Packaging device for additive manufacturing AME multilayer board
By using a vacuum flexible container and protective device in the packaging device of the AME multi -layer board, combined with the built -in desiccant storage package, the AME multi -layer plate oxidation and physical damage are solved, and more effective protection and environmental adaptability are achieved. It is suitable for large -scale production and reduced costs.
Patent Information
- Application Number
- CN202421077123.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-17
AI Technical Summary
AME multi-layer boards are prone to oxidation in the air and have reduced conductivity; they are susceptible to physical damage during transportation and storage; existing packaging materials do not have good environmental adaptability and cannot effectively isolate moisture and other oxidizing substances.
A packaging device including a vacuum flexible container is used, the flexible container is set up with the first and second protective parts. The protective parts include the ring and the plate body. Form an anaerobic environment and absorb moisture.
It significantly reduces the risk of the oxidation of the silver layer, prevent physical damage, enhances environmental adaptability, is suitable for large -scale production, and reduces production costs.
Smart Images
Figure CN222409257U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of packaging of electronic devices, and relates to a packaging device for additively manufactured electronic (AME) multilayer boards. Background Art
[0002] With the rapid development of electronic technology, additive manufacturing (AM) technology is increasingly used in the field of electronic circuit manufacturing. Additive manufacturing electronic circuits, commonly known as AME multilayer boards, are electronic devices with three-dimensional structures manufactured by stacking them layer by layer. This technology can realize complex circuit designs and improve the performance and reliability of electronic devices.
[0003] However, after the manufacture of AME multilayer boards, they face a series of packaging and protection challenges. At present, the packaging of AME multilayer boards mainly adopts traditional packaging materials, such as plastic bags or plastic boxes. In the process of realizing the utility model, the inventors found that although these materials are low-cost, they have obvious deficiencies in protecting AME multilayer boards. Specifically, there is at least one of the following technical problems in the prior art:
[0004] a) AME multilayer boards are susceptible to oxidation in the air, especially conductive media such as silver layers. Oxidation can lead to a decrease in conductivity and affect the stability and life of the circuit.
[0005] b) During transportation and storage, AME multilayer boards may be physically damaged by friction, impact or pressure, especially the inner hole surface made by femtosecond cutting technology, which may destroy the integrity of the circuit.
[0006] c) Existing packaging materials usually do not have good environmental adaptability and cannot effectively isolate moisture and other substances that may cause oxidation, which limits the application of AME multilayer boards in harsh environments.
[0007] In order to solve the above problems, researchers and engineers have conducted a lot of research and exploration, and proposed a variety of improvement solutions, such as using anti-oxidation materials, improving packaging processes, etc. However, these solutions are often costly and difficult to be widely used in industrial production. Utility Model Content
[0008] In view of this, the utility model aims to provide a new type of packaging device, which aims to provide more effective protection for AME multilayer boards. The packaging device of the present invention can not only effectively prevent oxidation and physical damage of AME multilayer boards through innovative structural design, but also has the advantages of simple operation and low cost, and is suitable for large-scale production. In addition, the packaging device of the present invention also has good environmental adaptability and can protect the performance and reliability of AME multilayer boards in various environments.
[0009] Through long-term exploration and attempts, as well as multiple experiments and efforts, the inventors have continuously reformed and innovated to solve the above technical problems. The technical solution provided by the utility model is to provide a packaging device for additively manufacturing AME multilayer boards, including a flexible container that can be vacuumed, and the flexible container includes an opening for the AME multilayer boards to enter and exit; a first protective member and a second protective member are arranged in the flexible container, the first protective member includes a first ring body, and the second protective member protects the second ring body, and the inner diameters of the first ring body and the second ring body are not less than the diameter of the silver layer area on the AME multilayer board.
[0010] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the first ring body is made of a flexible material; the second ring body is made of a flexible material.
[0011] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the first protective member further includes a first plate body, and the first ring body is connected to the first plate body.
[0012] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the first board body is connected to the inner wall of the flexible container.
[0013] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the second protective member further includes a second plate body, and the second ring body is connected to the second plate body.
[0014] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the second board body is connected to the inner wall of the flexible container.
[0015] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the flexible container is a plastic bag.
[0016] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the flexible container is a transparent plastic bag.
[0017] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the first ring body and the second ring body are arranged coaxially.
[0018] According to an embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, a desiccant storage bag is further arranged in the flexible container, and the desiccant storage bag is filled with desiccant.
[0019] The AME multilayer board packaging device of the utility model has the following advantages compared with the prior art through its unique structural design:
[0020] a) By using a flexible container that can be evacuated, the present packaging device greatly reduces the surface area of the AME multilayer board exposed to the air, thereby significantly reducing the risk of oxidation of the silver layer and other conductive media.
[0021] b) The design of the first protective member and the second protective member specifically provides additional protective space for protecting the silver coating and inner holes of the AME multilayer board, effectively preventing physical damage that may occur during transportation and storage.
[0022] c) Since the flexible container can be evacuated to form an oxygen-free environment and has a built-in desiccant storage bag, the packaging device can adapt to various environmental conditions, including high humidity environments, thereby enhancing the environmental adaptability of the AME multilayer board.
[0023] d) In one embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the first protective member and the second protective member are detachable, so that the installation and maintenance of the AME multilayer boards become simple and quick, and the packaging efficiency is improved.
[0024] e) In one embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, protective parts and plastic bags made of flexible materials are used, which not only provide necessary protection but also reduce production costs, so that the packaging device has high economic benefits.
[0025] f) In one embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the transparent design of the flexible container facilitates direct observation of the state of the AME multilayer board, and visual inspection can be performed without opening the package, further simplifying the use process.
[0026] g) In one embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the design of the built-in desiccant storage bag effectively absorbs moisture inside the package, providing additional moisture-proof protection for the AME multilayer boards.
[0027] h) In one embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model, the axial center line arrangement of the first ring body and the second ring body ensures the stability of the protective member inside the package and reduces the potential risk of damage caused by the movement of the protective member. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0029] Figure 1 It is a front structural schematic diagram of a preferred embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model.
[0030] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure.
[0031] Figure 3 yes Figure 1 AA cross-sectional view.
[0032] Figure 4 It is a schematic diagram of the positional relationship between the first protective member, the AME multilayer board and the first protective member in a preferred embodiment of the packaging device for additively manufacturing AME multilayer boards of the utility model.
[0033] The marks in the figure are:
[0034] 100 flexible containers,
[0035] 110 opening,
[0036] 200 first protection element,
[0037] 210 The first ring,
[0038] 220 first plate body,
[0039] 300 second protection piece,
[0040] 310 Second Ring,
[0041] 320 second plate body,
[0042] 400AME multilayer board,
[0043] 410 silver layers,
[0044] 420 inner hole. DETAILED DESCRIPTION
[0045] The following is a description with reference to the accompanying drawings and a specific embodiment.
[0046] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents selected embodiments of the utility model.
[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it may not be further defined or explained in the subsequent drawings.
[0048] Figure 4 The structure of the AME multilayer board 400 is shown, including a silver layer 410 and an inner hole 420. In the prior art, when the AME multilayer board 400 is exposed to the air for 5 to 10 days, the silver layer 410 will be oxidized and blackened, the conductivity will decrease, and the resistance will increase. In addition, during the storage or transportation of the AME multilayer board 400, the silver layer 410 is easily worn due to friction or pressure. Once the silver layer 410 is worn, it will not only lose its original conductivity, but also may affect the working stability of the entire circuit board. At the same time, the processing of the inner hole 420 adopts a femtosecond cutting process, and the surface is smooth. During the storage and transportation process, any damage to the surface of the inner hole 420 should also be avoided.
[0049] See also Figures 1 to 4 The packaging device for additively manufacturing an AME multilayer board described in this embodiment protects the silver layer 410 and the inner hole 420 on the AME multilayer board 400, prevents physical damage and chemical corrosion during storage and transportation, and reduces the impact of external factors on the silver layer 410 and the inner hole 420, thereby ensuring that the quality and performance of the AME multilayer board are guaranteed for a long time.
[0050] The packaging device includes a flexible container 100 that can be evacuated, and the flexible container 100 includes an opening 110 for the AME multilayer board 400 to enter and exit; the container is designed to accommodate the AME multilayer board 400, and the multilayer board can be entered and exited through the opening 110. It is recommended to use a plastic bag, especially a transparent plastic bag, for the flexible container 100. After the plastic bag is evacuated using a vacuum device, it is easy to heat-seal and achieve an oxygen-free sealing process. After the flexible container 100 is evacuated, an oxygen-free environment is formed, which effectively reduces the oxidation of the silver layer 410. The use of a transparent plastic bag makes it easy to observe the sealing state of the AME multilayer board 400 inside.
[0051] In an optional embodiment, a desiccant storage bag (not shown in the figure) is further disposed in the flexible container 100 , and the desiccant storage bag is filled with desiccant to maintain a dry environment in the flexible container 100 .
[0052] A first protective member 200 and a second protective member 300 are disposed in the flexible container 100. The first protective member 200 includes a first ring body 210. The second protective member 300 protects the second ring body 310. The inner diameters of the first ring body 210 and the second ring body 310 are not less than the diameter of the silver layer 410 on the AME multilayer board 400. It is recommended that the first ring body 210 and the second ring body 310 are of equal size. In the packaged state, the first ring body 210, the second ring body 310 and the inner hole 420 are coaxially arranged.
[0053] The first ring body 210 is made of a flexible material, and the second ring body 310 is made of a flexible material. The flexible material refers to a material in the prior art that does not cause physical friction damage when in contact with the silver layer 410, such as rubber.
[0054] In one embodiment, the first ring body 210 and the second ring body 310 are directly connected to the inner wall of the flexible container 100 .
[0055] In another embodiment, the first protective member 200 further includes a first plate 220, and the first ring 210 is connected to the first plate 220. The second protective member 300 further includes a second plate 320, and the second ring 310 is connected to the second plate 320. The first plate 220 and the second plate 320 are respectively connected to the inner wall of the flexible container 100. The first plate 220 and the first ring 210 constitute a first cover structure, and the second plate 320 and the second ring 310 constitute a second cover structure. When in use, the opening directions of the first cover structure and the second cover structure are both toward the inner hole 420, and the silver layer 410 and the inner hole 420 are located between the first protective member 200 and the second protective member 300. The first protective member 200, the second protective member 300 and the inner hole 420 constitute a protective space, and the silver layer 410 and the inner hole 420 are in the protective space. Of course, the protective space and the flexible container 100 can achieve normal gas exchange, and during vacuuming and unsealing, the vacuum degree in the protective space is synchronized with the vacuum degree in the flexible container 100. To achieve normal gas exchange, it is sufficient to set an air hole on the first protective member 200 or / and the second protective member 300, or to reserve an air hole on the contact surface between the first ring body 210 or / and the second ring body 310 and the AME multilayer board 400.
[0056] The first plate body 220 and the second plate body 320 are preferably made of a transparent material, such as a transparent resin, so as to facilitate observation of the sealing state of the silver layer 410 and the inner hole 420 of the protection space.
[0057] In the description of the present utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0058] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0059] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0060] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention. The protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A packaging device for additively manufacturing AME multilayer boards, characterized in that: The invention comprises a flexible container capable of being evacuated, wherein the flexible container comprises an opening for the AME multilayer board to enter and exit; a first protective member and a second protective member are arranged in the flexible container, wherein the first protective member comprises a first ring body, and the second protective member protects the second ring body, and the inner diameters of the first ring body and the second ring body are not less than the diameter of the silver layer area on the AME multilayer board.
2. The packaging device for additively manufacturing AME multilayer boards according to claim 1, characterized in that: The first ring body is made of a flexible material; the second ring body is made of a flexible material.
3. The packaging device for additively manufacturing AME multilayer boards according to claim 1, characterized in that: The first protective member further includes a first plate body, and the first ring body is connected to the first plate body.
4. The packaging device for additively manufacturing AME multilayer boards according to claim 3, characterized in that: The first plate is connected to the inner wall of the flexible container.
5. The packaging device for additive manufacturing of AME multilayer boards according to claim 1, characterized in that: The second protective member further includes a second plate body, and the second ring body is connected to the second plate body.
6. The packaging device for additively manufacturing AME multilayer boards according to claim 5, characterized in that: The second plate is connected to the inner wall of the flexible container.
7. The packaging device for additively manufacturing AME multilayer boards according to claim 1, characterized in that: The flexible container is a plastic bag.
8. The packaging device for additively manufacturing AME multilayer boards according to claim 7, characterized in that: The flexible container is a transparent plastic bag.
9. The packaging device for additively manufacturing AME multilayer boards according to claim 7, characterized in that: The first ring body and the second ring body are arranged through the axis.
10. The packaging device for additive manufacturing of AME multilayer boards according to claim 1, characterized in that: A desiccant storage bag is also arranged in the flexible container, and the desiccant storage bag is filled with desiccant.