Lead frame convenient for tinning

Abstract

The utility model relates to a lead frame convenient for tinning, which comprises an upper frame and a lower frame, and the upper frame and the lower frame are attached up and down. The upper frame comprises an upper frame body and a plurality of groups of upper packaging units, the plurality of groups of upper packaging units are sequentially arranged on the upper frame body from left to right, two adjacent groups of upper packaging units are connected, each group comprises a plurality of upper packaging units, and the plurality of upper packaging units in the same group are sequentially connected from front to back; the upper packaging unit comprises two first pins, the two first pins are arranged in a bilateral symmetry mode, a gap is formed between the two first pins, and first tin climbing holes are formed in the first pins; according to the utility model, the first pin part and the second pin part are respectively provided with the first tin climbing hole and the second tin climbing hole, and after rib cutting, the first tin climbing hole and the second tin climbing hole form the first notch and the second notch, so that molten tin can be conveniently tinned along the first notch and the second notch during subsequent surface mounting, and the tinning effect is improved.

Description

Technical Field

[0001] The utility model relates to a lead frame which is convenient for tinning and belongs to the field of semiconductors. Background Art

[0002] Semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, a diode is a device made of semiconductors. Semiconductors refer to a material whose conductivity can be controlled, ranging from an insulator to a conductor.

[0003] The Chinese utility model patent with the publication number CN207217552U discloses an environmentally friendly ultra-thin chip power diode, including a body, a lower chip frame and an upper chip frame, a crystal grain is arranged between the upper chip frame and the lower chip frame, and a convex table is arranged between the upper chip frame and the crystal grain; the convex table is square, and in the environmentally friendly ultra-thin chip power diode, the circular convex table is changed into a square convex table, so that the contact area between the upper chip frame and the crystal grain is greatly increased, and the size of the crystal grain is changed, so that the use power of 400W is increased to 600W, so that the power of the TVS product is increased; not only that, the product is designed as SMAF, and the SMAF product is mainly thinner and smaller than SMB, and SMAF reduces one process flow compared to SMB, reduces production costs, and reduces the limitations of customers on the application of the product in circuit boards, improves the practical value of TVS, reduces energy loss, and improves its environmental protection characteristics. However, in the prior art, the cutting position of the lower chip frame and the upper chip frame will cause copper leakage, affecting the subsequent tinning effect.

[0004] Therefore, there is a need for a lead frame that is easy to tin and improves the tinning effect. Utility Model Content

[0005] The technical problem to be solved by the utility model is: in order to overcome the shortcomings of the prior art, a lead frame which is convenient for tinning and improves the tinning effect is provided.

[0006] The technical solution adopted by the utility model to solve the above problems is: a lead frame that is convenient for tinning, comprising an upper frame and a lower frame, wherein the upper frame and the lower frame are arranged in a vertically contacting manner;

[0007] The upper frame comprises an upper frame body and a plurality of upper packaging units, wherein the plurality of upper packaging units are sequentially arranged on the upper frame body from left to right, two adjacent groups of upper packaging units are connected, each group of upper packaging units is provided with a plurality of upper packaging units, and the plurality of upper packaging units in the same group are sequentially connected from front to back;

[0008] The upper packaging unit includes two first pins, the two first pins are arranged symmetrically, a gap is provided between the two first pins, and a first tin climbing hole is provided on the first pin;

[0009] The upper frame comprises a lower frame body and multiple groups of lower packaging units, the multiple groups of lower packaging units are arranged on the lower frame body from left to right, a gap is arranged between two adjacent groups of lower packaging units, each group of lower packaging units is provided with multiple units, and the multiple lower packaging units in the same group are connected in sequence from front to back;

[0010] The lower packaging unit includes two second pins, the two second pins are connected symmetrically, the second pins are provided with second soldering holes, and the first pins correspond to the second pins one by one.

[0011] Preferably, two first pins close to each other in two upper packaging units adjacent to each other on the left and right are connected, and two first pins close to each other in two upper packaging units adjacent to each other on the front and back are connected.

[0012] Preferably, the first pin includes a first connecting portion, a first bending portion and a first pin portion, the first connecting portion and the first pin portion are distributed vertically, the first connecting portion and the first pin portion are distributed horizontally, the first bending portion is obliquely arranged between the first connecting portion and the first pin portion, and the first connecting portion is connected to the first pin portion through the first bending portion.

[0013] Preferably, in the same upper packaging unit, the two first pin portions are distributed on the left and right, and the two first connecting portions are both located between the two first pin portions.

[0014] Preferably, two second pins close to each other in two upper packaging units adjacent to each other on the left and right are connected, and two second pins close to each other in two upper packaging units adjacent to each other on the front and back are connected.

[0015] Preferably, the second pin includes a second connecting portion, a second bending portion and a second pin portion, the second connecting portion and the second pin portion are distributed up and down, the second connecting portion and the second pin portion are distributed left and right, the second bending portion is obliquely arranged between the second connecting portion and the second pin portion, the second connecting portion is connected to the second pin portion through the second bending portion, and a boss is arranged on the top of the second connecting portion.

[0016] Preferably, in the same lower packaging unit, the two second connecting portions are distributed left and right, and the two second pin portions are both located between the two second connecting portions.

[0017] A semiconductor that is easy to tin, comprising a plastic package, a first pin, a second pin and a chip, wherein the plastic package covers the chip, the first pin and the second pin are fixedly inserted into the plastic package, the first pin is provided with a first notch, the second pin is provided with a second notch, and the first notch and the second notch are both located outside the plastic package.

[0018] Preferably, the first pin comprises a first connecting portion, a first bending portion and a first pin portion, the first connecting portion and the first pin portion are arranged vertically, the first connecting portion and the first pin portion are arranged horizontally, the first bending portion is obliquely arranged between the first connecting portion and the first pin portion, the first connecting portion is connected to the first pin portion through the first bending portion, and the first notch is arranged on a side of the first pin portion away from the first connecting portion;

[0019] The second pin includes a second connecting portion, a second bending portion and a second pin portion, the second connecting portion and the second pin portion are distributed up and down, the second connecting portion and the second pin portion are distributed left and right, the second bending portion is obliquely arranged between the second connecting portion and the second pin portion, the second connecting portion is connected to the second pin portion through the second bending portion, a boss is arranged on the top of the second connecting portion, and the second notch is arranged on a side of the second pin portion away from the first connecting portion.

[0020] Preferably, the first connecting portion, the first bending portion, the second connecting portion, the second bending portion and the boss are all located in the plastic package, the first pin portion and the second pin portion extend out of the plastic package, and the first pin portion and the second pin portion are distributed left and right;

[0021] The first connection part and the second connection part are arranged vertically, the chip is located between the first connection part and the second connection part, and the boss is located between the chip and the second connection part.

[0022] Compared with the prior art, the advantages of the utility model are:

[0023] The utility model discloses a lead frame which is convenient for tinning. A first tinning hole and a second tinning hole are respectively preset on a first pin portion and a second pin portion. After rib cutting, the first tinning hole and the second tinning hole form a first notch and a second notch, which facilitates molten tin to be tinned along the first notch and the second notch during subsequent chip mounting, thereby improving the tinning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a front view of a lead frame that is convenient for tinning according to the utility model;

[0025] Figure 2 This is a bottom view of a lead frame that is convenient for tinning according to the utility model;

[0026] Figure 3It is the main view of the upper frame;

[0027] Figure 4 for Figure 3 A magnified view of part A;

[0028] Figure 5 This is a bottom view of the upper frame;

[0029] Figure 6 is the main view of the lower frame;

[0030] Figure 7 for Figure 6 A magnified view of part B;

[0031] Figure 8 It is a bottom view of the lower frame;

[0032] Fig. 9 A front view of a semiconductor that is easy to tin;

[0033] Fig.10 A bottom view of a semiconductor that is easy to tin;

[0034] Fig.11 It is a three-dimensional diagram of a semiconductor in the prior art.

[0035] in:

[0036] Upper frame 1, lower frame 2, plastic package 3, chip 4, first notch 5, second notch 6;

[0037] Upper frame 11, upper packaging unit 12;

[0038] A first pin 121, a first soldering hole 122;

[0039] A first connecting portion 1211, a first bending portion 1212, and a first pin portion 1213;

[0040] Lower frame 21, lower packaging unit 22;

[0041] A second pin 221, a second soldering hole 222;

[0042] The second connecting portion 2211 , the second bending portion 2212 , the second pin portion 2213 , and the boss 2214 . DETAILED DESCRIPTION

[0043] like Figure 1-11 As shown, a lead frame that is convenient for tinning in this embodiment includes an upper frame 1 and a lower frame 2, the upper frame 1 and the lower frame 2 are arranged in a vertically contacting manner, and the upper frame 1 and the lower frame 2 are both made of copper;

[0044] The upper frame 1 includes an upper frame body 11 and multiple groups of upper packaging units 12, the multiple groups of upper packaging units 12 are sequentially arranged on the upper frame body 11 from left to right, two adjacent groups of upper packaging units 12 are connected, each group of upper packaging units 12 is provided with multiple, and the multiple upper packaging units 12 in the same group are sequentially connected from front to back;

[0045] The upper packaging unit 12 includes two first pins 121, which are arranged symmetrically with each other, with a gap between the two first pins 121, and a first soldering hole 122 is provided on the first pin 121;

[0046] In two upper packaging units 12 adjacent to each other on the left and right, two first pins 121 close to each other are connected;

[0047] In two upper packaging units 12 adjacent to each other, two first pins 121 close to each other are connected;

[0048] The first pin 121 includes a first connection portion 1211, a first bending portion 1212 and a first pin portion 1213. The first connection portion 1211 and the first pin portion 1213 are arranged vertically, and the first connection portion 1211 and the first pin portion 1213 are arranged horizontally. The first bending portion 1212 is obliquely arranged between the first connection portion 1211 and the first pin portion 1213. The first connection portion 1211 is connected to the first pin portion 1213 through the first bending portion 1212.

[0049] In the same upper packaging unit 12, two first pin portions 1213 are distributed on the left and right, and two first connecting portions 1211 are located between the two first pin portions 1213;

[0050] The upper frame 1 includes a lower frame 21 and multiple groups of lower packaging units 22, the multiple groups of lower packaging units 22 are arranged on the lower frame 21 from left to right, a gap is arranged between two adjacent groups of lower packaging units 22, each group of lower packaging units 22 is provided with multiple, and the multiple lower packaging units 22 in the same group are connected in sequence from front to back;

[0051] The lower packaging unit 22 includes two second pins 221, the two second pins 221 are symmetrically connected, the second pins 221 are provided with second soldering holes 222, and the first pins 121 correspond to the second pins 221 one by one;

[0052] In two upper packaging units 12 adjacent to each other, two second pins 221 close to each other are connected;

[0053] In two upper packaging units 12 adjacent to each other, two second pins 221 close to each other are connected;

[0054] The second pin 221 includes a second connection portion 2211, a second bending portion 2212 and a second pin portion 2213. The second connection portion 2211 and the second pin portion 2213 are arranged vertically, and the second connection portion 2211 and the second pin portion 2213 are arranged horizontally. The second bending portion 2212 is obliquely arranged between the second connection portion 2211 and the second pin portion 2213. The second connection portion 2211 is connected to the second pin portion 2213 via the second bending portion 2212. A boss 2214 is arranged on the top of the second connection portion 2211.

[0055] In the same lower packaging unit 22, the two second connection parts 2211 are distributed on the left and right, and the two second pin parts 2213 are both located between the two second connection parts 2211;

[0056] The first connection portion 1211 and the second connection portion 2211 are arranged vertically opposite to each other;

[0057] The bottom of the first pin portion 1213 and the bottom of the second pin portion 2213 are in the same plane;

[0058] During the use of the lead frame, the upper frame 1 and the lower frame 2 are first separated and tinned by electroplating. After the electroplating is completed, the chip 4 is mounted on the second connecting portion 2211, and the chip 4 is located above the boss 2214. Subsequently, the upper frame 1 and the lower frame 2 are fitted together so that the first connecting portion 1211 is located directly above the second connecting portion 2211. Then, the lead frame is plastic-sealed, and the chip 4, the boss 2214, the first connecting portion 1211, the first bending portion 1212, the second connecting portion 2211 and the second bending portion 2212 are all covered by the plastic sealing body 3, and the first pin portion 1213 and the second pin portion 2213 extend out of the plastic sealing body 3, and the first tin climbing hole 122 and the second tin climbing hole 222 are located in the plastic sealing body. 3, at this time, the single upper packaging unit 12 and the corresponding single lower packaging unit 22 form a single product, and then the first pin 121 and the second pin 221 are cut, and the cutting position is the first tin climbing hole 122 and the second tin climbing hole 222, so that the cutting of the first pin part 1213 is at the first arc groove formed by the first tin climbing hole 122, and the cutting of the second pin part 2213 forms the second notch 6 through the second tin climbing hole 222, so that the cutting surface of the first pin part 1213 and the second pin part 2213 leaks copper, and the inner side walls of the first notch 5 and the second notch 6 do not leak copper. In the subsequent patch process, the molten tin during patching is tinned along the first notch 5 and the second notch 6, which improves the tinning effect;

[0059] A semiconductor that is easy to tin, comprising a plastic package 3, a first pin 121, a second pin 221 and a chip 4, wherein the plastic package 3 covers the chip 4, the first pin 121 and the second pin 221 are fixedly inserted into the plastic package 3, the first pin 121 is provided with a first notch 5, the second pin 221 is provided with a second notch 6, and the first notch 5 and the second notch 6 are both located outside the plastic package 3;

[0060] The first pin 121 includes a first connection portion 1211, a first bending portion 1212 and a first pin portion 1213. The first connection portion 1211 and the first pin portion 1213 are arranged vertically, and the first connection portion 1211 and the first pin portion 1213 are arranged horizontally. The first bending portion 1212 is obliquely arranged between the first connection portion 1211 and the first pin portion 1213. The first connection portion 1211 is connected to the first pin portion 1213 through the first bending portion 1212. The first notch 5 is arranged on a side of the first pin portion 1213 away from the first connection portion 1211.

[0061] The second pin 221 includes a second connection portion 2211, a second bending portion 2212 and a second pin portion 2213. The second connection portion 2211 and the second pin portion 2213 are arranged vertically, and the second connection portion 2211 and the second pin portion 2213 are arranged horizontally. The second bending portion 2212 is obliquely arranged between the second connection portion 2211 and the second pin portion 2213. The second connection portion 2211 is connected to the second pin portion 2213 through the second bending portion 2212. A boss 2214 is arranged on the top of the second connection portion 2211. The second notch 6 is arranged on a side of the second pin portion 2213 away from the first connection portion 1211.

[0062] The first connecting portion 1211, the first bending portion 1212, the second connecting portion 2211, the second bending portion 2212 and the boss 2214 are all located in the plastic package 3, the first pin portion 1213 and the second pin portion 2213 extend out of the plastic package 3, and the first pin portion 1213 and the second pin portion 2213 are distributed left and right;

[0063] The first connection part 1211 and the second connection part 2211 are arranged vertically, the chip 4 is located between the first connection part 1211 and the second connection part 2211, and the boss 2214 is located between the chip 4 and the second connection part 2211;

[0064] The first notch 5 extends to the top and bottom of the first pin portion 1213 , and the second notch 6 extends to the top and bottom of the second pin portion 2213 .

[0065] To summarize, the first tin climbing hole 122 and the second tin climbing hole 222 are preset in the first pin portion 1213 and the second pin portion 2213 respectively. After the ribs are cut, the first tin climbing hole 122 and the second tin climbing hole 222 form the first notch 5 and the second notch 6, which facilitates the molten tin to be tinned along the first notch 5 and the second notch 6 during the subsequent patch, thereby improving the tinning effect.

[0066] In addition to the above embodiments, the present invention also includes other implementation modes. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims

1. A lead frame that is easy to tin, characterized in that: It comprises an upper frame (1) and a lower frame (2), wherein the upper frame (1) and the lower frame (2) are arranged in a vertically aligned manner; The upper frame (1) comprises an upper frame body (11) and a plurality of groups of upper packaging units (12), wherein the plurality of groups of upper packaging units (12) are arranged on the upper frame body (11) in sequence from left to right, two adjacent groups of upper packaging units (12) are connected, each group of upper packaging units (12) is provided with a plurality of upper packaging units (12), and the plurality of upper packaging units (12) in the same group are connected in sequence from front to back; The upper packaging unit (12) comprises two first pins (121), the two first pins (121) are arranged symmetrically, a gap is provided between the two first pins (121), and a first tin climbing hole (122) is provided on the first pin (121); The upper frame (1) comprises a lower frame body (21) and a plurality of groups of lower packaging units (22), the plurality of groups of lower packaging units (22) being arranged on the lower frame body (21) in sequence from left to right, a gap being arranged between two adjacent groups of lower packaging units (22), a plurality of lower packaging units (22) being arranged in each group, and the plurality of lower packaging units (22) in the same group being connected in sequence from front to back; The lower packaging unit (22) comprises two second pins (221), the two second pins (221) are connected symmetrically to the left and right, the second pins (221) are provided with second soldering holes (222), and the first pins (121) correspond to the second pins (221) one by one.

2. A lead frame that is easy to tin according to claim 1, characterized in that: In two upper packaging units (12) adjacent to each other on the left and right, two first pins (121) close to each other are connected, and in two upper packaging units (12) adjacent to each other on the front and back, two first pins (121) close to each other are connected.

3. A lead frame that is easy to tin according to claim 1, characterized in that: The first pin (121) comprises a first connecting portion (1211), a first bending portion (1212) and a first pin portion (1213); the first connecting portion (1211) and the first pin portion (1213) are distributed vertically, and the first connecting portion (1211) and the first pin portion (1213) are distributed horizontally; the first bending portion (1212) is obliquely arranged between the first connecting portion (1211) and the first pin portion (1213); and the first connecting portion (1211) is connected to the first pin portion (1213) via the first bending portion (1212).

4. A lead frame that is easy to tin according to claim 3, characterized in that: In the same upper packaging unit (12), the two first pin portions (1213) are distributed on the left and right, and the two first connecting portions (1211) are both located between the two first pin portions (1213).

5. The lead frame that is easy to tin according to claim 1, characterized in that: In two upper packaging units (12) adjacent to each other on the left and right, two second pins (221) close to each other are connected, and in two upper packaging units (12) adjacent to each other on the front and back, two second pins (221) close to each other are connected.

6. The lead frame convenient for tinning according to claim 1, characterized in that: The second pin (221) comprises a second connection portion (2211), a second bending portion (2212) and a second pin portion (2213); the second connection portion (2211) and the second pin portion (2213) are distributed vertically, and the second connection portion (2211) and the second pin portion (2213) are distributed horizontally; the second bending portion (2212) is obliquely arranged between the second connection portion (2211) and the second pin portion (2213); the second connection portion (2211) is connected to the second pin portion (2213) via the second bending portion (2212); and a boss (2214) is arranged on the top of the second connection portion (2211).

7. A lead frame that is easy to tin according to claim 6, characterized in that: In the same lower packaging unit (22), the two second connection parts (2211) are distributed on the left and right, and the two second pin parts (2213) are both located between the two second connection parts (2211).

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