PGA ceramic packaging needle grid electroplating device

Abstract

The utility model discloses a pin grid electroplating device for PGA ceramic packaging. The pin grid electroplating device comprises a porous carrier and a clamp, wherein a PGA pin grid can be inserted into the porous carrier, and the clamp is used for clamping a PGA ceramic shell. A plurality of vertical small holes and a plurality of positioning holes are formed in the front surface of the carrier; a telescopic metal spring is vertically arranged in each small hole, and the two ends of each spring are each connected with a horizontally-arranged metal sheet. And all the metal sheets at the bottom are interconnected through metal strips and extend to be connected to the metal sheets on the side surfaces of the carrier. When the clamp clamping the PGA ceramic shell is assembled on the front face of the carrier, the lead pins at the bottom of the PGA ceramic shell are correspondingly and vertically inserted into the small holes and make contact with the first metal sheets, and the springs are in a pressed state. Compared with the prior art, the device has the advantages that the electroplating of the PGA ceramic packaged pin grid is more convenient, the corresponding process steps are reduced, and the yield is improved.

Description

Technical Field

[0001] The utility model relates to a device for electroplating a workpiece, in particular to a device for pin-grid electroplating of a chip ceramic package. Background Art

[0002] For the dual in-line package (Dual In-Line Package) or pin grid array package (Pin Grid Array Package) structure of the chip, when using ceramic packaging technology, such as Figure 1 , Figure 2 As described, the chip is arranged inside the ceramic housing 2, and a plurality of pads are arranged on the bottom surface of the ceramic housing. Lead pins 2-1 are respectively welded on each pad to form a pin grid structure, and the pin grid structure needs to be electroplated with nickel and gold after welding.

[0003] In the case where there are a large number of lead pins, and each or most of the lead pins are independent of each other, the prior art, during electroplating, is to lead all the isolated pads corresponding to each lead pin to the edge of the ceramic shell through the wiring inside the ceramic shell, and then perform electroplating. In this method, the above wiring is usually a pre-designed printed circuit, which extends from the inside of the ceramic shell to the edge of the ceramic shell. In order to facilitate wiring and protect the ceramic shell body during electroplating, the wiring needs to extend a small section at the edge of the ceramic shell. Therefore, the edge of the ceramic shell is also provided with a corresponding ceramic epitaxial part as a carrier of the epitaxial printed circuit. After the electroplating is completed, the cooked porcelain is separated, that is, the ceramic epitaxial part and the epitaxial wiring on its surface are removed.

[0004] When performing the above-mentioned separation of the cooked porcelain, it is usually necessary to pre-groove the edge of the ceramic epitaxial part connecting the ceramic shell to facilitate the separation of the cooked porcelain. The above process steps are too complicated and involve multiple processes such as ceramic shell preparation, printed circuit design and preparation, and cooked porcelain separation, which is time-consuming and labor-intensive. In addition, there will be burrs on the end face of the final separation of the cooked porcelain, which affects the final yield. Summary of the invention

[0005] Purpose of the invention: In view of the above-mentioned prior art, a device for pin grid electroplating of PGA ceramic package is proposed to simplify the existing electroplating process.

[0006] Technical solution: A device for pin grid electroplating of a PGA ceramic package, comprising a porous carrier into which the PGA pin grid can be inserted and a fixture for clamping the PGA ceramic housing;

[0007] The front of the carrier is provided with a plurality of vertical small holes and a plurality of positioning holes; a telescopic metal spring is vertically provided in each small hole, the top end of the spring is connected to a first metal sheet arranged horizontally, and the bottom end of the spring is connected to a second metal sheet arranged horizontally; the second metal sheets in all the small holes are interconnected through a metal strip inside the carrier, and the metal strip is extended to connect to a third metal sheet on the side of the carrier;

[0008] The fixture is provided with a vertical positioning pin adapted to the positioning hole; when the fixture holding the PGA ceramic shell is assembled to the front of the carrier, the lead pins at the bottom of the PGA ceramic shell are vertically inserted into the small holes and contact the first metal sheet, and the spring is in a compressed state.

[0009] Furthermore, vertical grooves are respectively formed on two opposite side surfaces of the carrier, and the third metal sheet is attached to the grooves.

[0010] Furthermore, the clamp comprises a flat plate, on which are disposed two pairs of orthogonal clamping parts; each pair of clamping parts comprises two horizontally movable positioning pins arranged opposite to each other.

[0011] Furthermore, the vertical positioning pin is provided with a positioning pin height adjustment structure.

[0012] Furthermore, a layer of silicone is provided at the position where the clamp contacts the PGA ceramic shell.

[0013] Furthermore, the first metal sheet, the spring, the second metal sheet, the third metal sheet and the metal strip inside the carrier are all made of SUS304 or SUS316 material.

[0014] Furthermore, the carrier and the clamp are made of PE material.

[0015] Beneficial effects: The springs, discs and metal strips in the carrier of the device interconnect each lead pin in the PGA insertion device and lead them out from the side of the carrier. It only needs to be directly plated on the device. It has the following advantages:

[0016] 1. Compared with the prior art, the device makes the electroplating of the pin grid of the PGA ceramic package more convenient and reduces the corresponding process steps.

[0017] 2. Since the device no longer needs to make a ceramic epitaxial part, it does not need to perform a ceramic separation operation after the electroplating is completed. Therefore, compared with the existing technology, it can improve the yield of PGA ceramic shells and avoid the problem of poor rear end state of the ceramic shell after ceramic separation.

[0018] 3. This device is compatible with PGA ceramic packages of different shapes and pin grids of different lengths and sizes, and has good compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the side view structure of the PGA ceramic package;

[0020] Figure 2 It is a schematic diagram of the bottom structure of a pin grid array plug-in ceramic package;

[0021] Figure 3 It is a schematic diagram of the porous carrier structure in which the PGA pin grid can be inserted in the device;

[0022] Figure 4 is a side sectional view of the entire device;

[0023] Figure 5 It is a side cross-sectional view of the device as a whole after being assembled with the electroplating product;

[0024] Figure 6 It is a schematic diagram of the spring state after a single small hole of the carrier is inserted into the lead needle. DETAILED DESCRIPTION

[0025] The present invention will be further explained below in conjunction with the accompanying drawings.

[0026] A device for pin grid electroplating of a PGA ceramic package comprises a porous carrier 1 into which the PGA pin grid can be inserted and a clamp 3 for clamping a PGA ceramic shell 2.

[0027] like Figure 3 As shown, the front of the rectangular carrier 1 of PE material is provided with a plurality of vertical small holes 1-1 and a plurality of positioning holes. The number and position of the small holes 1-1 can be set according to the corresponding product, or a universal small hole array structure can be set according to the corresponding packaging standard, so as to facilitate the adaptation of multiple models of products. The positioning holes are usually set at the four corners of the carrier 1 or in the middle of the opposite sides, and the positioning hole structure is not shown in the figure. PE material has good acid and alkali resistance.

[0028] like Figure 4 As shown, a telescopic metal spring 4-1 is vertically arranged in each small hole 1-1, the top end of the spring 4-1 is connected to the horizontally arranged first metal sheet 4, and the bottom end of the spring 4-1 is connected to the horizontally arranged second metal sheet 4-2. The second metal sheets 4-2 in all small holes 1-1 are interconnected through a metal strip inside the carrier 1, and the metal strip extends to and connects to the third metal sheet 4-3 on the side of the carrier 1.

[0029] In some embodiments, the small hole 1-1 is a cylindrical blind hole; the first metal sheet 4 and the second metal sheet 4-2 are both circular thin metal sheets, with a diameter slightly smaller than the inner diameter of the cylindrical blind hole; the spring 4-1 is a lightweight spring with sensitive elasticity. The metal strip is pre-buried inside the carrier 1, and its path passes through each small hole 1-1. The main structure of the carrier 1 can be prepared by injection molding and other processes; the second metal sheet 4-2 can be fixed to the bottom of the blind hole, or directly connected and fixed to the metal strip at the bottom of the blind hole.

[0030] In some embodiments, vertical arc-shaped grooves are respectively formed on two opposite sides of the carrier 1, and the third metal sheet 4-3 is fitted in the arc-shaped grooves, and the metal strips are respectively connected to the third metal sheets 4-3 on both sides. The arc-shaped grooves and the third metal sheet 4-3 with a large internal area of ​​the grooves can ensure that when the device is plated, the hanger can well clamp the carrier and form a good conductive effect with the hanger.

[0031] In some embodiments, the first metal sheet 4 , the spring 4 - 1 , the second metal sheet 4 - 2 , the third metal sheet 4 - 3 and the metal strip inside the carrier 1 are all made of SUS304 or SUS316 material.

[0032] The clamp 3 includes a flat plate of PE material, on which two pairs of orthogonal clamping parts are provided, and each pair of clamping parts includes two horizontally movable positioning pins 3-1 arranged opposite to each other. The flat plate is also provided with vertical positioning pins 3-2 adapted to the positioning holes on the carrier 1. In this embodiment, the horizontally movable positioning pins 3-1 pass through the flat plate vertically and can move in a straight line in the horizontal direction. By adjusting the relative spacing between the two pairs of horizontally movable positioning pins 3-1, the four sides of the PGA ceramic shell 2 are clamped, and it is suitable for products with different shapes. The horizontally movable positioning pins 3-1 can be connected to the flat plate by a sliding groove or other means, and the two can be kept stable by relative friction or a conventional locking device can be set.

[0033] The position and number of the vertical locating pins 3-2 on the clamp 3 are adapted to the locating holes of the carrier 1, and a locating pin height adjustment structure is provided. The vertical locating pins 3-2 pass through the plate vertically, and their length is relatively long. The locating pin height adjustment structure can adopt other existing technologies such as setting a height locking nut on the side. The relative distance between the clamp 3 and the carrier 1 is controlled by adjusting the height of the vertical locating pins 3-2, so as to adapt to products of different sizes. Furthermore, a layer of silicone 3-3 is provided at the position where the clamp 3 contacts the PGA ceramic shell 2.

[0034] like Figure 5 , Figure 6 As shown, when the fixture 3 holding the PGA ceramic shell 2 is assembled to the front side of the carrier 1, the lead pins 2-1 at the bottom of the PGA ceramic shell 2 are vertically inserted into the small holes 1-1 and contact the first metal sheet 4, and the spring 4-1 is in a compressed state, thereby ensuring that the lead pins 2-1 have a good electrical connection with the first metal sheet 4, so that all the lead pin grids are interconnected and led out from the side of the carrier 1.

[0035] With structure like Figure 1 , Figure 2Taking the PGA121 ceramic shell shown as an example, the PGA ceramic shell 2 is a ceramic shell using a normal production process. Since the 121 lead pins 2-1 at the bottom are independent of each other, if conventional electroplating is used, the efficiency is low and the yield rate is also low. With this device, the PGA ceramic shell 2 is first clamped and fixed with a horizontal movable positioning pin 3-1, and then all the lead pins 2-1 are respectively inserted into the small holes 1-1 on the front of the carrier 1, and each lead pin 2-1 is respectively in contact with the first metal sheet 4 in the small hole 1-1, and then fixed on the carrier 1 with a vertical positioning pin 3-2. All the lead pins 2-1 are interconnected to the third metal sheet 4-3 on the side of the device carrier 1 through the first metal sheet 4, the spring 4-1, the second metal sheet 4-2, and the metal strip in turn, and finally the entire device can be hang-plated. This device makes the island pin grid electroplating of the PGA ceramic shell more convenient and greatly improves the yield rate of electroplating.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A device for pin grid electroplating of a PGA ceramic package, characterized in that: It comprises a porous carrier (1) into which a PGA pin grid can be inserted and a clamp (3) for clamping a PGA ceramic housing (2); The front surface of the carrier (1) is provided with a plurality of vertical small holes (1-1) and a plurality of positioning holes; a telescopic metal spring (4-1) is vertically provided in each small hole (1-1); the top end of the spring (4-1) is connected to a horizontally arranged first metal sheet (4); the bottom end of the spring (4-1) is connected to a horizontally arranged second metal sheet (4-2); the second metal sheets (4-2) in all the small holes (1-1) are interconnected via a metal strip inside the carrier (1); the metal strip is extended to connect to a third metal sheet (4-3) on the side of the carrier (1); The fixture (3) is provided with a vertical positioning pin (3-2) adapted to the positioning hole; when the fixture (3) holding the PGA ceramic shell (2) is assembled to the front side of the carrier (1), the lead pins (2-1) at the bottom of the PGA ceramic shell (2) are correspondingly vertically inserted into the small holes (1-1) and contact the first metal sheet (4), and the spring (4-1) is in a compressed state.

2. The pin grid electroplating device for PGA ceramic package according to claim 1, characterized in that: The carrier (1) has vertical grooves on two opposite side surfaces, respectively, and the third metal sheet (4-3) is fitted in the grooves.

3. The pin grid electroplating device for PGA ceramic package according to claim 1, characterized in that: The clamp (3) comprises a flat plate, on which are provided two pairs of orthogonal clamping parts; each pair of clamping parts comprises two horizontally movable positioning pins (3-1) arranged opposite to each other.

4. The pin grid electroplating device for PGA ceramic package according to claim 3, characterized in that: The vertical positioning pin (3-2) is provided with a positioning pin height adjustment structure.

5. The pin grid electroplating device for PGA ceramic package according to claim 4, characterized in that: A layer of silica gel (3-3) is provided at the position where the clamp (3) contacts the PGA ceramic housing (2).

6. The device for pin-grid electroplating of a PGA ceramic package according to any one of claims 1 to 4, characterized in that: The first metal sheet (4), the spring (4-1), the second metal sheet (4-2), the third metal sheet (4-3) and the metal strip inside the carrier (1) are all made of SUS304 or SUS316 material.

7. The pin grid electroplating device for PGA ceramic package according to claim 6, characterized in that: The carrier (1) and the clamp (3) are made of PE material.

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