Material clamping device of wire welding machine for light emitting diode production

Abstract

The utility model relates to the technical field of welding wire machines, in particular to a welding wire machine material clamping device for light emitting diode production, and the welding wire machine comprises a gold wire machine, an aluminum wire machine, an ultrasonic welding wire machine and the like. The wire welding machine is mainly applied to high-power devices such as light-emitting diodes and laser tubes. In the wire welding process of a wire welding machine, the trend of a wire needs to be continuously adjusted, an existing wire welding clamping device is generally clamped manually, common clamping is conducted through clamps such as tweezers, the mode is single in clamping, low in welding accuracy and serious in personal influence, and the welding process fails, and therefore the wire welding machine is inconvenient to use. The material clamping device comprises a positioning assembly, a tin soldering assembly and a guiding assembly, a mounting ring and a circular ring are provided with multiple groups of through holes, a supporting frame and a connecting plate can move to a designated position by adjusting angles, a tin wire is arranged between a first clamping block and a second clamping block at the top end of a connecting rod, and the tin wire penetrates through a tin feeding pen; the motor drives the roller to push the solder wire forwards.

Description

Technical Field

[0001] The utility model relates to the technical field of wire bonding machines, in particular to a material clamping device for wire bonding machines used in the production of light-emitting diodes. Background Art

[0002] In recent years, in the semiconductor industry, wire bonding machines are one of the most frequently used equipment. Most semiconductor components need to be wire bonded. Wire bonding machines include gold wire bonding machines, aluminum wire bonding machines, ultrasonic wire bonding machines, etc. Wire bonding machines are mainly used for high-power devices: light-emitting diodes, laser tubes, etc. During the wire bonding process, wire bonding machines need to continuously adjust the direction of the wires. Existing wire bonding clamping devices are generally manual clamping, using tweezers and other clamps for ordinary clamping. This method has a single clamping method, low welding accuracy, and is seriously affected by personal influence, resulting in failure of the welding process. Therefore, a material clamping device for a wire bonding machine for light-emitting diode production is introduced. Utility Model Content

[0003] To this end, the utility model provides a material clamping device for a wire bonding machine for light emitting diode production, so as to overcome the deficiencies existing in the prior art.

[0004] The utility model provides a material clamping device for a wire bonding machine for light emitting diode production, comprising: a positioning component, a solder component, and a guide component; the positioning component comprises a mounting ring and a support frame, the mounting ring is a semicircular ring structure, the mounting ring is provided with a plurality of first through holes, the mounting ring is provided with a first threaded column; the support frame is movably provided with a second threaded column; the solder component is provided with a circular ring and a solder head, the solder head is provided at the bottom end of the circular ring, the circular ring is provided with a plurality of second through holes; the support frame is connected to the circular ring; the guide component is provided on the circular ring.

[0005] Furthermore, a support column is provided at the bottom end of the support frame.

[0006] Furthermore, the guide assembly includes a connecting plate, a connecting rod, a guide column, a guide plate, and a tin feeding pen, wherein the connecting plate is movably connected to the connecting rod; the guide column is threadedly connected to the guide plate; the guide column is arranged on the connecting rod; and the guide plate is connected to the tin feeding pen.

[0007] Furthermore, a third threaded column is movably provided on the connecting plate, and a clamping block is provided on the connecting rod; the tin feeding pen also includes a motor, a placement table, and a tin feeding column, the motor is arranged on the placement table, and the placement table is connected to the tin feeding column.

[0008] Furthermore, the motor includes a first motor and a second motor, and rollers are provided on output shafts of the first motor and the second motor.

[0009] Furthermore, the tin feeding column is a hollow structure.

[0010] Compared with the prior art, the utility model provides a material clamping device for a wire bonding machine for light emitting diode production. A plurality of through holes are provided on the mounting ring and the circular ring. The support frame and the connecting plate can be adjusted in angle and moved to a specified position. The solder wire is placed between the first clamping block and the second clamping block at the top end of the connecting rod, so that the solder wire passes through the solder feeding pen. The motor drives the roller to push the solder wire forward. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The utility model is a structural diagram of a material clamping device for a wire bonding machine for light emitting diode production.

[0012] 1 is a positioning assembly, 11 is a mounting ring, 111 is a first through hole, 112 is a first threaded column, 12 is a support frame, 121 is a second threaded column, 13 is a support column, 2 is a solder assembly, 21 is a circular ring, 211 is a second through hole, 22 is a solder head, 3 is a guide assembly, 31 is a connecting plate, 311 is a third threaded column, 32 is a connecting rod, 321 is a block, 322 is a first block, 323 is a second block, 33 is a guide column, 34 is a guide plate, 35 is a tin feeding pen, 351 is a motor, 352 is a first motor, 353 is a second motor, 354 is a roller, 355 is a placement table, and 356 is a tin feeding column. DETAILED DESCRIPTION

[0013] In order to make the purpose and advantages of the utility model more clearly understood, the utility model is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0014] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0015] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0016] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0017] The utility model is further described in detail below with reference to the accompanying drawings:

[0018] The positioning assembly 1 includes a mounting ring 11 and a support frame 12. The mounting ring 11 is a semicircular ring structure. The mounting ring 11 is provided with a plurality of first through holes 111, and the mounting ring 11 is provided with a first threaded column 112; the support frame 12 is movably provided with a second threaded column 121; the soldering assembly 2 is provided with a circular ring 21 and a soldering head 22, and the soldering head 22 is provided at the bottom end of the circular ring 21, and the circular ring 21 is provided with a plurality of second through holes 211; the support frame 12 is connected to the circular ring 21; the circular ring 21 is provided with the guiding assembly 3; the bottom end of the supporting frame 12 is also provided with a supporting column 13; the guiding assembly 3 includes a connecting plate 31, a connecting rod 32, a guide column 33, a guide plate 34, a solder feeding pen 35, and the connecting rod 32. The connecting plate 31 is movably connected to the connecting rod 32; the guide column 33 is threadedly connected to the guide plate 34; the guide column 33 is arranged on the connecting rod 32; the guide plate 34 is connected to the tin feeding pen 35; a third threaded column 311 is movably provided on the connecting plate 31, and a blocking block 321 is provided on the connecting rod 32; the tin feeding pen 35 also includes a motor 351, a placement table 355, and a tin feeding column 356, the motor 351 is arranged on the placement table 355, and the placement table 355 is connected to the tin feeding column 356; the motor 351 includes a first motor 352 and a second motor 353, and rollers 354 are provided on the output shafts of the first motor 352 and the second motor 353; the tin feeding column 356 is a hollow structure.

[0019] Specifically:

[0020] The mounting ring 11 of the positioning assembly 1 is provided with a plurality of groups of first through holes 111 and first threaded columns 112. The first threaded columns 112 pass through the mounting ring 11 and are fixed to an external wall or a support member. The support frame 12 is movably connected to the mounting ring 11. The support frame 12 is provided with a second threaded column 121. The angle can be adjusted to fix the second threaded column 121 on the support frame 12. The second threaded column 121 passes through the support frame 12 and is threadedly connected to the first through hole 111 of the mounting ring 11, so that the support frame 12 can be fixed on the mounting ring 11; the support frame 12 is connected to the support column 13; a plurality of groups of second through holes 211 are provided on the circular ring 21, the circular ring 21 is connected to the solder head 22, the connecting plate 31 is movably provided on the circular ring 21, and a third threaded column 311 is provided on the connecting plate 31. The connecting plate 31 is adjusted to a position so that the third threaded column 311 passes through the second through hole 211 of the circular ring 21, and the third threaded column 311 and the second through hole The hole 211 is threadedly connected, so the connecting plate 31 can be fixed on the ring 21; a block 321 is provided on the top of the connecting rod 32, the first block 321 is fixedly arranged on the connecting rod 32, and the second block 321 is movably arranged on the connecting rod 32; a guide column 33 is provided at the bottom end of the connecting rod 32, and the guide column 33 is embedded in the guide plate 34, and the guide column 33 is threadedly connected to the guide plate 34, and the guide column 33 and the guide plate 34 can be stably adjusted to any angle without falling off; one end of the guide plate 34 is connected to the guide column 33, and the other end of the guide plate 34 is connected to the tin feeding pen 35, and the tin feeding pen 35 is provided with a motor 351, and the motor 351 includes a first motor 352 and a second motor 353, so that the first motor 352 rotates clockwise and the second motor 353 rotates counterclockwise to push the solder wire forward; the first motor 352 rotates counterclockwise and the second motor 353 rotates clockwise, so that the solder wire can be driven to be retracted inward.

[0021] So far, the technical solution of the utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings, but it is easy for those skilled in the art to understand that the protection scope of the utility model is obviously not limited to these specific embodiments. Without departing from the principle of the utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the utility model.

[0022] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A material clamping device for a wire bonding machine for light emitting diode production, characterized in that: include: A positioning assembly (1), a soldering assembly (2), and a guiding assembly (3); the positioning assembly (1) comprises a mounting ring (11) and a supporting frame (12); the mounting ring (11) is a semicircular ring structure; the mounting ring (11) is provided with a plurality of first through holes (111); the mounting ring (11) is provided with a first threaded column (112); a second threaded column (121) is movably provided on the supporting frame (12); the soldering assembly (2) is provided with a circular ring (21) and a soldering head (22); the soldering head (22) is provided at the bottom end of the circular ring (21); the circular ring (21) is provided with a plurality of second through holes (211); the supporting frame (12) is connected to the circular ring (21); the guiding assembly (3) is provided on the circular ring (21).

2. A material clamping device for a wire bonding machine for light emitting diode production according to claim 1, characterized in that: A support column (13) is also provided at the bottom end of the support frame (12).

3. The material clamping device for a wire bonding machine for light emitting diode production according to claim 1, characterized in that: The guide assembly (3) comprises a connecting plate (31), a connecting rod (32), a guide column (33), a guide plate (34), and a tin feeding pen (35); the connecting plate (31) is movably connected to the connecting rod (32); the guide column (33) is threadedly connected to the guide plate (34); the guide column (33) is arranged on the connecting rod (32); and the guide plate (34) is connected to the tin feeding pen (35).

4. A material clamping device for a wire bonding machine for light emitting diode production according to claim 3, characterized in that: A third threaded column (311) is movably provided on the connecting plate (31), and a clamping block (321) is provided on the connecting rod (32); the tin feeding pen (35) also includes a motor (351), a placement table (355), and a tin feeding column (356); the motor (351) is provided on the placement table (355), and the placement table (355) is connected to the tin feeding column (356).

5. A material clamping device for a wire bonding machine for light emitting diode production according to claim 4, characterized in that: The motor (351) comprises a first motor (352) and a second motor (353), and rollers (354) are provided on the output shafts of the first motor (352) and the second motor (353).

6. The material clamping device for a wire bonding machine for light emitting diode production according to claim 4, characterized in that: The tin delivery column (356) is a hollow structure.

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