Non-contact radio frequency antenna structure

Abstract

The utility model discloses a non-contact radio frequency antenna structure, which relates to the technical field of radio frequency antennas and comprises a packaging plate, a groove is arranged in the packaging plate, fixing columns are arranged on the periphery of the groove, an insulating pad is fixedly connected in the groove, a substrate is fixedly connected to the top of the insulating pad, and the substrate is fixedly connected to the bottom of the groove. The packaging board comprises a substrate, through holes are formed in the periphery of the substrate, a bonding pad groove is formed in the substrate, a bonding pad is fixedly connected into the bonding pad groove, a fixing assembly used for fixing is arranged on one side of the top of the packaging board, and a radio frequency module used for receiving and transmitting signals is arranged in the substrate. The radio frequency module is better protected by fixing the fixing assembly and the packaging plate, and when the radio frequency module breaks down, the fixing assembly is detached from the packaging plate, so that later maintenance work is facilitated, the maintenance process is simplified, and time and labor cost are greatly saved.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency antennas, in particular to a non-contact radio frequency antenna structure. Background Art

[0002] With the development of communication technology, contactless cards are mainly used in automatic toll collection systems for buses, ferries and subways, and are also used in various fields of production and life such as access control management, identity verification and electronic wallets. The contactless card itself is a passive body. When the reader reads and writes the card, the signal sent by the reader is composed of two parts: one part is the power signal. After the signal is received by the card, it resonates with its own LC and generates an instantaneous energy to supply the chip to work. The other part is combined with the data signal to command the chip to complete data, modification and storage, etc., and return it to the reader.

[0003] The contactless smart card in the prior art has complicated production procedures. The contactless chip production process requires glue dispensing, crystal bonding, wire welding, glue sealing, and chip punching. After the chip is made, it is necessary to punch a contactless chip hole in the PVC material, implant the antenna after punching, and weld the antenna and the contactless chip together through a welding machine to form a contactless smart card through pressing. The production process is complicated and difficult to install. When problems occur in the internal components, it is not convenient to repair, which wastes production resources and manpower and material resources.

[0004] Based on this, a non-contact radio frequency antenna structure is now provided, which can eliminate the disadvantages of the existing devices. Utility Model Content

[0005] The purpose of the utility model is to provide a non-contact radio frequency antenna structure to solve the problems in the background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A non-contact radio frequency antenna structure, comprising a packaging plate and a substrate structure, wherein a groove is arranged inside the packaging plate, fixing columns are arranged around the groove, an insulating pad is fixedly connected inside the groove, a substrate is fixedly connected to the top of the insulating pad, through holes are arranged around the substrate, a pad groove is arranged inside the substrate, a pad is fixedly connected inside the pad groove, the substrate structure is constructed of a metal layer and an insulating layer, and an insulating layer is fixedly connected between two metal layers;

[0008] A fixing component for fixing is provided on one side of the top of the packaging plate;

[0009] A radio frequency module for sending and receiving signals is arranged inside the substrate.

[0010] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0011] In an optional solution: the fixing component includes a packaging cover, and limiting slide grooves are arranged on both sides of the bottom of the packaging cover, and a fixing hook is arranged on the side of the packaging cover away from the limiting slide groove, a hook hole is opened on the surface of one side of the groove, and limiting slide rails are arranged on both sides of the top of the packaging plate.

[0012] In an optional scheme: the RF module includes an antenna, the bottom end of the antenna is fixedly connected to the pad, and the connecting end of the antenna is connected to a wafer, the bottom of the wafer is fixedly connected to the top of the pad, the wafer is fixedly connected to the top of the solid crystal, the top of the wafer is fixedly connected to a welding wire, the other end of the welding wire is fixedly connected to the wafer welding wire area, the welding wire and the top of the wafer welding wire area are fixedly connected with sealing glue, a jumper via hole is provided at the end of the wafer welding wire area, and a bridge circuit is provided between the two jumper via holes.

[0013] In an optional solution, the fixing column is consistent with the size of the through hole.

[0014] In an optional solution, the cross-section shapes of the limiting slide rail and the limiting slide groove are both convex.

[0015] In an optional solution: the size of the insulating pad is smaller than the size of the substrate.

[0016] In an optional solution: a rubber pad is arranged in the hook hole, and the hook hole is L-shaped.

[0017] In an optional solution: the fixing hook is made of elastic material.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] 1. The utility model enables the packaging cover to slide on the packaging board through the limiting slide groove on the packaging cover and the limiting slide rail on the packaging board, driving the fixing hook to slide, so that when the fixing hook slides into the hook hole, the packaging cover can be fixed on the packaging board, which is convenient for operation and maintenance.

[0020] 2. The utility model fixes the substrate by passing the fixing column through the through hole, so that the substrate can be fixed in the packaging plate during daily use, and when disassembly and maintenance are required, the substrate can be easily picked up for maintenance.

[0021] 3. The utility model combines the antenna and the die bonding together by etching, thereby achieving the effect of simplifying the production process. In addition, the smart card can design different antennas according to different radio frequency modules to meet the application of different occasions, and is suitable for large-scale application in various smart cards and other short-range wireless communication technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the utility model.

[0023] Figure 2 It is a cross-sectional structural schematic diagram of the utility model.

[0024] Figure 3 It is a schematic diagram of the disassembled structure of the utility model.

[0025] Figure 4 This is a schematic diagram of the substrate structure of the utility model.

[0026] Figure 5 For the utility model Figure 2 Schematic diagram of the structure of A.

[0027] Figure 6 For the utility model Figure 3 Schematic diagram of the structure of B.

[0028] Figure 7 It is a schematic diagram of the local structure of the radio frequency module in the utility model.

[0029] Figure 8 It is a schematic diagram of the local structure of the radio frequency module in the utility model.

[0030] Fig. 9 It is a structural schematic diagram of the substrate structure in the utility model.

[0031] Among them: 1, packaging plate, 2, groove, 3, fixing column, 4, insulating pad, 5, substrate, 6, perforation, 7, packaging cover, 8, limiting slide groove, 9, fixing hook, 10, hook hole, 11, rubber pad, 12, limiting slide rail, 13, antenna, 14, wafer, 15, pad groove, 16, pad, 17, solid crystal, 18, welding wire; 19, jumper clearance hole, 20, bridge line; 21, sealing glue; 22, wafer welding wire area; 23, metal layer; 24, insulating layer; 25, substrate structure. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Example 1

[0034] See also Figure 1-Figure 9In an embodiment of the utility model, a non-contact radio frequency antenna structure includes a packaging board 1 and a substrate structure 25, wherein a groove 2 is arranged inside the packaging board 1, and a fixing column 3 is arranged around the groove 2, and an insulating pad 4 is fixedly connected inside the groove 2, and a substrate 5 is fixedly connected to the top of the insulating pad 4, and the substrate 5 is provided with through holes 6 around the four sides, and a pad groove 15 is arranged inside the substrate 5, and a pad 16 is fixedly connected inside the pad groove 15, and the substrate structure 25 is constructed of a metal layer 23 and an insulating layer 24, and an insulating layer 24 is fixedly connected between the two metal layers 23; through the sealing groove 2, the fixing column 3 and the insulating pad 4 can be arranged inside the packaging board 1, and the through hole 6 on the substrate 5 can pass through the fixing column 3 to fix the substrate 5, and the metal layer 23 can be of any geometric shape, and the size can be changed, and the circuit design can be performed;

[0035] A fixing component for fixing is provided on one side of the top of the packaging plate 1;

[0036] A radio frequency module for sending and receiving signals is disposed inside the substrate 5 .

[0037] In one embodiment, Figure 1-3 As shown, the fixing assembly includes a packaging cover 7, and limiting slide grooves 8 are arranged on both sides of the bottom of the packaging cover 7, and a fixing hook 9 is arranged on the side of the packaging cover 7 away from the limiting slide groove 8, a hook hole 10 is opened on the surface of one side of the groove 2, and limiting slide rails 12 are arranged on both sides of the top of the packaging plate 1; through the mutual cooperation between the limiting slide rails 12 and the limiting slide grooves 8, the packaging cover 7 can slide on the packaging plate 1, and at the same time drive the packaging cover 7 to drive the fixing hook 9 to slide, and the fixing hook 9 slides into the hook hole 10 for fixation.

[0038] In one embodiment, Figure 4 and Figure 6 As shown, the RF module includes an antenna 13, the bottom end of the antenna 13 is fixedly connected to the pad 16, and the connecting end of the antenna 13 is connected to the wafer 14, the bottom of the wafer 14 is fixedly connected to the top of the pad 16, the wafer 14 is fixedly connected to the top of the solid crystal 17, the top of the wafer 14 is fixedly connected to a welding wire 18, the other end of the welding wire 18 is fixedly connected to a wafer welding wire area 22, the welding wire 18 and the top of the wafer welding wire area 22 are fixedly connected with a sealing glue 21, a jumper via 19 is provided at the end of the wafer welding wire area 22, and a bridge circuit 20 is provided between the two jumper vias 19; the sealing glue 21 protects the wafer 14 and the welding wire 18 to prevent the wafer 14 and the welding wire 18 from being damaged, the welding wire 18 can fix the wafer 14 on the pad 15, and the sealing glue 21 cooperates with the antenna 13 and the wafer 14 at the same time, so that signals can be sent and received.

[0039] In one embodiment, Figure 3 and Figure 4 As shown, the fixing post 3 is consistent in size with the through hole 6 ; the through hole 6 can pass through the fixing post 3 , thereby fixing the substrate 5 in the groove 2 of the packaging plate 1 .

[0040] In one embodiment, Figure 3 and Figure 5 As shown, the cross-sectional shapes of the limiting slide rail 12 and the limiting slide groove 8 are both convex-shaped; by aligning the limiting slide groove 8 with the limiting slide rail 12, the packaging plate 1 and the packaging cover 7 are fixed to limit their up and down movement.

[0041] Example 2

[0042] In one embodiment, Figure 2 As shown, the size of the insulating pad 4 is smaller than that of the substrate 5 ; the insulating pad 4 can well insulate the packaging board 1 and the substrate 5 , while increasing flexibility and reducing friction between the substrate 5 and the packaging board 1 .

[0043] In one embodiment, Figure 5 As shown, a rubber pad 11 is arranged in the hook hole 10 , and the hook hole 10 is L-shaped; the rubber pad 11 helps to remove the fixing hook 9 from the hook hole 10 .

[0044] In one embodiment, Figure 1 and Figure 5 As shown, the fixing hook 9 is made of elastic material, which facilitates the fixing hook 9 to pass through the protruding position in the hook hole 10 . After passing through, the fixing hook 9 automatically bounces back to the original position, thereby being stuck in the hook hole 10 .

[0045] The working principle of the utility model is as follows: the above embodiment discloses a non-contact radio frequency antenna structure, wherein the wafer 14 is welded to the welding pad 16 by the welding wire 18, and the wafer 14 and the welding wire 18 are protected by the sealing glue 21, and at the same time, the through hole 6 on the substrate 5 is aligned with the fixing column 3, and the substrate 5 is fixed on the packaging board 1. After installation, the limiting slide groove 8 on the packaging cover 7 is aligned with the limiting slide rail 12, so that the packaging cover 7 can slide through the limiting slide rail 12, driving the fixing hook 9 to slide, when the fixing hook 9 slides into the hook hole 10, the fixing hook 9 buckles the raised part in the hook hole 10, thereby fixing the packaging cover 7 on the packaging board 1, when it is necessary to disassemble and repair, it is only necessary to lightly press the top of the packaging cover 7, and when the fixing hook 9 is forced to move downward, the fixing hook 9 can be separated from the restraint of the hook hole 10 through the rubber pad 11, and stay away from the raised part in the hook hole 10, thereby pulling the packaging cover 7 out of the packaging board 1;

[0046] The material of the metal layer 23 can be Cu or Al, and the material of the insulating layer 24 can be paper, PVC, PP, PET, PI, FR4, BT, adhesive material, etc. The metal layer 23 can be defined into any geometric shape and the size can be changed to facilitate circuit design.

[0047] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A non-contact radio frequency antenna structure, comprising a packaging plate (1) and a substrate structure (25), characterized in that: The packaging board (1) is provided with a groove (2) inside, the groove (2) is provided with fixing columns (3) around, the groove (2) is fixedly connected with an insulating pad (4), the top of the insulating pad (4) is fixedly connected with a substrate (5), the substrate (5) is provided with through holes (6) around, the substrate (5) is provided with a pad groove (15) inside, the pad groove (15) is fixedly connected with a pad (16), the base material structure (25) is constructed of a metal layer (23) and an insulating layer (24), and the insulating layer (24) is fixedly connected between the two metal layers (23); A fixing component for fixing is provided on one side of the top of the packaging plate (1); A radio frequency module for sending and receiving signals is arranged inside the substrate (5).

2. A non-contact radio frequency antenna structure according to claim 1, characterized in that: The fixing assembly comprises a packaging cover (7), two sides of the bottom of the packaging cover (7) are provided with limiting slide grooves (8), and a fixing hook (9) is provided on the side of the packaging cover (7) away from the limiting slide groove (8), a hook hole (10) is opened on the surface of one side of the groove (2), and two sides of the top of the packaging plate (1) are provided with limiting slide rails (12).

3. The non-contact radio frequency antenna structure according to claim 1, characterized in that: The radio frequency module comprises an antenna (13), the bottom end of the antenna (13) is fixedly connected to a pad (16), and the connection end of the antenna (13) is connected to a wafer (14), the bottom of the wafer (14) is fixedly connected to the top of the pad (16), the wafer (14) is fixedly connected to the top of a solid crystal (17), the top of the wafer (14) is fixedly connected to a welding wire (18), the other end of the welding wire (18) is fixedly connected to a wafer welding wire area (22), the welding wire (18) and the top of the wafer welding wire area (22) are fixedly connected to a sealing glue (21), a jumper wire conduction hole (19) is provided at the end of the wafer welding wire area (22), and a bridge circuit (20) is provided between the two jumper wire conduction holes (19).

4. The non-contact radio frequency antenna structure according to claim 1, characterized in that: The size of the fixing column (3) is consistent with that of the through hole (6).

5. The non-contact radio frequency antenna structure according to claim 3, characterized in that: The cross-sectional shapes of the limiting slide rail (12) and the limiting slide groove (8) are both convex-shaped.

6. The non-contact radio frequency antenna structure according to claim 1, characterized in that: The size of the insulating pad (4) is smaller than the size of the base plate (5).

7. The non-contact radio frequency antenna structure according to claim 2, characterized in that: A rubber pad (11) is arranged in the hook hole (10), and the hook hole (10) is L-shaped.

8. The non-contact radio frequency antenna structure according to claim 2, characterized in that: The fixing hook (9) is made of elastic material.

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