Anti-static chip transfer waffle box

By designing the anti -static chip of the mobile fastener shelf, the Wafef box is transferred to the Wafef box, which solves the problem of fixed specifications of the existing Wafef box, realized the flexible adjustment and stable placement of different specifications chips, and improved the efficiency and resource utilization of the equipment. Rate.

CN222409128UActive Publication Date: 2025-01-28WUXI JINGJINGYI INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202420917365.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2025-01-28
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

The internal specifications of the existing waffle boxes are fixed and cannot be adjusted according to chips of different specifications, resulting in the need to prepare waffle boxes of multiple sizes, wasting resources and limiting the scope of use.

Method used

A anti -static chip transfer to the Wafef box, which contains the moveable horizontal and vertical fasteners. By the cooperation of the sliding slice and sliding rod, the fastening frame is flexibly adjusted to adapt to different specifications of chips.

Benefits of technology

The effect of tightening the chip specifications is achieved, the equipment pre -order waste is reduced, the range of use of the device is expanded, and the stability of the chip placing is improved by the viscous material made of glue.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an anti-static chip transfer waffle box which comprises a supporting frame and a containing chamber arranged at the upper end of the supporting frame, a plurality of transverse sliding grooves are formed in the lower half portion of the interior of the containing chamber, a plurality of longitudinal sliding grooves are formed in the lower end of the supporting frame, the longitudinal sliding grooves are communicated with the containing chamber, and the transverse sliding grooves are communicated with the containing chamber. The transverse sliding groove is slidably connected with a plurality of moving frames, the upper ends of the moving frames are fixedly connected with a longitudinal fastening frame, the longitudinal sliding groove is slidably connected with a plurality of sliding rods, and the upper ends of the sliding rods are fixedly connected with a transverse fastening frame; according to the utility model, the stability and high efficiency of the combined use of a plurality of transverse fastening frames and longitudinal fastening frames are ensured, the device can adjust and fix the chips in time according to the chips of different specifications, and the placement stability of the device on the chips is further improved due to the certain viscosity of the device.
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Description

Technical Field

[0001] The utility model relates to the technical field of waffle boxes, in particular to an anti-static chip transport waffle box. Background Art

[0002] The waffle box is a protective device that provides protection and support for chips during transportation.

[0003] By making the waffle box with a glue injection process, it can be made to have a certain degree of anti-static and stickiness, thereby improving its protection and support effect on the chip during transportation. However, the internal specifications of the existing waffle boxes are generally fixed in size. When facing the transportation and placement of chips of different specifications, different types of waffle boxes need to be prepared in advance as spares. The device itself cannot be adjusted to fix the chips according to their specifications, resulting in excessive pre-order waste and limiting the scope of use of the device.

[0004] Therefore, we offer an anti-static chip transport waffle box. Utility Model Content

[0005] The purpose of the utility model is to provide an anti-static chip transport waffle box to solve the above-mentioned technical problems, so as to achieve the effect of corresponding fastening according to the corresponding chip specifications.

[0006] In view of this, the utility model provides an anti-static chip transport waffle box, comprising a support frame, a placement chamber opened at the upper end of the support frame, a plurality of transverse sliding grooves opened in the lower half of the interior of the placement chamber, a plurality of longitudinal sliding grooves opened at the lower end of the support frame, the longitudinal sliding grooves being communicated with the placement chamber, the transverse sliding grooves being slidably connected to a movable rack, there are several movable racks, the upper end of the movable rack is fixedly connected to a longitudinal fastening rack, the longitudinal sliding grooves are slidably connected to a sliding rod, there are several sliding rods, the upper end of the sliding rod is fixedly connected to a transverse fastening rack.

[0007] Preferably, the upper end of one side of the movable frame is screwed together with a positioning bolt, and one side of the positioning bolt extending out of the bottom end of the positioning bolt is screwed together with one side of the inner wall of the transverse sliding groove.

[0008] Preferably, one end of the sliding rod away from the transverse fastening frame is fixedly connected to a movable connecting block, the movable connecting block is located below the supporting frame, and the transverse fastening frame is located inside the placement chamber.

[0009] Preferably, the lower end of the movable connecting block is fixedly connected to a movable supporting block, and fastening bolts are provided on both sides of the corresponding movable supporting block. The fastening bolts are threadedly screwed to the movable connecting block, and the fastening bolts are plugged into the movable supporting block and extend to its upper end.

[0010] Preferably, the placement chamber card is connected to an adsorption card layer, and the upper end of the adsorption card layer is fixedly connected to a sealing plate.

[0011] Preferably, the sealing plate is connected to a clamping groove via a clamping column, the clamping column is fixedly connected to the sealing plate, and the clamping groove is opened at the upper end of the support frame.

[0012] Preferably, a plurality of clamping blocks are fixedly connected to the outer side of the support frame, a clamping interface is provided below the support frame, and a plurality of clamping blocks are provided on the inner wall of the clamping interface, which are clamped and connected to the clamping blocks.

[0013] Compared with the existing technology, the utility model provides an anti-static chip transport waffle box with the following beneficial effects:

[0014] The utility model moves the movable frame and the sliding rod respectively under the support of multiple horizontal sliding grooves and longitudinal sliding grooves opened inside the placement chamber, and moves the movable frame under the limit and guide support of the horizontal sliding groove, and moves the sliding rod under the limit and guide support of the longitudinal sliding groove, thereby achieving the effect of separately moving the multiple longitudinal fastening frames and the horizontal fastening frames above.

[0015] The utility model uses a combination of a transverse fastening frame and a longitudinal fastening frame, and the limiting support effect of the limiting support surfaces on both sides of the transverse fastening frame and the longitudinal fastening frame when the chip is placed, so that the transverse fastening frame and the longitudinal fastening frame can be moved to adjust the fastening effect of chips of different specifications accordingly.

[0016] The utility model ensures the stability and efficiency of the combined use of multiple horizontal fastening frames and longitudinal fastening frames, enables the device to timely adjust the fixing effect according to chips of different specifications, and by making the device in a glue-injected manner, the device itself has a certain viscosity, further improving the stability of the device in placing the chip.

[0017] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. The utility model has a simple structure and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a front view structural diagram of an anti-static chip transport waffle box proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of the top view of the storage chamber of an anti-static chip transport waffle box proposed in the utility model;

[0020] Figure 3This is a bottom-up structural diagram of the support frame portion of an anti-static chip transport waffle box proposed by the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of a transverse fastening frame for an anti-static chip transport waffle box proposed in the present invention;

[0022] Figure 5 This is a schematic diagram of the longitudinal fastening frame structure of an anti-static chip transport waffle box proposed by the utility model.

[0023] In the figure: 1. Support frame; 2. Horizontal sliding groove; 3. Longitudinal sliding groove; 301. Mobile connecting block; 4. Mobile support block; 5. Fastening bolt; 6. Sliding rod; 7. Horizontal fastening frame; 8. Mobile frame; 9. Positioning bolt; 10. Longitudinal fastening frame; 11. Placement chamber; 12. Adsorption card layer; 13. Sealing plate; 14. Card column; 15. Card groove; 16. Card block; 17. Protective bottom frame; 18. Card interface. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0025] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0026] Example 1: An anti-static chip transport waffle box, such as Figure 1-Figure 5As shown, it includes a support frame 1, a placement chamber 11 opened at the upper end of the support frame 1, a plurality of transverse sliding grooves 2 are opened in the lower half of the placement chamber 11, a plurality of longitudinal sliding grooves 3 are opened at the lower end of the support frame 1, the longitudinal sliding groove 3 is communicated with the placement chamber 11, the transverse sliding groove 2 is slidably connected to a moving frame 8, there are several moving frames 8, the upper end of the moving frame 8 is fixedly connected to a longitudinal fastening frame 10, the longitudinal sliding groove 3 is slidably connected to a sliding rod 6, there are several sliding rods 6, the upper end of the sliding rod 6 is fixedly connected to a transverse fastening frame 7, when the device is running, the moving frame 8 and the sliding rod 6 are moved respectively under the support of the plurality of transverse sliding grooves 2 and the longitudinal sliding grooves 3 opened in the placement chamber 11, and the moving frame 8 is moved under the limit and guide support of the transverse sliding groove 2, and the sliding rod 6 is moved under the limit and guide support of the longitudinal sliding groove 3, so as to achieve the plurality of longitudinal fastening frames 10 and the transverse fastening frames above. The cam 12 is provided with a plurality of support rails 14 and 15 for supporting the chips, and the support rails 12 are provided with a plurality of support rails 14 for supporting the chips.

[0027] like Figure 1-Figure 5 As shown, a positioning bolt 9 is screwed in the upper end of one side of the movable frame 8, and the positioning bolt 9 extends out of one side of the bottom end of the positioning bolt 9 and is screwed in the inner wall of the horizontal sliding groove 2. By rotating the positioning bolt 9, it is connected and fastened to the movable frame 8 and the horizontal sliding groove 2 at the same time, thereby achieving the effect of fixing the position of the movable frame 8, thereby ensuring the stability of the upper component when fixing the chip.

[0028] like Figure 1-Figure 5As shown, one end of the sliding rod 6 away from the transverse fastening frame 7 is fixedly connected to a movable connecting block 301, the movable connecting block 301 is located below the support frame 1, and the transverse fastening frame 7 is located inside the placement chamber 11. The lower end of the movable connecting block 301 is fixedly connected to the movable support block 4, and the movable support block 4 is provided with fastening bolts 5 on both sides. The fastening bolts 5 are threadedly engaged with the movable connecting block 301, and the fastening bolts 5 are plugged into the movable support block 4 and extend to its upper end. By moving the movable support block 4, the sliding rod 6 can be driven to slide under the connection of the movable connecting block 301, thereby achieving the effect of adjusting the position of the transverse fastening frame 7, and then by rotating the fastening bolts 5 on both sides of the movable connecting block 301, it is connected and fastened to the support frame 1, so that the fastening bolts 5 and the transverse fastening frame 7 are in close contact with the support frame 1 at the same time. The effect of position fastening is achieved.

[0029] Example 2: An anti-static chip transport waffle box, such as Figure 1-Figure 5 As shown, the placement chamber 11 is connected to an adsorption clamping layer 12, and the upper end of the adsorption clamping layer 12 is fixedly connected to a sealing plate 13, and the sealing plate 13 is connected to a clamping groove 15 through a clamping column 14. The clamping column 14 is fixedly connected to the sealing plate 13, and the clamping groove 15 is opened at the upper end of the support frame 1. Through the clamping support of the clamping groove 15 and the clamping column 14, the sealing plate 13 is stably connected to the support frame 1. At the same time, under the clamping effect of the adsorption clamping layer 12 and the placement chamber 11, the position of the chip placed inside the support frame 1 is stable and safe, and under the adsorption effect of the adsorption clamping layer 12, the dust inside the device can be adsorbed to ensure the safety of chip transportation.

[0030] like Figure 1-Figure 5 As shown, a number of snap-in blocks 16 are fixedly connected to the outside of the support frame 1, and a protective bottom frame 17 is provided below the support frame 1. A number of snap-in interfaces 18 are provided on the inner wall of the protective bottom frame 17. The snap-in interfaces 18 are connected to the snap-in blocks 16. By snapping the snap-in blocks 16 and the protective bottom frame 17, the support frame 1 and the snap-in interfaces 18 are stably connected, thereby achieving the effect of protecting and supporting the lower end of the support frame 1. In addition, by setting the protective bottom frame 17 as a one-stage type, a certain gap is left between the support frame 1 and the snap-in interface 18 after the two are snapped together, thereby ensuring the stability of the lower end components of the support frame 1 when they are placed.

[0031] Working principle: by supporting the multiple transverse sliding grooves 2 and the longitudinal sliding grooves 3 opened inside the placement chamber 11, the movable frame 8 and the sliding rod 6 are moved respectively, and the movable frame 8 is moved under the limit and guide support of the transverse sliding groove 2, and the sliding rod 6 is moved under the limit and guide support of the longitudinal sliding groove 3, so as to achieve the effect of moving the multiple longitudinal fastening frames 10 and the transverse fastening frame 7 above respectively, and the transverse fastening frame 7 is used in combination with the longitudinal fastening frame 10 and the limit support effect of the limit support surface on both sides of the transverse fastening frame 7 and the longitudinal fastening frame 10 when the chip is placed, so that the transverse fastening frame 7 and the longitudinal fastening frame 10 are fixed to each other. 0 can adjust and tighten the chips of different specifications accordingly by moving, and by setting the longitudinal sliding groove 3 to be connected to the placement chamber 11, and setting the transverse sliding groove 2 to be inside the placement chamber 11 and not penetrating the lower end of the support frame 1, the transverse fastening frame 7 and the longitudinal fastening frame 10 in two directions will not affect each other when moving, thereby ensuring the stability and efficiency when multiple transverse fastening frames 7 and longitudinal fastening frames 10 are used in combination, so that the device can adjust the fixing effect in time according to chips of different specifications, and by making the device in a glue injection manner, so that it itself has a certain viscosity, further improving the device's stability in placing chips.

[0032] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An anti-static chip transport waffle box, comprising a support frame (1), a placement chamber (11) opened at the upper end of the support frame (1), characterized in that: The lower half of the interior of the placement chamber (11) is provided with a plurality of transverse sliding grooves (2); the lower end of the support frame (1) is provided with a plurality of longitudinal sliding grooves (3); the longitudinal sliding grooves (3) are communicated with the placement chamber (11); the transverse sliding grooves (2) are slidably connected to a movable frame (8); there are a plurality of movable frames (8); the upper end of the movable frame (8) is fixedly connected to a longitudinal fastening frame (10); the longitudinal sliding grooves (3) are slidably connected to a sliding rod (6); there are a plurality of sliding rods (6); the upper end of the sliding rod (6) is fixedly connected to a transverse fastening frame (7).

2. The anti-static chip transport waffle box according to claim 1, characterized in that: A positioning bolt (9) is screwed together with an upper end of one side of the movable frame (8), and one side of the positioning bolt (9) extending out of the bottom end of the positioning bolt (9) is screwed together with a side of the inner wall of the transverse sliding groove (2).

3. The anti-static chip transport waffle box according to claim 1, characterized in that: One end of the sliding rod (6) away from the transverse fastening frame (7) is fixedly connected to a movable connection block (301), the movable connection block (301) is located below the support frame (1), and the transverse fastening frame (7) is located inside the placement chamber (11).

4. The anti-static chip transport waffle box according to claim 3, characterized in that: The lower end of the movable connection block (301) is fixedly connected to a movable support block (4), and fastening bolts (5) are provided on corresponding sides of the movable support block (4), and the fastening bolts (5) are threadedly screwed to the movable connection block (301), and the fastening bolts (5) are plugged into the movable support block (4) and extend to the upper end thereof.

5. The anti-static chip transport waffle box according to claim 1, characterized in that: The placement chamber (11) is connected to an adsorption clamping layer (12), and the upper end of the adsorption clamping layer (12) is fixedly connected to a sealing plate (13).

6. The anti-static chip transport waffle box according to claim 5, characterized in that: The sealing plate (13) is connected to a clamping groove (15) via a clamping column (14); the clamping column (14) is fixedly connected to the sealing plate (13); and the clamping groove (15) is formed at the upper end of the support frame (1).

7. The anti-static chip transport waffle box according to claim 1, characterized in that: A plurality of snap-in blocks (16) are fixedly connected to the outside of the support frame (1), a snap-in interface (17) is provided below the support frame (1), and a plurality of (18) are provided on the inner wall of the snap-in interface (17), the (18) being snap-connected to the snap-in blocks (16).