Thermal treatment furnace temperature control device for semiconductor production

Abstract

The utility model provides a heat treatment furnace temperature control device used for semiconductor production. The heat treatment furnace temperature control device comprises a first temperature acquisition module, a first PI D adjusting module, a first heating device, a controller module, a second temperature acquisition module, a second PI D adjusting module, a furnace door detection module, a contactor and a second heating device. According to the utility model, the first temperature acquisition module acquires internal temperature data of the heat treatment furnace in real time and sends the internal temperature data to the first PI D adjusting module, the first PI D adjusting module controls the first heating device to adjust the temperature in the heat treatment furnace, and the second temperature acquisition module acquires temperature data of the furnace door and sends the temperature data to the second PI D adjusting module. And the second heating equipment is controlled to adjust the temperature at the furnace door according to the furnace door opening and closing state detected by the furnace door detection module so as to supplement the temperature lost by frequent door opening and closing in the heat treatment furnace.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to a temperature control device for a heat treatment furnace used in semiconductor production. Background Art

[0002] With the development of the manufacturing industry and the improvement of product quality requirements, the requirements for heat treatment processes are also increasing. It is necessary to develop and promote equipment and technologies that can perform heat treatment in high-temperature environments to meet the processing needs of specific materials and products. The automation level of traditional heat treatment equipment is relatively low, and operators need to perform manual operation and monitoring, which will increase production cycles and labor costs. Precise control of the temperature of semiconductors during heat treatment is very important to ensure that the annealing temperature can accurately and stably reach the preset value.

[0003] Publication number CN202576515U provides a fully automatic temperature control system for a heat treatment furnace, which mainly includes a thermocouple arranged in the furnace, a controller connected to the thermocouple in sequence, an automatic valve servo and an automatic valve. The automatic valve servo and the automatic valve are used for the control of natural gas and combustion-supporting gas. The utility model system feeds back the temperature data in the furnace through the thermocouple and transmits it to the controller. The controller outputs instructions according to the given temperature requirements to open or close the valves of natural gas and combustion-supporting air. The servo motor on the automatic valve receives the actuator instruction to execute the change of the valve opening size and position to ensure that the temperature in the furnace is consistent with the given temperature. However, this system controls the heating equipment through a regulating valve, and the heating response is relatively slow, and the temperature cannot be adjusted quickly. Since the gas is affected by the pressure, the heating is unstable, and the influence of frequent opening and closing of the door of the heat treatment furnace on the temperature in the furnace is not considered.

[0004] Based on the above problems, there is an urgent need in the art for a heat treatment furnace temperature control device with fast temperature control adjustment speed, stable heating speed and rapid response, and the ability to compensate for the temperature lost due to frequent door opening and closing. Summary of the invention

[0005] The purpose of the utility model is to provide a temperature control device for a heat treatment furnace used in semiconductor production to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A temperature control device for a heat treatment furnace used in semiconductor production, comprising:

[0008] A first temperature acquisition module, which is installed inside the heat treatment furnace and electrically connected to the first PID adjustment module, and is used to collect temperature data inside the heat treatment furnace and send it to the first PID adjustment module;

[0009] A first PID adjustment module, the first PID adjustment module is electrically connected to the first heating device and is used to send a control instruction to the first heating device;

[0010] A first heating device, which is installed in the heat treatment furnace and is used to receive control instructions from the first PID adjustment module to adjust the temperature in the heat treatment furnace;

[0011] A controller module, the controller module is electrically connected to the first PID adjustment module and the second PID adjustment module, and is used to send the set temperature data of the heat treatment furnace to the first PID adjustment module and the second PID adjustment module;

[0012] A second temperature acquisition module, which is installed at the door of the heat treatment furnace and is used to detect temperature data at the door and send it to the second PID adjustment module;

[0013] A second PID adjustment module, the second PID adjustment module is electrically connected to the contactor and is used to send a control instruction to the contactor;

[0014] A furnace door detection module, which is electrically connected to the contactor and is used to detect the switch state of the furnace door of the heat treatment furnace and send an on / off control instruction to the contactor;

[0015] A contactor, the contactor being electrically connected to the second heating device and being used for switching on and off the connection between the second PID adjustment module and the second heating device under the control of the on-off control instruction of the furnace door detection module;

[0016] The second heating device is installed at the door of the heat treatment furnace and is used to adjust the temperature at the door of the heat treatment furnace.

[0017] Furthermore, there are two furnace door detection modules, which are installed on both sides of the furnace door of the heat treatment furnace and are used to detect the open door state and the closed door state of the heat treatment furnace respectively.

[0018] Furthermore, the controller module is connected to the first PID adjustment module and the second PID adjustment module via RS485 communication connection.

[0019] Furthermore, the contactor includes two parts: a coil and a contact, one end of the contact is electrically connected to the second PID adjustment module, and the other end is electrically connected to the second heating device, and the coil is electrically connected to the furnace door detection module.

[0020] The beneficial effects of the utility model are:

[0021] The utility model collects the internal temperature data of the heat treatment furnace in real time through the first temperature acquisition module, sends it to the first PID adjustment module, controls the first heating device to adjust the temperature in the heat treatment furnace through the first PID adjustment module, and at the same time controls the second heating device to adjust the temperature at the furnace door according to the temperature data at the furnace door collected by the second temperature acquisition module and sent to the second PID adjustment module, and the furnace door switch state detected by the furnace door detection module, so as to make up for the temperature in the heat treatment furnace lost due to frequent opening and closing of the door. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the system structure of the utility model.

[0023] In the figure: 10 a first temperature acquisition module, 20 a first PID adjustment module, 30 a first heating device, 40 a controller module, 50 a second temperature acquisition module, 60 a second PID adjustment module, 70 a furnace door detection module, 80 a contactor, and 90 a second heating device 90. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example:

[0026] See also Figure 1 , the utility model provides a technical solution:

[0027] A temperature control device for a heat treatment furnace for semiconductor production, comprising a first temperature acquisition module 10, a first PID adjustment module 20, a first heating device 30, a controller module 40, a second temperature acquisition module 50, a second PID adjustment module 60, a furnace door detection module 70, a contactor 80 and a second heating device 90, wherein:

[0028] The first temperature acquisition module 10 is a probe-type thermocouple of model WRNK-191, which is installed inside the heat treatment furnace and electrically connected to the first PID adjustment module 20 for collecting temperature data inside the heat treatment furnace and sending it to the first PID adjustment module 20.

[0029] The first PID adjustment module 20 is a temperature controller of model AI-207 / 208 / 218, which is electrically connected to the first heating device 30 and is used to send control instructions to the first heating device 30.

[0030] The first heating device 30 is a halogen lamp of model ALARGE-FJC180 installed in the heat treatment furnace, and is used to receive control instructions from the first PID adjustment module 20 to adjust the temperature in the heat treatment furnace.

[0031] One end of the first temperature acquisition module 10 passes through the heat treatment furnace body and is installed inside the heat treatment furnace, and the other end is outside the heat treatment furnace. The other end is connected to the first PID adjustment module 20 through an analog communication method. The first temperature acquisition module 10 converts the temperature data into a 4-20ma current signal and sends it to the first PID adjustment module 20. The first PID adjustment module 20 adjusts the output power of the first heating device 30 connected to the first PID adjustment module 20 according to the size of the current signal and the set temperature value, thereby realizing the adjustment of the internal temperature of the heat treatment furnace.

[0032] The controller module 40 is a STM32F103C6T6A controller, which is electrically connected to the first PID adjustment module 20 and the second PID adjustment module 60 , and is used to send the set temperature data of the heat treatment furnace to the first PID adjustment module 20 and the second PID adjustment module 60 .

[0033] In this embodiment, the controller module 40 is connected to the first PID adjustment module 20 and the second PID adjustment module 60 via RS485 communication connection.

[0034] The second temperature acquisition module 50 is a probe-type thermocouple of model WRNK-191, which is installed at the door of the heat treatment furnace and is used to detect the temperature data at the door and send it to the second PID adjustment module 60.

[0035] The second PID adjustment module 60 is a temperature controller of model AI-207 / 208 / 218, which is electrically connected to the contactor 80 for sending control instructions to the contactor 80 .

[0036] One end of the second temperature acquisition module 50 is installed at the furnace door, and the other end is connected to the second PID adjustment module 60 through analog communication. The collected temperature data is converted into a 4-20ma current signal and sent to the second PID adjustment module 60. The second PID adjustment module 60 issues a control instruction based on the set temperature data.

[0037] The furnace door detection module 70 is a travel detection switch of model ME-8108, which is electrically connected to the contactor 80 and is used to detect the switch state of the furnace door of the heat treatment furnace and send an on / off control instruction to the contactor 80.

[0038] In this embodiment, there are two furnace door detection modules 70 installed on both sides of the furnace door of the heat treatment furnace, and are used to detect the open state and the closed state of the heat treatment furnace respectively.

[0039] The contactor 80 is an AC contactor of model LC1N0901, which is electrically connected to the second heating device 90 and is used to switch on and off the connection between the second PID adjustment module 60 and the second heating device 90 under the control of the on-off control instruction of the furnace door detection module 70.

[0040] In this embodiment, the contactor 80 includes two parts: a coil and a contact. One end of the contact is electrically connected to the second PID adjustment module 60 , and the other end is electrically connected to the second heating device 90 . The coil is electrically connected to the furnace door detection module 70 .

[0041] When the furnace door detection module 70 detects that the furnace door is open, it sends a control instruction to the coil part of the contactor 80, so that the coil of the contactor 80 is energized and the contacts of the contactor 80 are controlled to be attracted, thereby connecting the second PID adjustment module 60 and the second heating device 90, so that the second heating device 90 can receive the instruction issued by the second PID adjustment module 60 and heat the furnace door according to the instruction. When the furnace door detection module 70 detects that the furnace door is closed, the coil of the contactor 80 loses the control signal, and the contacts of the contactor 80 are disconnected, thereby disconnecting the connection between the second PID adjustment module 60 and the second heating device 90. The second heating device 90 cannot receive the instruction issued by the second PID adjustment module 60 and stops heating the furnace door.

[0042] The second heating device 90 is a halogen lamp of model ALARGE-FJC180, which is installed at the door of the heat treatment furnace and is used to adjust the temperature at the door of the heat treatment furnace. The halogen lamp heats up quickly and can quickly adjust the temperature of the heat treatment furnace.

[0043] The use principle of the utility model: When in use, the utility model collects the internal temperature data of the heat treatment furnace in real time through the first temperature acquisition module, sends it to the first PID adjustment module, controls the first heating device to adjust the temperature inside the heat treatment furnace through the first PID adjustment module, and at the same time, according to the temperature data at the furnace door collected by the second temperature acquisition module, sends it to the second PID adjustment module, and the furnace door detection module detects the furnace door switch state, controls the second heating device to adjust the temperature at the furnace door, so as to supplement the temperature inside the heat treatment furnace lost due to frequent opening and closing of the door.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A temperature control device for a heat treatment furnace used in semiconductor production, characterized in that: include: A first temperature acquisition module (10), the first temperature acquisition module (10) being installed inside the heat treatment furnace and electrically connected to the first PID adjustment module (20), and being used to collect temperature data inside the heat treatment furnace and send the temperature data to the first PID adjustment module (20); A first PID adjustment module (20), the first PID adjustment module (20) being electrically connected to the first heating device (30) and used for sending a control instruction to the first heating device (30); A first heating device (30), the first heating device (30) is installed in the heat treatment furnace and is used to receive the control instruction of the first PID adjustment module (20) to adjust the temperature in the heat treatment furnace; A controller module (40), the controller module (40) being electrically connected to the first PID adjustment module (20) and the second PID adjustment module (60), and being used to send set temperature data of the heat treatment furnace to the first PID adjustment module (20) and the second PID adjustment module (60); A second temperature acquisition module (50), the second temperature acquisition module (50) being installed at the furnace door of the heat treatment furnace and used for detecting temperature data at the furnace door and sending the temperature data to the second PID adjustment module (60); A second PID adjustment module (60), the second PID adjustment module (60) being electrically connected to the contactor (80) and used for sending a control instruction to the contactor (80); A furnace door detection module (70), the furnace door detection module (70) being electrically connected to the contactor (80) and used for detecting the switch state of the furnace door of the heat treatment furnace and sending an on / off control instruction to the contactor (80); a contactor (80), the contactor (80) being electrically connected to the second heating device (90) and used for switching on and off the connection between the second PID adjustment module (60) and the second heating device (90) under the control of an on-off control instruction of the furnace door detection module (70); The second heating device (90) is installed at the door of the heat treatment furnace and is used to adjust the temperature at the door of the heat treatment furnace.

2. A temperature control device for a heat treatment furnace for semiconductor production according to claim 1, characterized in that: There are two furnace door detection modules (70), which are installed on both sides of the furnace door of the heat treatment furnace and are used to detect the open state and the closed state of the heat treatment furnace respectively.

3. A temperature control device for a heat treatment furnace for semiconductor production according to claim 1, characterized in that: The controller module (40) is connected to the first PID adjustment module (20) and the second PID adjustment module (60) via an RS485 communication connection.

4. A temperature control device for a heat treatment furnace for semiconductor production according to claim 1, characterized in that: The contactor (80) comprises two parts: a coil and a contact, one end of the contact is electrically connected to the second PID adjustment module (60), and the other end is electrically connected to the second heating device (90), and the coil is electrically connected to the furnace door detection module (70).

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