Shielding structure and electronic device

Abstract

The utility model discloses a shielding structure and an electronic device. The electronic device comprises a substrate, an electronic element and a shielding structure. The electronic component is arranged on the substrate. The shielding structure comprises a frame body, a cover body and a conductive adhesive material. The frame body is suitable for enclosing the electronic component and comprises an annular side wall and an annular top wall, the annular top wall is connected with the annular side wall, the top surface of the annular top wall comprises a groove, the cover body is assembled on the frame body and covers the groove, and the conductive adhesive material is filled in the groove so as to fix the cover body on the frame body and seal the electronic component in the shielding structure. Therefore, an excellent electromagnetic shielding effect is achieved.

Description

Technical Field

[0001] The present invention relates to a shielding structure and an electronic device using the shielding structure. Background Art

[0002] Compact portable electronic devices are becoming increasingly popular. Examples of compact portable electronic devices include laptops, tablet computers, smartphones, handheld devices, miniature devices such as pendant and wearable devices, and other devices. These devices often include circuit systems that require electromagnetic shielding. If care is not taken, a signal from one circuit can interfere with the proper operation of another circuit.

[0003] In order to protect the device from electromagnetic interference, a circuit such as a radio frequency transceiver may be enclosed in a metal shielding cover or a conductive paste may be placed between multiple circuits. This metal shielding cover can block signals and help shield the enclosed components from electromagnetic interference. In traditional practices, the cover and frame of the shielding cover are assembled by providing corresponding snap-fit ​​structures on the frame and cover, respectively, and then snapping the snap-fit ​​structures on the cover and frame together to limit the relative displacement between the two. However, this assembly method still leaves some gaps around the edges of the cover and frame, which cannot completely block and isolate electromagnetic waves from entering the interior of the shielding cover, thereby causing the communication test to fail. In addition, this assembly method of the shielding cover is prone to causing the snap-fit ​​structure to be displaced due to vibration or to deformation and / or wear of the snap-fit ​​structure due to long-term use, making it unusable. Utility Model Content

[0004] The purpose of the present disclosure is to provide a shielding structure and an electronic device using the shielding structure, which can effectively block and isolate electromagnetic waves from entering the interior of the shielding structure and can be easily reworked and reused.

[0005] A shielding structure disclosed in the present invention includes a frame, a cover, and a conductive adhesive. The frame is suitable for surrounding an electronic component, and the frame includes an annular side wall and an annular top wall, the annular top wall is connected to the annular side wall, and the top surface of the annular top wall includes a groove. The cover is assembled on the frame and covers the groove. The conductive adhesive is filled in the groove to fix the cover to the frame.

[0006] According to one embodiment of the present invention, the conductive adhesive material includes solder or conductive glue.

[0007] According to one embodiment of the present invention, the material of the shielding structure includes metal.

[0008] According to one embodiment of the present invention, the shielding structure further includes a connector, which is disposed on the annular side wall of the frame and coupled to the electronic component.

[0009] According to one embodiment of the present invention, the groove completely surrounds the entire periphery of the top surface of the annular top wall.

[0010] An electronic device disclosed herein includes a substrate, an electronic component, and a shielding structure. The electronic component is disposed on the substrate. The shielding structure includes a frame disposed on the substrate, a cover covering the frame, and a conductive adhesive material, wherein the frame is suitable for surrounding the electronic component and includes an annular side wall and an annular top wall, the annular top wall is connected to the annular side wall, and the top surface of the annular top wall includes a groove, the cover is assembled on the frame and covers the groove, and the conductive adhesive material is filled in the groove to fix the cover to the frame and seal the electronic component in the shielding structure.

[0011] According to one embodiment of the present invention, the substrate further includes a positioning hole, and the frame further includes a positioning portion for engaging with the positioning hole.

[0012] According to one embodiment of the present invention, the frame is fixed on the substrate by soldering.

[0013] Based on the above, the shielding structure disclosed in the present invention is provided with a groove surrounding the periphery on the top surface of the frame, and a conductive adhesive is filled therein. The cover body is fixed to the frame body through the conductive adhesive, and the electronic components can be sealed in the shielding structure. With such a configuration, fixing the frame body and the cover body with a conductive adhesive can eliminate the redundant fixing structure on the frame body and the cover body, thereby reducing the amount of plate materials used to make the frame body and the cover body, and effectively reducing the production cost. In addition, since the material of the conductive adhesive includes metal, it also has an electromagnetic shielding effect. Therefore, the conductive adhesive filled in the groove surrounds the periphery of the top surface of the frame, which can not only make the cover body firmly fixed to the frame, but also ensure that the electronic components are completely enclosed in the shielding structure, thereby achieving an excellent electromagnetic shielding effect. In addition, the conductive adhesive has the property of melting when heated, so the cover body and the frame body can be easily separated by only heating and melting the conductive adhesive again, thereby further improving the reworkability and reusability of the shielding structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of an exploded view of components of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 2 It is a schematic diagram of a frame of a shielding structure disposed on a substrate according to an embodiment of the present disclosure.

[0016] Figure 3 yes Figure 2 A partial cross-sectional schematic diagram of an electronic device.

[0017] Figure 4 is a schematic diagram of an assembled electronic device according to an embodiment of the present disclosure.

[0018] Figure 5 is a schematic side view of an electronic device according to an embodiment of the present disclosure.

[0019] Figure 6 yes Figure 5 A partial cross-sectional schematic diagram of an electronic device.

[0020] The reference numerals are as follows:

[0021] 100: Electronic devices

[0022] 110: Substrate

[0023] 112: Positioning hole

[0024] 120: Electronic components

[0025] 130: Shielding structure

[0026] 132: Frame

[0027] 1321: Groove

[0028] 1322: Positioning Department

[0029] 1323: Annular top wall

[0030] 1324: Annular sidewall

[0031] 134: Cover

[0032] 136: Conductive adhesive

[0033] 138: Connector

[0034] 1381: First End

[0035] 1382: Second End

[0036] S1: Top surface

[0037] S2: Bottom surface DETAILED DESCRIPTION

[0038] The aforementioned and other technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only the directions with reference to the attached drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In addition, in the following embodiments, the same or similar elements will be labeled with the same or similar numbers.

[0039] Figure 1It is a schematic diagram of an exploded view of components of an electronic device according to an embodiment of the present disclosure. Figure 2 This is a schematic diagram of a shielding structure frame disposed on a substrate according to an embodiment of the present disclosure. Figure 1 and Figure 2 In some embodiments, the electronic device 100 may include a substrate 110, an electronic component 120, and a shielding structure 130. The electronic component 120 is disposed on the substrate 110. In this embodiment, the substrate 110 may include a circuit board. The shielding structure 130 is disposed on the substrate 110 and includes a frame 132, a cover 134, and a conductive adhesive 136, wherein the frame 132 is disposed on the substrate 110, and the cover 134 is covered on the frame 132 and fixed by the conductive adhesive 136. In some embodiments, the material of the shielding structure 130 includes metal to provide a shielding effect for the electronic component 120 covered therein.

[0040] Specifically, the present disclosure relates to a shielding structure 130 used in an electronic device 100 to provide shielding for electronic, mechanical and optical components. The shielding structure 130 may include, but is not limited to, a radio frequency shielding structure and / or a magnetic shielding structure. In the present embodiment, the shielding structure 130 may be used to shield electronic components 120 such as integrated circuits operating in a radio frequency band (e.g., transceiver integrated circuits, memory circuits, and other circuits). The electronic component 120 may also include a circuit system formed by one or more discrete components such as an inductor, a capacitor, a resistor, a switch, etc. The shielded electronic component 120 may be an aggressor (a component that generates radio frequency or magnetic shielding interference) and / or a victim (a component that is sensitive to interference received from an external source). The shielding structure 130 can help reduce electromagnetic interference and is therefore sometimes referred to as an electromagnetic interference (EMI) shielding structure.

[0041] Figure 3 yes Figure 2 A partial cross-sectional schematic diagram of an electronic device. Figure 4 is a schematic diagram of an assembled electronic device according to an embodiment of the present disclosure. Figures 2 to 4In some embodiments, the frame 132 is disposed on the substrate 110 and is used to frame a receiving space for receiving the electronic element 120. In other words, the frame 132 is disposed on the substrate 110 to frame the electronic element 120 on the substrate 110. In one embodiment, the frame 132 includes an annular side wall 1324 and an annular top wall 1323, wherein the annular top wall 1323 is connected to the annular side wall 1324, and the top surface S1 of the annular top wall 1323 includes a groove 1321. In other words, the groove 1321 surrounds the top surface S1 of the frame 132. The conductive adhesive 136 is filled in the groove 1321. The cover 134 is assembled on the frame 132 and covers the groove 1321, and contacts the conductive adhesive 136, so that the cover 134 is fixed on the frame 132 by the conductive adhesive 136, and the electronic component 120 can be sealed in the shielding structure 130. Such a configuration can save the process of respectively setting the locking structure on the frame 132 and the cover 134, and can reduce the amount of plate materials used to make the frame 132 and the cover 134, thereby effectively reducing the production cost.

[0042] In some embodiments, Figure 1 As shown, the substrate 110 may further include a positioning hole 112, and the frame 132 may include a positioning portion 1322 that matches the positioning hole 112 structure and is used to engage with the positioning hole 112. The positioning portion 1322 may be disposed on the bottom surface S2 of the frame 132 (i.e., the surface of the annular side wall 1324 adjacent to the substrate 110). In this embodiment, the positioning portion 1322 may be a limiting column corresponding to the positioning hole 112, which is suitable for passing through the positioning hole 112 of the substrate 110 to limit the relative lateral displacement between the substrate 110 and the frame 132. In addition, in this embodiment, the electronic component 120 and the frame 132 can be fixed to the substrate 110 by surface mount technology (SMT). In other words, the electronic component 120 and the frame 132 can be fixed to the substrate 110 by solder. The structural cooperation between the positioning hole 112 of the substrate 110 and the positioning portion 1322 of the frame 132 is used for preliminary positioning before joining and auxiliary fixing after joining.

[0043] Figure 5 is a schematic side view of an electronic device according to an embodiment of the present disclosure. Figure 6 yes Figure 5 A partial cross-sectional diagram of an electronic device. Please also refer to Figures 5 and 6In some embodiments, the conductive adhesive material 136 includes solder or conductive adhesive. Furthermore, the solder may include materials used for welding such as solder paste, and the conductive adhesive may include conductive adhesive, conductive foam or the like. In the present embodiment, the conductive adhesive material 136 may be lead-free low-temperature solder paste, which is first applied and filled in the groove 1321, and a heating process may be performed after the cover 134 covers the top surface S1 of the frame 132 and the groove 1321, so as to heat the cover 134 to a temperature exceeding the melting point of the lead-free low-temperature solder paste and weld the cover 134 to the frame 132. In such a configuration, since the material of the solder paste includes metal, it also has an electromagnetic shielding effect.

[0044] Generally speaking, the melting point of common lead-free solder paste (96.6% Sn, 3% Ag, 0.5% Cu) is 217℃, while lead-free low-temperature solder paste usually refers to solder paste containing "bismuth" (Bi) metal. Among the tin-bismuth alloys, the melting point of Sn64Bi35Ag1 is about 178℃, and the melting point of Sn42Bi58 is even lower, about 138℃. In other words, the melting point of solder paste containing "bismuth" is about 39℃ to 79℃ lower than that of common lead-free solder paste (such as SAC305). The biggest advantage of low-temperature solder paste is energy saving, carbon reduction and cost saving. Because the melting point of lead-free low-temperature solder paste is low, the temperature of reflow can be reduced, thereby reducing the cost of high-temperature resistant soldering components and materials used on the circuit board. Because the reflow furnace temperature does not need to be too high for soldering, the power consumption of the equipment is reduced, achieving the purpose of saving power cost and energy saving and carbon reduction.

[0045] In this embodiment, the groove 1321 is as shown in FIG. Figure 1 and Figure 2 As shown, the entire periphery of the top surface S1 of the annular top wall 1323 is completely surrounded. With such a configuration, the solder filled in the groove 1321 surrounds the entire top surface S1 of the frame 132, thereby not only enabling the cover 134 to be firmly soldered to the frame 132, but also ensuring that the electronic component 120 is completely enclosed in the shielding structure 130, thereby achieving an excellent electromagnetic shielding effect. In addition, by using solder as the conductive adhesive 136, the cover 134 can be easily separated from the frame 132 by simply heating the molten solder again, thereby further improving the reworkability and reusability of the shielding structure 130. In the embodiment where the conductive adhesive 136 is a conductive adhesive, the conductive adhesive contains metal particles, thereby providing an electromagnetic shielding effect.

[0046] Please refer to Figure 1 and Figure 5In some embodiments, the shielding structure 130 further includes a connector 138, which is disposed on the annular side wall 1324 of the frame 132 and coupled to the electronic component 120 to couple the electronic component 120 to an external component (e.g., a cable, a printed circuit board, or other signal-carrying media, etc.). In one embodiment, the connector 138 may include a first end 1381 and a second end 1382 opposite to each other, wherein the first end 1381 may be, for example, attached to a cable of the electronic component 120, and the second end 1382 has an interface that can be coupled to an appropriate signal conductor (including a cable, a printed circuit board, or other signal-carrying media). In one embodiment, the cable may include a center conductor, an insulating layer covering the center conductor, an outer conductor layer covering the insulating layer, and an outer insulating layer covering the outermost periphery.

[0047] In summary, the shielding structure disclosed in the present invention is provided with a groove surrounding the periphery on the top surface of the frame, and a conductive adhesive is filled therein. The cover body is fixed to the frame body by the conductive adhesive, and the electronic components can be sealed in the shielding structure. With such a configuration, fixing the frame body and the cover body with a conductive adhesive can save the extra fixing structure on the frame body and the cover body, thereby reducing the amount of plate materials used to make the frame body and the cover body, and effectively reducing the production cost. In addition, since the material of the conductive adhesive includes metal, it also has an electromagnetic shielding effect. Therefore, the conductive adhesive filled in the groove surrounds the periphery of the top surface of the frame, which can not only firmly fix the cover body to the frame body, but also ensure that the electronic components are completely enclosed in the shielding structure, thereby achieving an excellent electromagnetic shielding effect. In addition, the conductive adhesive has the property of melting when heated, so the cover body and the frame body can be easily separated by only heating and melting the conductive adhesive again, thereby further improving the reworkability and reusability of the shielding structure.

Claims

1. A shielding structure, characterized in that: include: A frame body, suitable for surrounding an electronic component, the frame body comprises an annular side wall and an annular top wall, the annular top wall is connected to the annular side wall, and a top surface of the annular top wall comprises a groove; a cover body, assembled on the frame body and covering the groove; and A conductive adhesive material is filled in the groove to fix the cover to the frame.

2. The shielding structure according to claim 1, characterized in that: The conductive adhesive material includes solder or conductive glue.

3. The shielding structure according to claim 1, characterized in that: The material of the shielding structure includes metal.

4. The shielding structure according to claim 1, characterized in that: The shielding structure also includes a connector, which is arranged on the annular side wall of the frame and coupled to the electronic element.

5. The shielding structure according to claim 1, characterized in that: The groove completely surrounds the entire periphery of the top surface of the annular top wall.

6. An electronic device, characterized in that: include: a substrate; an electronic component disposed on the substrate; as well as A shielding structure includes a frame body arranged on the substrate, a cover body covering the frame body and a conductive adhesive material, wherein the frame body is suitable for framing the electronic component and includes an annular side wall and an annular top wall, the annular top wall is connected to the annular side wall, and a top surface of the annular top wall includes a groove, the cover body is assembled on the frame body and covers the groove, and the conductive adhesive material is filled in the groove to fix the cover body to the frame body and seal the electronic component in the shielding structure.

7. The electronic device according to claim 6, wherein: The shielding structure also includes a connector, which is arranged on the annular side wall of the frame and coupled to the electronic element.

8. The electronic device as claimed in claim 6, characterized in that: The groove completely surrounds the entire periphery of the top surface of the annular top wall.

9. The electronic device as claimed in claim 6, characterized in that: The base plate further comprises a positioning hole, and the frame body further comprises a positioning portion for engaging with the positioning hole.

10. The electronic device according to claim 6, wherein: The frame is fixed on the substrate through solder.

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