Plastic earphone shell mold

By using a combination of moving mold, temperature control assembly and feed assembly in the plastic earphone case mold, the materials are heated and cooled by using an air pump, heating wire and semiconductor refrigeration sheet, the long molding time of the plastic earphone case mold in the prior art is solved. The problem of this achieves a more efficient molding and mold demolding process.

CN222431508UActive Publication Date: 2025-02-07GUANGDONG YINGTAI HIGH PRECISION TECH CO LTD
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Patent Information

Application Number
CN202421005657.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-10
Publication Date
2025-02-07
Estimated Expiration
2034-05-10

AI Technical Summary

Technical Problem

The molding time of existing plastic earphone case is long, resulting in low production efficiency.

Method used

The plastic headphone case mold is used to heat and cool the material through components such as air pumps, heating wires and semiconductor refrigeration sheets to improve the fluidity and forming speed of the material.

Benefits of technology

Through heating and cooling treatment, the molding time of the plastic headphone case is significantly shortened, production efficiency is improved, and a rapid mold release operation is achieved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a plastic earphone shell mould, which relates to the technical field of moulds, and comprises a base, the top of the base is provided with a forming assembly, the forming assembly comprises a movable mould and a temperature control assembly, the temperature control assembly comprises a sealing tank, and the top of the movable mould is provided with an air pump close to the center. In the processing and manufacturing process of the plastic earphone shell, firstly, softened plastic is conveyed into the material storage barrel, the air pump is started, the first electromagnetic valve and the heating wire are opened, the movable mold is heated, then the negative pressure pump is started, materials are conveyed into the model groove of the movable mold, and after the model groove of the movable mold is filled with the materials, the movable mold is opened. And a second electromagnetic valve and a semiconductor chilling plate are opened to cool and shape the material in the movable mold, so that the shaping time of the plastic earphone shell is shortened, and the problem of slow molding time of the plastic earphone shell mold in the prior art is solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to a plastic earphone shell mold. Background Art

[0002] A plastic earphone shell is a shell used to protect earphones and is made of plastic material. During the processing and production of the plastic earphone shell, a mold is needed to press the earphone shell into shape. A plastic earphone shell mold is a mold equipment used to produce plastic earphone shells. It is made of metal material and is wear-resistant, corrosion-resistant and highly durable to adapt to high-intensity injection molding production processes.

[0003] However, in the prior art, in the process of using a mold to process and manufacture a plastic earphone shell, most of the earphone shell mold equipment simply transports the material into the mold, then extrudes and molds it, and then takes it out of the mold after the earphone shell is naturally cooled and shaped. Before the material is transported into the mold, the temperature in the mold is lower than the temperature of the material, so that the material entering the mold is cooled and shaped, which reduces the fluidity of the material and thereby reduces the molding speed of the plastic earphone. Therefore, in view of the above shortcomings, a plastic earphone shell mold is proposed. Utility Model Content

[0004] The utility model aims to solve the problem of slow molding time of plastic earphone shell mold in the prior art, and proposes a plastic earphone shell mold.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a plastic earphone shell mold, comprising: a base, a molding component is arranged on the top of the base, the molding component includes a movable mold, a temperature control component, the temperature control component includes a sealing tank, an air pump is arranged near the center of the top of the movable mold, the input end of the air pump is fixedly connected with a drainage tube, the output end of the air pump is fixedly connected with a connecting tube, one end of the connecting tube is fixedly connected with a heat pipe, a first solenoid valve is arranged on the outer surface of the heat pipe, two hollow tubes are fixedly embedded in the inner wall of the movable mold, a heating wire is arranged on the inner wall of one of the hollow tubes, the other end of the connecting tube is fixedly connected with a cold pipe, a second solenoid valve is arranged on the outer surface of the cold pipe, and a semiconductor refrigeration plate is arranged near the top of the inner wall of the other hollow tube.

[0006] Preferably, the outer surface of the sealed tank is fixedly connected to a recovery pipe, and a third solenoid valve is arranged on the outer surface of the recovery pipe. One end of the drainage pipe passes through the interior of the sealed tank, one end of the heat pipe passes through the interior of one of the hollow tubes, and one end of the cold pipe passes through the interior of the other hollow tube. The bottom of the sealed tank is fixedly connected to the top of the movable mold by screws.

[0007] Preferably, a support frame is fixed to the top of the base near one side edge, a feed assembly is arranged inside the support frame, the feed assembly includes a storage barrel, the outer surface of the storage barrel is fixedly connected to the interior of the support frame, the top of the storage barrel is fixedly connected to a feed pipe, and a fourth solenoid valve is arranged on the outer surface of the feed pipe.

[0008] Preferably, a mounting bracket is fixedly mounted on the outer surface of one side of the material storage barrel, a negative pressure pump is arranged on the inner wall of the mounting bracket, valves are arranged on the outer surfaces of the suction pipe and the outlet pipe of the negative pressure pump, and one end of the suction pipe and the outlet pipe of the negative pressure pump penetrates into the interior of the material storage barrel.

[0009] Preferably, a piston is slidably connected inside the storage barrel, a discharge pipe is fixedly connected to the outer surface of the other side of the storage barrel, a fifth solenoid valve is arranged on the outer surface of the discharge pipe, and a sealing plate is fixedly sleeved on the outer surface of the discharge pipe.

[0010] Preferably, a slide groove is provided on the top of the base, a moving block is fixed on the bottom of the movable mold, a connecting block is fixed on an inner wall of one side of the slide groove, a multi-stage electric telescopic rod is provided on the outer surface of the connecting block, one end of the multi-stage electric telescopic rod is fixedly connected to the outer surface of the moving block, and the outer surface of the moving block is slidably connected to the inner wall of the slide groove.

[0011] Preferably, a connecting rod is fixedly installed between the opposite inner walls of the movable mold, an electric push rod is arranged on the outer surface of the connecting rod, a movable plate is fixed on one end of the electric push rod, and a groove is opened on the outer surface of the movable mold.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, during the processing and manufacturing of the plastic earphone shell, the softened plastic is first transported to the storage barrel, the air pump is started, the first solenoid valve and the heating wire are opened to heat the movable mold, and then the negative pressure pump is started to transport the material to the model groove of the movable mold. When the material in the model groove of the movable mold is full, the second solenoid valve and the semiconductor refrigeration sheet are opened to cool and shape the material in the movable mold, thereby shortening the shaping time of the plastic earphone shell, and solving the problem of slow molding time of the plastic earphone shell mold in the prior art.

[0014] 2. In the utility model, after the material is molded, the multi-stage electric telescopic rod is started to separate the movable mold and the sealing plate, and then the electric push rod is started to move the molded plastic earphone shell out of the inside of the movable mold. The staff can then move the earphone shell out from the outer surface of the movable plate, thereby realizing the demolding of the plastic earphone and further accelerating the demolding speed of the plastic earphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A front perspective view of a plastic earphone shell mold is provided for the utility model;

[0016] Figure 2 The utility model provides a partial cutaway perspective view of a material storage barrel of a plastic earphone shell mold;

[0017] Figure 3 The utility model provides a sectional stereoscopic diagram of the movable mold part of a plastic earphone shell mold;

[0018] Figure 4 The utility model provides a sectional stereoscopic view of a hollow tube portion of a plastic earphone shell mold.

[0019] Legend: 1. Base; 2. Support frame; 3. Feeding assembly; 301. Storage barrel; 302. Feeding pipe; 303. Fourth solenoid valve; 304. Mounting frame; 305. Negative pressure pump; 306. Valve; 307. Piston; 308. Discharging pipe; 309. Fifth solenoid valve; 310. Sealing plate; 4. Slide; 5. Forming assembly; 501. Connecting block; 502. Multi-stage electric telescopic rod; 503. Moving block; 504. Moving mold; 505, connecting rod; 506, electric push rod; 507, moving plate; 508, groove; 6, temperature control component; 601, sealing tank; 602, air pump; 603, connecting pipe; 604, heat pipe; 605, first solenoid valve; 606, heating wire; 607, cold pipe; 608, second solenoid valve; 609, hollow tube; 610, semiconductor refrigeration plate; 611, recovery pipe; 612, third solenoid valve; 613, drainage pipe. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] Embodiment 1, as Figure 1-Figure 4As shown, the utility model provides a plastic earphone shell mold, including: a base 1, a molding component 5 is arranged on the top of the base 1, the molding component 5 includes a movable mold 504, a temperature control component 6, the temperature control component 6 includes a sealing tank 601, an air pump 602 is arranged near the center of the top of the movable mold 504, the input end of the air pump 602 is fixedly connected with a drainage tube 613, the output end of the air pump 602 is fixedly connected with a connecting pipe 603, one end of the connecting pipe 603 is fixedly connected with a heat pipe 604, a first solenoid valve 605 is arranged on the outer surface of the heat pipe 604, two hollow tubes 609 are fixedly embedded in the inner wall of the movable mold 504, a heating wire 606 is arranged on the inner wall of one of the hollow tubes 609, the other end of the connecting tube 603 is fixedly connected with a cold pipe 607, a second solenoid valve 608 is arranged on the outer surface of the cold pipe 607, and a semiconductor cooling plate 610 is arranged near the top of the inner wall of the other hollow tube 609.

[0023] The effect achieved by the entire embodiment 1 is that the Bluetooth headset has become a popular device. The material of the headset shell is mostly plastic. In the process of processing and manufacturing the plastic headset shell, the softened plastic is first transported to the inside of the storage barrel 301 through the feed pipe 302, and then the fourth solenoid valve 303 is closed, and the outer surface of the movable mold 504 is moved to fit tightly with the outer surface of the sealing plate 310, and the air pump 602 is started to drive the drainage pipe 613 to extract the inert gas argon into the interior of the sealing tank 601. , then open the first solenoid valve 605, so that the gas is transported to the inside of one of the hollow tubes 609 through the heat pipe 604, and then the heating wire 606 is electrically connected to the external power supply to heat the gas in the hollow tube 609, thereby heating the gas entering the groove 508, thereby heating the inside of the movable mold 504, and then start the negative pressure pump 305, open the valve 306 on the surface of the air inlet pipe, and transport gas to the inside of the storage barrel 301, and drive the piston 307 to move forward under the pressure of the air pressure, so that the material The material is transported to the model groove of the movable mold 504 through the discharge pipe 308. By heating the inner wall of the movable mold 504, the fluidity of the material entering the movable mold 504 is improved, and the production efficiency of the earphone shell is improved. When the material in the model groove of the movable mold 504 is full, the fifth solenoid valve 309 is closed, the first solenoid valve 605 is closed, and the second solenoid valve 608 is opened. At the same time, the semiconductor refrigeration plate 610 is electrically connected to the external power supply, wherein the cold surface of the semiconductor refrigeration plate 610 faces the inside of the hollow tube 609, wherein the semiconductor refrigeration plate 610 is a device that uses the thermoelectric effect of semiconductor materials to achieve refrigeration. The gas enters the inside of another hollow tube 609 through the cold tube 607, and is finally transported to the inside of the groove 508 through the hollow tube 609, so as to cool and shape the material in the movable mold 504, thereby shortening the shaping time of the plastic earphone shell. Through the function of the molding component 5, the problem that most plastic earphone shell molds in the prior art do not have the function of reasonably heating and cooling the material to reduce the molding time of the earphone shell is solved.

[0024] Embodiment 2, as Figure 1-Figure 4 As shown, the outer surface of the sealed tank 601 is fixedly connected with a recovery pipe 611, and the outer surface of the recovery pipe 611 is provided with a third solenoid valve 612. One end of the drainage pipe 613 penetrates into the interior of the sealed tank 601, one end of the heat pipe 604 penetrates into the interior of one of the hollow tubes 609, and one end of the cold pipe 607 penetrates into the interior of the other hollow tube 609. The bottom of the sealed tank 601 is fixedly connected to the top of the movable mold 504 by screws, and a support is fixed near the edge of one side of the top of the base 1. The support frame 2 is provided with a feed assembly 3 inside the support frame 2, the feed assembly 3 includes a storage barrel 301, the outer surface of the storage barrel 301 is fixedly connected to the inside of the support frame 2, the top of the storage barrel 301 is fixedly connected with a feed pipe 302, the outer surface of the feed pipe 302 is provided with a fourth solenoid valve 303, a mounting frame 304 is fixedly installed on the outer surface of one side of the storage barrel 301, a negative pressure pump 305 is provided on the inner wall of the mounting frame 304, and valves are provided on the outer surfaces of the suction pipe and the outlet pipe of the negative pressure pump 305 306, one end of the suction pipe and the outlet pipe of the negative pressure pump 305 are both penetrated into the interior of the storage barrel 301, the interior of the storage barrel 301 is slidably connected with a piston 307, the outer surface of the other side of the storage barrel 301 is fixedly connected with a discharge pipe 308, the outer surface of the discharge pipe 308 is provided with a fifth solenoid valve 309, the outer surface of the discharge pipe 308 is fixedly sleeved with a sealing plate 310, the top of the base 1 is provided with a slide groove 4, the bottom of the movable mold 504 is fixed with a moving block 503, and the inner wall of one side of the slide groove 4 A connecting block 501 is fixed, and a multi-stage electric telescopic rod 502 is arranged on the outer surface of the connecting block 501. One end of the multi-stage electric telescopic rod 502 is fixedly connected to the outer surface of the moving block 503. The outer surface of the moving block 503 is slidably connected to the inner wall of the slide groove 4. A connecting rod 505 is fixedly installed between the relative inner walls of the movable mold 504. An electric push rod 506 is arranged on the outer surface of the connecting rod 505. A moving plate 507 is fixed to one end of the electric push rod 506. A groove 508 is opened on the outer surface of the movable mold 504.

[0025] The effect achieved by the entire embodiment 2 is that when the material is formed, the multi-stage electric telescopic rod 502 is started to shorten it, driving the moving block 503 to move in the direction of the connecting block 501, wherein the stability of the movement of the moving block 503 is ensured by the limiting effect between the slide groove 4 and the moving block 503, thereby separating the movable mold 504 from the sealing plate 310, and at the same time starting the electric push rod 506 to extend it, driving the moving plate 507 to move to the outside of the movable mold 504, thereby moving the molded plastic earphone shell out from the inside of the movable mold 504, and the staff can move the earphone shell out from the outer surface of the moving plate 507, thereby realizing the demolding of the plastic earphone, and through the action of the molding component 5, the demolding speed of the plastic earphone is further accelerated.

[0026] Working principle: Bluetooth headsets have become a popular device. The material of the headset shell is mostly plastic. In the process of processing and manufacturing the plastic headset shell, the softened plastic is first transported to the inside of the storage barrel 301 through the feed pipe 302, and then the fourth solenoid valve 303 is closed, and the outer surface of the movable mold 504 is moved to fit tightly with the outer surface of the sealing plate 310, and the air pump 602 is started to drive the drainage pipe 613 to extract the inert gas argon into the inside of the sealing tank 601, and then the first solenoid valve 605 is opened, so that the gas is transported to one of the heat pipes 604. The inside of the hollow tube 609 is then electrically connected to the heating wire 606 with an external power supply to heat the gas in the hollow tube 609, thereby heating the inside of the movable mold 504, and then starting the negative pressure pump 305, opening the valve 306 on the surface of the air inlet pipe, and delivering gas to the inside of the storage barrel 301. Under the pressure of the air pressure, the piston 307 is driven to move forward, so that the material is delivered to the model groove of the movable mold 504 through the discharge pipe 308. By heating the inner wall of the movable mold 504, when the material in the model groove of the movable mold 504 is full, the fifth solenoid valve 309 is closed, and the first solenoid valve is closed. Valve 605 opens the second solenoid valve 608 and electrically connects the semiconductor cooling sheet 610 to the external power supply, wherein the cold surface of the semiconductor cooling sheet 610 faces the inside of the hollow tube 609, wherein the semiconductor cooling sheet 610 is a device that uses the thermoelectric effect of semiconductor materials to achieve refrigeration. The gas enters the inside of another hollow tube 609 through the cold tube 607, and is finally transported to the inside of the groove 508 through the hollow tube 609, cooling and shaping the material in the moving mold 504, thereby shortening the shaping time of the plastic earphone shell. When the material is formed, start The multi-stage electric telescopic rod 502 is shortened to drive the moving block 503 to move in the direction of the connecting block 501, wherein the stability of the movement of the moving block 503 is ensured by the limiting effect between the slide groove 4 and the moving block 503, thereby separating the movable mold 504 from the sealing plate 310, and at the same time starting the electric push rod 506 to extend it, driving the moving plate 507 to move to the outside of the movable mold 504, thereby moving the molded plastic earphone shell out from the inside of the movable mold 504, and the staff can move the earphone shell out from the outer surface of the moving plate 507, thereby realizing the demolding of the plastic earphone.

[0027] The wiring diagrams of the fourth solenoid valve 303, the negative pressure pump 305, the fifth solenoid valve 309, the multi-stage electric telescopic rod 502, the electric push rod 506, the air pump 602, the first solenoid valve 605, the heating wire 606, the second solenoid valve 608, the semiconductor cooling plate 610 and the third solenoid valve 612 in the utility model are common knowledge in the field, and their working principles are already known technologies. The models are selected according to actual use. Therefore, the control method and wiring arrangement of the fourth solenoid valve 303, the negative pressure pump 305, the fifth solenoid valve 309, the multi-stage electric telescopic rod 502, the electric push rod 506, the air pump 602, the first solenoid valve 605, the heating wire 606, the second solenoid valve 608, the semiconductor cooling plate 610 and the third solenoid valve 612 are no longer explained in detail.

[0028] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A plastic earphone shell mold, characterized in that: include: A base (1), a molding component (5) being arranged on the top of the base (1), the molding component (5) comprising a movable mold (504); A temperature control component (6), the temperature control component (6) comprising a sealing tank (601), an air pump (602) being arranged near the center of the top of the movable mold (504), an input end of the air pump (602) being fixedly connected to a drainage tube (613), an output end of the air pump (602) being fixedly connected to a connecting tube (603), one end of the connecting tube (603) being fixedly connected to a heat pipe (604), a first solenoid valve (605) being arranged on the outer surface of the heat pipe (604), two hollow tubes (609) being fixedly embedded on the inner wall of the movable mold (504), a heating wire (606) being arranged on the inner wall of one of the hollow tubes (609), the other end of the connecting tube (603) being fixedly connected to a cooling tube (607), a second solenoid valve (608) being arranged on the outer surface of the cooling tube (607), and a semiconductor cooling plate (610) being arranged near the top of the inner wall of the other hollow tube (609).

2. The plastic earphone shell mold according to claim 1, characterized in that: The outer surface of the sealed tank (601) is fixedly connected to a recovery pipe (611), and a third solenoid valve (612) is arranged on the outer surface of the recovery pipe (611). One end of the drainage pipe (613) penetrates into the interior of the sealed tank (601), one end of the heat pipe (604) penetrates into the interior of one of the hollow tubes (609), and one end of the cold pipe (607) penetrates into the interior of the other hollow tube (609). The bottom of the sealed tank (601) is fixedly connected to the top of the movable mold (504) by screws.

3. The plastic earphone shell mold according to claim 1, characterized in that: A support frame (2) is fixed to the top of the base (1) near one side edge, a feed assembly (3) is arranged inside the support frame (2), and the feed assembly (3) comprises a storage barrel (301), the outer surface of the storage barrel (301) is fixedly connected to the inside of the support frame (2), the top of the storage barrel (301) is fixedly connected to a feed pipe (302), and a fourth solenoid valve (303) is arranged on the outer surface of the feed pipe (302).

4. The plastic earphone shell mold according to claim 3, characterized in that: A mounting frame (304) is fixedly mounted on the outer surface of one side of the material storage barrel (301), a negative pressure pump (305) is arranged on the inner wall of the mounting frame (304), valves (306) are arranged on the outer surfaces of the air intake pipe and the air outlet pipe of the negative pressure pump (305), and one end of the air intake pipe and the air outlet pipe of the negative pressure pump (305) penetrates into the interior of the material storage barrel (301).

5. The plastic earphone shell mold according to claim 3, characterized in that: The interior of the material storage barrel (301) is slidably connected to a piston (307), the outer surface of the other side of the material storage barrel (301) is fixedly connected to a discharge pipe (308), a fifth solenoid valve (309) is provided on the outer surface of the discharge pipe (308), and a sealing plate (310) is fixedly sleeved on the outer surface of the discharge pipe (308).

6. The plastic earphone shell mold according to claim 1, characterized in that: A slide groove (4) is provided on the top of the base (1); a moving block (503) is fixed on the bottom of the movable mold (504); a connecting block (501) is fixed on the inner wall of one side of the slide groove (4); a multi-stage electric telescopic rod (502) is provided on the outer surface of the connecting block (501); one end of the multi-stage electric telescopic rod (502) is fixedly connected to the outer surface of the moving block (503); and the outer surface of the moving block (503) is slidably connected to the inner wall of the slide groove (4).

7. The plastic earphone shell mold according to claim 6, characterized in that: A connecting rod (505) is fixedly installed between the opposite inner walls of the movable mold (504), an electric push rod (506) is arranged on the outer surface of the connecting rod (505), a moving plate (507) is fixed at one end of the electric push rod (506), and a groove (508) is provided on the outer surface of the movable mold (504).