grinding travel guide rail.

18. The square silicon rod cutting and grinding machine according to claim 15, characterized in that: It comprises a first square silicon rod supporting device arranged at a first grinding area and a second square silicon rod supporting device arranged at a second grinding area.

19. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The silicon rod transport device comprises: Transshipment mounting frame; The transfer fixture comprises a clamp seat, at least one pair of clamp arms arranged along a first direction on opposite sides of the clamp seat, and a clamp arm driving mechanism, wherein the at least one pair of clamp arms is provided with a clamping portion and a clamping portion rotating mechanism; A transfer lifting mechanism, used for driving the transfer fixture to be lifted vertically on the transfer mounting frame; and The transfer translation mechanism is used to drive the transfer fixture to move along the second direction on the transfer mounting frame.

20. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: include: A feeding and conveying device is used to convey the original square silicon rods to be processed; as well as The unloading conveying device is used to convey the processed first square silicon rods and the second square silicon rods.

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