Signal module for converting Type-C into EDP, MIPI, LVDS and SPI
By designing the signal modules of Type-C to EDP, MIPI, LVDS, and SPI, different problems caused by the diverse display screens caused by the diversified LCD display interface can be solved. Effect.
Patent Information
- Application Number
- CN202421094486.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-20
AI Technical Summary
The interface types of LCD monitors are diverse, which leads to the inability of the display screens of mobile phones, tablets, and computers to be synchronized to LCD monitors, which has certain limitations.
设计一种Type-C转EDP、MIPI、LVDS和SPI的信号模块,通过Type-C接口将信号传输到转换模块,转换模块将信号转换为EDP、MIPI、LVDS、SPI信号,使手机、平板、 The display signal on the computer can be displayed directly on the LCD display.
The display signal of mobile phones, tablets, and computers can be displayed directly through the Type-C interface on the LCD screen of EDP, MIPI, LVDS, and SPI signals. It solves the problem of universal interface and enhances the flexibility of display synchronization.
Smart Images

Figure CN222422686U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cable interfaces, and in particular to a signal module for converting Type-C to EDP, MIPI, LVDS and SPI. Background Art
[0002] At present, the mobile phones, tablet computers, various electronic consumer products, smart terminals, automotive aviation, and industrial control digital products we use all have Type-C interfaces. Type-C is a set of symmetrical connectors. During use, there is no need to identify the interface direction like USBA, MinUSB, and MicroUSB. Secondly, it can withstand higher power and can support up to 100W of power. Therefore, using this interface can better support fast charging and higher data throughput. The general specification also reaches a data bandwidth of 10Gb / s, which can be used for high-definition video transmission.
[0003] There are many types of interfaces for LCD monitors, including RGB interface, LVDS interface, eDP interface, MIPI-DSI interface, HDMI interface, etc. Each interface has a corresponding connection cable, and the interfaces are not universal with each other, resulting in the display images of mobile phones, tablets, and computers cannot be synchronized with the LCD monitor, which has certain limitations. Utility Model Content
[0004] 1. Technical issues to be solved
[0005] In view of the shortcomings of the prior art, the utility model provides a Type-C to EDP, MIPI, LVDS and SPI signal module to solve the problem that there are many interface types of liquid crystal displays, including RGB interface, LVDS interface, eDP interface, MIPI-DSI interface, HDMI interface, etc. Each interface has a corresponding connecting line, and the interfaces are not universal with each other, resulting in the display images of mobile phones, tablets, and computers cannot be synchronized with the liquid crystal display, which has certain limitations.
[0006] (II) Technical solution
[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:
[0008] A signal module for converting Type-C to EDP, MIPI, LVDS and SPI, the signal module comprising a Type-C interface body, a first data line is fixedly installed on the side end of the Type-C interface body, a conversion module is arranged on one side of the Type-C interface body, a second data line is fixedly installed on the side end of the conversion module, a single-chip computer module is fixedly installed on the top of the second data line, a groove is provided on one side of the conversion module, and a reel is rotatably installed on the inner side wall of the groove;
[0009] Preferably: a fixed block is fixedly installed on the inner side wall of the groove, a positioning block is slidably installed inside each of the fixed blocks, two telescopic rods are fixedly installed on the side ends of the positioning blocks, the ends of the telescopic rods are connected to the fixed blocks, a rotating shaft is fixedly installed on the side ends of each reel, a torsion spring is fixedly installed on the side ends of the reels, and at least two slots are opened on the surface of the reel.
[0010] (III) Beneficial effects
[0011] 1. By moving the first data line, the Type-C interface body is inserted into one end of the electronic device, and the signal is transmitted to the conversion module through the first data line. The conversion module converts each signal IC to output EDP, M IPI, LVDS, and SPI signals, so that the display signals on the mobile phone, tablet, and computer can be directly displayed on the LCD screen of EDP, M IPI, LVDS, and SPI signals through the Type-C interface body.
[0012] 2. Let the positioning block slide continuously on the side end of the fixed block. At the same time, a telescopic rod is installed at the end of the positioning block to push the positioning block and the surface of the reel to rub against each other, so that the top of the positioning block fits into the card slot. After the reel stops rotating, fix the reel. By pulling the reel to rotate, the length of the first data cable is increased, and the user can freely adjust it according to the distance of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.
[0014] Figure 1 This is a structural diagram of the Type-C interface body of the utility model;
[0015] Figure 2 This is a structural diagram of the single chip microcomputer module of the utility model;
[0016] Figure 3 This is a structural diagram of the conversion module of the utility model;
[0017] Figure 4 It is the structural diagram of the reel of the utility model.
[0018] Legend: 1. Type-C interface body; 11. First data cable; 12. Conversion module; 13. Second data cable; 14. MCU module; 15. Reel; 16. Groove; 17. Fixing block; 18. Positioning block; 19. Card slot; 21. Shaft; 22. Torsion spring. DETAILED DESCRIPTION
[0019] The embodiment of the present application provides a signal module for converting Type-C to EDP, M IPI, LVDS and SPI, which effectively solves the problem that there are many types of interfaces of liquid crystal displays, including RGB interface, LVDS interface, eDP interface, M IPI-DS I interface, HDMI interface, etc. Each interface has a corresponding connecting line, and the interfaces are not universal with each other, resulting in that the display screens of mobile phones, tablets and computers cannot be synchronized to the liquid crystal display, which has certain limitations. By moving the first data line, the Type-C interface body is inserted into one end of the electronic device, and the signal is transmitted to the conversion module through the first data line. The conversion module converts each signal conversion IC to output EDP, M IPI, LVDS, and SPI signals, so that the display signals on the mobile phone, tablet and computer can be directly displayed on the liquid crystal display screen of EDP, M IPI, LVDS, and SPI signals through the Type-C interface body.
[0020] Example
[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the technical solution in the embodiment of the present application effectively solves the problem that there are many types of interfaces of the liquid crystal display, including RGB interface, LVDS interface, eDP interface, M IPI-DS I interface, HDMI interface, etc., each interface has a corresponding connection line, and the interfaces are not universal with each other, resulting in the display screen of the mobile phone, tablet, and computer cannot be synchronized to the liquid crystal display, which has certain limitations. The overall idea is as follows:
[0022] In view of the problems existing in the prior art, the utility model provides a signal module for converting Type-C to EDP, M IPI, LVDS and SPI. The signal module comprises a Type-C interface body 1, a first data line 11 is fixedly installed on the side end of the Type-C interface body 1, a conversion module 12 is arranged on one side of the Type-C interface body 1, a second data line 13 is fixedly installed on the side end of the conversion module 12, a single-chip computer module 14 is fixedly installed on the top of the second data line 13, a groove 16 is provided on one side of the conversion module 12, a reel 15 is rotatably installed on the inner side wall of the groove 16, the first data line 11 is moved, the Type-C interface body 1 is inserted into one end of the electronic device, the signal is transmitted to the conversion module 12 through the first data line 11, and each signal conversion IC outputs EDP, M IPI, LVDS, and SPI signals through the conversion module 12, so that the display signals on the mobile phone, tablet, and computer can be directly displayed on the liquid crystal display screen of EDP, M IPI, LVDS, and SPI signals through the Type-C interface body 1.
[0023] A fixing block 17 is fixedly installed on the inner wall of the groove 16, and a positioning block 18 is slidably installed inside each fixing block 17. Two telescopic rods are fixedly installed on the side ends of the positioning blocks 18, and the ends of the telescopic rods are connected to the fixing blocks 17. A rotating shaft 21 is fixedly installed on the side ends of each reel 15, and a torsion spring 22 is fixedly installed on the side ends of the reel 15. At least two card slots 19 are opened on the surface of the reel 15. The reel 15 is driven to rotate inside the groove 16 by the movement of the first data line 11, and the reel 15 drives the rotating shaft 21 to rotate. At the same time, the rotating reel 15 drives the top end of the torsion spring 22 to move, so that the torsion spring 22 continuously rotates and retracts, so that the length of the first data line 11 is increased, and the user can freely adjust it according to the distance of the device.
[0024] Working principle:
[0025] The first step is to move the first data line 11, insert the Type-C interface body 1 into one end of the electronic device, transmit the signal to the conversion module 12 through the first data line 11, and convert each signal conversion IC to output EDP, MIPI, LVDS, and SPI signals through the conversion module 12, so that the display signals on the mobile phone, tablet, and computer can be directly displayed on the LCD screen of EDP, M IPI, LVDS, and SPI signals through the Type-C interface body 1. The output of EDP, MIPI, LVDS, and SPI signals can be controlled and displayed through the single-chip microcomputer module 14. The single-chip microcomputer module 14 can realize the transmission of video signals to the LCD screen of EDP, M IPI, LVDS, and SPI signal interfaces of electronic products such as mobile phones, tablets, and computers through the second data line 13. The single-chip microcomputer control circuit in the single-chip microcomputer module 14 can also directly realize the transmission of EDP, M IPI, LVDS, and SPI signals. Therefore, the module can be used to display the screen of EDP, MIPI, LVDS, and SPI signals on the corresponding LCD screen for testing.
[0026] In the second step, by pulling the Type-C interface body 1 at the same time, the Type-C interface body 1 drives the first data line 11 to move to one side, and the end of the first data line 11 is fixedly connected to the reel 15. The reel 15 is driven to rotate inside the groove 16 by the movement of the first data line 11, and the reel 15 drives the rotating shaft 21 to rotate. At the same time, the rotating reel 15 drives the top of the torsion spring 22 to move, so that the torsion spring 22 continuously rotates and retracts to compress its own volume. At the same time, the surface of the reel 15 rubs against the positioning block 18, and the top of the positioning block 18 matches the card slot 19, so that the positioning block 18 continuously slides on the side end of the fixed block 17. At the same time, a telescopic rod is installed at the end of the positioning block 18, which keeps pushing the positioning block 18 to rub against the surface of the reel 15, so that the top of the positioning block 18 matches the card slot 19. After the reel 15 stops rotating, the reel 15 is fixed, and the length of the first data line 11 is increased by pulling the reel 15 to rotate. The user can freely adjust it according to the distance of the device.
[0027] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.
Claims
1. A signal module for Type-C to EDP, MIPI, LVDS and SPI, characterized in that: The signal module comprises a Type-C interface body (1), a first data line (11) being fixedly mounted on a side end of the Type-C interface body (1), a conversion module (12) being arranged on one side of the Type-C interface body (1), a second data line (13) being fixedly mounted on a side end of the conversion module (12), a single-chip computer module (14) being fixedly mounted on the top of the second data line (13), a groove (16) being provided on one side of the conversion module (12), and a reel (15) being rotatably mounted on the inner side wall of the groove (16); The end of the first data line (11) is fixedly connected to the reel (15), and the reel (15) drives the first data line (11) to rotate. At the same time, four different types of interfaces are installed on one side of the conversion module (12).
2. A Type-C to EDP, M IPI, LVDS and SPI signal module as claimed in claim 1, characterized in that, A fixing block (17) is fixedly installed on the inner side wall of the groove (16) located on one side of the reel (15), and a positioning block (18) is slidably installed inside each of the fixing blocks (17); Wherein, the top end of the positioning block (18) is designed to be arc-shaped.
3. A signal module for Type-C to EDP, M IPI, LVDS and SPI as claimed in claim 2, characterized in that, Two telescopic rods are fixedly mounted on the side ends of the positioning block (18), and the ends of the telescopic rods are connected to the fixed block (17).
4. A Type-C to EDP, M IPI, LVDS and SPI signal module as claimed in claim 1, characterized in that, A rotating shaft (21) is fixedly mounted on the side end of each reel (15); The end of the rotating shaft (21) is rotatably connected to the inner wall of the groove (16).
5. A Type-C to EDP, M IPI, LVDS and SPI signal module as claimed in claim 1, characterized in that, A torsion spring (22) is fixedly mounted on the side end of the reel (15) located outside the rotating shaft (21); The end of the torsion spring (22) is fixedly connected to the inner wall of the groove (16), and the torsion spring (22) itself has a certain elasticity.
6. A Type-C to EDP, M IPI, LVDS and SPI signal module as claimed in claim 1, characterized in that: The surface of the reel (15) is provided with at least two slots (19); The shape of the clamping groove (19) matches the top end of the positioning block (18).