Air conditioner

Abstract

The embodiment of the utility model provides an air conditioner. The air conditioner comprises a display panel and a voice device arranged on the display panel. Wherein the voice device comprises a shell, a loudspeaker assembly, a microphone assembly and a circuit board, and the loudspeaker assembly, the microphone assembly and the circuit board are all arranged in the shell. The loudspeaker assembly and the microphone assembly are electrically connected with the display panel through the circuit board, and the loudspeaker assembly and the microphone assembly are arranged on the two sides of the circuit board in the thickness direction. On one hand, the loudspeaker assembly and the microphone assembly are both arranged in the shell to form an assembly, the installation process is simplified, and the production efficiency is improved. And on the other hand, the loudspeaker assembly and the microphone assembly are electrically connected with the circuit board, the circuit arrangement is simplified, only the circuit board needs to be connected for inspection before installation, and the inspection process is simplified. And meanwhile, the circuit board is arranged to block the sound of the loudspeaker assembly, so that the sound receiving effect of the microphone assembly is improved, parts are reduced, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of air conditioning, and in particular to an air conditioner. Background Art

[0002] Air conditioners have entered more and more households and have become an indispensable tool for people to cool down in summer. With the change of people's usage needs and the development of technology, people have more and more requirements for the functions of air conditioners, and air conditioners with voice functions have become the choice of more consumers. In the related technology, the production and installation of speakers and microphones in air conditioners requires multiple wiring and separate inspections, which is complicated to install and has low production efficiency. Utility Model Content

[0003] In view of this, an embodiment of the present application provides an air conditioner for improving the problems of complex installation of speakers and microphones and low production efficiency during the production process of air conditioners.

[0004] To achieve the above-mentioned purpose, an embodiment of the present application provides an air conditioner, which includes a display panel and a voice device arranged on the display panel, wherein the voice device includes a shell, a speaker assembly, a microphone assembly and a circuit board, the speaker assembly, the microphone assembly and the circuit board are all arranged in the shell, the speaker assembly and the microphone assembly are both electrically connected to the display panel through the circuit board, and the speaker assembly and the microphone assembly are arranged on both sides of the circuit board along the thickness direction.

[0005] In some embodiments, the shell has a accommodating cavity, the circuit board divides the accommodating cavity into a first accommodating cavity and a second accommodating cavity arranged along the thickness direction of the shell, the speaker assembly is arranged in the first accommodating cavity, and the microphone assembly is arranged in the second accommodating cavity.

[0006] In some embodiments, a support structure is disposed in the first accommodating cavity and / or the second accommodating cavity, and the circuit board is connected to the support structure.

[0007] In some embodiments, a sound emission area is provided on a side wall of the shell located on a side of the first accommodating cavity away from the second accommodating cavity, and a sound receiving area is provided on a side wall of the shell located on a side of the second accommodating cavity away from the first accommodating cavity.

[0008] In some embodiments, the sound release area is provided with a plurality of sound release holes, and the shell includes a reinforcement member provided in the sound release area.

[0009] In some embodiments, the audio device includes a sound insulating member, and the sound insulating member is disposed on a side of the speaker assembly close to the microphone assembly.

[0010] In some embodiments, the circuit board is provided with an avoidance area, the avoidance area is used to avoid the speaker assembly and / or the sound insulation member, and the sound insulation member covers the avoidance area.

[0011] In some embodiments, the microphone assembly is disposed on a side of the circuit board facing the second accommodating cavity.

[0012] In some embodiments, the shell includes a first shell and a second shell, the first shell and the second shell are connected to define the accommodating cavity; and / or, an outer wall of the shell is protrudingly provided with a mounting portion, and the mounting portion is connected to the display panel.

[0013] In some embodiments, a wire hole is provided through the side wall of the shell.

[0014] The speech device provided in the embodiment of the present application includes a housing, a speaker assembly, a microphone assembly and a circuit board. On the one hand, the speaker assembly and the microphone assembly are both arranged in the housing to form a component. When installing, it is only necessary to install the housing, which simplifies the installation process and improves production efficiency. On the other hand, the speaker assembly and the microphone assembly are electrically connected to the circuit board, and then the circuit board is electrically connected to the display panel of the air conditioner, which simplifies the circuit setting, and only the circuit board needs to be connected for inspection before installation, which simplifies the inspection process. At the same time, the circuit board is arranged between the speaker assembly and the microphone assembly to block the sound of the speaker assembly and improve the sound collection effect of the microphone assembly, without setting other components to separate the speaker assembly and the microphone assembly, thereby reducing components, reducing costs and improving assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 An exploded diagram of a voice device according to an embodiment of the present application;

[0016] Figure 2 This is a schematic structural diagram of a first shell according to an embodiment of the present application;

[0017] Figure 3 for Figure 1 A cross-sectional view of a speech device.

[0018] Description of Reference Numerals

[0019] 100. Voice device; 1. Shell; 1a. Mounting portion; 1b. Wire hole; 11. Accommodating cavity; 11a. First accommodating cavity; 11b. Second accommodating cavity; 12. First shell; 121. Sound emission area; 121a. Sound emission hole; 122. Reinforcement member; 13. Second shell; 131. Sound receiving area; 131a. Sound receiving hole; 14. Support structure; 2. Speaker assembly; 3. Microphone assembly; 4. Circuit board; 4a. Avoidance area; 5. Sound insulation member. DETAILED DESCRIPTION

[0020] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0021] In the description of the embodiments of the present application, the technical terms "first", "second", "third", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0022] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0024] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0025] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "contact" should be understood in a broad sense, and may be direct contact or contact through an intermediate medium layer. It may be contact with essentially no interaction force between the two contacting parties, or it may be contact with interaction force between the two contacting parties.

[0026] In the related art, the speaker and the microphone are two independent parts. The installation of the speaker and the microphone in the air conditioner production requires multiple wirings and separate inspections, which makes the installation complicated and the production efficiency low.

[0027] The present application embodiment provides an air conditioner. Figure 1 The air conditioner includes a display panel and a voice device 100 disposed on the display panel. The voice device 100 includes a housing 1, a speaker assembly 2, a microphone assembly 3 and a circuit board 4, and the speaker assembly 2, the microphone assembly 3 and the circuit board 4 are all disposed in the housing 1. The speaker assembly 2 and the microphone assembly 3 are both electrically connected to the display panel through the circuit board 4, and the speaker assembly 2 and the microphone assembly 3 are disposed on both sides of the circuit board 4 along the thickness direction.

[0028] The display panel is a module in the air conditioner that displays the air conditioner status data, such as the air conditioner temperature, wind speed, working mode, etc. The display panel is connected to the control system of the air conditioner, and the voice device 100 is connected to the display panel to connect the voice device 100 to the control system of the air conditioner, thereby realizing the power supply of the voice device 100, and the control of the functions such as the sound emission of the speaker component 2 and the sound collection of the microphone component 3.

[0029] The speaker assembly 2 is an electroacoustic transducer device. By converting the electrical signal emitted by the control system into an acoustic signal, the control system can transmit information through the speaker assembly 2 .

[0030] Generally, the speaker assembly 2 is composed of a truncated cone-shaped frame and a cylindrical driving unit. The truncated cone has a cavity inside, and a paper cone or diaphragm is arranged on the side close to the smaller bottom surface of the truncated cone. The cylindrical driving unit is connected to the side of the smaller bottom surface of the truncated cone to drive the paper cone or diaphragm to vibrate. The sound is diffused and transmitted from the side of the smaller bottom surface of the truncated cone to the side of the larger bottom surface of the truncated cone. When the speaker assembly 2 is installed in the shell 1, the larger bottom surface of the truncated cone is aligned with the inner wall of the shell 1 as much as possible, and the distance from the inner wall is as small as possible to reduce the loss of sound inside the shell 1.

[0031] The microphone assembly 3 is an acoustic-electric transducer device, which converts external acoustic signals into electrical signals and transmits them to the control system. The control system can receive signals sent from the outside through the microphone assembly 3 .

[0032] Here, in order to reduce the volume of the microphone component 3, the microphone component 3 generally adopts a microphone module, and the microphone module includes a control module and a sound receiving module. The microphone module is small in size, and when in use, only the wiring of the microphone module needs to be connected.

[0033] The specific type of the circuit board 4 is not limited here, for example, it can be a printed circuit board or a printed circuit board 4, etc. Various circuits can be integrated on the circuit board 4, and the circuits of the speaker assembly 2 and the microphone assembly 3 can be connected to the circuit board 4, and then the wiring harness led out from the circuit board 4 is connected to the display panel to realize the power supply and signal transmission control of the speaker assembly 2 and the microphone assembly 3, simplifying the circuit design. The circuit board 4 can also be designed into various shapes to adapt to the internal shape of the housing 1 for easy installation.

[0034] Here, the speaker assembly and the microphone assembly are arranged on both sides of the circuit board along the thickness direction. On the one hand, it is conducive to realizing the electrical connection between the speaker assembly 2 and the microphone assembly 3. On the other hand, the circuit board is equivalent to a separator, separating the speaker assembly 2 from the microphone assembly 3. Therefore, there is no need to set other components to separate the speaker assembly and the microphone assembly, which can reduce components, reduce costs and improve assembly efficiency.

[0035] The speech device 100 provided in the embodiment of the present application includes a housing 1, a speaker assembly 2, a microphone assembly 3 and a circuit board 4. On the one hand, the speaker assembly 2 and the microphone assembly 3 are both arranged in the housing 1 to form a component. When installing, it is only necessary to install the housing 1, which simplifies the installation process and improves production efficiency. On the other hand, the speaker assembly 2 and the microphone assembly 3 are electrically connected to the circuit board 4, and then the circuit board 4 is electrically connected to the display panel of the air conditioner, which simplifies the circuit setting, and before installation, it is only necessary to connect the circuit board 4 for inspection, which simplifies the inspection process. At the same time, the circuit board 4 is arranged between the speaker assembly 2 and the microphone assembly 3 to block the sound of the speaker assembly 2 and improve the sound collection effect of the microphone assembly 3, without setting other components to separate the speaker assembly 2 and the microphone assembly 3, reducing components, reducing costs and improving assembly efficiency.

[0036] For some examples, see Figure 1 and Figure 3 The shell 1 has a accommodating cavity 11, and the circuit board 4 divides the accommodating cavity 11 into a first accommodating cavity 11a and a second accommodating cavity 11b arranged along the thickness direction of the shell. The speaker assembly 2 is arranged in the first accommodating cavity 11a, and the microphone assembly 3 is arranged in the second accommodating cavity 11b.

[0037] The specific shape of the housing 1 is not limited here.

[0038] Here, for convenience of explanation, the thickness direction is Figure 1 direction shown.

[0039] The specific structures of the first accommodating cavity 11 a and the second accommodating cavity 11 b are not limited here, and are specifically determined according to the structures of the speaker assembly 2 and the microphone assembly 3 , and can accommodate the speaker assembly 2 and the microphone assembly 3 .

[0040] On one hand, the circuit board 4 can separate the accommodating chamber 11 into a first accommodating chamber 11 a and a second accommodating chamber 11 b . On the other hand, the circuit board 4 can separate the speaker assembly 2 and the microphone assembly 3 , thereby reducing the influence of the sound emitted by the speaker assembly 2 on the sound collection of the microphone assembly 3 .

[0041] In some embodiments, see Figure 1 The outer contour of the housing 1 is a rectangular parallelepiped, and the circuit board 4 is arranged perpendicular to the thickness direction of the housing, dividing the housing 1 into a first accommodating cavity 11a and a second accommodating cavity 11b from bottom to top along the thickness direction of the housing. The outer contour edge of the housing 1 is smoothly transitioned through an arc, which reduces the risk of the internal wiring harness of the air conditioner being damaged by the sharp edges of the housing 1 and also increases the aesthetics of the housing 1.

[0042] The arrangement of the loudspeaker assembly 2 in the first accommodating cavity 11 a is not limited here. For example, the loudspeaker assembly 2 can be fixed to the inner wall of the first accommodating cavity 11 a by screws or glue.

[0043] The arrangement of the microphone assembly 3 in the second accommodating cavity 11 b is not limited here. For example, the speaker assembly 2 can be fixed to the inner wall of the second accommodating cavity 11 b by using screws or glue.

[0044] Here, it should be noted that the arrangement positions of the speaker assembly 2 and the microphone assembly 3 should be as conducive as possible to reducing the volumes of the first accommodating cavity 11 a and the second accommodating cavity 11 b , so as to reduce the volume of the housing 1 .

[0045] The speaker assembly 2 and the microphone assembly 3 are separated by the circuit board 4. The blocking of the circuit board 4 reduces the influence of the sound emitted by the speaker assembly 2 on the sound collected by the microphone assembly 3, and fully utilizes the structural separation function of the circuit board 4 to simplify the structure of the voice device 100 and reduce the production cost.

[0046] For some examples, see Figure 1 and Figure 2 A supporting structure 14 is disposed in the first accommodating cavity 11 a and / or the second accommodating cavity 11 b , and the circuit board 4 is connected to the supporting structure 14 .

[0047] The specific structure of the support structure 14 is not limited here. The circuit board 4 can be fixed in the accommodating cavity 11, and the accommodating cavity 11 can be divided into a first accommodating cavity 11a and a second accommodating cavity 11b. For example, the support structure 14 can be extended into the accommodating cavity 11 near the separation position of the first accommodating cavity 11a and the second accommodating cavity 11b in the housing 1, and the circuit board 4 is connected to the support structure 14. The support structure 14 here can be a structure of a continuous protruding edge arranged around the housing 1, or a discontinuous structure of multiple protruding blocks, etc.

[0048] The specific setting position of the support structure 14 is not limited here. It is determined according to the separation position of the first accommodating cavity 11a and the second accommodating cavity 11b, so that after the circuit board 4 is installed, it will not interfere with the speaker component 2 in the first accommodating cavity 11a and the microphone component 3 in the second accommodating cavity 11b.

[0049] In some embodiments, see Figure 2 , on the inner wall of the first accommodating cavity 11a opposite to the circuit board 4, a plurality of columns are arranged along the thickness direction of the shell, threaded holes are arranged on the columns, the circuit board 4 is supported by the columns, round holes are opened on the circuit board 4 at positions corresponding to the columns, and the circuit board 4 is connected to the columns using corresponding screws. By changing the height of the columns, the setting position of the circuit board 4 in the thickness direction of the shell is adjusted, so that the volume of the first accommodating cavity 11a and the second accommodating cavity 11b can be controlled. Here, the setting of the columns can also support the shell 1 and enhance the strength of the shell 1.

[0050] It is understandable that the column can be set in the first accommodating cavity 11a, or in the second accommodating cavity 11b, or both the first accommodating cavity 11a and the second accommodating cavity 11b can be provided with columns, and both can realize the support connection of the circuit board 4. The specific setting position is determined according to the internal space structure of the shell 1.

[0051] By setting the support structure 14 to connect the circuit board 4, the setting position of the circuit board 4 is adjusted by changing the setting position of the support structure 14, thereby controlling the volume of the first accommodating cavity 11a and the second accommodating cavity 11b. On the other hand, during assembly, the parts that are inconvenient to install are installed first, and after the installation is completed, the circuit board 4 is installed and connected to the support structure 14, thereby reducing the difficulty of installation.

[0052] For some examples, see Figures 1 to 3 A sound emission area 121 is provided on the side wall of the shell 1 located on the side of the first accommodating cavity 11a away from the second accommodating cavity 11b, and a sound receiving area 131 is provided on the side wall of the shell 1 located on the side of the second accommodating cavity 11b away from the first accommodating cavity 11a.

[0053] The sound emission area 121 is an area on the shell 1 where the sound emission holes 121a corresponding to the sound emission positions of the speaker assembly 2 are arranged. The sound emitted by the speaker assembly 2 can be transmitted to the outside of the shell 1 through the sound emission holes 121a, reducing the attenuation of the sound caused by the obstruction of the shell 1.

[0054] Similarly, the sound collecting area 131 is an area on the shell 1 where the sound collecting holes 131a corresponding to the sound collecting positions of the microphone assembly 3 are set. External sounds are transmitted to the sound collecting positions of the microphone assembly 3 inside the shell 1 through the sound collecting holes 131a, thereby reducing the attenuation of the sound caused by the obstruction of the shell 1.

[0055] Here, it should be noted that the setting positions of the sound emission area 121 and the sound receiving area 131 correspond to the sound emission position of the speaker assembly 2 and the sound receiving position of the microphone assembly 3 respectively, and the sound emission hole 121a and the sound receiving hole 131a are respectively limited to the range of the shell 1 corresponding to the sound emission position of the speaker assembly 2 and the sound receiving position of the microphone assembly 3, which can improve the sound emission effect of the speaker assembly 2 and the sound receiving effect of the microphone assembly 3.

[0056] The structures of the sound-releasing holes 121 a and the sound-receiving holes 131 a are not limited here, and they may be, for example, circular holes, polygonal holes, elliptical holes, waist-shaped holes, or irregular holes, etc.

[0057] Generally, the sound-emitting area of ​​the speaker assembly 2 is relatively large, and as many sound-emitting holes 121a as possible can be provided on the housing 1 corresponding to the sound-emitting area of ​​the speaker assembly 2 to improve the sound-emitting effect. The sound-receiving area of ​​the microphone assembly 3 is relatively small, and one, two, or three sound-receiving holes 131a can be provided. Of course, in order to improve the sound-receiving effect, the number of sound-receiving holes 131a can also be increased.

[0058] By setting the sound emission area 121 and the sound collection area 131 on the housing 1, the attenuation of the sound caused by the obstruction of the housing 1 is reduced, which is beneficial to the sound emission of the speaker assembly 2 and the sound collection of the microphone assembly 3. The sound emission area 121 and the sound collection area 131 are respectively set on the opposite sides of the housing 1, so that the sound emitted by the speaker assembly 2 is as far away from the sound collection position of the microphone assembly 3 as possible, reducing the influence on the sound collection of the microphone assembly 3.

[0059] For some examples, see Figures 1 to 3 The sound release area 121 is provided with a plurality of sound release holes 121 a , and the housing 1 includes a reinforcement member 122 provided in the sound release area 121 .

[0060] The sound release hole 121 a is a through hole structure opened on the sound release area 121 . The sound release hole 121 a corresponds to the sound release position of the speaker assembly 2 , and transmits the sound emitted by the speaker assembly 2 to the outside of the housing 1 .

[0061] Generally, a plurality of sound-releasing holes 121a are required to improve the sound-releasing effect of the speaker. When a plurality of sound-releasing holes 121a are provided in the sound-releasing area 121, the strength of the sound-releasing area 121 is weakened, and when pressed from the outside, the sound-releasing area 121 is deformed toward the inside of the housing 1. Here, by providing a reinforcement member 122 inside the housing 1, the deformation of the sound-releasing area 121 is prevented from exceeding the allowable elastic deformation limit of the housing 1 in the sound-releasing area 121, thereby damaging the housing 1.

[0062] The specific structure of the reinforcement 122 is not limited here, and it only needs to be able to block the sound-releasing area 121 from deforming too much inside the shell 1, and at the same time, the reinforcement area will not block the sound emitted by the speaker assembly 2 too much.

[0063] In some embodiments, the reinforcement member 122 is disposed on the inner side of the sound release area 121 close to the shell 1, and the reinforcement member 122 is connected to the inner wall of the shell 1. The reinforcement member 122 is a mesh structure formed by cross-connecting a plurality of reinforcement ribs, which has a certain strength, and the gaps in the middle of the mesh structure can allow sound to be freely transmitted to the sound release area 121.

[0064] The sound-generating position of the speaker assembly 2 can also be bonded to the reinforcement member 122 by means of glue, thereby shortening the sound transmission distance. At the same time, the reinforcement member 122 also provides support and fixation for the speaker assembly 2 .

[0065] By providing a plurality of sound holes 121a in the sound emission area 121, the sound emission effect of the speaker assembly 2 is improved. The provision of the reinforcement member 122 solves the problem that too many sound holes 121a lead to a weak structure of the sound emission area 121, and is conducive to providing more sound holes 121a, further improving the sound emission effect.

[0066] For some examples, see Figure 1 and Figure 3 The voice device 100 includes a sound insulating member 5 , which is arranged on a side of the speaker assembly 2 close to the microphone assembly 3 .

[0067] The sound insulation member 5 is made of sound insulation material and has the function of weakening and blocking the sound. The specific material of the sound insulation member 5 is not limited here, for example, it can be sound insulation cotton or sound insulation board.

[0068] The form in which the sound insulation member 5 is arranged on the side of the speaker assembly 2 close to the microphone assembly 3 is not limited here and is determined according to actual needs.

[0069] In some embodiments, a partition layer is set in the first cavity using a sound insulation member 5, so that one side of the sound insulation member 5 is the speaker assembly 2, and on the other side, the sound insulation member 5 and the circuit board 4 form an air layer. In this way, the sound insulation member 5 itself and the air layer have a double barrier effect on the sound emitted by the speaker assembly 2, so as to obtain a good sound insulation effect.

[0070] In other embodiments, the sound insulation member 5 is made of sound insulation cotton, which is pasted on the side of the circuit board 4 close to the speaker assembly 2 to fully cover the circuit board 4. In this way, a certain sound insulation effect can be obtained while the structure is simple and the cost is saved. Of course, the sound insulation cotton can also be pasted only at the location where the sound is most concentratedly transmitted to the microphone assembly 3 to save the manufacturing materials of the sound insulation member 5.

[0071] By arranging a sound insulation member 5 on the side of the loudspeaker assembly 2 close to the microphone assembly 3, the sound transmitted from the loudspeaker assembly 2 to the microphone assembly 3 is weakened, thereby reducing the influence of noise on the sound collection of the microphone assembly 3.

[0072] For some examples, see Figure 1 and Figure 3 The circuit board 4 is provided with an avoidance area 4a, and the avoidance area 4a is used to avoid the speaker assembly 2 and / or the sound insulation member 5, and the sound insulation member 5 covers the avoidance area 4a.

[0073] The specific structure of the avoidance area 4a is not limited hereafter, and is specifically determined by the structures of the speaker assembly 2 and the sound insulation member 5. It only needs to avoid the speaker assembly 2 and the sound insulation member 5 and not interfere with the circuit board 4.

[0074] The sound insulation member 5 covers the avoidance area 4 a , weakening the sound transmitted from the speaker assembly 2 from the avoidance area 4 a to the second accommodating cavity 11 b , affecting the sound collection of the microphone assembly 3 .

[0075] The form in which the sound insulation member 5 covers the avoidance area 4a is not limited here. For example, the sound insulation member 5 having a larger area than the avoidance area 4a can be pasted on one side of the avoidance area 4a, and the sound insulation member 5 covers the avoidance area 4a so that the avoidance area 4a is not exposed.

[0076] In some embodiments, see Figure 1 The speaker assembly 2 has a protruding cylindrical structure on one side close to the circuit board 4, the sound insulation member 5 is pasted on the circular bottom surface of the cylindrical structure, the circuit board 4 has a circular avoidance area 4a, the cylindrical structure and the sound insulation member 5 extend into the avoidance area 4a, wherein the sound insulation member 5 is interference fit with the avoidance area 4a, so that the avoidance area 4a is tightly filled with the sound insulation member 5.

[0077] By setting the avoidance area 4a on the circuit board 4, the circuit board 4 and the speaker assembly 2 are assembled more compactly, which is beneficial to reducing the volume of the housing 1. The sound insulation member 5 is set in the avoidance area 4a to reduce the adverse effect of the avoidance area 4a on the sound insulation effect.

[0078] For some examples, see Figure 1 and Figure 3 The microphone assembly 3 is arranged on a side of the circuit board 4 facing the second accommodating cavity 11 b.

[0079] The specific arrangement of the microphone assembly 3 on the circuit board 4 is not limited here. For example, a mounting structure of the microphone assembly 3 can be arranged on the circuit board 4, and the microphone assembly 3 is connected to the mounting structure.

[0080] In some embodiments, the microphone assembly 3 is a microphone module, the microphone module is provided with pins, the circuit board 4 is provided with welding points corresponding to the pins, and the pins are welded to the welding points by welding, so that the microphone assembly 3 is fixed to the circuit board 4. Here, the connection between the pins and the welding points not only realizes the structural connection and fixation between the microphone assembly 3 and the circuit board 4, but also realizes the connection of the circuit of the microphone assembly 3 to the circuit board 4. At the same time, the length of the pins and the position of the welding points can be changed to realize that the microphone assembly 3 is close to the circuit board 4, thereby reducing the volume of the second accommodating cavity 11b.

[0081] The location of the microphone assembly 3 on the side of the circuit board 4 facing the second accommodating cavity 11 b is not limited here, and only needs to facilitate the circuit design of the circuit board 4, the shape and size design of the second accommodating cavity 11 b, and the setting of the sound collecting area 131.

[0082] Exemplarily, the microphone assembly 3 is disposed at a position on the circuit board 4 away from the sound-emitting position of the speaker assembly 2 , so that the influence of the sound emitted by the speaker assembly 2 on the sound received by the microphone assembly 3 can be reduced.

[0083] Exemplarily, the sound receiving position of the microphone assembly 3 is upward in the thickness direction of the shell, and two sound receiving holes are provided on the shell 1 at positions opposite to the sound receiving position to form a sound receiving area. The shell 1 is installed in contact with the air conditioning panel on one side where the sound receiving area is provided, and an avoidance structure is provided on the air conditioning panel at positions corresponding to the sound receiving holes to avoid the sound receiving holes.

[0084] By arranging the microphone assembly 3 on the side of the circuit board 4 facing the second accommodating cavity 11b, on the one hand, the circuit board 4 blocks the sound emitted by the speaker assembly 2 from entering the second accommodating cavity 11b and affecting the sound receiving effect of the microphone assembly 3. On the other hand, arranging the microphone assembly 3 on the circuit board 4 is beneficial to reducing the installation space required for the microphone assembly 3, thereby reducing the size of the housing 1 and simplifying the circuit.

[0085] For some examples, see Figure 1 and Figure 3 The housing 1 includes a first housing 12 and a second housing 13, the first housing 12 and the second housing 13 are connected to define a receiving chamber 11;

[0086] The specific structure of the first shell 12 and the second shell 13 is not limited here. It is only necessary that the accommodating cavity 11 formed by connecting the first shell 12 and the second shell 13 can accommodate the speaker assembly 2, the microphone assembly 3 and the circuit board 4.

[0087] The connection between the first shell 12 and the second shell 13 is not limited here, and it is sufficient that the connection between the first shell 12 and the second shell 13 is firm and reliable.

[0088] In some embodiments, the first shell 12 and the second shell 13 are bonded at the connection contact surface to make the overall structure firm and reliable. The connection surfaces of the first shell 12 and the second shell 13 only need to be two fittable surfaces, and the structure is simple.

[0089] In other embodiments, the connection between the first shell 12 and the second shell 13 adopts a detachable structure, for example, corresponding buckle structures are respectively provided on the first shell 12 and the second shell 13, or corresponding threaded structures are respectively provided on the structural bodies of the first shell 12 and the second shell 13, or the first shell 12 and the second shell 13 are connected by screws, etc. In this way, the first shell 12 and the second shell 13 are conveniently disassembled, which is beneficial to the maintenance of the voice device 100.

[0090] The connection surface of the first shell 12 and the second shell 13 may be disposed at any position without limitation. For example, the connection surface may be perpendicular to the thickness direction of the shell, or parallel to the thickness direction of the shell, or may be disposed at an angle to the thickness direction of the shell.

[0091] By configuring the housing 1 to be formed by connecting the first housing 12 and the second housing 13, it is convenient to manufacture the housing 1 and reduce the production cost of the housing 1. At the same time, the separate housing 1 provides more installation operation space for assembly during the production and assembly of the voice device 100, reducing the difficulty of assembly. When the first housing 12 and the second housing 13 are connected in a detachable structure, it is also convenient for the maintenance of the voice device 100.

[0092] For some examples, see Figure 1 The outer wall of the housing 1 is provided with a mounting portion 1a protruding therefrom, and the mounting portion 1a is connected to the display panel.

[0093] The specific structure of the installation wall is not limited here.

[0094] Exemplarily, two mounting parts 1a are provided on the outer wall of the housing 1, and the mounting parts 1a are rectangular blocks extending outward from the outer wall of the housing 1, and one side of the rectangular block is flush with the surface of the housing 1. Through holes are provided on the mounting parts 1a, and the mounting parts 1a are fixed and installed by screws.

[0095] By providing the mounting portion 1a and connecting the mounting portion 1a and the display panel, the fixed installation of the voice device 100 is achieved, and the structure is simple.

[0096] For some examples, see Figures 1 to 3 A wire hole 1b is provided through the side wall of the housing 1.

[0097] The structure of the wire hole 1b is not limited here, and is specifically determined according to the size of the wire harness. For example, it can be a round hole or a waist hole.

[0098] The location of the wire hole 1 b is not limited here, as long as it is convenient for the circuit board 4 to lead out the wire harness.

[0099] For example, a circular hole is opened on the surface of the housing 1 parallel to the thickness direction of the housing as a wire hole 1b, and the wire harness is connected from the circuit board 4, passes through the wire hole 1b, and is connected to the display panel. In some embodiments, the edge of the circular hole is chamfered, or a soft material is wrapped on the circular hole, such as a rubber sheath, to reduce the damage to the wire harness caused by the friction between the edge of the wire hole 1b and the wire harness.

[0100] By setting a wire hole 1b through the side wall of the shell 1, the wiring harness on the circuit board 4 is led out from the inside of the shell 1 and connected to the display panel of the air conditioner, so as to realize the connection between the display panel and the voice device 100 and simplify the equipment wiring.

[0101] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. An air conditioner, characterized in that: The air conditioner includes a display panel and a voice device arranged on the display panel, wherein the voice device includes a shell, a speaker assembly, a microphone assembly and a circuit board, the speaker assembly, the microphone assembly and the circuit board are all arranged in the shell, the speaker assembly and the microphone assembly are both electrically connected to the display panel through the circuit board, and the speaker assembly and the microphone assembly are arranged on both sides of the circuit board along the thickness direction.

2. The air conditioner according to claim 1, characterized in that: The shell has a accommodating cavity, and the circuit board divides the accommodating cavity into a first accommodating cavity and a second accommodating cavity arranged along the thickness direction of the shell. The speaker assembly is arranged in the first accommodating cavity, and the microphone assembly is arranged in the second accommodating cavity.

3. The air conditioner according to claim 2, characterized in that: A supporting structure is disposed in the first accommodating cavity and / or the second accommodating cavity, and the circuit board is connected to the supporting structure.

4. The air conditioner according to claim 2, characterized in that: A sound emission area is arranged on the side wall of the shell located at the side of the first accommodating chamber away from the second accommodating chamber, and a sound receiving area is arranged on the side wall of the shell located at the side of the second accommodating chamber away from the first accommodating chamber.

5. The air conditioner according to claim 4, characterized in that: The sound release area is provided with a plurality of sound release holes, and the shell includes a reinforcement member provided in the sound release area.

6. The air conditioner according to claim 2, characterized in that: The voice device comprises a sound insulating member, and the sound insulating member is arranged on a side of the speaker assembly close to the microphone assembly.

7. The air conditioner according to claim 6, characterized in that: The circuit board is provided with an avoidance area, the avoidance area is used to avoid the speaker assembly and / or the sound insulation member, and the sound insulation member covers the avoidance area.

8. The air conditioner according to claim 2, characterized in that: The microphone assembly is arranged on a side of the circuit board facing the second accommodating cavity.

9. The air conditioner according to claim 2, characterized in that: The shell includes a first shell and a second shell, the first shell and the second shell are connected to define the accommodating cavity; and / or, an outer side wall of the shell is protrudingly provided with a mounting portion, and the mounting portion is connected to the display panel.

10. The air conditioner according to claim 1, characterized in that: A wire hole is formed through the side wall of the shell.

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