High-precision PCBA patch dispensing equipment

Abstract

The utility model discloses a high-precision PCBA patch dispensing device, which comprises a product feeding device used for positioning and conveying a PCBA; the polishing device is arranged corresponding to the product feeding device and is used for polishing the to-be-mounted area of the PCBA; the patch dispensing device is arranged corresponding to the product feeding device and is used for performing patch dispensing operation on the area to be subjected to patch of the PCBA; the fine adjustment curing device is arranged on the product feeding device and is used for performing fine adjustment and patch adhesive melting operation on the patch position of the PCBA; the welding device is arranged corresponding to the product feeding device and is used for carrying out welding operation on patches of the PCBA; and the detection device is arranged corresponding to the product feeding device and is used for detecting the welded PCBA. According to the utility model, PCBA board surface cleaning, element mounting, element fine-tuning fixing and welding operation can be completed in a limited operation space, and the mounting and welding precision and reliability of elements are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of patch glue dispensing equipment, and in particular to a high-precision PCBA patch glue dispensing equipment. Background Art

[0002] Existing patch dispensing equipment usually uses structures such as X-axis linear modules, Y-axis linear modules, and Z-axis linear modules to drive the dispensing device, mounting device, welding device and other devices to move freely. Due to limited operating space, it is difficult to meet the supporting settings of multiple devices and multiple workstations, and it cannot be applied to mass production needs; and the existing patch dispensing equipment has poor positioning accuracy for PCBAs and components, which can easily affect the installation effect and quality of components due to offset, resulting in uncontrollable processing quality. Utility Model Content

[0003] In order to overcome the above technical problems, the utility model discloses a high-precision PCBA patch dispensing device.

[0004] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0005] A high-precision PCBA patch dispensing device, the device comprising:

[0006] Product loading device, used to position and convey PCBA;

[0007] A polishing device, corresponding to the product feeding device, is used to perform a polishing operation on the area to be mounted on the PCBA;

[0008] The patch dispensing device is set corresponding to the product feeding device and is used for performing patch dispensing operation on the area to be patched of the PCBA;

[0009] A fine-tuning curing device is provided on the product feeding device and is used to fine-tune the patch position of the PCBA and melt the patch glue;

[0010] A welding device, corresponding to the product feeding device, is used to perform welding operations on the patches of the PCBA;

[0011] A detection device, arranged corresponding to the product feeding device, for performing detection operations on the soldered PCBA;

[0012] Among them, the product loading device includes a conveyor belt with a number of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, and a first side end fixing seat, a middle fixing seat and a second side end fixing seat are arranged around the product fixing cavity, the first side end fixing seat is integrally formed with the product fixing base, and a first translation mechanism and a second translation mechanism with driving directions perpendicular to them are arranged on the product fixing base, and the middle fixing seat and the second side end fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism.

[0013] The above-mentioned high-precision PCBA patch dispensing equipment, wherein a first clamping block and a second clamping block are respectively arranged between the first side end fixing seat and the middle fixing seat, and between the middle fixing seat and the second side end fixing seat, a first positioning rod driven to rotate by a first motor is arranged on the first clamping block, and a second positioning rod driven to rotate by a second motor is arranged on the second clamping block, and the first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and parallel to the product fixing base.

[0014] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the polishing device includes a first lifting mechanism, and a polishing mechanism, a dust suction mechanism and a thickness measuring mechanism arranged on the first lifting mechanism;

[0015] The grinding mechanism comprises a grinding wheel and a cleaning wheel synchronously driven by a third motor, the grinding wheel and the cleaning wheel are parallel and in contact with each other, and the grinding wheel is arranged corresponding to the product fixing cavity;

[0016] A clean negative pressure chamber is arranged inside the cleaning wheel, and the clean negative pressure chamber is connected to the negative pressure device. A plurality of adsorption through holes communicating with the clean negative pressure chamber are densely arranged on the surface of the cleaning wheel.

[0017] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the dust suction mechanism includes a dust suction ring arranged around the grinding wheel, the suction end of the dust suction ring is arranged corresponding to the product fixing cavity, and the dust suction ring is connected to the negative pressure device;

[0018] The thickness measuring mechanism comprises a first rotating shaft driven to rotate by a fourth motor, and a sensor for triggering a thickness measuring signal to perform a thickness measuring operation is arranged on the first rotating shaft.

[0019] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the patch dispensing device includes a patch point recognition mechanism and a placement mechanism;

[0020] The mounting mechanism includes a patch glue discharge tray, a silk screen dispensing assembly, a component loading assembly and a mounting assembly. The patch glue is arranged in the patch glue discharge tray and is mounted on the to-be-mounted area of ​​the PCBA through the silk screen dispensing assembly.

[0021] The placement assembly includes a second rotating shaft driven to rotate by a fifth motor, a placement head is arranged on the second rotating shaft, the placement head moves back and forth between the component loading assembly and the product fixing base, and a surface of the placement head is provided with several groups of positioning parts for locating PCBA placement points.

[0022] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the fine-tuning and curing device includes a component position recognition mechanism, a fine-tuning mechanism, a component fixing mechanism and a curing mechanism;

[0023] The fine-tuning mechanism includes a third rotating shaft driven to rotate by a sixth motor, a paddle assembly is arranged on the third rotating shaft, the paddle assembly includes a first rotating cylinder, and a paddle rotating seat sleeved on the driving shaft of the first rotating cylinder, a first paddle and a second paddle are correspondingly arranged on both sides of the paddle rotating seat, the first paddle and the second paddle are arranged corresponding to the product fixing cavity, and the first rotating cylinder is electrically connected to the component position identification mechanism.

[0024] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the component fixing mechanism includes a component fixing rod driven to rotate by a seventh motor, and the component fixing rod is arranged corresponding to the product fixing cavity and parallel to the product fixing base;

[0025] The curing mechanism includes a plurality of curing rods extending from the peripheral side of the component fixing rod, and a heater for melting the patch adhesive is arranged on the curing rod, and the heater is arranged corresponding to the product fixing cavity.

[0026] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the welding device includes a welding position recognition mechanism and a welding mechanism;

[0027] The welding mechanism includes a second rotary cylinder and a welding seat mounted on the driving shaft of the second rotary cylinder. A welding head is arranged on the welding seat. An angle adjuster for adjusting the inclination angle of the welding head is arranged between the welding seat and the welding head. The welding head is arranged corresponding to the product fixing cavity. The second rotary cylinder and the angle adjuster are both electrically connected to the welding position identification mechanism.

[0028] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the detection device includes a detection light source, a welding point detection mechanism and an electrical detection mechanism, and the detection light source and the welding point detection mechanism are arranged corresponding to the product fixing cavity;

[0029] The electrical detection mechanism includes a third rotary cylinder and a detection rotary seat sleeved on the driving shaft of the third rotary cylinder, and a detection probe is arranged on the detection rotary seat.

[0030] The above-mentioned high-precision PCBA patch dispensing equipment, wherein the equipment also includes a material transfer device, a good product discharge device and a bad product discharge device;

[0031] The material transfer device includes a third translation mechanism and a translation seat arranged on the third translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism moves back and forth between the product loading device and the good product discharging device, and the defective product picking mechanism moves back and forth between the product loading device and the defective product discharging device;

[0032] The good product picking mechanism includes a second lifting mechanism and a first picking seat arranged on the second lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity;

[0033] The defective product picking mechanism includes a third lifting mechanism and a second picking seat arranged on the third lifting mechanism. A plurality of groups of second air nozzles are arranged on the second picking seat, and the second air nozzles are arranged corresponding to the product fixing cavity.

[0034] The beneficial effects of the utility model are:

[0035] (1) The utility model is equipped with a grinding device, a patch dispensing device, a fine-tuning curing device, a welding device and a detection device to complete PCBA board cleaning, component mounting, component fine-tuning and fixing, and welding operations within a limited operating space, greatly improving the accuracy and reliability of component mounting and welding;

[0036] (2) The structure of the product feeding device is optimized, and the lateral side fixation and the rotating upper surface fixation are combined to effectively position and fix PCBAs of different sizes, thereby preventing the PCBA from shaking left and right or up and down and affecting the subsequent operation accuracy, and improving the fixation reliability of the PCBA;

[0037] (3) The polishing device is provided with the polishing mechanism, the dust collecting mechanism and the thickness measuring mechanism, so as to achieve the thickness measuring operation while keeping the PCBA board surface clean and absorbing the debris, thereby improving the product quality of the PCBA;

[0038] (4) The fine-tuning and curing device optimizes the arrangement of the component position recognition mechanism, the fine-tuning mechanism, the component fixing mechanism and the curing mechanism, and realizes the fine-tuning mechanism to adjust and compensate the mounting position of the component according to the recognition result of the component position recognition mechanism by rotating and driving each mechanism to avoid, and uses the component fixing mechanism to position the component. At the same time, the curing mechanism melts the patch adhesive in the form of small-scale heating, thereby realizing the bonding of the component to the PCBA, avoiding the performance of the remaining component structures of the PCBA being affected by the excessive heating area;

[0039] (5) The welding mechanism performs angle compensation on the inclination angle of the welding head according to the recognition result of the welding position recognition mechanism, so as to achieve precise adjustment of the welding angle and position of the welding head, thereby further improving the welding accuracy of the component;

[0040] (6) The detection device can realize welding quality detection and electrical detection of PCBA, and effectively complete the detection of abnormal open circuit, short circuit, wrong vertical spacing, connectivity, resistance value and capacitance value. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0042] Figure 1 It is a schematic diagram of the structure of the utility model. DETAILED DESCRIPTION

[0043] The present invention is further described below through specific embodiments to make the technical solution of the present invention easier to understand and grasp, rather than to limit the present invention.

[0044] Example: See Figure 1 , this embodiment provides a high-precision PCBA patch dispensing device, the device comprising:

[0045] Product feeding device 1, used for positioning and conveying PCBA;

[0046] A polishing device 2, which is provided corresponding to the product feeding device 1, and is used for performing a polishing operation on the area to be mounted on the PCBA;

[0047] The patch glue dispensing device 3 is provided corresponding to the product feeding device 1 and is used for performing patch glue dispensing operation on the patch area of ​​the PCBA;

[0048] A fine-tuning curing device 4 is provided on the product feeding device 1 and is used for fine-tuning the patch position of the PCBA and melting the patch adhesive;

[0049] A welding device 5, arranged corresponding to the product feeding device 1, for welding the patches of the PCBA;

[0050] The detection device 6 is arranged corresponding to the product feeding device 1 and is used for performing detection operations on the soldered PCBA.

[0051] Preferably, the product loading device 1 comprises a conveyor belt with a plurality of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, a first side fixing seat, a middle fixing seat and a second side fixing seat are arranged around the product fixing cavity, the first side fixing seat is integrally formed with the product fixing base, a first translation mechanism and a second translation mechanism whose driving directions are perpendicular are arranged on the product fixing base, the middle fixing seat and the second side fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism; specifically, when the PCBA is placed in the product fixing cavity, at this time, one side end of the PCBA abuts against the first side fixing seat to achieve pre-positioning, the first translation mechanism and the second translation mechanism respectively drive the middle fixing seat and the second side fixing seat to approach the PCBA, so as to achieve peripheral fixation of the PCBA, avoid left and right shaking of the PCBA and affect subsequent operation accuracy, and is suitable for peripheral fixation of PCBAs of different sizes, thereby increasing the application range of the device;

[0052] A first clamping block and a second clamping block are respectively arranged between the first side end fixing seat and the middle fixing seat, and between the middle fixing seat and the second side end fixing seat. A first positioning rod driven to rotate by a first motor is arranged on the first clamping block, and a second positioning rod driven to rotate by a second motor is arranged on the second clamping block. The first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and are parallel to the product fixing base. Specifically, after the first side end fixing seat, the middle fixing seat and the second side end fixing seat fix the PCBA, the first motor and the second motor respectively drive the first positioning rod and the second positioning rod to rotate to press against the surface of the PCBA, so as to fix the upper surface of the PCBA, avoid the PCBA shaking up and down and affect the subsequent operation accuracy, and are suitable for fixing the upper surface of PCBAs of different sizes, thereby increasing the application range of the device.

[0053] Preferably, the polishing device 2 includes a first lifting mechanism, and a polishing mechanism, a dust collecting mechanism and a thickness measuring mechanism arranged on the first lifting mechanism; specifically, the first lifting mechanism drives the polishing mechanism, the dust collecting mechanism and the thickness measuring mechanism to rise and fall synchronously, so as to quickly approach the area to be polished of the PCBA;

[0054] The grinding mechanism includes a grinding wheel and a cleaning wheel synchronously driven by a third motor, the grinding wheel and the cleaning wheel are parallel and in contact with each other, and the grinding wheel is arranged corresponding to the product fixing cavity; specifically, the grinding wheel and the cleaning wheel are synchronously driven by synchronous wheels, synchronous belts, etc.; the grinding wheel is used to sweep away debris, burrs, etc. in the area to be patched on the PCBA, so as to ensure that the PCBA board surface is neat and clean, thereby improving the quality of subsequent patch welding, and the cleaning wheel is used to achieve all-round adsorption of debris on the surface of the grinding wheel, so as to ensure that the surface of the grinding wheel is neat and clean, and facilitate unified collection of debris to complete cleaning;

[0055] A clean negative pressure chamber is arranged inside the cleaning wheel, and the clean negative pressure chamber is connected to the negative pressure device. A plurality of adsorption through holes communicating with the clean negative pressure chamber are densely arranged on the surface of the cleaning wheel. Specifically, when the grinding wheel cleans the area to be mounted on the PCBA, since the cleaning wheel contacts the grinding wheel, the cleaning wheel absorbs the debris on the surface of the grinding wheel through the adsorption through holes, thereby achieving the purpose of cleaning the surface of the grinding wheel and further improving the cleanliness of the PCBA board surface.

[0056] Further, the dust suction mechanism includes a dust suction ring arranged around the grinding wheel, the suction end of the dust suction ring is arranged corresponding to the product fixing cavity, and the dust suction ring is connected to the negative pressure device; specifically, when the grinding wheel cleans the area to be mounted on the PCBA, the dust suction ring absorbs the debris splashed by the grinding wheel to prevent the debris from splashing randomly and affecting the cleanliness of the PCBA board surface;

[0057] The thickness measuring mechanism includes a first rotating shaft driven to rotate by a fourth motor, and a sensor for triggering a thickness measuring signal to perform a thickness measuring operation is arranged on the first rotating shaft; specifically, after the polishing mechanism completes cleaning, the thickness measuring mechanism performs a thickness measuring operation on the area to be mounted on the PCBA to prevent the PCBA from affecting product quality due to excessive polishing.

[0058] Preferably, the patch dispensing device 3 includes a patch point recognition mechanism and a mounting mechanism; the patch point recognition mechanism is used to identify the area to be mounted on the PCBA to improve the accuracy of the patch;

[0059] The mounting mechanism includes a patch glue feeding tray, a silk screen dispensing assembly, a component loading assembly and a mounting assembly. The patch glue is arranged in the patch glue feeding tray and is mounted on the waiting patch area of ​​the PCBA through the silk screen dispensing assembly; the silk screen dispensing assembly is used to dispense the patch glue on the waiting patch area of ​​the PCBA;

[0060] The placement assembly includes a second rotating shaft driven to rotate by a fifth motor, a placement head is arranged on the second rotating shaft, the placement head moves back and forth between the component loading assembly and the product fixing base, and a surface of the placement head is provided with a plurality of groups of positioning members for locating PCBA placement points; specifically, the placement head picks up the component to be mounted at the component loading assembly, the fifth motor drives the placement head to rotate to the area to be mounted on the PCBA, and the placement head mounts the component in the area to be mounted on the PCBA to complete the component placement operation.

[0061] Preferably, the fine-tuning and curing device 4 comprises a component position recognition mechanism, a fine-tuning mechanism, a component fixing mechanism and a curing mechanism; the component position recognition mechanism is used to recognize the position of the component mounted on the PCBA;

[0062] The fine-tuning mechanism includes a third rotating shaft driven to rotate by a sixth motor, a paddle assembly is arranged on the third rotating shaft, the paddle assembly includes a first rotating cylinder, and a paddle rotating seat sleeved on the driving shaft of the first rotating cylinder, a first paddle and a second paddle are correspondingly arranged on both sides of the paddle rotating seat, the first paddle and the second paddle are arranged corresponding to the product fixing cavity, and the first rotating cylinder is electrically connected to the component position identification mechanism; specifically, the sixth motor drives the paddle assembly to approach the PCBA, and after the component position identification mechanism identifies the position of the component, the first rotating cylinder synchronously drives the first paddle and the second paddle to rotate, thereby driving the component to perform position adjustment compensation, so as to achieve precise adjustment of the component position and further improve the installation accuracy of the component.

[0063] Further, the component fixing mechanism includes a component fixing rod driven to rotate by a seventh motor, the component fixing rod is arranged corresponding to the product fixing cavity and is parallel to the product fixing base; specifically, the seventh motor drives the component fixing rod to approach and fix the component mounted on the PCBA to achieve the fixation of the component and avoid displacement in subsequent curing and welding operations to affect the installation accuracy;

[0064] The curing mechanism includes a plurality of curing rods extending from the circumferential side of the component fixing rod, and a heater for melting the patch adhesive is arranged on the curing rod, and the heater is arranged corresponding to the product fixing cavity; specifically, when the component fixing rod fixes the component, the heater generates heat, and the patch adhesive is melted through the curing rod, thereby achieving the bonding of the component to the PCBA, thereby improving the curing accuracy of the component.

[0065] Preferably, the welding device 5 comprises a welding position identification mechanism and a welding mechanism; the welding position identification mechanism is used to identify the area to be welded of the PCBA;

[0066] The welding mechanism includes a second rotating cylinder and a welding rotary seat mounted on a driving shaft of the second rotating cylinder, a welding head is arranged on the welding rotary seat, an angle adjuster for adjusting the inclination angle of the welding head is arranged between the welding rotary seat and the welding head, the welding head is arranged corresponding to the product fixing cavity, the second rotating cylinder and the angle adjuster are both electrically connected to the welding position identification mechanism; specifically, after the welding position identification mechanism identifies the area to be welded of the PCBA, the second rotating cylinder drives the welding head to rotate close to the area to be welded, and the angle adjuster adjusts the inclination angle of the welding head for angle adjustment compensation, so as to achieve precise adjustment of the welding angle and position of the welding head, and further improve the welding accuracy of the components.

[0067] Preferably, the detection device 6 includes a detection light source, a welding point detection mechanism and an electrical detection mechanism, and the detection light source and the welding point detection mechanism are arranged corresponding to the product fixing cavity; specifically, the detection light source emits light to the PCBA placed in the product fixing cavity, and the welding point detection mechanism performs welding quality detection on the welded position of the PCBA;

[0068] The electrical detection mechanism includes a third rotating cylinder and a detection rotary seat sleeved on the driving shaft of the third rotating cylinder. A detection probe is arranged on the detection rotary seat. The detection probe is used to input an electrical signal to a test point of the PCBA to detect abnormal open circuit, short circuit, wrong vertical spacing, connectivity, resistance value, capacitance value and other detection items; specifically, the third rotating cylinder drives the detection probe to rotate for angle compensation until the detection probe contacts the test point of the PCBA, thereby improving the contact reliability between the detection probe and the test point, thereby improving the detection accuracy.

[0069] Preferably, the device further comprises a material transfer device 7, a good product discharging device and a bad product discharging device;

[0070] The material moving device 7 includes a third translation mechanism and a translation seat arranged on the third translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism moves back and forth between the product feeding device 1 and the good product discharging device, and the defective product picking mechanism moves back and forth between the product feeding device 1 and the defective product discharging device; specifically, the third translation mechanism drives the good product picking mechanism and the defective product picking mechanism to move horizontally synchronously, when the detection device 6 detects that the PCBA is a good product, the good product picking mechanism picks up the PCBA and moves it out, and when the detection device 6 detects that the PCBA is a defective product, the defective product picking mechanism picks up the PCBA and moves it out;

[0071] The good product picking mechanism includes a second lifting mechanism and a first picking seat arranged on the second lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity; specifically, the second lifting mechanism drives the first air nozzle to descend to the good PCBA product, and the first air nozzle absorbs the good PCBA product;

[0072] The defective product picking mechanism includes a third lifting mechanism and a second picking seat arranged on the third lifting mechanism, and a plurality of groups of second air nozzles are arranged on the second picking seat, and the second air nozzles are arranged corresponding to the product fixing cavity; specifically, the third lifting mechanism drives the second air nozzle to descend to the defective PCBA product, and the second air nozzle absorbs the defective PCBA product.

[0073] The high-precision PCBA patch dispensing equipment of the utility model comprises the following steps when working:

[0074] (1) The product feeding device 1 conveys PCBA;

[0075] (2) The product feeding device 1 drives the PCBA to move to the polishing device 2;

[0076] The first lifting mechanism drives the grinding mechanism, the dust collecting mechanism and the thickness measuring mechanism to synchronously descend to the area to be ground close to the PCBA;

[0077] The grinding wheel removes debris, burrs, etc. from the area of ​​the PCBA to be mounted, the cleaning wheel absorbs debris in all directions on the surface of the grinding wheel, and the dust collecting ring absorbs the debris splashed by the grinding wheel.

[0078] (3) After polishing is completed, the product loading device 1 drives the PCBA to move to the patch dispensing device 3;

[0079] The patch point recognition mechanism identifies the area to be patched on the PCBA, and the mounting mechanism performs glue dispensing and component mounting operations on the PCBA according to the recognition result of the patch point recognition mechanism;

[0080] The patch glue feeding tray feeds the patch glue to be dispensed, and the screen printing dispensing component dispenses the patch glue in the area to be patched on the PCBA;

[0081] The fifth motor drives the second rotating shaft to rotate, thereby driving the placement head to pick up the component to be mounted at the component loading assembly, and then drives the placement head to rotate to the area to be mounted on the PCBA, and the placement head mounts the component in the area to be mounted on the PCBA to complete the component mounting operation;

[0082] (4) After the mounting is completed, the product loading device 1 drives the PCBA to move to the fine-tuning and curing device 4;

[0083] The component position recognition mechanism is used to recognize the position of the component mounted on the PCBA, and the fine-tuning mechanism further adjusts the position and angle of the component according to the recognition result of the component position recognition mechanism. After the adjustment is completed, the component fixing mechanism fixes the component, and the curing mechanism generates heat to melt the patch adhesive to achieve bonding of the component to the PCBA;

[0084] The sixth motor drives the paddle assembly to approach the PCBA, and according to the recognition result of the component position recognition mechanism, the first rotary cylinder synchronously drives the first paddle and the second paddle to rotate, thereby shifting the component to perform position adjustment compensation, so as to achieve precise adjustment of the component position;

[0085] After the adjustment is completed, the seventh motor drives the component fixing rod to approach and fix the component mounted on the PCBA to fix the component, and at this time, the sixth motor drives the paddle assembly to reset to leave the component;

[0086] After the component is fixed, the heater generates heat, and the patch adhesive is melted through the curing rod, thereby achieving the bonding of the component to the PCBA;

[0087] (5) After curing is completed, the product loading device 1 drives the PCBA to move to the welding device 5;

[0088] The welding position recognition mechanism recognizes the area to be welded of the PCBA, and the welding mechanism welds the component on the PCBA according to the recognition result of the welding position recognition mechanism;

[0089] The second rotary cylinder drives the welding head to rotate close to the area to be welded, the angle adjuster adjusts the tilt angle of the welding head to perform angle adjustment compensation, and the welding head welds the component on the PCBA according to the recognition result of the welding position recognition mechanism;

[0090] (6) After the welding is completed, the product loading device 1 drives the PCBA to move to the detection device 6;

[0091] The detection light source emits detection light to the PCBA, the welding point detection mechanism performs welding quality detection on the welded position of the PCBA, and the electrical detection mechanism performs electrical detection on the PCBA;

[0092] Wherein, after the welding point detection mechanism completes the welding quality detection, the third rotary cylinder drives the detection probe to rotate for angle compensation until the detection probe contacts the test point of the PCBA, and the detection probe detects abnormal open circuit, short circuit, wrong vertical spacing, connectivity, resistance value and capacitance value of the PCBA;

[0093] (7) After the inspection is completed, the product loading device 1 drives the PCBA to move to the material moving device 7;

[0094] If the PCBA is a good product, the good product picking mechanism picks up the PCBA and moves it out;

[0095] If the PCBA is a defective product, the defective product picking mechanism picks up the PCBA and moves it out.

[0096] The high-precision PCBA patch dispensing equipment of this utility model has the following advantages:

[0097] (1) The utility model is equipped with a grinding device, a patch dispensing device, a fine-tuning curing device, a welding device and a detection device to complete PCBA board cleaning, component mounting, component fine-tuning and fixing, and welding operations within a limited operating space, greatly improving the accuracy and reliability of component mounting and welding;

[0098] (2) The structure of the product feeding device is optimized, and the lateral side fixation and the rotating upper surface fixation are combined to effectively position and fix PCBAs of different sizes, thereby preventing the PCBA from shaking left and right or up and down and affecting the subsequent operation accuracy, and improving the fixation reliability of the PCBA;

[0099] (3) The polishing device is provided with the polishing mechanism, the dust collecting mechanism and the thickness measuring mechanism, so as to achieve the thickness measuring operation while keeping the PCBA board surface clean and absorbing the debris, thereby improving the product quality of the PCBA;

[0100] (4) The fine-tuning and curing device optimizes the arrangement of the component position recognition mechanism, the fine-tuning mechanism, the component fixing mechanism and the curing mechanism, and realizes the fine-tuning mechanism to adjust and compensate the mounting position of the component according to the recognition result of the component position recognition mechanism by rotating and driving each mechanism to avoid, and uses the component fixing mechanism to position the component. At the same time, the curing mechanism melts the patch adhesive in the form of small-scale heating, thereby realizing the bonding of the component to the PCBA, avoiding the performance of the remaining component structures of the PCBA being affected by the excessive heating area;

[0101] (5) The welding mechanism performs angle compensation on the inclination angle of the welding head according to the recognition result of the welding position recognition mechanism, so as to achieve precise adjustment of the welding angle and position of the welding head, thereby further improving the welding accuracy of the component;

[0102] (6) The detection device can realize welding quality detection and electrical detection of PCBA, and effectively complete the detection of abnormal open circuit, short circuit, wrong vertical spacing, connectivity, resistance value and capacitance value.

[0103] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the utility model by using the technical means and technical contents disclosed above, without departing from the scope of the technical solution of the utility model, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the utility model without departing from the content of the technical solution of the utility model should be covered by the protection scope of the utility model.

Claims

1. A high-precision PCBA patch dispensing equipment, characterized in that: The device comprises: Product loading device, used to position and convey PCBA; A polishing device, corresponding to the product feeding device, is used to perform a polishing operation on the area to be mounted on the PCBA; The patch dispensing device is set corresponding to the product feeding device and is used for performing patch dispensing operation on the area to be patched of the PCBA; A fine-tuning curing device is provided on the product feeding device and is used to fine-tune the patch position of the PCBA and melt the patch glue; A welding device, corresponding to the product feeding device, is used to perform welding operations on the patches of the PCBA; A detection device, arranged corresponding to the product feeding device, for performing detection operations on the soldered PCBA; Among them, the product loading device includes a conveyor belt with a number of product fixing bases installed at equal intervals, the product fixing base is provided with a product fixing cavity, and a first side end fixing seat, a middle fixing seat and a second side end fixing seat are arranged around the product fixing cavity, the first side end fixing seat is integrally formed with the product fixing base, and a first translation mechanism and a second translation mechanism with driving directions perpendicular to them are arranged on the product fixing base, and the middle fixing seat and the second side end fixing seat are respectively arranged on the first translation mechanism and the second translation mechanism.

2. The high-precision PCBA patch dispensing equipment according to claim 1 is characterized in that: A first clamping block and a second clamping block are respectively arranged between the first side end fixing seat and the middle fixing seat, and between the middle fixing seat and the second side end fixing seat. A first positioning rod driven to rotate by a first motor is arranged on the first clamping block, and a second positioning rod driven to rotate by a second motor is arranged on the second clamping block. The first positioning rod and the second positioning rod are both arranged corresponding to the product fixing cavity and are parallel to the product fixing base.

3. The high-precision PCBA patch dispensing equipment according to claim 2 is characterized in that: The grinding device includes a first lifting mechanism, and a grinding mechanism, a dust collecting mechanism and a thickness measuring mechanism arranged on the first lifting mechanism; The grinding mechanism comprises a grinding wheel and a cleaning wheel synchronously driven by a third motor, the grinding wheel and the cleaning wheel are parallel and in contact with each other, and the grinding wheel is arranged corresponding to the product fixing cavity; A clean negative pressure chamber is arranged inside the cleaning wheel, and the clean negative pressure chamber is connected to the negative pressure device. A plurality of adsorption through holes communicating with the clean negative pressure chamber are densely arranged on the surface of the cleaning wheel.

4. The high-precision PCBA patch dispensing equipment according to claim 3 is characterized in that: The dust suction mechanism comprises a dust suction ring arranged around the grinding wheel, the suction end of the dust suction ring is arranged corresponding to the product fixing cavity, and the dust suction ring is connected to the negative pressure device; The thickness measuring mechanism comprises a first rotating shaft driven to rotate by a fourth motor, and a sensor for triggering a thickness measuring signal to perform a thickness measuring operation is arranged on the first rotating shaft.

5. The high-precision PCBA patch dispensing equipment according to claim 2, characterized in that: The patch dispensing device comprises a patch point recognition mechanism and a placement mechanism; The mounting mechanism includes a patch glue discharge tray, a silk screen dispensing assembly, a component loading assembly and a mounting assembly. The patch glue is arranged in the patch glue discharge tray and is mounted on the to-be-mounted area of ​​the PCBA through the silk screen dispensing assembly. The placement assembly includes a second rotating shaft driven to rotate by a fifth motor, a placement head is arranged on the second rotating shaft, the placement head moves back and forth between the component loading assembly and the product fixing base, and a surface of the placement head is provided with several groups of positioning parts for locating PCBA placement points.

6. The high-precision PCBA patch dispensing equipment according to claim 2, characterized in that: The fine-tuning and curing device comprises a component position recognition mechanism, a fine-tuning mechanism, a component fixing mechanism and a curing mechanism; The fine-tuning mechanism includes a third rotating shaft driven to rotate by a sixth motor, a paddle assembly is arranged on the third rotating shaft, the paddle assembly includes a first rotating cylinder, and a paddle rotating seat sleeved on the driving shaft of the first rotating cylinder, a first paddle and a second paddle are correspondingly arranged on both sides of the paddle rotating seat, the first paddle and the second paddle are arranged corresponding to the product fixing cavity, and the first rotating cylinder is electrically connected to the component position identification mechanism.

7. The high-precision PCBA patch dispensing equipment according to claim 6, characterized in that: The component fixing mechanism includes a component fixing rod driven to rotate by a seventh motor, the component fixing rod is arranged corresponding to the product fixing cavity and parallel to the product fixing base; The curing mechanism includes a plurality of curing rods extending from the peripheral side of the component fixing rod, and a heater for melting the patch adhesive is arranged on the curing rod, and the heater is arranged corresponding to the product fixing cavity.

8. The high-precision PCBA patch dispensing equipment according to claim 2, characterized in that: The welding device comprises a welding position identification mechanism and a welding mechanism; The welding mechanism includes a second rotary cylinder and a welding seat mounted on the driving shaft of the second rotary cylinder. A welding head is arranged on the welding seat. An angle adjuster for adjusting the inclination angle of the welding head is arranged between the welding seat and the welding head. The welding head is arranged corresponding to the product fixing cavity. The second rotary cylinder and the angle adjuster are both electrically connected to the welding position identification mechanism.

9. The high-precision PCBA patch dispensing equipment according to claim 2, characterized in that: The detection device includes a detection light source, a welding point detection mechanism and an electrical detection mechanism, and the detection light source and the welding point detection mechanism are arranged corresponding to the product fixing cavity; The electrical detection mechanism includes a third rotary cylinder and a detection rotary seat sleeved on the driving shaft of the third rotary cylinder, and a detection probe is arranged on the detection rotary seat.

10. The high-precision PCBA patch dispensing equipment according to claim 2, characterized in that: The equipment also includes a material transfer device, a good product discharging device and a bad product discharging device; The material transfer device includes a third translation mechanism and a translation seat arranged on the third translation mechanism, a good product picking mechanism and a defective product picking mechanism are arranged in parallel on the translation seat, the good product picking mechanism moves back and forth between the product loading device and the good product discharging device, and the defective product picking mechanism moves back and forth between the product loading device and the defective product discharging device; The good product picking mechanism includes a second lifting mechanism and a first picking seat arranged on the second lifting mechanism, and a plurality of first air nozzles are arranged on the first picking seat, and the first air nozzles are arranged corresponding to the product fixing cavity; The defective product picking mechanism includes a third lifting mechanism and a second picking seat arranged on the third lifting mechanism. A plurality of groups of second air nozzles are arranged on the second picking seat, and the second air nozzles are arranged corresponding to the product fixing cavity.

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