Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device which comprises a wafer piece A. The wafer cleaning device further comprises a cleaning box, a brush base, a first transmission roller, a second transmission roller and a motor, one side of the cleaning box is connected with a blow-off pipe in a penetrating mode, and the blow-off pipe is communicated with the bottom of the inner wall of the cleaning box. Firstly, through mutual cooperation of a first transmission roller and a second transmission roller, a placed wafer can be clamped and positioned, then, a motor can drive the clamped wafer to rotate in a cleaning box, finally, cleaning liquid is injected into the cleaning box, two brush strips arranged in front of and behind the wafer are used for brushing the wafer, and the cleaning efficiency is improved. The structure is reasonable, the wafer can be rotationally brushed, and the cleaning effect can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning devices, in particular to a wafer cleaning device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. The surface of the wafer must have extremely high flatness, smoothness and cleanliness. During the processing, there will be chemical reagents on the surface of the wafer. The residual chemical solvents on the surface of the wafer need to be cleaned to ensure the cleanliness of the wafer. Therefore, wafer cleaning brushes and wafer cleaning devices are needed;

[0003] The Chinese utility model patent with publication number CN215844496U discloses a wafer cleaning brush and a wafer cleaning device, including a cleaning machine and a cleaning brush. Adjustment mechanisms are welded on both sides of the inner wall of the cleaning machine, and the adjustment mechanisms can automatically retract and fix the wafer. A drainage mechanism is installed under the inner wall of the cleaning machine; the cleaning brush is installed above the inner wall of the cleaning machine, and a sliding mechanism is installed under the cleaning brush. The utility model is provided with a fixing plate, an electric turntable, an electric telescopic sleeve, a clamping plate and a sponge layer. When in use, the clamping plate can be moved to a suitable position by the extension and retraction of the electric telescopic sleeve, so as to effectively fix and clamp the wafer, and a sponge layer is installed on the inner wall of the clamping plate, which can effectively protect the wafer. After one side of the wafer is rinsed clean, the electric turntable is started to drive the wafer to automatically rotate and change the surface, making it extremely convenient to use.

[0004] When the device cleans the wafer, a clamping structure is required to clamp and fix the wafer. However, the clamped wafer has limitations during cleaning, resulting in incomplete cleaning, which affects the cleaning effect of the wafer. Utility Model Content

[0005] In order to solve the above problems, the utility model provides a wafer cleaning device, which is implemented through the following technical solutions.

[0006] A wafer cleaning device includes a wafer A and further includes:

[0007] A cleaning box, one side of which is connected with a sewage pipe, and the sewage pipe is connected to the bottom of the inner wall of the cleaning box;

[0008] Brush holders, wherein two brush holders are symmetrically arranged at the front and rear of wafer A, a brush strip is embedded in the top of the brush holder, and the bristles of the brush strip are attached to the outer surface of wafer A;

[0009] A first transmission roller, wherein the first transmission roller is pressed on the outer surface of the wafer A, both ends of the first transmission roller are rotatably connected to suspension rods, one end of the two suspension rods is commonly fixed to a lifting plate, and both ends of the top of the lifting plate are penetrated by sliding rods fixed on the cleaning box;

[0010] A second transmission roller, wherein the second transmission roller is two rollers arranged on the same plane inside the cleaning box, a transmission rod is connected through the second transmission roller, and one end of the transmission rod that passes through the front side of the cleaning box is fixedly connected to the first gear;

[0011] The motor is fixedly connected to the front side of the cleaning box, and the output shaft of the motor is fixedly connected to a second gear meshing with the first gear.

[0012] Furthermore, the top ends of the two slide bars are commonly fixed with a fixing plate, the bottom of the fixing plate is fixed with a second spring sleeved on the slide bar, and the other end of the second spring is fixed with a lifting plate, and the lifting plate is slidably matched with the slide bar.

[0013] Furthermore, the bottom of the inner wall of the cleaning box is a symmetrically arranged inclined surface, and the sewage pipe is located in the middle of the two inclined surfaces, and one end of the sewage pipe is connected to a rubber stopper.

[0014] Furthermore, the first transmission roller is located directly above the two second transmission rollers, and the first transmission roller and the two second transmission rollers are distributed in a triangle, and the first transmission roller and the second transmission roller are both made of rubber.

[0015] Furthermore, it also includes support columns, and the two support columns are fixed between the cleaning box and the brush bar.

[0016] Furthermore, the support column is also provided with a movably connected telescopic rod, one end of the telescopic rod is connected to a slider, and the slider slides inside the support column, the bottom of the slider is fixedly connected to a first spring, one end of the first spring is fixedly connected to the inner wall of the support column.

[0017] The beneficial effect of the utility model is that during the operation of the device, firstly, the first transmission roller and the second transmission roller cooperate with each other to clamp and position the placed wafer, and then the motor is used to drive the clamped wafer to rotate inside the cleaning box, and finally the cleaning box is injected with cleaning liquid to make the two brush bars in front and behind the wafer brush it. The structure is reasonable, and the wafer can be rotated and brushed, which can improve the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the specific implementation methods will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 : A schematic structural diagram of a wafer cleaning device according to the utility model;

[0020] Figure 2 : A schematic diagram of the interior of the cleaning box of the utility model;

[0021] Figure 3 : A schematic diagram of the connection between the support column and the telescopic rod of the utility model.

[0022] The reference numerals are as follows:

[0023] Wafer A;

[0024] 1. Cleaning box; 11. Drain pipe;

[0025] 2. Brush seat; 21. Brush strip; 22. Support column; 221. Telescopic rod; 222. Sliding block; 223. First spring;

[0026] 3. First transmission roller; 31. Suspension rod; 32. Lifting plate; 321. Sliding rod; 322. Fixed plate; 323. Second spring;

[0027] 4. Second transmission roller; 41. Transmission rod; 42. First gear;

[0028] 5. Motor; 51. Second gear. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] like Figure 1-3 As shown, the utility model has the following specific embodiments.

[0031] Example:

[0032] A wafer cleaning device includes a wafer A and further includes:

[0033] A cleaning box 1, a sewage pipe 11 is connected through one side of the cleaning box 1, and the sewage pipe 11 is connected to the bottom of the inner wall of the cleaning box 1;

[0034] Brush holders 2, two brush holders 2 are symmetrically arranged at the front and rear of the wafer A, a brush strip 21 is embedded and connected to the top of the brush holder 2, and the bristles of the brush strip 21 are attached to the outer surface of the wafer A;

[0035] A first transmission roller 3, the first transmission roller 3 is pressed on the outer surface of the wafer A, both ends of the first transmission roller 3 are rotatably connected to the suspension rods 31, one end of the two suspension rods 31 is commonly fixed to a lifting plate 32, and both ends of the top of the lifting plate 32 are penetrated by sliding rods 321 fixed on the cleaning box 1;

[0036] Second transmission rollers 4, which are two second transmission rollers 4 arranged on the same plane inside the cleaning box 1, and a transmission rod 41 is connected through the second transmission rollers 4, and one end of the transmission rod 41 that passes through the front side of the cleaning box 1 is fixedly connected to a first gear 42;

[0037] The motor 5 is fixedly connected to the front side of the cleaning box 1 , and the output shaft of the motor 5 is fixedly connected to a second gear 51 meshing with the first gear 42 .

[0038] By adopting the above technical solution, when using the device, first inject cleaning liquid into the cleaning box 1, then put the wafer A on the top of the two second drive rollers 4, and at the same time, the two brush strips 21 are respectively pressed against the front and rear outer surfaces of the wafer A, and the first drive roller 3 is squeezed on the outer surface of the wafer A under the elasticity of the second spring 323, and then the second gear 51 is driven to rotate by turning on the motor 5, and the second gear 51 drives the meshing first gear 42 to rotate, and the first gear 42 drives the second drive roller 4 to rotate through the transmission rod 41, and the second drive roller 4 cooperates with the first drive roller 3 to drive the squeezed and clamped wafer A to rotate, so that the wafer A is rotated and brushed between the two brush strips 21, which can improve the brushing effect.

[0039] Specifically, the top ends of the two slide bars 321 are fixedly connected to a fixing plate 322 , the bottom of the fixing plate 322 is fixedly connected to a second spring 323 sleeved on the slide bars 321 , and the other end of the second spring 323 is fixedly connected to the lifting plate 32 , and the lifting plate 32 and the slide bars 321 are slidably matched.

[0040] By adopting the above technical solution, the set lifting plate 32 can slide on the slide bar 321, and the lifting plate 32 drives the rotating first transmission roller 3 to be squeezed on the surface of the wafer part A through the suspension rod 31, wherein the second spring 323 connected to the slide bar 321 can generate a reaction force after being compressed, thereby applying pressure to the connected lifting plate 32, and then driving the connected first transmission roller 3 to roll closely on the surface of the wafer part A.

[0041] Specifically, the bottom of the inner wall of the cleaning box 1 is a symmetrically arranged inclined surface, and the sewage pipe 11 is located in the middle of the two inclined surfaces, and one end of the sewage pipe 11 is connected to a rubber plug.

[0042] By adopting the above technical solution, the sewage pipe 11 provided can discharge the sewage after cleaning inside the cleaning box 1, and the rubber plug can close the sewage pipe 11, so as to facilitate the control of opening or closing.

[0043] Specifically, the first transmission roller 3 is located right above the two second transmission rollers 4 , and the first transmission roller 3 and the two second transmission rollers 4 are distributed in a triangle. Both the first transmission roller 3 and the second transmission roller 4 are made of rubber.

[0044] By adopting the above technical solution, the first transmission roller 3 is located directly above the two second transmission rollers 4, and the first transmission roller 3 and the second transmission roller 4 are distributed in a triangle, which can prevent the wafer A in the middle from being clamped and positioned. At the same time, the first transmission roller 3 and the second transmission roller 4 are made of rubber material to provide a protective effect when clamping, thereby avoiding damage to the wafer A caused by clamping.

[0045] Specifically, it also includes support columns 22, which are two fixedly connected between the cleaning box 1 and the brush strip 21;

[0046] The support column 22 is also provided with a movably connected telescopic rod 221, one end of which is connected to a slider 222, and the slider 222 slides inside the support column 22, and the bottom of the slider 222 is fixedly connected to a first spring 223, one end of the first spring 223 is fixedly connected to the inner wall of the support column 22.

[0047] By adopting the above technical solution, the telescopic rod 221 connected to one end of the support column 22 slides inside the support column 22 through the slider 222, and the first spring 223 connected to the bottom of the slider 222 has a reverse force after being compressed, so that the telescopic rod 221 applies pressure to the connected brush holder 2 in the reverse direction, and then the brush holder 2 drives the connected brush strip 21 to be tightly attached to the surface of the wafer A, so that the brush strip 21 has a better brushing effect.

[0048] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer cleaning device, comprising a wafer A, characterized in that: Also includes: A cleaning box (1), wherein a sewage discharge pipe (11) is connected through one side of the cleaning box (1), and the sewage discharge pipe (11) is connected to the bottom of the inner wall of the cleaning box (1); Brush seats (2), wherein two brush seats (2) are symmetrically arranged at the front and rear of the wafer A, a brush strip (21) is embedded and connected to the top of the brush seat (2), and the bristles of the brush strip (21) are attached to the outer surface of the wafer A; A first transmission roller (3), the first transmission roller (3) being pressed onto the outer surface of the wafer A, both ends of the first transmission roller (3) being rotatably connected to suspension rods (31), one end of the two suspension rods (31) being commonly fixedly connected to a lifting plate (32), and both ends of the top of the lifting plate (32) being penetrated by sliding rods (321) fixed to the cleaning box (1); Second transmission rollers (4), the second transmission rollers (4) being two arranged on the same plane inside the cleaning box (1), a transmission rod (41) passing through the second transmission rollers (4), one end of the transmission rod (41) passing through the front side of the cleaning box (1) being fixedly connected to a first gear (42); The motor (5) is fixedly connected to the front side of the cleaning box (1), and the output shaft of the motor (5) is fixedly connected to a second gear (51) meshing with the first gear (42).

2. A wafer cleaning device according to claim 1, characterized in that: The top ends of the two slide bars (321) are fixedly connected to a fixed plate (322), the bottom end of the fixed plate (322) is fixedly connected to a second spring (323) sleeved on the slide bar (321), and the other end of the second spring (323) is fixedly connected to the lifting plate (32), and the lifting plate (32) and the slide bar (321) are slidably matched.

3. A wafer cleaning device according to claim 1, characterized in that: The bottom of the inner wall of the cleaning box (1) is a symmetrically arranged inclined surface, and the sewage discharge pipe (11) is located in the middle of the two inclined surfaces. One end of the sewage discharge pipe (11) is connected to a rubber plug.

4. A wafer cleaning device according to claim 1, characterized in that: The first transmission roller (3) is located directly above the two second transmission rollers (4), and the first transmission roller (3) and the two second transmission rollers (4) are distributed in a triangle, and the first transmission roller (3) and the second transmission roller (4) are both made of rubber.

5. The wafer cleaning device according to claim 1, characterized in that: It also includes support columns (22), which are two support columns (22) fixedly connected between the cleaning box (1) and the brush bar (21).

6. A wafer cleaning device according to claim 5, characterized in that: The support column (22) is also provided with a movably connected telescopic rod (221), one end of the telescopic rod (221) is connected to a slider (222), and the slider (222) slides inside the support column (22), and the bottom of the slider (222) is fixedly connected to a first spring (223), and one end of the first spring (223) is fixedly connected to the inner wall of the support column (22).

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