Computer and aircraft

Abstract

The embodiment of the utility model relates to the technical field of electronic equipment, and discloses a computer and an aircraft, the computer is applied to the aircraft, and an installation opening is formed in a fuselage of the aircraft; the computer comprises a case, a circuit board and a radiator, wherein the circuit board and the radiator are arranged in the case; one face of the case is a heat dissipation face, heat dissipation fins are arranged in the middle of the outer wall of the heat dissipation face, and the heat dissipation device abuts against the portion between the circuit board and the inner wall of the heat dissipation face and is used for conducting heat of the circuit board to the heat dissipation fins of the heat dissipation face; a mounting part is arranged on the edge of the outer wall of the heat dissipation surface and is fixedly connected with the position, located on the edge of the mounting opening, of the machine body, so that the heat dissipation fins extend out of the machine body from the mounting opening. By means of the mode, it can be guaranteed that the computer meets the airborne working environment requirement, and meanwhile the heat dissipation performance of the computer is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and specifically to a computer and an aircraft. Background Art

[0002] Computers have become an indispensable electronic device in people's daily work and life. At the same time, computers are also needed in the fields of industry, aerospace, etc. to realize corresponding control functions. For example, in the field of aircraft such as drones, onboard computers are needed to realize the communication and control of the aircraft.

[0003] Since airborne computers often work in working environments such as strong winds, rain showers, vibrations and bumps, airborne computers generally use fanless reinforced computers that dissipate heat through the casing. However, the casing heat dissipation method will reduce the heat dissipation efficiency and affect the computer's working performance. Utility Model Content

[0004] In view of the above problems, the embodiments of the present application provide a computer and an aircraft, which can ensure that the computer meets the requirements of the onboard working environment while improving its heat dissipation performance.

[0005] According to one aspect of an embodiment of the present application, a computer is provided for use in an aircraft, wherein a mounting opening is provided on the fuselage of the aircraft; the computer comprises a chassis, a circuit board and a radiator, wherein the circuit board and the radiator are both arranged in the chassis; one side of the chassis is a heat dissipation surface, and heat dissipation fins are arranged in the middle of an outer wall of the heat dissipation surface, and the radiator abuts between the circuit board and the inner wall of the heat dissipation surface, and is used to conduct heat from the circuit board to the heat dissipation fins of the heat dissipation surface; an installation portion is provided on the edge of the outer wall of the heat dissipation surface, and the installation portion is used to be fixedly connected to a position on the fuselage located at the edge of the installation opening, so that the heat dissipation fins extend from the installation opening to the outside of the fuselage.

[0006] In an optional manner, an air flow channel is formed on the heat dissipation fin, and the extension direction of the air flow channel is configured to be parallel to the forward direction of the aircraft.

[0007] In an optional manner, the edge of the heat dissipation surface is used to be sealed with the inner wall of the body located at the edge of the installation opening by sandwiching a buffer pad.

[0008] In an optional manner, the circuit board includes a main board, the main board and the heat sink are adapted in area, the heat sink is fixedly connected to the main board, and a thermal pad is sandwiched between the heat sink and the heating element on the main board.

[0009] In an optional manner, the heating element includes a memory, a memory connector is provided on the mainboard, the memory is plugged into the memory connector in a state parallel to the mainboard, and a support pad is filled between the memory and the mainboard.

[0010] In an optional manner, a side of the chassis opposite to the heat dissipation surface is a mounting surface, and the circuit board also includes a substrate, which is fixed to the inner wall of the mounting surface; a mainboard mounting area is provided on the side of the substrate facing away from the mounting surface, the mainboard is fixedly connected to the mainboard mounting area, and a side of the mainboard facing away from the radiator faces the mainboard mounting area, and the mainboard is signal-connected to the substrate.

[0011] In an optional manner, a first signal connector is disposed in the mainboard mounting area, and a second signal connector is disposed on a side of the mainboard facing away from the heat sink, and the second signal connector is plugged into the first signal connector to form a signal connection.

[0012] In an optional manner, interfaces are mounted on opposite ends of the substrate, and openings are correspondingly provided on opposite end surfaces of the chassis, and the interfaces at both ends of the substrate are respectively exposed from the openings on the two end surfaces of the chassis.

[0013] In an optional embodiment, the chassis includes a box body and a top cover, a first opening is provided on the top of the box body, a portion of the box body located at the edge of the first opening extends inward to form an overlap, the top cover covers the first opening and is fixedly connected to the overlap, and the top cover forms a heat dissipation surface; a second opening is provided at one end of the box body, and the chassis also includes an end plate, which covers the second opening and is respectively fixedly connected to the box body and the top cover.

[0014] According to another aspect of an embodiment of the present application, there is provided an aircraft, comprising a fuselage and a computer as described in any one of the above items, wherein a mounting opening is provided on the fuselage, a main body of the computer is fixed inside the fuselage, and heat dissipation fins on the computer extend from the mounting opening to outside the fuselage.

[0015] The computer provided in the embodiment of the present application is a reinforced computer that dissipates heat through the heat dissipation surface of the chassis, ensuring that it can adapt to the harsh environment of the airborne scenario. The computer is fixed inside the fuselage of the aircraft to ensure its stability. At the same time, the relative movement between the aircraft and the surrounding air during flight is utilized to extend the heat dissipation fins on the heat dissipation surface directly to the outside of the fuselage through the mounting port on the fuselage. In this way, the heat of the heat dissipation fins can be quickly dissipated to the outside during the flight of the aircraft, thereby improving the heat dissipation efficiency of the computer and meeting the high power consumption requirements.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A three-dimensional structural diagram of a computer provided in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the three-dimensional structure of a computer provided by an embodiment of the utility model in an airborne application scenario;

[0020] Figure 3 A schematic diagram of the cross-sectional structure of a computer provided by an embodiment of the utility model in an airborne application scenario;

[0021] Figure 4 A schematic diagram of the internal structure of a computer provided by an embodiment of the utility model;

[0022] Figure 5 A structural schematic diagram of a mainboard and a heat sink in a computer provided by an embodiment of the utility model from one perspective;

[0023] Figure 6 A structural schematic diagram of a mainboard and a heat sink in a computer provided by an embodiment of the utility model from another perspective;

[0024] Figure 7 A schematic cross-sectional structure diagram of a mainboard and a heat sink in a computer provided by an embodiment of the utility model;

[0025] Figure 8 A schematic diagram of the explosion structure inside a computer provided by an embodiment of the utility model;

[0026] Fig. 9 A schematic diagram of the three-dimensional structure of a substrate, a mainboard and a heat sink in a computer provided by an embodiment of the utility model;

[0027] Fig.10 A schematic diagram of the structure of a substrate, a mainboard and a heat sink in a computer provided by an embodiment of the utility model from a top view;

[0028] Fig.11 A schematic cross-sectional structure diagram of a substrate, a mainboard and a heat sink in a computer provided by an embodiment of the utility model;

[0029] Fig.12 A schematic diagram of the internal structure of a computer mid-end board after explosion provided by an embodiment of the utility model.

[0030] The reference numerals in the specific implementation manner are as follows:

[0031] 100, computer; 110, chassis; 111, heat dissipation surface; 112, heat dissipation fins; 1121, air flow channel; 113, mounting portion; 114, mounting surface; 1141, second stud; 115, opening; 116, box body; 1161, first opening; 1162, overlap; 1163, second opening; 117, top cover; 118, end plate; 1181, connecting edge;

[0032] 120, circuit board; 121, motherboard; 1211, CPU; 1212, memory; 1213, memory connector; 1214, support pad; 1215, fourth threaded fastener; 1216, second signal connector; 122, substrate; 1221, motherboard mounting area; 1222, first stud; 1223, fifth threaded fastener; 1224, first signal connector; 1225, interface;

[0033] 130, heat sink; 131, thermal pad; 132, second threaded fastener; 133, third threaded fastener;

[0034] 141. First module; 142. Second module;

[0035] 200, aircraft; 210, fuselage; 211, mounting port; 220, first threaded fastener; 230, buffer pad. DETAILED DESCRIPTION

[0036] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0038] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0039] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0041] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0042] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0043] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0044] Airborne computers are generally fixedly installed in an installation compartment inside the aircraft fuselage. The heat of the heating elements inside the computer is first conducted to its outer wall through the heat-conducting components, and then dissipated into the air in the installation compartment for heat dissipation. This heat dissipation method makes the heat dissipation efficiency of the airborne computer low and cannot meet the heat dissipation requirements of high power consumption.

[0045] Based on this, an embodiment of the present application proposes a computer applied to an aircraft, which combines the characteristics of rapid flow of surrounding air when the aircraft is flying into the heat dissipation of the computer. Specifically, the edge of the computer's heat dissipation surface is fixed to the inner wall of the aircraft fuselage, and the heat dissipation fins in the middle area of ​​the heat dissipation surface are extended from the mounting port of the aircraft fuselage to the outside. After the radiator inside the computer transfers the heat from the circuit board to the heat dissipation fins, the cold air flowing around the aircraft can quickly take away the heat from the heat dissipation fins, thereby greatly improving the heat dissipation efficiency of the computer.

[0046] Please refer to Figures 1 to 4 , Figure 1 The three-dimensional structure of the computer is shown in FIG. Figure 2 The three-dimensional structure of the computer installed on the aircraft is shown in FIG. Figure 3 The cross-sectional structure of a computer installed on an aircraft is shown in FIG. Figure 4 The internal structure of the computer is shown in Figure 2 As shown, the computer 100 is applied to an aircraft 200, and a mounting opening 211 is provided on a fuselage 210 of the aircraft 200. Figure 1 and Figure 4 As shown, the computer 100 includes a case 110, a circuit board 120 and a heat sink 130, and the circuit board 120 and the heat sink 130 are both arranged in the case 110. One side of the case 110 is a heat sink 111, and a heat sink 112 is arranged in the middle of the outer wall of the heat sink 111. The heat sink 130 is abutted between the circuit board 120 and the inner wall of the heat sink 111, and is used to conduct the heat of the circuit board 120 to the heat sink 112 of the heat sink 111. Figures 1 to 3 As shown, a mounting portion 113 is provided on the outer wall edge of the heat dissipation surface 111 , and the mounting portion 113 is used to be fixedly connected to a position on the edge of the mounting opening 211 of the fuselage 210 so that the heat dissipation fins 112 extend from the mounting opening 211 to the outside of the fuselage 210 .

[0047] It should be noted that Figure 2 and Figure 3 The area where the letter A is located is the interior of the fuselage 210 , and the area where the letter B is located is the exterior of the fuselage 210 .

[0048] The heat sink 130 can be made of a metal material with good thermal conductivity, such as copper, aluminum, copper alloy or aluminum alloy. Considering the high requirements for lightweight in the aircraft field, the heat sink 130 preferably uses an aluminum alloy with a lower density to ensure its heat dissipation performance while reducing the overall weight of the computer 100.

[0049] Similarly, the heat dissipation surface 111 of the chassis 110 and the heat dissipation fins 112 thereon can be made of the same material with good thermal conductivity as the radiator 130, and the heat dissipation surface 111 and the heat dissipation fins 112 are preferably configured as an integrated structure to improve the heat transfer efficiency from the heat dissipation surface 111 to the heat dissipation fins 112.

[0050] exist Figure 1 In the specific embodiment shown, the mounting portion 113 is a plurality of threaded holes provided around the edge of the heat dissipation surface 111. Accordingly, the fuselage 210 may have a plurality of through holes provided around the edge of the mounting opening 211. When the computer 100 is assembled on the aircraft 200, the heat dissipation fins 112 are extended from the inside of the fuselage 210 through the mounting opening 211 to the outside of the fuselage 210. The plurality of through holes are aligned with the plurality of threaded holes one by one, and then the plurality of through holes are aligned with the plurality of threaded holes one by one. Figure 2 ) passes through the through hole and is connected with the threaded hole to fix the computer 100 on the body 210.

[0051] In addition to the fixing method provided above, the mounting portion 113 may also be a snap buckle and be fixed to the fuselage 210 by snapping, or the mounting portion 113 may also be a welding portion and be fixed to the fuselage 210 by welding. Of course, other existing connection structures may also be used to achieve the assembly and fixation of the mounting portion 113 and the fuselage 210.

[0052] The installation opening 211 may be provided on the side wall, bottom or top of the body 210 , and may be specifically designed according to the structural features of the body 210 and the arrangement of its internal components, which is not limited here.

[0053] like Figure 3 As shown in FIG. 1 , when the aircraft 200 flies to the left along the direction indicated by the straight arrow in the figure, the air around the heat sink 112 moves rapidly to the right relative to the heat sink 112 (as shown in FIG. 1 ). Figure 3 As shown by the dashed arrow in the middle, the heat on the heat dissipation fins 112 can be quickly taken away, ensuring that the computer 100 has efficient heat dissipation performance.

[0054] In summary, the computer 100 provided in the embodiment of the present application is a reinforced computer that dissipates heat through the heat dissipation surface 111 of the chassis 110, ensuring that it can adapt to the harsh environment in the airborne scenario. The computer 100 is fixed inside the fuselage 210 of the aircraft 200 to ensure its stability. At the same time, by utilizing the relative movement between the aircraft 200 and the surrounding air during flight, the heat dissipation fins 112 on the heat dissipation surface 111 are directly extended to the outside of the fuselage 210 through the installation port 211 on the fuselage 210, so that the heat of the heat dissipation fins 112 can be quickly dissipated to the outside during the flight of the aircraft 200, thereby improving the heat dissipation efficiency of the computer 100 and meeting the high power consumption requirements.

[0055] In order to further improve the heat dissipation rate of the heat dissipation fins 112, as Figure 2 and Figure 3 As shown in FIG. 1 , in some embodiments, an air channel 1121 is formed on the heat dissipation fin 112, and the extension direction of the air channel 1121 ( Figure 2 The direction indicated by the double arrow X in the figure is configured to be parallel to the forward direction of the aircraft 200.

[0056] By setting the extension direction of the air flow channel 1121 formed on the heat dissipating fin 112 to be parallel to the forward direction of the aircraft 200, during the flight of the aircraft 200, the surrounding air quickly passes through the air flow channel 1121 and fully contacts the surface of the heat dissipating fin 112, so as to quickly take away the heat on the heat dissipating fin 112.

[0057] After the installation opening 211 is opened on the fuselage 210 of the aircraft 200, in order to ensure the sealing of the interior of the fuselage 210, the present application further proposes an implementation method. Figure 3 As shown in the figure, the edge of the heat dissipation surface 111 is used to be sealed with the inner wall of the body 210 located at the edge of the installation opening 211 by sandwiching a buffer pad 230.

[0058] The buffer pad 230 can be made of soft materials such as waterproof noodles or silica gel. The buffer pad 230 is clamped between the heat dissipation surface 111 and the fuselage 210 and compressed to form an interference fit to seal the assembly gap between the two. At the same time, the buffer pad 230 can also buffer the impact vibration between the fuselage 210 and the computer 100 to achieve a vibration reduction effect and improve the stability of the assembly connection between the two. Furthermore, waterproof glue can be applied between the heat dissipation surface 111 and the fuselage 210 for isolation and sealing.

[0059] In addition to filling the buffer pad 230 and / or coating the waterproof glue between the heat dissipation surface 111 and the body 210 as provided in the above-mentioned embodiment, a closed cavity can also be set up to isolate the inside of the body 210, and the computer 100 can be installed in the closed cavity to achieve isolation between other components inside the body 210 and the environment in which the computer 100 is located. The computer 100 and other electronic components inside the body 210 can be connected by signals by opening holes in the wall of the closed cavity and passing wires, and the opened wire holes are sealed by means of rubber plugs, waterproof glue, etc.

[0060] In order to achieve sufficient heat dissipation of the circuit board 120, the present application further proposes an implementation method. Figures 5 to 7 , Figure 5 and Figure 6 The three-dimensional structure of the motherboard and the radiator after assembly from two perspectives is shown in FIG. Figure 7As shown in the figure, the cross-sectional structure of the mainboard and the heat sink after assembly. As shown in the figure, the circuit board 120 includes a mainboard 121, the mainboard 121 and the heat sink 130 are adapted in area, the heat sink 130 is fixedly connected to the mainboard 121, and a thermal pad 131 is sandwiched between the heat sink 130 and the heating element on the mainboard 121.

[0061] Considering the manufacturing errors of each component and the assembly errors between them, if the heat sink 130 is in direct contact with the heating element, there is a high probability that a gap will exist between the heat sink 130 and the heating element due to the error, thereby affecting the efficiency of heat transfer. Based on this, in this embodiment, the heat conduction pad 131 is clamped between the heat sink 130 and the heating element to ensure the efficiency of heat transfer from the heating element to the heat sink 130. At the same time, the heat conduction pad 131 can press the heating element well against the motherboard 121, which plays a role in reinforcing the heating element and improving the vibration resistance inside the computer 100.

[0062] Furthermore, in some embodiments, a thermal pad 131 may be clamped between the top of the heat sink 130 and the inner wall of the heat dissipation surface 111 to ensure the efficiency of heat transfer from the heat sink 130 to the heat dissipation surface 111 .

[0063] Specifically, Figure 7 As shown in , the heating elements on the motherboard 121 may include a CPU 1211 and a memory 1212, and the thermal pad 131 may be made of a thermally conductive silicone sheet, which has good thermal conductivity and high-level pressure resistance, and has a certain flexibility, and can fit well with the surface of the heating element and the radiator 130 to achieve a higher thermal conductivity.

[0064] exist Figure 5 and Figure 6 In the specific embodiment shown, the edges of the heat sink 130 on opposite sides are fixedly connected to the main board 121 by second threaded fasteners 132 extending from the side of the heat sink 130 away from the main board 121, and the end corners of the main board 121 are also fixedly connected to the heat sink by third threaded fasteners 133 extending from the side of the main board 121 away from the heat sink 130, so that the heat sink 130 and the main board 121 are firmly and reliably fixed together. Of course, in some other embodiments, the heat sink 130 and the main board 121 can also be fixed by means of clamping, welding, etc., which are not specifically limited.

[0065] In order to achieve efficient heat dissipation of the heating element while ensuring the overall anti-vibration performance of the computer 100, the present application further proposes an implementation method. Please refer to the Figure 7As shown in the figure, the heating element includes a memory 1212, a memory connector 1213 is provided on the mainboard 121, the memory 1212 is plugged into the memory connector 1213 in a state parallel to the mainboard 121, and a support pad 1214 is filled between the memory 1212 and the mainboard 121.

[0066] Considering that if the memory 1212 is inserted in a conventional vertical manner, the heat transferred from the top to the heat sink 130 is limited due to the small area of ​​the top of the memory 1212, and the heat transfer efficiency is low. In this regard, the present application adopts a horizontal insertion method of the memory 1212, so that the large surface of one side of the memory 1212 faces upward, so that the large surface facing upward can transfer the heat of the memory 1212 to the heat sink 130 more efficiently through the thermal pad 131 clamped between the heat sink 130.

[0067] Since the memory 1212 itself is relatively thin, after being horizontally inserted, it is easy to detach from the memory connector 1213 or even break when subjected to pressure or vibration. Therefore, in this embodiment, a support pad 1214 is filled between the large surface of the bottom of the memory 1212 and the motherboard 121. The support pad 1214 supports the bottom of the memory 1212, and the heat sink 130 and the thermal pad 131 press the memory 1212 at the top, thereby achieving the effect of reinforcing the memory 1212.

[0068] Specifically, the support pad 1214 can be made of the same material as the thermal pad 131, so as to achieve a certain heat conduction effect while achieving a supporting effect.

[0069] In order to facilitate the assembly of the internal structure of the computer 100, the present application further proposes an implementation method. Figure 8 , the figure shows the exploded structure inside the computer, as shown in the figure, the side of the chassis 110 opposite to the heat dissipation surface 111 is the mounting surface 114, and the circuit board 120 also includes a substrate 122, and the substrate 122 is fixed to the inner wall of the mounting surface 114. The side of the substrate 122 away from the mounting surface 114 is provided with a mainboard mounting area 1221, and the mainboard 121 is fixedly connected to the mainboard mounting area 1221, and the side of the mainboard 121 away from the radiator 130 faces the mainboard mounting area 1221, and the mainboard 121 and the substrate 122 are connected by signals.

[0070] In order to meet the corresponding functions of the computer 100 while reducing the area of ​​the circuit board 120 to meet the miniaturization requirements of the onboard computer, this embodiment adopts a stacking method of the substrate 122 and the main board 121. The basic circuit structure is set on the substrate 122, and high-power heating elements such as the CPU 1211 and the memory 1212 are set on the main board 121, and they are efficiently cooled by the radiator 130.

[0071] Specifically, in Fig. 9In the specific embodiment shown, a first stud 1222 is provided on the mainboard mounting area 1221 of the substrate 122 at a position corresponding to the end corner of the mainboard 121, and the mainboard 121 is fixedly connected to the first stud 1222 via a fourth threaded fastener 1215 at the end corner, thereby achieving assembly fixation with the substrate 122 while avoiding spacing from circuit components on the substrate 122 located in the mainboard mounting area 1221.

[0072] Likewise, if Fig. 9 as well as Fig.10 As shown in the top view in the figure, a plurality of second studs 1141 are provided on the inner wall of the mounting surface 114 corresponding to the edge of the substrate 122, and the substrate 122 is fixedly connected to the second studs 1141 via fifth threaded fasteners 1223 on the edge, so that the substrate 122 is assembled and fixed on the mounting surface 114. The use of the second studs 1141 can avoid opening holes on the mounting surface 114, thereby ensuring the overall reinforcement performance of the computer 100.

[0073] When assembling the computer 100, the heat sink 130 and the mainboard 121 may be assembled and fixed to form the first module 141 (eg, Figure 5 Then, the first module 141 and the substrate 122 are assembled and fixed to form the second module 142 (as shown in FIG. Fig. 9 As shown), finally, the second module 142 is assembled and fixed on the mounting surface 114 to realize the installation of the internal structure in the chassis 110. Each step in the entire assembly process is convenient to operate, which is conducive to improving the assembly efficiency of the computer 100.

[0074] Regarding the signal connection between the mainboard 121 and the substrate 122, in order to avoid the problem of increased volume and messy layout caused by the use of a wiring harness, the present application proposes an implementation method, which is specifically referred to in Fig.11 The figure shows the cross-sectional structure of the connection between the mainboard 121 and the substrate 122. As shown in the figure, the mainboard mounting area 1221 is provided with a first signal connector 1224, and the side of the mainboard 121 facing away from the heat sink 130 is provided with a second signal connector 1216. The second signal connector 1216 is plugged into the first signal connector 1224 to form a signal connection.

[0075] Specifically, the first signal connector 1224 and the second signal connector 1216 can be COM Express (COMe for short) connectors. The mainboard 121 and the baseboard 122 transmit signals by plugging the second signal connector 1216 and the first signal connector 1224, without the need to arrange a wiring harness, which is beneficial to reducing the overall volume of the computer 100, ensuring the compactness of the internal structure of the chassis 110, and improving the vibration resistance of the entire machine.

[0076] In order to further meet the requirements of miniaturization, this application also proposes an implementation method. Figure 4 , Figure 8 and Fig. 9 As shown in the figure, interfaces 1225 are mounted at opposite ends of the substrate 122 , and openings 115 are correspondingly opened at opposite ends of the chassis 110 . The interfaces 1225 at opposite ends of the substrate 122 are respectively exposed at the openings 115 at opposite ends of the chassis 110 .

[0077] In this embodiment, the interface 1225 is directly mounted on both ends of the substrate 122 . Compared with the method of additionally providing an interface backplane, this method can effectively save space and realize a miniaturized design of the chassis 110 .

[0078] Regarding the design of the chassis 110, this application proposes an implementation method. Figure 1 and Figure 4 , and further combined with Fig.12 , Fig.12 The exploded structure of part of the chassis is shown in FIG. Figure 1 and Figure 4 As shown in , the chassis 110 includes a box body 116 and a top cover 117. A first opening 1161 is provided on the top of the box body 116. The portion of the box body 116 located at the edge of the first opening 1161 extends inward to form a lap edge 1162. The top cover 117 covers the first opening 1161 and is fixedly connected to the lap edge 1162. The top cover 117 forms a heat dissipation surface 111. Fig.12 As shown in FIG. 1 , a second opening 1163 is provided at one end of the box body 116 , and the chassis 110 further includes an end plate 118 , which covers the second opening 1163 and is fixedly connected to the box body 116 and the top cover 117 , respectively.

[0079] Taking into account the difficulty in molding the heat sink fins 112, if the chassis 110 and the heat sink fins 112 are molded as one piece, the requirements for the mold are high, which will lead to increased production costs. Therefore, the chassis 110 adopts a separate design of the box body 116 and the top cover 117. The box body 116 and the top cover 117 are molded separately, and the difficulty of integrally molding the top cover 117 and the heat sink fins 112 is relatively low, which is beneficial to reducing the production costs of the chassis 110.

[0080] Specifically, Figure 4 As shown in , a plurality of threaded holes can be provided on the lap 1162, and the top cover is fixedly connected to the threaded holes on the lap 1162 by threaded fasteners. The design of the lap 1162 makes it possible to have no additional protruding structure after the top cover 117 and the box body 116 are assembled and fixed, which is conducive to the miniaturization design of the whole machine.

[0081] Considering that after the overlap 1162 is set on the edge of the first opening 1161, the circuit board 120 and the heat sink 130 may have structural interference with the overlap 1162 and cannot be installed into the box body 116 from the first opening 1161, based on this, a second opening 1163 is also opened at one end of the box body 116, and the circuit board 120 and the heat sink 130 can be installed into the box body 116 from the second opening 1163.

[0082] like Fig.12 As shown in the figure, the edge of the end plate 118 can extend inwardly to form a connecting edge 1181, and the connecting edge 1181 is respectively connected to the top cover 117 and the box body 116 by threaded fasteners, so as to realize the assembly and fixation of the end plate 118 with the top cover 117 and the box body 116, thereby ensuring the overall stability of the chassis 110. At the same time, the inwardly extending connecting edge 1181 is fixedly connected to the box body 116 without occupying the space on the outer surface of the chassis 110, thereby ensuring the miniaturization of the size. Finally, the overall size of the computer 100 can reach 220×130×67mm.

[0083] According to another aspect of the embodiment of the present application, an aircraft is provided, which may be, for example, a drone. Figure 2 As shown in the figure, the aircraft 200 includes a fuselage 210 and a computer 100 in any of the above embodiments, a mounting opening 211 is opened on the fuselage 210, the main body of the computer 100 is fixed in the fuselage 210, and the heat dissipation fins 112 on the computer 100 extend from the mounting opening 211 to the outside of the fuselage 210.

[0084] The aircraft 200 provided in the embodiment of the present application can utilize the relative movement between the aircraft 200 and the surrounding air during flight by adopting the computer 100 provided in any of the above embodiments to quickly dissipate the heat of the heat dissipation fins 112 to the outside, thereby improving the heat dissipation efficiency of the computer 100.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way.

Claims

1. A computer, applied to an aircraft, characterized in that: A mounting opening is provided on the fuselage of the aircraft; The computer comprises a chassis, a circuit board and a radiator, wherein the circuit board and the radiator are both arranged in the chassis; One side of the chassis is a heat dissipation surface, a heat dissipation fin is arranged in the middle of the outer wall of the heat dissipation surface, and the radiator is abutted between the circuit board and the inner wall of the heat dissipation surface to conduct the heat of the circuit board to the heat dissipation fin of the heat dissipation surface; The outer wall edge of the heat dissipation surface is provided with a mounting portion, and the mounting portion is used to be fixedly connected to a position on the fuselage located at the edge of the mounting opening, so that the heat dissipation fins extend from the mounting opening to the outside of the fuselage.

2. The computer according to claim 1, characterized in that An air flow channel is formed on the heat dissipation fin, and the extension direction of the air flow channel is configured to be parallel to the forward direction of the aircraft.

3. The computer according to claim 1, wherein: The edge of the heat dissipation surface is used to be sealed with the inner wall of the body located at the edge of the installation opening by sandwiching a buffer pad.

4. The computer according to claim 1, wherein: The circuit board comprises a mainboard, the mainboard and the heat sink are adapted in area, the heat sink is fixedly connected to the mainboard, and a thermal pad is sandwiched between the heat sink and the heating element on the mainboard.

5. The computer according to claim 4, characterized in that The heating element comprises a memory, a memory connector is arranged on the mainboard, the memory is plugged into the memory connector in a state parallel to the mainboard, and a support pad is filled between the memory and the mainboard.

6. The computer according to claim 4, characterized in that A surface of the chassis opposite to the heat dissipation surface is a mounting surface, and the circuit board further comprises a substrate, and the substrate is fixed to an inner wall of the mounting surface; A mainboard installation area is arranged on a side of the substrate away from the installation surface, the mainboard is fixedly connected to the mainboard installation area, and a side of the mainboard away from the heat sink faces the mainboard installation area, and the mainboard is signal-connected to the substrate.

7. The computer according to claim 6, characterized in that The mainboard installation area is provided with a first signal connector, and the side of the mainboard facing away from the heat sink is provided with a second signal connector, and the second signal connector is plugged with the first signal connector to form a signal connection.

8. The computer according to claim 6, characterized in that Interfaces are mounted on opposite ends of the substrate, and openings are correspondingly provided on opposite end surfaces of the chassis. The interfaces at the two ends of the substrate are respectively exposed from the openings at the two end surfaces of the chassis.

9. The computer according to any one of claims 1 to 8, characterized in that: The chassis comprises a box body and a top cover, the top of the box body is provided with a first opening, a portion of the box body located at the edge of the first opening extends inward to form a lap edge, the top cover covers the first opening and is fixedly connected to the lap edge, and the top cover forms the heat dissipation surface; A second opening is provided at one end of the box body, and the chassis further comprises an end plate, which covers the second opening and is fixedly connected to the box body and the top cover respectively.

10. An aircraft, characterized in that: It comprises a fuselage and a computer as described in any one of claims 1 to 9, wherein a mounting opening is provided on the fuselage, a main body of the computer is fixed inside the fuselage, and the heat dissipation fins on the computer extend from the mounting opening to outside the fuselage.

Images