Wafer bearing table with nozzle offset monitoring structure for photoresist coating

Abstract

The utility model relates to the technical field of chip sealing and testing, and particularly discloses a photoresist coating wafer bearing table with a nozzle offset monitoring structure, which comprises a base, a box seat, a positioning table for placing a wafer, a lifting plate and a nozzle body, the box seat penetrates through and is fixedly arranged at the top end of the base, the positioning table is movably arranged at the top end of the box seat, and the lifting plate is fixedly arranged at the top end of the base. The lifting plate is installed above the base through a supporting assembly, an offset monitoring assembly used for monitoring the position of the nozzle body is arranged in the positioning table, the offset monitoring assembly comprises a laser transmitter and a receiving ring plate, a through hole is formed in the top end of the positioning table, the laser transmitter is installed in the through hole, and the receiving ring plate is connected with the laser transmitter. The receiving ring plate is fixedly installed at the bottom end of the lifting plate, and a supporting block is arranged at the bottom end of the positioning table. The photoresist spraying device is provided with a monitoring structure for the relative position deviation of the nozzle and the wafer and an automatic deviation reset structure, and the photoresist spraying efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging and testing, and in particular to a wafer carrier for photoresist coating with a nozzle deviation monitoring structure. Background Art

[0002] During the semiconductor chip packaging and testing process, the uniformity of photoresist thickness is very important. When applying photoresist, the photoresist should be dripped on the center of the wafer, and then evenly distributed on the surface of the wafer through high-speed rotation. Therefore, the nozzle is also located directly above the wafer. In actual use, due to various reasons, the relative position of the nozzle and the wafer will be offset, which requires regular confirmation and adjustment.

[0003] At present, factories generally use the method of trial coating with baffles to detect the offset of the photoresist coating position. That is, baffles are used for trial coating of photoresist to observe and confirm whether the photoresist landing point is in the center of the guide. This easily leads to waste of photoresist. Later, the baffles need to be cleaned and recycled after coating, resulting in high labor costs. The wafer cannot be monitored for offset during the photoresist coating process. Utility Model Content

[0004] In order to solve the above problems existing in the prior art, the utility model provides a wafer carrier for photoresist coating with a nozzle deviation monitoring structure.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A wafer carrier for photoresist coating with a nozzle offset monitoring structure, comprising a base, a box seat, a positioning platform for placing wafers, a lifting plate and a nozzle body, wherein the box seat penetrates and is fixedly installed on the top of the base, the positioning platform is movably installed on the top of the box seat, the lifting plate is installed above the base through a supporting component, and a deviation monitoring component for monitoring the position of the nozzle body is arranged in the positioning platform;

[0007] The offset monitoring component includes a laser emitter and a receiving ring plate. A through hole is provided at the top of the positioning platform, and the laser emitter is installed in the through hole. The receiving ring plate is fixedly installed at the bottom end of the lifting plate. A support block is provided at the bottom end of the positioning platform, and a limiting hole is provided at the top of the box seat. The support block movably passes through the limiting hole. A driving component for adjusting the position of the support block is provided in the box seat.

[0008] Preferably, the receiving ring plate is sleeved with the nozzle body, and the nozzle body, the through hole, the laser emitter and the receiving ring plate are coaxially arranged.

[0009] Preferably, the supporting assembly includes a box frame, which is fixedly mounted on the top of the base, and two supporting rods are fixedly mounted between the top wall and the bottom wall of the box frame, and the lifting plate is slidably mounted between the two supporting rods. A driving mechanism for driving the lifting plate to rise and fall is arranged in the box frame.

[0010] Preferably, the driving mechanism comprises a motor, a screw is rotatably installed in the box frame, the motor is fixedly installed on the top of the box frame, and the output shaft of the motor is fixedly connected to the screw via a coupling.

[0011] Preferably, the driving assembly includes two electric hydraulic push rods, support rails are fixedly installed on the four inner walls of the box seat, and limit plates are slidably installed in the support rails. Two groups of limit structures are arranged between the limit plates and the support blocks. The electric hydraulic push rods are arranged on the side walls of the support blocks through mounting seats, and the two electric hydraulic push rods are located on two adjacent sides of the support blocks, and the movable ends of the electric hydraulic push rods are fixedly connected to the adjacent limit plates.

[0012] Preferably, the limiting structure comprises a limiting tube and a limiting rod, one end of the limiting tube is fixedly mounted on the side wall of the support block, one end of the limiting rod is fixedly mounted on the side wall of the limiting plate, and the limiting rod and the limiting tube are slidably sleeved.

[0013] The beneficial effects of the utility model are:

[0014] 1. By setting up a base and a box seat, the wafer is placed on the top of the positioning table. The wafer and the positioning table are coaxially arranged and relatively fixed. When the relative position of the nozzle body and the wafer on the positioning table shifts, the laser of the laser transmitter is misaligned with the nozzle body and irradiated onto the receiving ring plate, and the positioning table offset electrical signal is sent to the PLC controller, which has a monitoring structure for the relative position offset of the nozzle and the wafer.

[0015] 2. By setting the support block and the driving assembly, when the nozzle is detected to be offset relative to the wafer, the two electric hydraulic push rods adjust the position of the support block in the horizontal X-axis and Y-axis respectively. During the sliding of the support block, the limit structure along the sliding direction is extended and retracted, and the limit structure and the limit plate in the vertical sliding direction slide synchronously to adjust and reset the position of the positioning table. It has a structure for adjusting the wafer position and a structure for offset reset, thereby improving the efficiency of photoresist spraying. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2It is a bottom view in the utility model;

[0019] Figure 3 This is a diagram of the installation structure of the receiving ring plate in the utility model;

[0020] Figure 4 It is a cross-sectional view of the positioning platform in the utility model;

[0021] Figure 5 This is an installation structure diagram of the limiting structure in the utility model.

[0022] Description of main component symbols:

[0023] In the figure: 1. base; 2. box seat; 201. limit hole; 3. positioning platform; 301. negative pressure chamber; 302. air hole; 303. drainage tube; 4. lifting plate; 5. nozzle body; 6. through hole; 7. laser transmitter; 8. receiving ring plate; 9. box frame; 10. support rod; 11. screw rod; 12. motor; 13. support block; 14. support rail; 15. limit plate; 16. limit tube; 17. limit rod; 18. electric hydraulic push rod. DETAILED DESCRIPTION

[0024] In order to further explain the technical means and effects adopted by the utility model to achieve the predetermined utility model purpose, the specific implementation methods, structures, features and effects of the utility model are clearly and completely described below in combination with the accompanying drawings and preferred embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present application, it should be understood that the orientation or position relationship indicated by "inside" or "outside" etc. is based on the orientation or position described in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, a specific orientation structure and operation, and therefore cannot be understood as a limitation on the present application.

[0026] Reference Figure 1-Figure 4, a wafer carrier for photoresist coating with a nozzle offset monitoring structure disclosed in the utility model, including a base 1, a box seat 2, a positioning table 3 for placing wafers, a lifting plate 4 and a nozzle body 5, the box seat 2 passes through and is fixedly installed on the top of the base 1, the positioning table 3 is movably installed on the top of the box seat 2, the lifting plate 4 is installed above the base 1 through a supporting component, an offset monitoring component for monitoring the position of the nozzle body 5 is arranged in the positioning table 3, the offset monitoring component includes a laser emitter 7 and a receiving ring plate 8, a through hole 6 is arranged at the top of the positioning table 3, and space is reserved, the laser emitter 7 is installed in the through hole 6, the receiving ring plate 8 is fixedly installed at the bottom end of the lifting plate 4, the receiving ring plate 8 is sleeved with the nozzle body 5, the nozzle body 5, the through hole 6, the laser emitter 7 and the receiving ring plate 8 are coaxially arranged, and the bottom end of the positioning table 3 is provided with A limiting hole 201 is arranged on the top of the support block 13 and the box seat 2, and the support block 13 is movable through the limiting hole 201. A PLC controller is arranged on the outer wall of one side of the box seat 2. The wafer is placed on the top of the positioning table 3. A negative pressure cavity 301 is arranged in the positioning table 3. A plurality of air holes 302 are arranged on the top of the positioning table 3. A drainage tube 303 for connecting a vacuum pump is arranged on the side wall of the positioning table 3. The drainage tube 303 is connected to the negative pressure cavity 302, and is coaxially arranged with the positioning table 3 and relatively fixed. When the relative position of the nozzle body 5 and the wafer on the positioning table 3 is offset, the visible laser of the laser transmitter 7 passes through the wafer and the nozzle body 5 and is misaligned and irradiated onto the receiving ring plate 8. The receiving ring plate 8 converts these optical signals into electrical signals through corresponding photoelectric detectors, and finally restores the original baseband electrical signals. In cooperation with the PLC controller, the photoresist coating is suspended.

[0027] Reference Figure 1 The support assembly includes a box frame 9, which is fixedly installed on the top of the base 1. Two support rods 10 are fixedly installed between the top wall and the bottom wall of the box frame 9. The lifting plate 4 is slidably installed between the two support rods 10. A driving mechanism for driving the lifting plate 4 to rise and fall is provided in the box frame 9. The driving mechanism includes a motor 12. A screw 11 is rotatably installed in the box frame 9. The motor 12 is fixedly installed on the top of the box frame 9. The output shaft of the motor 12 is fixedly connected to the screw 11 through a coupling. The motor 12 is connected to the output end of the PLC controller. The motor 12 drives the screw 11 to rotate, drives the lifting plate 4 to slide, and adjusts the distance from the nozzle body 5 to the wafer.

[0028] Reference Figure 1-Figure 2 and Figure 5A driving assembly for adjusting the position of the support block 13 is arranged in the box seat 2, and the driving assembly includes two electric hydraulic push rods 18. The inner walls of the four sides of the box seat 2 are fixedly installed with support rails 14, which have a supporting function. A limit plate 15 is slidably installed in the support rail 14. Two sets of limit structures are arranged between the limit plate 15 and the support block 13. The limit structure includes a limit tube 16 and a limit rod 17. One end of the limit tube 16 is fixedly installed on the side wall of the support block 13, and one end of the limit rod 17 is fixedly installed on the side wall of the limit plate 15. The limit rod 17 and the limit tube 16 are slidably sleeved. The dynamic hydraulic push rod 18 is set on the side wall of the support block 13 through a mounting seat. The two electric hydraulic push rods 18 are located on the adjacent two sides of the support block 13. The movable end of the electric hydraulic push rod 18 is fixedly connected to the adjacent limit plate 15. The two electric hydraulic push rods 18 are both connected to the output end of the PLC controller. The two electric hydraulic push rods 18 respectively adjust the position of the support block 13 in the horizontal direction of the X-axis and the Y-axis. During the sliding process of the support block 13, the limit structure along the sliding direction is extended and retracted, and the limit structure and the limit plate 15 in the vertical sliding direction slide synchronously to adjust the position of the positioning table 3.

[0029] The working principle and use process of the utility model are as follows: the wafer is placed on the top of the positioning table 3, the wafer and the positioning table 3 are coaxially arranged and relatively fixed, when the relative position of the nozzle body 5 and the wafer on the positioning table 3 is offset, the laser of the laser transmitter 7 is misaligned with the nozzle body 5 and irradiated onto the receiving ring plate 8, and the positioning table 3 offset electrical signal is sent to the PLC controller, and the two electric hydraulic push rods 18 respectively adjust the position of the support block 13 in the horizontal direction of the X-axis and the Y-axis. During the sliding process of the support block 13, the limiting structure along the sliding direction is extended and retracted, and the limiting structure and the limiting plate 15 in the vertical sliding direction slide synchronously to adjust and reset the position of the positioning table 3.

[0030] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A wafer carrier for photoresist coating with a nozzle offset monitoring structure, comprising a base (1), a cassette seat (2), a positioning table (3) for placing a wafer, a lifting plate (4) and a nozzle body (5), characterized in that: The box seat (2) penetrates through and is fixedly mounted on the top of the base (1); the positioning platform (3) is movably mounted on the top of the box seat (2); the lifting plate (4) is mounted above the base (1) through a supporting component; and a deviation monitoring component for monitoring the position of the nozzle body (5) is arranged in the positioning platform (3); The offset monitoring component comprises a laser emitter (7) and a receiving ring plate (8); a through hole (6) is provided at the top of the positioning platform (3); the laser emitter (7) is installed in the through hole (6); the receiving ring plate (8) is fixedly installed at the bottom of the lifting plate (4); a support block (13) is provided at the bottom of the positioning platform (3); a limiting hole (201) is provided at the top of the box seat (2); the support block (13) movably passes through the limiting hole (201); and a driving component for adjusting the position of the support block (13) is provided in the box seat (2).

2. The wafer carrier for photoresist coating with a nozzle deviation monitoring structure according to claim 1, characterized in that: The receiving ring plate (8) is sleeve-connected with the nozzle body (5), and the nozzle body (5), the through hole (6), the laser emitter (7) and the receiving ring plate (8) are coaxially arranged.

3. The wafer carrier for photoresist coating with a nozzle deviation monitoring structure according to claim 1, characterized in that: The support assembly comprises a box frame (9), the box frame (9) is fixedly mounted on the top of the base (1), two support rods (10) are fixedly mounted between the top wall and the bottom wall of the box frame (9), the lifting plate (4) is slidably mounted between the two support rods (10), and a driving mechanism for driving the lifting plate (4) to rise and fall is arranged inside the box frame (9).

4. The wafer carrier for photoresist coating with a nozzle deviation monitoring structure according to claim 3, characterized in that: The driving mechanism comprises a motor (12), a screw rod (11) is rotatably mounted in the box frame (9), the motor (12) is fixedly mounted on the top of the box frame (9), and the output shaft of the motor (12) is fixedly connected to the screw rod (11) via a coupling.

5. The wafer carrier for photoresist coating with a nozzle deviation monitoring structure according to claim 1, characterized in that: The driving assembly comprises two electric hydraulic push rods (18), the inner walls of the four sides of the box seat (2) are fixedly mounted with support rails (14), a limit plate (15) is slidably mounted in the support rail (14), two groups of limit structures are arranged between the limit plate (15) and the support block (13), the electric hydraulic push rod (18) is arranged on the side wall of the support block (13) through a mounting seat, the two electric hydraulic push rods (18) are located on two adjacent sides of the support block (13), and the movable end of the electric hydraulic push rod (18) is fixedly connected to the adjacent limit plate (15).

6. The wafer carrier for photoresist coating with a nozzle deviation monitoring structure according to claim 5, characterized in that: The limiting structure comprises a limiting tube (16) and a limiting rod (17); one end of the limiting tube (16) is fixedly mounted on the side wall of the support block (13); one end of the limiting rod (17) is fixedly mounted on the side wall of the limiting plate (15); and the limiting rod (17) and the limiting tube (16) are slidably sleeved.

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