Chip suction head adsorption structure

Abstract

The utility model discloses an adsorption structure of a chip suction head. The adsorption structure comprises a shell; the suction assembly is arranged in the shell and comprises a pressing rod, one end of the pressing rod is arranged outside the shell, and the other end of the pressing rod is arranged in the shell; one end of the air suction cylinder is connected with the pressing rod; the compression spring is arranged in the air extracting pump and is used for resetting the air extracting pump after being pressed; the exhaust pipe is connected to the end, away from the pressing rod, of the exhaust pump; the suction head assembly is fixedly connected with the suction assembly and comprises a connecting rod which is fixedly connected with the end, away from the pressing rod, of the shell; and the suction head is fixedly arranged on the connecting rod. By arranging the suction assembly and the suction head assembly, when a user needs to transfer a single chip, air in the suction assembly can be emptied through pressing, the suction assembly is tightly attached to the chip, a suction pump is reset through a compression spring, certain adsorption force is given to the suction head assembly, and therefore the chip is adsorbed and transferred.

Description

Technical Field

[0001] The utility model relates to the technical field of chip adsorption, in particular to a chip suction head adsorption structure. Background Art

[0002] After the chip production is completed, it is usually placed in a tray. After the production is completed, the chips also need to be sampled. In the prior art, the chips are usually taken manually and placed in a detection mechanism. This method of taking the chips is inconvenient and can easily cause chip damage or inaccurate detection results. Accordingly, the utility model provides a chip tray pen to solve the above technical problems. Utility Model Content

[0003] Purpose of the utility model: To solve the problem in the prior art that the chip is usually taken manually and then placed in the detection mechanism. This method of taking the chip is inconvenient and can easily cause chip damage or inaccurate detection results.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A chip suction head adsorption structure, comprising:

[0006] case;

[0007] A suction assembly, the suction assembly is arranged inside the shell, and the suction assembly includes: a pressing rod, one end of the pressing rod is arranged outside the shell, and the other end is arranged inside the shell; a vacuum pump, one end of which is connected to the pressing rod; a compression spring, the compression spring is arranged inside the vacuum pump, and is used to reset the vacuum pump after being pressed; a vacuum pipe, the vacuum pipe is connected to one end of the vacuum pump away from the pressing rod;

[0008] A suction head assembly, which is fixedly connected to the suction assembly, and the suction head assembly includes: a connecting rod, which is hollow inside and fixedly connected to one end of the shell away from the pressing rod; a suction head, which is fixedly installed on the connecting rod, and is provided with an exhaust hole, and the suction head is fixedly set to the exhaust pipe.

[0009] Furthermore, limit blocks are provided at both ends of the pressing rod, which are used to move and limit the pressing rod on the shell.

[0010] Furthermore, a sealing silicone ring is adhered to the inner surface of the suction head.

[0011] Furthermore, the air pump is made of a resilient soft plastic material.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] By setting up a suction component and a suction head component, when the user needs to transfer a single chip, the air inside the suction component can be exhausted by pressing, the suction head component can be tightly fitted on the chip, and the suction pump can be reset by compressing the spring to give the suction head component a certain adsorption force, so as to adsorb the chip for transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model.

[0015] In the figure: 1, shell; 201, pressing rod; 2011, limiting block; 202, vacuum cylinder; 203, compression spring; 204, vacuum pipe; 301, connecting rod; 302, suction head; 3021, silicone ring. DETAILED DESCRIPTION

[0016] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0017] The applicant believes that in the prior art, the chip is usually taken manually and then placed in the detection mechanism. This method of taking the chip is inconvenient and can easily cause chip damage or inaccurate detection results.

[0018] To this end, the applicant designed Figure 1 The chip suction head adsorption structure of the present embodiment shown includes:

[0019] Shell 1; suction assembly, the suction assembly is arranged inside the shell 1, and the suction assembly includes: a pressing rod 201, one end of the pressing rod 201 is arranged outside the shell 1, and the other end is arranged inside the shell 1; a vacuum cylinder 202, one end of the vacuum cylinder 202 is connected to the pressing rod 201; a compression spring 203, the compression spring 203 is arranged inside the vacuum pump, and is used to reset the vacuum pump after pressing; a vacuum pipe 204, the vacuum pipe 204 is connected to one end of the vacuum pump away from the pressing rod 201;

[0020] The suction head assembly is fixedly connected to the suction assembly, and the suction head assembly includes: a connecting rod 301, the connecting rod 301 is hollow inside and is fixedly connected to the end of the shell 1 away from the pressing rod 201; the suction head 302, the suction head 302 is fixedly installed on the connecting rod 301, the suction head 302 is provided with an exhaust hole, and the suction head 302 is fixedly set with the exhaust pipe 204.

[0021] In the chip suction head adsorption structure of this embodiment, limit blocks 2011 are provided at both ends of the pressing rod 201 for moving and limiting the pressing rod 201 on the housing 1.

[0022] In the chip suction head adsorption structure of this embodiment, a sealing silicone ring 3021 is adhered to the inner surface of the suction head 302 .

[0023] In the chip suction head adsorption structure of this embodiment, the air pump is made of a resilient soft plastic material.

[0024] Working principle: The user first presses the pressing rod 201 to squeeze the air inside the vacuum cylinder 202 into a vacuum state, and then releases the pressing rod 201 after the suction head 302 is tightly attached to the chip to be adsorbed. Since a compression spring 203 is provided inside the vacuum cylinder 202, the compression spring 203 will reset after the pressing rod 201 is released. However, since the chip blocks the vacuum hole of the suction head 302, the spring has a tendency to reset but cannot reset. In this process, the atmospheric pressure will press the chip tightly against the suction head 302, thereby completing the adsorption of the chip.

[0025] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A chip suction head adsorption structure, characterized in that: include: Housing (1); A suction assembly, the suction assembly being arranged inside the shell (1), the suction assembly comprising: a pressing rod (201), one end of the pressing rod (201) being arranged outside the shell (1), and the other end being arranged inside the shell (1); an air pump (202), one end of the air pump (202) being connected to the pressing rod (201); a compression spring (203), the compression spring (203) being arranged inside the air pump and being used to reset the air pump after being pressed; and an air suction pipe (204), the air suction pipe (204) being connected to one end of the air pump away from the pressing rod (201); A suction head assembly, the suction head assembly is fixedly connected to the suction assembly, and the suction head assembly comprises: a connecting rod (301), the connecting rod (301) is hollow inside and is fixedly connected to an end of the shell (1) away from the pressing rod (201); a suction head (302), the suction head (302) is fixedly mounted on the connecting rod (301), an air extraction hole is provided on the suction head (302), and the suction head (302) is fixedly arranged with the air extraction pipe (204).

2. The chip suction head adsorption structure according to claim 1, characterized in that: Limiting blocks (2011) are provided at both ends of the pressing rod (201) for movably and limiting the pressing rod (201) to be set on the housing (1).

3. The chip suction head adsorption structure according to claim 1, characterized in that: A sealing silicone ring (3021) is adhered to the inner surface of the suction head (302).

4. The chip suction head adsorption structure according to claim 1, characterized in that: The air pump is made of a resilient soft plastic material.

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