Novel multiprocessor heat dissipation device

Abstract

The utility model belongs to the technical field of board card heat dissipation structures, and particularly relates to a novel multiprocessor heat dissipation device which comprises an aluminum heat dissipation base body, a fan and matched screws, the lower end of the aluminum heat dissipation base body is provided with heat dissipation bosses which are evenly distributed, the upper side wall of the aluminum heat dissipation base body is provided with heat dissipation fins, and the heat dissipation fins are arranged on the lower side wall of the aluminum heat dissipation base body. Mounting threaded holes which are uniformly distributed are formed in the side wall of the aluminum heat dissipation base body, mounting through holes which are uniformly distributed are formed in the side wall of the fan, the matched screws are in threaded connection with the mounting through holes, and the fan is fixedly connected with the aluminum heat dissipation base body through the matched screws. The fan and the aluminum heat dissipation base body are installed and fixed through the matched screws, and the fan and the heat dissipation fins are effectively matched, so that the heat dissipation effect can be greatly improved, internal electrical components are prevented from being damaged by long-time high temperature, and the service life of the electronic components is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of board heat dissipation structures, in particular to a novel multi-processor heat dissipation device. Background Art

[0002] As the performance of electronic devices continues to improve, the heat they generate is also increasing. If the heat cannot be effectively dissipated, it will cause the performance of the device to decline or even damage it.

[0003] The localization of components is an inevitable trend, but with the widespread application of domestic components, the problem of high heat generation of process processors has not been effectively solved. The integration of high-performance boards is getting higher and higher, especially multi-processor boards, which generate more and more concentrated heat and are more difficult to dissipate. Therefore, how to improve the heat dissipation effect of the board and ensure that the equipment can maintain stable performance under high load operation is an urgent problem to be solved.

[0004] Overheating is one of the main causes of failure and damage to electronic equipment. Domestic multi-processor high-efficiency cooling solutions can effectively control device temperature and prevent overheating, thereby enhancing the reliability and stability of the device. The development of domestic processor high-efficiency cooling solutions will also promote the advancement of related materials, processes, and design technologies, laying the foundation for the future development of electronic equipment. Utility Model Content

[0005] The purpose of the utility model is to provide a novel multi-processor heat dissipation device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a novel multi-processor heat dissipation device, comprising an aluminum heat dissipation substrate, a fan and matching screws, the lower end of the aluminum heat dissipation substrate is provided with evenly arranged heat dissipation bosses, the upper side wall of the aluminum heat dissipation substrate is provided with heat dissipation fins, the side wall of the aluminum heat dissipation substrate is provided with evenly arranged mounting threaded holes, the side wall of the fan is provided with evenly arranged mounting through holes, the matching screws are threadedly connected to the mounting through holes, and the fan is fixedly connected to the aluminum heat dissipation substrate through the matching screws.

[0007] Preferably, a washer is provided on the outer sleeve of the matching screw.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] The present application uses matching screws to install and fix the fan to the aluminum heat dissipation base, and the effective cooperation with the heat dissipation fins can greatly improve the heat dissipation effect, avoid damage to internal electrical components due to long-term high temperature, and effectively extend the service life of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the explosion structure of the utility model;

[0011] Figure 2 This is a schematic diagram of the structure after installation.

[0012] In the figure: 1 aluminum heat dissipation base, 2 fan, 3 matching screws, 11 heat dissipation boss, 12 mounting threaded hole, 13 heat dissipation fin, 21 mounting through hole, 31 washer. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0014] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0015] Example:

[0016] See also Figure 1-2 , the utility model provides a technical solution:

[0017] A novel multi-processor heat dissipation device comprises an aluminum heat dissipation substrate 1, a fan 2 and matching screws 3. The lower end of the aluminum heat dissipation substrate 1 is provided with evenly arranged heat dissipation bosses 11, the upper side wall of the aluminum heat dissipation substrate 1 is provided with heat dissipation fins 13, the side wall of the aluminum heat dissipation substrate 1 is provided with evenly arranged mounting threaded holes 12, the side wall of the fan 2 is provided with evenly arranged mounting through holes 21, the matching screws 3 are threadedly connected to the mounting through holes 21, and the fan 2 is fixedly connected to the aluminum heat dissipation substrate 1 through the matching screws 3.

[0018] The outer sleeve of the matching screw 3 is provided with a washer 31. After the matching screw 3 fixes the fan 2 and the aluminum heat dissipation substrate 1, the washer 31 is provided to prevent the matching screw 3 from loosening.

[0019] Working principle:

[0020] The fan 2 is placed on the upper end of the aluminum heat dissipation substrate 1, and the matching screws 3 are passed through the mounting through holes 21 and connected to the aluminum heat dissipation substrate 1, so that the fan 2 is fixed to the upper end of the aluminum heat dissipation substrate 1, and with the function of the heat dissipation fins 13, the electrical components fixed on the side wall of the aluminum heat dissipation substrate 1 are quickly dissipated and cooled.

[0021] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description. Therefore, it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel multi-processor heat dissipation device, comprising an aluminum heat dissipation substrate (1), a fan (2) and matching screws (3), characterized in that: The lower end of the aluminum heat dissipation substrate (1) is provided with evenly arranged heat dissipation bosses (11), the upper side wall of the aluminum heat dissipation substrate (1) is provided with heat dissipation fins (13), the side wall of the aluminum heat dissipation substrate (1) is provided with evenly arranged mounting threaded holes (12), the side wall of the fan (2) is provided with evenly arranged mounting through holes (21), the matching screws (3) are threadedly connected to the mounting through holes (21), and the fan (2) is fixedly connected to the aluminum heat dissipation substrate (1) via the matching screws (3).

2. A novel multi-processor heat dissipation device according to claim 1, characterized in that: The outer sleeve of the matching screw (3) is provided with a washer (31).

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