LED bulb module with COB light source sealed with IC and LED lamp

Abstract

The utility model relates to an LED bulb module with a COB light source sealed with an IC and an LED lamp, the LED bulb module with the COB light source sealed with the IC comprises a substrate and LED chips, the substrate is of a three-dimensional structure formed by bending, the LED chips are arranged on one or more faces of the three-dimensional structure, and the LED chips have various different light colors and can emit light in multiple directions in a three-dimensional space, so that the LED bulb module is more attractive in appearance and more attractive in appearance. Compared with the prior art, local darkness is relieved or even eliminated, the lighting effect is improved, the LED chips with various different light colors are packaged on each face in a COB packaging mode, good light distribution uniformity and a high color rendering index are achieved in the whole space, more real and natural colors are shown in lighting application, and the light efficiency is improved. Compared with a traditional lamp with a plurality of mixed lamp filaments, the LED lamp has the advantages of being better in color mixing uniformity, good in heat dissipation effect, good in lighting effect, easy to machine, small in occupied space, low in cost and the like.

Description

Technical Field

[0001] The present application relates to the technical field of LED lamps, and more particularly to a COB light source sealed IC LED bulb module and an LED lamp. Background Art

[0002] Existing CCT or RGBW and other multi-color temperature glass lamps all use multiple filaments to mix colors. The driver needs to extend multiple terminals to connect to the light source. The processing is complicated and the defect rate is high. The color mixing uniformity and other effects are relatively poor. However, COB (Chip On Board, high-power integrated surface) light sources have better uniformity of light emission and are more widely used in various places, such as LED downlights, track lights, grille lights, wall washers, floodlights and other spotlights and spotlight light sources. At present, there are existing technologies for manufacturing three-dimensional COB light sources. For example, the patent with publication number CN102889480A proposes a three-dimensional luminous LED bulb module and manufacturing method, but it does not arrange light sources with multiple color temperatures and colors, and cannot adapt to the changing needs of different places and scenes such as homes, offices, commercial places, and buildings for lamp color temperature, lamp color and brightness. Utility Model Content

[0003] In view of the above-mentioned problem of uneven filament color mixing, the present application proposes a COB light source IC-encapsulated LED bulb module and LED lamp, which adopts the following technical solutions:

[0004] In the first aspect, the present application proposes a COB light source sealed IC LED bulb module, including a substrate and an LED chip, wherein the substrate is a three-dimensional structure formed by bending, and the LED chip is arranged on one or more surfaces of the three-dimensional structure, and the LED chip includes a plurality of different light colors.

[0005] By adopting the above technical solution, light can be emitted in multiple directions in three-dimensional space, local dimming can be reduced or even eliminated, and the lighting efficiency can be improved. In addition, LED chips of various light colors are arranged on each surface, which has good light distribution uniformity and high color rendering index in the overall space, and presents more real and natural colors in lighting applications. Compared with traditional multi-filament color mixing, it has better color mixing uniformity.

[0006] Furthermore, the LED chip is packaged on the substrate in a COB packaging manner.

[0007] By adopting the above technical solution, the COB packaging method allows multiple LED chips to be densely arranged on the same substrate, sharing a heat dissipation base to improve the heat dissipation effect, and can provide higher brightness output at the same size, and has better light distribution uniformity and a higher color rendering index, occupies less space, is easy to process, and has low cost.

[0008] Furthermore, the three-dimensional structure is a cylinder, a prism, a sphere, a frustum, a cone, a pyramid or a combination thereof.

[0009] Furthermore, the number of the LED chips of different light colors on each surface of the three-dimensional structure is the same.

[0010] By adopting the above technical solution, the light output is made more uniform.

[0011] Furthermore, the LED chips of different light colors on each surface of the three-dimensional structure are arranged vertically, horizontally, evenly and alternately, or irregularly.

[0012] By adopting the above technical solution, different arrangement methods can be selected according to the requirements of different scenes for the color temperature and color effects of lamps to achieve various color mixing and light emission effects.

[0013] Furthermore, the LED chips have five light color types, including red light chip, green light chip, blue light chip, cold white light chip, and warm white light chip.

[0014] By adopting the above technical solution, according to the different proportion settings of the five RGBWW chips or the adjustment of the current size, the LED bulb module can mix lights of various color temperatures to match various scenes.

[0015] Furthermore, the three-dimensional structure is a cylinder, and the red light chip, green light chip, blue light chip, cold white light chip, and warm white light chip are arranged horizontally on the upper end surface of the cylinder, and vertically or horizontally on the circumferential surface of the cylinder.

[0016] Furthermore, at least one electrode terminal is disposed on each surface of the three-dimensional structure.

[0017] By adopting the above technical solution, the electrode terminal is used to connect with the driver to control the LED bulb module to emit light.

[0018] Furthermore, the substrate is made of metal.

[0019] By adopting the above technical solution, the metal substrate can be bent and shaped as a carrier, and can conduct electricity and dissipate heat.

[0020] In a second aspect, the present application further proposes an LED lamp, comprising the LED bulb module with a COB light source and an IC package as described in the first aspect.

[0021] By adopting the above technical solution, the light output of the entire LED lamp is softer and more uniform, without dark spots and uneven color mixing, and can better meet the needs of various light distributions. The filament is directly replaced by the COB light source, eliminating the spot welding step. At the same time, the design of the COB light source sealed control IC occupies a small space, which makes the filament drive space larger. Compared with traditional lamps with multiple filaments mixed in color, it has the advantages of good color mixing uniformity, good heat dissipation effect, good lighting effect, simple processing and low cost.

[0022] In summary, the present application proposes a COB light source IC-sealed LED bulb module, which includes a substrate and an LED chip. The substrate is a three-dimensional structure formed by bending, and one or more surfaces of the three-dimensional structure are provided with LED chips, and the LED chips include a variety of different light colors. It can emit light in multiple directions in three-dimensional space, reduce or even eliminate local dimming, and improve the light efficiency. In addition, each surface is packaged with a variety of LED chips of different light colors in a COB packaging manner, which has good light distribution uniformity and a high color rendering index in the overall space, and presents more real and natural colors in lighting applications. Compared with traditional lamps with multiple filaments mixed in color, the LED lamps made of it have the advantages of better color mixing uniformity, good heat dissipation effect, good light efficiency, simple processing, small space occupation, and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate the embodiments and are used together with the description to explain the principles of the present application. It will be easy to recognize other embodiments and many expected advantages of the embodiments because they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale with each other. The same reference numerals refer to corresponding similar parts.

[0024] Figure 1 It is a structural schematic diagram of an LED bulb module of a COB light source sealed IC according to an embodiment of the present application.

[0025] Figure 2 It is a structural schematic diagram of an LED bulb module of a COB light source sealed IC according to another embodiment of the present application.

[0026] Figure 3 It is a schematic diagram of the structure of an LED lamp according to an embodiment of the present application.

[0027] Description of reference numerals:

[0028] Figure 1 :101, substrate; 102, LED chip; 102a, red light chip; 102b, green light chip; 102c, blue light chip; 102d, cold white light chip; 102e, warm white light chip;

[0029] Figure 2 :201, substrate; 202, LED chip; 202a, red light chip; 202b, green light chip; 202c, blue light chip; 202d, cold white light chip; 202e, warm white light chip;

[0030] Figure 3 : 1. LED lamp; 2. LED bulb module. DETAILED DESCRIPTION

[0031] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the relevant invention are shown in the accompanying drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0033] In the first aspect, the present application proposes a COB light source IC package LED bulb module, referring to Figure 1 The LED bulb module of the COB light source sealed IC includes a substrate 101 and an LED chip 102. The substrate 101 is a three-dimensional structure formed by bending. The LED chip 102 is arranged on one or more surfaces of the three-dimensional structure, and the LED chip 102 includes a plurality of different light colors. The LED chip 102 is arranged on the outer surface of the three-dimensional structure, so that the LED bulb module can emit light in multiple directions in the three-dimensional space, reduce or even eliminate local dimming, and improve the light efficiency. In addition, a plurality of LED chips 102 of different light colors are arranged on each surface, which has good light distribution uniformity and a high color rendering index in the overall space, presents more real and natural colors in lighting applications, and has better color mixing uniformity than traditional multi-filament color mixing.

[0034] In a specific embodiment, the LED chip 102 is packaged on the substrate 101 using a COB packaging method. COB packaging is to fix multiple LED chips 102 on the same substrate 101 using thermal conductive glue or welding. This design allows multiple LED chips 102 to be densely arranged and share a heat dissipation base, thereby improving the heat dissipation effect and providing higher brightness output at the same size. In addition, COB light sources generally have better light distribution uniformity and a higher color rendering index, presenting more realistic and natural colors in lighting applications.

[0035] In a specific embodiment, the number of LED chips 102 of different light colors on each surface of the three-dimensional structure is the same, so that the light output is more uniform.

[0036] In a specific embodiment, the substrate 101 is made of metal. The metal substrate 101 can be bent and shaped to serve as a carrier and to conduct electricity and dissipate heat.

[0037] In a specific embodiment, the three-dimensional structure is a cylinder, a prism, a sphere, a frustum, a cone, a pyramid or a combination thereof, and the LED chip 102 is disposed on the outer surface of the three-dimensional structure to enable it to emit light in three dimensions and in multiple directions.

[0038] In a specific embodiment, the three-dimensional structure is a cylinder, and the light color types of the LED chip 102 are five, including a red chip 102a, a green chip 102b, a blue chip 102c, a cold white chip 102d, and a warm white chip 102e. The red chip 102a, the green chip 102b, the blue chip 102c, the cold white chip 102d, and the warm white chip 102e are arranged horizontally on the upper end face and the circumferential surface of the cylinder. According to the different proportions of the five types of LED chips 102 of RGBWW or the adjustment of the current size, the LED bulb module can mix lights of various color temperatures to match various scenes. An electrode terminal is respectively provided on the upper end face and the circumferential surface. The traditional lamp that uses RGBWW five-way filaments for color mixing needs to extend 6 terminals to connect to the light source, while this embodiment only uses two electrode terminals to connect to the driver, which can control the light of the bulb module, and is easy to install, cost-saving and small in space.

[0039] Reference Figure 2 In another specific embodiment, five kinds of LED chips 202, namely, red light chip 202a, green light chip 202b, blue light chip 202c, cold white light chip 202d, and warm white light chip 202e, are arranged on a substrate 201 that is bent and spliced ​​to form a cylinder, and are arranged horizontally on the upper end surface of the cylinder and vertically on the circumferential surface. In other embodiments, the LED chips 202 of different light colors on each surface of the three-dimensional structure can also be arranged evenly and alternately or irregularly. Different arrangement methods can be selected according to the requirements of different scenes for the color temperature and color effects of the lamps to achieve various color mixing and light emission effects, which can also achieve the technical effects of the utility model.

[0040] In other specific embodiments, in addition to the above five light color types, the LED chip can also be designed to have other numbers and types of light colors according to the usage scenario, which can also achieve the technical effect of the present invention.

[0041] In a second aspect, the present application further proposes an LED lamp, comprising the LED bulb module of the COB light source and IC package described in the first aspect. Figure 3, the LED bulb module 2 of the COB light source sealed IC described in the first aspect is applied to the LED lamp 1, so that the light output of the entire LED lamp 1 is softer and more uniform, without dark spots and uneven color mixing, and can better meet the needs of various light distributions. The COB light source is used to directly replace the traditional filament, eliminating the spot welding step. At the same time, the design of the COB light source sealed control IC occupies a small space, which makes the filament drive space larger. Compared with traditional lamps with multiple filaments mixed in color, it has the advantages of good color mixing uniformity, good heat dissipation effect, good lighting effect, simple processing, and low cost.

[0042] The above describes the specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0043] In the description of the present application, it should be understood that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. The wording 'comprising' does not exclude the presence of elements or steps not listed in the claims. The wording 'one' or 'an' preceding an element does not exclude the presence of a plurality of such elements. The simple fact that certain measures are recorded in mutually different dependent claims does not indicate that a combination of these measures cannot be used for improvement. Any reference symbols in the claims should not be interpreted as limiting the scope.

Claims

1. A COB light source IC-sealed LED bulb module, characterized in that: It comprises a substrate and an LED chip. The substrate is a three-dimensional structure formed by bending. One or more surfaces of the three-dimensional structure are provided with LED chips, and the LED chips include a variety of different light colors.

2. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: The LED chip is packaged on the substrate in a COB packaging manner.

3. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: The three-dimensional structure is a cylinder, a prism, a sphere, a frustum, a cone, a pyramid or a combination thereof.

4. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: The number of the LED chips of different light colors on each surface of the three-dimensional structure is the same.

5. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: The LED chips of different light colors on each surface of the three-dimensional structure are arranged vertically, horizontally, evenly and alternately, or irregularly.

6. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: The LED chips have five light color types, including red light chip, green light chip, blue light chip, cold white light chip, and warm white light chip.

7. The COB light source IC-sealed LED bulb module according to claim 6, characterized in that: The three-dimensional structure is a cylinder, and the red light chip, green light chip, blue light chip, cold white light chip, and warm white light chip are arranged horizontally on the upper end surface of the cylinder, and are arranged vertically or horizontally on the circumferential surface of the cylinder.

8. The LED bulb module with COB light source and IC package according to claim 1, characterized in that: At least one electrode terminal is disposed on each surface of the three-dimensional structure.

9. The COB light source IC-sealed LED bulb module according to claim 1, characterized in that: The substrate is made of metal.

10. An LED lamp, characterized in that: An LED bulb module comprising a COB light source sealed IC as described in any one of claims 1-9.

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