Chip processing gluing equipment

Abstract

The utility model relates to the technical field of chip processing, in particular to chip processing gluing equipment which comprises a supporting plate, connecting plates are fixedly connected to shaft bodies at the front ends of a threaded sleeve shaft and a sliding sleeve shaft, two extension plates are fixed to one sides of the two connecting plates, roller brushes are embedded between every two extension plates, and the roller brushes are connected with the supporting plate. A glue injection cabin penetrates through the center of the supporting plate, a first chip clamping groove is fixedly connected to the bottom of the glue injection cabin, a second chip clamping groove is formed in the first chip clamping groove in a sliding mode, a chip plate is embedded in the second chip clamping groove, a first plate groove is formed in the upper end of the second chip clamping groove, first arc groove plates are fixed to the two sides in the first plate groove, and a second plate groove is formed in the lower end of the first plate groove. Glue liquid is distributed to the upper ends of the two ends of the chip plate by opening the valves, the motor rotates to drive the threaded rod to rotate so that the connecting plate and the roller brush can roll up and down on the chip plate, the two faces of the chip can be evenly glued at the same time, and the working efficiency and the chip quality are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip processing glue coating device. Background Art

[0002] The purpose of chip processing and gluing is to protect the chip surface from the influence of the external environment and prevent dust, moisture, etc. from entering the inside of the chip, thereby affecting the normal operation of the chip. Gluing can also improve the wear resistance and corrosion resistance of the chip, extend the service life of the chip, and ensure that the connection between the chip and other components is firm and stable.

[0003] The conventional method of gluing chips is to manually apply glue to one side of the chip, wait for the glue to solidify on the chip surface, and then manually turn the chip over to apply glue again on the other side.

[0004] The existing manually operated equipment for applying glue needs to solidify the glue on the other side before flipping, which not only reduces the work efficiency, but also the glue on the other side may not be completely solidified and is located at the bottom after the chip is flipped. When squeezed by the machine, it is easy to cause the glue that has been applied to be unevenly applied, affecting the quality of the chip. Therefore, a chip processing glue coating equipment is proposed to address the above problems. Utility Model Content

[0005] In order to make up for the deficiencies of the prior art and address the problems existing in the prior art equipment, the utility model provides a chip processing glue coating equipment.

[0006] The technical solution adopted by the utility model to solve its technical problems is a chip processing and gluing equipment, comprising: a support plate, motors are fixed on both sides of the upper surface of the support plate, two motor output ends are fixed with threaded rods, the motor output ends pass through the support plate and are connected with the threaded rods, support rods are fixed on both sides of the lower end surface of the support plate, the two threaded rods and the bottom of the support rods are fixed with a support bottom plate, the upper end shafts of the two threaded rods are sleeved with threaded sleeves, the upper end shafts of the two support rods are sleeved with sliding sleeves, the threaded sleeves and the front end shafts of the sliding sleeves are fixedly connected with connecting plates, two extension plates are fixed on one side of the two connecting plates, and roller brushes are embedded between the four extension plates, a glue injection cabin is penetrated at the center of the support plate, the bottom of the glue injection cabin is fixedly connected with a first chip slot, and the first chip slot is fixedly connected with the first chip slot. A second chip slot is slidably arranged in a chip slot, a chip board is embedded in the second chip slot, special-shaped slots are arranged in the second chip slot at the four corners of the front and rear end surfaces of the chip board, rotating shafts are embedded in the eight special-shaped slots, and blocking rods are fixed on the shaft bodies of the eight rotating shafts close to the chip board, a first plate slot is arranged at the upper end of the second chip slot, first arc slot plates are fixed on both sides of the first plate slot, the chip board is put into the second chip slot and slid into the first chip slot, the valve is opened to divert the glue liquid to the upper ends of both sides of the chip board, the motor is started, the threaded rod is driven to rotate, the threaded sleeve shaft is moved up and down, the connecting plate and the roller brush are driven to move up and down, so that the roller brush evenly applies the glue liquid on both sides of the chip board, which not only improves the work efficiency, but also effectively avoids damage to the glue injection surface when the chip board is turned over, thereby improving the quality of the chip after glue injection.

[0007] Preferably, fixed shafts are fixed on opposite sides of the front and rear end surfaces of the glue injection cabin, connecting rods are passed through the two fixed shafts, and hot air blowers are fixed on one side of the two connecting rods, so that the glue applied on both sides of the chip board can be quickly solidified by the hot air blowers.

[0008] Preferably, a cover plate is hingedly connected to one side of the upper end surface of the glue injection cabin, and the hinged cover plate is not only convenient for adding glue, but also convenient for blocking dust from entering.

[0009] Preferably, a valve is fixed on one side of the lower end of the glue injection cabin, and the valve is used to facilitate the control of the glue in the glue injection cabin to coat the chip board.

[0010] Preferably, the interior of the lower end pipeline of the glue injection cabin is divided into two glue injection channels, and the glue liquid is evenly applied on the chip board through the two glue injection channels.

[0011] Preferably, the eight special-shaped grooves are each provided with a wide groove at one end away from the rotating shaft, so that the blocking rod can be rotated through the rotating shaft to facilitate fixing the chip board.

[0012] The utility model is beneficial in that: when the chip is processed and glued, the chip is placed in the second chip slot and slid into the first chip slot, the valve is opened to divert the glue liquid to the upper ends of both sides of the chip board, the motor is started, the threaded rod is driven to rotate, the threaded sleeve shaft moves up and down, the connecting plate and the roller brush are driven to move up and down, and the roller brush evenly applies the glue liquid on the chip board. When the glue injection is completed, the connecting rods on both sides are rotated, and the two hot air blowers are respectively aimed at the two sides of the chip board to make the glue liquid solidify quickly, which not only reduces the steps of turning over the chip board for glue injection again and improves the work efficiency, but also avoids damage to the glue injection surface when the chip board is turned over, thereby improving the quality of the chip after glue injection. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0014] Figure 1 This is a schematic diagram of the axial side of the utility model;

[0015] Figure 2 This is a schematic diagram of the connection between the connecting plate, threaded rod and support rod of the utility model;

[0016] Figure 3 This is an enlarged schematic diagram of the first chip card slot and the second chip card slot of the utility model;

[0017] Figure 4 For this utility model Figure 3 Enlarged schematic diagram at point A in the middle.

[0018] Legend:

[0019] 1. Support plate; 2. Motor; 3. Glue injection cabin; 4. Cover plate; 5. Valve; 6. Threaded rod; 7. Support rod; 8. Support bottom plate; 9. Threaded sleeve; 10. Sliding sleeve; 11. Connecting plate; 12. Fixed shaft; 13. Connecting rod; 14. Hot air blower; 15. First chip slot; 16. Second chip slot; 17. Extension plate; 18. Roller brush; 19. Chip board; 20. First board slot; 21. First arc slot board; 22. Special-shaped slot; 23. Rotating shaft; 24. Stop rod. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4 As shown, a chip processing glue coating equipment includes: a support plate 1, motors 2 are fixed on both sides of the upper end surface of the support plate 1, threaded rods 6 are fixed on the output ends of the two motors 2, the output ends of the motors 2 pass through the support plate 1 and are connected to the threaded rods 6, support rods 7 are fixed on both sides of the lower end surface of the support plate 1, and support bottom plates 8 are fixed to the bottoms of the two threaded rods 6 and the support rods 7, threaded sleeves 9 are sleeved on the upper end shafts of the two threaded rods 6, sliding sleeves 10 are sleeved on the upper end shafts of the two support rods 7, connecting plates 11 are fixedly connected to the front end shafts of the threaded sleeves 9 and the sliding sleeves 10, and two extension plates 17 are fixed on one side of the two connecting plates 11, four A roller brush 18 is embedded between each of the extension plates 17, a glue injection cabin 3 is penetrated at the center of the support plate 1, a first chip slot 15 is fixedly connected to the bottom of the glue injection cabin 3, a second chip slot 16 is slidably arranged in the first chip slot 15, a chip board 19 is embedded in the second chip slot 16, special-shaped grooves 22 are provided at the four corners of the front and rear end surfaces of the chip board 19 in the second chip slot 16, a rotating shaft 23 is embedded in the eight special-shaped grooves 22, a baffle 24 is fixed to the shaft body of the eight rotating shafts 23 close to one side of the chip board 19, a first plate slot 20 is provided at the upper end of the second chip slot 16, and first arc groove plates 21 are fixed on both sides of the first plate slot 20.

[0022] Rotate the rotating shafts 23 at the four corners of the rear end of the second chip slot 16 to make the four blocking rods 24 perpendicular to the four sides of the second chip slot 16, and at the same time put the chip board 19 into the rear end blocking rod 24 of the second chip slot 16, rotate the rotating shafts 23 at the four corners of the front end of the second chip slot 16 to fix the chip board 19, slide the second chip slot 16 into the first chip slot 15, open the valve 5, and inject the glue into the two first arc groove plates 21 on both sides of the upper end of the second chip slot 16 when passing through the layered pipeline at the lower end of the glue injection cabin 3. The first arc groove plate 21 is a "J"-shaped curved surface. The glue is evenly distributed in the first arc groove plate 21 in the liquid storage area at the bend, and the glue is injected into the chip board 19 located at the first plate groove 20 through the lower side arc surface, so that the glue is evenly injected from the chip board 1 9 rolls from the upper end on both sides to the lower end, closes the valve 5, and turns on the motor 2 at the same time, driving the threaded rod 6 to rotate, so that the threaded sleeve shaft 9 and the sliding sleeve shaft 10 slide up and down, driving the connecting plate 11 and the roller brush 18 to move up and down, and the outermost shaft body of the roller brush 18 contacts the chip board 19 to form a rolling brush effect, so that the glue is evenly applied on both sides of the chip board 19. When the glue is applied, the motor 2 drives the roller brush 18 to be located at the lower end of the first chip slot 15, and rotates the connecting rods 13 on both sides of the support plate 1, so that the two hot air blowers 14 are respectively facing the two sides of the chip board 19 for solidification treatment, which not only reduces the step of turning over the chip board 19 for glue injection again, but also improves the work efficiency. At the same time, it avoids the glue leakage caused by squeezing the glue injection surface of the equipment when the chip board 19 is turned over, thereby improving the quality of the chip after glue injection.

[0023] Fixed shafts 12 are fixed on opposite sides of the front and rear end surfaces of the glue injection cabin 3, and connecting rods 13 are passed through the two fixed shafts 12. Hot air blowers 14 are fixed on one side of the two connecting rods 13. The connecting rods 13 can rotate with damping in the fixed shafts 12. By rotating the connecting rods 13, the heating surface of the hot air blower 14 is aligned with the chip board 19 after the glue is applied to implement hot air solidification, thereby reducing the time for the glue to automatically solidify. A cover plate 4 is hinged on one side of the upper end surface of the glue injection cabin 3. The hinged cover plate 4 is not only convenient for opening the glue injection cabin 3 to add glue, but also convenient for preventing dust from entering the glue injection cabin 3 and affecting the quality of the chip board 19 after glue coating. A valve 5 is fixed on one side of the lower end of the glue injection cabin 3, which is convenient for flexible control through the valve 5 The glue in the glue injection cabin 3 is coated on the chip board 19, and the inner part of the pipeline at the lower end of the glue injection cabin 3 is divided into two glue injection channels, which are respectively aligned with the glue injection ports on both sides of the upper end of the first chip card slot 15, and the glue flows to the first arc groove plates 21 on both sides of the upper end of the second chip card slot 16 through the isolation plate in the middle of the glue injection port of the first chip card slot 15. The first arc groove plate 21 is a "J"-shaped curved surface, and the glue is evenly distributed in the first arc groove plate 21 in the liquid storage area at the bend, and the chip board 19 located at the first plate groove 20 is evenly injected with glue through the lower side arc surface. The eight special-shaped grooves 22 are all provided with wide grooves at one end away from the rotating shaft 23. The finger is inserted into the wide groove to rotate the blocking rod 24, so as to fix the chip board 19.

[0024] Working principle: Rotate the rotating shafts 23 at the four corners of the rear end of the second chip slot 16 to make the four blocking rods 24 perpendicular to the four sides of the second chip slot 16, and at the same time put the chip board 19 into the rear end blocking rod 24 of the second chip slot 16, rotate the rotating shafts 23 at the four corners of the front end of the second chip slot 16 to fix the chip board 19, slide the second chip slot 16 into the first chip slot 15, open the valve 5, and inject the glue into the two first arc groove plates 21 on both sides of the upper end of the second chip slot 16 when passing through the layered pipeline at the lower end of the glue injection cabin 3. The first arc groove plate 21 is a "J"-shaped curved surface. The glue is evenly distributed in the first arc groove plate 21 in the liquid storage area at the bend, and the glue is injected on both sides of the chip board 19 located at the first plate groove 20 through the lower side arc surface, so that the glue is evenly injected from the core The upper ends of both sides of the sheet plate 19 roll toward the lower ends, closing the valve 5, and turning on the motor 2 at the same time, driving the threaded rod 6 to rotate, causing the threaded sleeve shaft 9 and the sliding sleeve shaft 10 to slide up and down, driving the connecting plate 11 and the roller brush 18 to move up and down, and the outermost shaft of the roller brush 18 contacts the chip plate 19 to form a rolling brush effect, so that the glue is evenly applied on both sides of the chip plate 19. When the gluing is completed, the motor 2 drives the roller brush 18 to be located at the lower end of the first chip slot 15, and rotates the connecting rods 13 on both sides of the support plate 1, so that the two hot air blowers 14 are respectively solidified on both sides of the chip plate 19, which not only reduces the step of turning over the chip plate 19 for glue injection again, but also improves work efficiency. At the same time, it avoids the glue leakage caused by squeezing the glue injection surface of the equipment when the chip plate 19 is turned over, thereby improving the quality of the chip after glue injection.

[0025] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0026] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A chip processing glue coating equipment, characterized in that: The invention comprises a support plate (1), wherein motors (2) are fixed on both sides of the upper end surface of the support plate (1), and threaded rods (6) are fixed on the output ends of the two motors (2), and the output ends of the motors (2) penetrate the support plate (1) and are connected to the threaded rods (6), and support rods (7) are fixed on both sides of the lower end surface of the support plate (1), and support bottom plates (8) are fixed at the bottoms of the two threaded rods (6) and the support rods (7), and threaded sleeves (9) are sleeved on the upper end shaft bodies of the two threaded rods (6), and sliding sleeves (10) are sleeved on the upper end shaft bodies of the two support rods (7), and connecting plates (11) are fixedly connected to the front end shaft bodies of the threaded sleeves (9) and the sliding sleeves (10), and two extension plates (17) are fixed on one side of the two connection plates (11), and the four extension plates (17) are fixed on the bottom of the four extension plates (17). 7) A roller brush (18) is embedded between each pair of the two support plates; a glue injection chamber (3) is penetrated at the center of the support plate (1); a first chip card slot (15) is fixedly connected to the bottom of the glue injection chamber (3); a second chip card slot (16) is slidably disposed in the first chip card slot (15); a chip board (19) is embedded in the second chip card slot (16); special-shaped grooves (22) are provided at the four corners of the front and rear end surfaces of the chip board (19) in the second chip card slot (16); a rotating shaft (23) is embedded in the eight special-shaped grooves (22); a stopper (24) is fixed on the shaft body of the eight rotating shafts (23) on one side close to the chip board (19); a first plate groove (20) is provided at the upper end of the second chip card slot (16); first arc groove plates (21) are fixed on both sides of the first plate groove (20).

2. The chip processing glue coating equipment according to claim 1, characterized in that: Fixed shafts (12) are fixed to opposite sides of the front and rear end surfaces of the glue injection chamber (3), connecting rods (13) are passed through the two fixed shafts (12), and hot air blowers (14) are fixed to one side of the two connecting rods (13).

3. The chip processing glue coating equipment according to claim 1, characterized in that: A cover plate (4) is hingedly connected to one side of the upper end surface of the glue injection cabin (3).

4. The chip processing glue coating equipment according to claim 1, characterized in that: A valve (5) is fixed on one side of the lower end of the glue injection cabin (3).

5. The chip processing glue coating equipment according to claim 1, characterized in that: The interior of the lower end pipeline of the glue injection cabin (3) is divided into two glue injection channels.

6. The chip processing glue coating equipment according to claim 1, characterized in that: The eight special-shaped grooves (22) are all provided with a wide groove at one end away from the rotating shaft (23).

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