Multi-pixel optical module and vehicle-mounted signal lamp

By using multi-pixel optical modules in vehicle signal lights and using dispensing technology to create glossy surfaces and light-insulating parts, the problems of large pixel spacing and poor display effects in existing vehicle signal lights are solved, and higher pixel density and Better static appearance while reducing costs.

CN222503615UActive Publication Date: 2025-02-18HASCO VISION TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202420549379.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-20
Publication Date
2025-02-18
Estimated Expiration
2034-03-20

AI Technical Summary

Technical Problem

The pixel center spacing of existing vehicle signal lights is large, resulting in serious mosaics in the display effect and not delicate enough. At the same time, the dense packaging of traditional LEDs leads to poor static appearance and high cost.

Method used

Using multi-pixel optical modules, including substrates, light source components and light-exit components, the gloss surface and light-insulating components are produced through the dispensing process, which can effectively export the light beam and reduce the light leakage, and achieve smaller pixel center pitch and higher Pixel density.

Benefits of technology

Minimize pixel center spacing (2mm-4mm), improve display resolution and static appearance effect, while reducing costs.

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Abstract

The utility model provides a multi-pixel optical module and a vehicle-mounted signal lamp, and relates to the technical field of vehicle-mounted signal lamps. The multi-pixel optical module comprises a substrate, at least two light source assemblies are arranged on the substrate at intervals, a light emitting component is arranged on the side, away from the substrate, of each light source assembly, the surface, away from the light source assemblies, of each light emitting component is a light emitting face, and the light emitting components are used for guiding out light beams emitted by the light source assemblies from the light emitting faces; the first light isolation part is arranged around the side faces of the at least two light emitting parts. According to the multi-pixel optical module, the required structure can be manufactured on the substrate step by step by adopting a dispensing process, so that the space of the multi-pixel optical module can be reduced, and the assembly process can be simplified. On the premise of ensuring uniform pixel luminescence, the minimum thickness can be 3mm, the minimum pixel center distance can be 2mm-4mm, the pixel density is high, the display resolution can be improved, the static appearance effect is good, and the cost is relatively low.
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Description

Technical Field

[0001] The present application relates to the technical field of vehicle signal lights, and in particular to a multi-pixel optical module and a vehicle signal light. Background Art

[0002] With the development of electric and intelligent vehicles, people pay more and more attention to traffic safety and the intelligent interactive functions of vehicles. Pixelated intelligent lights with multiple safety warning patterns and signal interactive functions to achieve rich personalized animation effects are one of the development trends of vehicle signal lights and have been mass-produced on many models.

[0003] The existing vehicle signal lights, display pixel components are mainly divided into two categories: thick-walled parts and thin-walled parts. For example, a thick-walled light collector corresponds to one display pixel, or a display pixel is formed by a light-isolating bracket. The disadvantage of this type of vehicle signal light is that the pixel center spacing is large, usually cannot be 4mm or less, the display effect is seriously mosaic, and not delicate enough. There are also some vehicle signal lights that directly use traditional size (for example, three-dimensional size 3mm×3mm×0.8mm) black packaged LEDs as display pixels. Although this can make the pixel display more delicate, the entire vehicle signal light can directly see the densely packaged LEDs, and the static appearance effect is extremely poor. In addition, miniLED display screens with smaller pixels and pixel spacing can also be used as vehicle signal lights, but the pixel density of such display screens is too high, resulting in a significantly higher cost per unit display area, which cannot meet the cost control requirements of the OEM. Therefore, how to make the pixels of vehicle signal lights smaller, the display more delicate, and take into account both appearance and cost has become a key development direction. Utility Model Content

[0004] The purpose of the present application is to provide a multi-pixel optical module and a vehicle signal light to address the deficiencies in the above-mentioned prior art, which can take into account static appearance, display effect and cost.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] According to one aspect of an embodiment of the present application, a multi-pixel optical module is provided, comprising: a substrate, at least two light source assemblies are spaced apart on the substrate, a light emitting component is provided on a side of each light source assembly away from the substrate, a surface of the light emitting component away from the light source assembly is a light emitting surface, the light emitting component is used for guiding a light beam emitted by the light source assembly out of the light emitting surface, a first light isolating component is further provided on the substrate, and the first light isolating component is arranged around the side surfaces of at least two light emitting components.

[0007] Optionally, the material of the light emitting component is a light-transmitting glue material, and the material of the first light-isolating component is a light-opaque glue material.

[0008] Optionally, a second light-isolating component is further provided on the substrate, and the second light-isolating component is arranged around the sides of at least two light source assemblies, and the surface of the second light-isolating component away from the substrate is connected to the first light-isolating component.

[0009] Optionally, the surface of the light emitting component facing the substrate is the light incident surface, the surface of the first light blocking component facing the substrate is lower than the light incident surface or flush with the light incident surface, and the surface of the first light blocking component away from the substrate is higher than the light emitting surface or flush with the light emitting surface.

[0010] Optionally, the substrate is a circuit board, and the at least two light source assemblies are electrically connected to the circuit board respectively.

[0011] Optionally, the light source assembly includes at least one light source.

[0012] Optionally, the substrate has multiple side surfaces connected in sequence, wherein at least some of the side surfaces protrude from the outside of the first light-isolating component, and the substrate is also provided with an installation process hole, which is located between the first light-isolating component and at least one side surface protruding from the outside of the first light-isolating component.

[0013] Another aspect of the embodiments of the present application provides a vehicle signal light, comprising a multi-pixel optical module as described above.

[0014] Optionally, the number of the multi-pixel optical modules is at least two, and at least two multi-pixel optical modules are spliced ​​along a preset direction.

[0015] Optionally, the first light-isolating component of the multi-pixel optical module includes a light-isolating ring and a light-isolating strip arranged inside the light-isolating ring, the light-isolating strip is located between two adjacent light-emitting components of the multi-pixel optical module, and the light-isolating ring and the light-isolating strip are connected as a whole; the distance between two adjacent multi-pixel optical modules is a, the width of the light-isolating ring is b, and the width of the light-isolating strip is d, then d=2b+a.

[0016] The beneficial effects of this application include:

[0017] The present application provides a multi-pixel optical module, comprising: a substrate, at least two light source assemblies are arranged at intervals on the substrate, each light source assembly is provided with a light emitting component on the side away from the substrate, the surface of the light emitting component away from the light source assembly is the light emitting surface, and the light emitting component is used to guide the light beam emitted by the light source assembly from the light emitting surface, and a first light-isolating component is also provided on the substrate, and the first light-isolating component is arranged around the side of at least two light-emitting components. The multi-pixel optical module can adopt a dispensing process to make the required structure on the substrate in steps, reducing the installation structure of traditional plastic parts, which is conducive to reducing the space of the multi-pixel optical module and simplifying the assembly process. Under the premise of ensuring uniform pixel light emission, the minimum thickness of the multi-pixel optical module can be 3mm, which is difficult to achieve with traditional optical parts modules. At the same time, under the premise of ensuring uniform pixel light emission, the minimum pixel center spacing of the multi-pixel optical module can be 2mm-4mm, with a high pixel density, which can significantly improve the display resolution, and has a good static appearance effect and a relatively low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of a multi-pixel optical module provided in an embodiment of the present application;

[0020] Figure 2 A cross-sectional view of a multi-pixel optical module provided in an embodiment of the present application;

[0021] Figure 3 One of the schematic diagrams of the preparation process of the multi-pixel optical module provided in the embodiment of the present application;

[0022] Figure 4 The second schematic diagram of the preparation process of the multi-pixel optical module provided in the embodiment of the present application;

[0023] Figure 5 The third schematic diagram of the preparation process of the multi-pixel optical module provided in the embodiment of the present application;

[0024] Figure 6 A fourth schematic diagram of the preparation process of a multi-pixel optical module provided in an embodiment of the present application;

[0025] Figure 7 A fifth schematic diagram of the preparation process of a multi-pixel optical module provided in an embodiment of the present application;

[0026] Figure 8 Schematic diagram six of the preparation process of the multi-pixel optical module provided in the embodiment of the present application;

[0027] Fig. 9 Schematic diagram 7 of the preparation process of the multi-pixel optical module provided in the embodiment of the present application;

[0028] Fig.10 Schematic diagram eight of the preparation process of a multi-pixel optical module provided in an embodiment of the present application;

[0029] Fig.11 The ninth schematic diagram of the preparation process of the multi-pixel optical module provided in the embodiment of the present application.

[0030] Icon: 100-multi-pixel optical module; 110-substrate; 111-first side; 112-second side; 113-third side; 114-fourth side; 115-installation process hole; 120-light source assembly; 130-light emitting component; 131-light emitting surface; 132-light incident surface; 140-first light-isolating component; 141-light-isolating ring; 142-light-isolating strip; 150-second light-isolating component; 200-enclosure; 300-light-emitting layer; 400-light-isolating layer. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In one aspect of the embodiment of the present application, referring to Figure 1 and Figure 2 , a multi-pixel optical module 100 is provided, including: a substrate 110, at least two light source components 120 are arranged on the substrate 110 at intervals, each light source component 120 is provided with a light emitting component 130 on a side away from the substrate 110, the surface of the light emitting component 130 away from the light source component 120 is a light emitting surface 131, the light emitting component 130 is used to guide the light beam emitted by the light source component 120 from the light emitting surface 131, and a first light blocking component 140 is also provided on the substrate 110, and the first light blocking component 140 is arranged around the side of at least two light emitting components 130.

[0037] The multi-pixel optical module 100 includes a substrate 110, at least two light source assemblies 120, at least two light emitting components 130 and a first light isolation component 140. Specifically, at least two light source assemblies 120 are installed on the same substrate 110 at intervals. Preferably, the center distance between two adjacent light source assemblies 120 is 2mm-6mm. Each light source assembly 120 is provided with a light emitting component 130 on the side away from the substrate 110, that is, the number of light emitting components 130 is equal to the number of light source assemblies 120 and the positions correspond one to one. The light emitting component 130 has a relative light incident surface 132 and a light emitting surface 131. The light beam emitted by the light source assembly 120 enters the interior of the light emitting component 130 from the light incident surface 132, and after propagation and reflection by the light emitting component 130, it is emitted from the light emitting surface 131. Each light source assembly 120 and the corresponding light emitting component 130 constitute a pixel, and the cross-sectional shape of the pixel can be rectangular, polygonal, circular or other irregular shapes. In order to avoid light crosstalk between two adjacent pixels, a first light isolation component 140 is also provided on the substrate 110. The first light isolation component 140 surrounds at least two light emitting components 130 at the same time, so that each light emitting component 130 has a light isolation structure (i.e., a part of the first light isolation component 140) all around. The first light isolation component 140 reflects the light beam emitted from the side wall of the light emitting component 130 back to the inside of the light emitting component 130, thereby improving the utilization rate of light, reducing light crosstalk, and at the same time, improving the contrast of the pixel. Preferably, the width of the first light isolation component 140 is 0.2mm-0.5mm.

[0038] The multi-pixel optical module 100 can adopt a dispensing process to manufacture the required structure onto the substrate 110 in steps, which reduces the installation structure of traditional plastic parts, and is conducive to reducing the space of the multi-pixel optical module 100 and simplifying the assembly process. Under the premise of ensuring uniform pixel light emission, the minimum thickness of the multi-pixel optical module 100 can be 3mm, which is difficult to achieve with traditional optical parts modules. At the same time, under the premise of ensuring uniform pixel light emission, the minimum pixel center spacing of the multi-pixel optical module 100 can be 2mm-4mm, with a higher pixel density, which can significantly improve the display resolution, and has a better static appearance effect and a relatively low cost.

[0039] Optionally, in one achievable manner of the embodiment of the present application, the material of the light emitting component 130 is a light-transmitting glue material (such as silicone or resin with scattering properties), and the material of the first light-isolating component 140 is an opaque glue material (such as opaque silicone or resin). The light emitting component 130 and the first light-isolating component 140 are fabricated onto the substrate 110 in steps by a glue dispensing process.

[0040] Optionally, in an achievable manner of the embodiment of the present application, the substrate 110 is a circuit board, and at least two light source assemblies 120 are electrically connected to the circuit board respectively. The circuit board can provide support for the light source assembly 120 and can also control the operation of the light source assembly 120.

[0041] Optionally, in one implementable manner of the embodiment of the present application, the surface of the light emitting component 130 facing the substrate 110 is the light incident surface 132, the surface of the first light blocking component 140 facing the substrate 110 is lower than the light incident surface 132 or is flush with the light incident surface 132, and the surface of the first light blocking component 140 away from the substrate 110 is higher than the light emitting surface 131 or is flush with the light emitting surface 131.

[0042] In other words, the side of the light emitting component 130 is completely surrounded by the first light isolating component 140, so that it can play a better role in preventing light from crossing. Preferably, the surface of the first light isolating component 140 away from the substrate 110 is flush with the light emitting surface 131, so that the surface of the multi-pixel optical module 100 is smooth and beautiful.

[0043] Optionally, in one implementable manner of the embodiment of the present application, a second light-blocking component 150 is further provided on the substrate 110, and the second light-blocking component 150 is arranged around the sides of at least two light source assemblies 120, and the second light-blocking component 150 is connected to the first light-blocking component 140 away from the surface of the substrate 110.

[0044] The second light-isolating component 150 surrounds at least two light source assemblies 120 at the same time, so that each light source assembly 120 has a light-isolating structure (i.e., a part of the second light-isolating component 150) all around. At the same time, the second light-isolating component 150 is also connected to the first light-isolating component 140, so that the light beam emitted by each light source assembly 120 can only be transmitted and reflected inside its corresponding light-emitting component 130, thereby avoiding the light-channeling phenomenon. The material of the second light-isolating component 150 can also be a light-proof dispensing material (such as light-proof silicone, resin, etc.), and is made onto the substrate 110 through a dispensing process.

[0045] Preferably, the height of the second light-blocking component 150 is lower than the height of the light source assembly 120, thereby preventing the opaque dispensing material used to prepare the second light-blocking component 150 from covering the surface of the light source assembly 120 during the dispensing process, causing the light beam emitted by the light source assembly 120 to be unable to be emitted.

[0046] Optionally, in one implementable manner of the embodiment of the present application, the light source assembly 120 includes at least one light source.

[0047] A pixel may include one light source, or may include two or more light sources. For example, each pixel includes an RGB light source or multiple light sources of different colors. When the number of light sources in a pixel is two or more, there is no need to set a light isolation component between the two or more light sources.

[0048] Optionally, in one achievable method of an embodiment of the present application, the substrate 110 has a plurality of side surfaces connected in sequence, wherein at least some of the side surfaces protrude from the outside of the first light-isolating component 140, and an installation process hole 115 is also provided on the substrate 110, and the installation process hole 115 is located between the first light-isolating component 140 and at least one side surface protruding from the outside of the first light-isolating component 140.

[0049] In practical applications, it may be necessary to splice a plurality of multi-pixel optical modules 100 to form an optical module of a larger size, therefore, in the direction in which the multi-pixel optical module 100 needs to be spliced, the side surface of the substrate 110 is flush with the side surface of the first light-isolating component 140. In the direction in which splicing is not required, the side surface of the substrate 110 protrudes from the outside of the first light-isolating component 140, and a mounting process hole 115 is provided on the protruding portion of the substrate 110 to facilitate the fixed installation of the multi-pixel optical module 100.

[0050] For example, the substrate 110 is rectangular, and has a first side 111, a second side 112, a third side 113 and a fourth side 114 connected in sequence, wherein the first side 111 and the third side 113 are respectively flush with the two sides opposite to the first light-isolating component 140, and the second side 112 and the fourth side 114 are respectively protruded from the outside of the first light-isolating component 140, and an installation process hole 115 is also provided on the substrate 110, and the installation process hole 115 is located between the first light-isolating component 140 and the second side 112, or, the installation process hole 115 is located between the first light-isolating component 140 and the fourth side 114.

[0051] Please refer to Figures 3 to 8When the multi-pixel optical module 100 is actually prepared, at least two light source assemblies 120 can be arranged and fixed to the substrate 110 according to the required spacing, and then a fence 200 is made around the substrate 110 (the fence 200 needs to surround all the light source assemblies 120 inside it). The fence 200 is injected with opaque glue material by using a glue dispensing process, and the thickness of the injected material is slightly lower than that of the light source assembly 120. After the opaque glue dispensing material is cured, the second light-isolating component 150 is formed. Of course, the second light-isolating component 150 can also be omitted, but the anti-light-channeling effect is slightly worse. Afterwards, the fence 200 is injected with a glue dispensing process by using a light-transmitting glue dispensing material, and after the light-transmitting glue dispensing material is cured, an integral light-emitting layer 300 is formed. Between the two light source assemblies 120, a cutting device is used to remove part of the light-emitting layer 300, thereby forming a light-emitting component 130 corresponding to the light source assembly 120. When the second light-isolating component 150 is not formed, the cutting height here can be lower than the height of the light source assembly 120. After cutting, an opaque glue material is injected between the light-emitting components 130, and the opaque glue material is cured to form a light-isolating layer 400. Finally, please refer to Fig. 9 , all the enclosures 200 and the light emitting layer 300 connected to the enclosures 200 can be removed to expose the light isolation layer 400. In this case, the light isolation layer 400 is the first light isolation component 140. Fig.10 and Fig.11 Alternatively, only a portion of the enclosure 200 may be cut off. In this case, the light-isolating layer 400 and the remaining enclosure 200 together constitute the first light-isolating component 140 .

[0052] Please refer again Figure 1 and Figure 2 This embodiment also provides a vehicle signal light, including a multi-pixel optical module 100 as described above.

[0053] The vehicle signal light comprises the same structure and beneficial effects as the multi-pixel optical module 100 in the aforementioned embodiment. The structure and beneficial effects of the multi-pixel optical module 100 have been described in detail in the aforementioned embodiment and will not be repeated here.

[0054] Optionally, in an achievable manner of the embodiment of the present application, the number of multi-pixel optical modules 100 is at least two, and at least two multi-pixel optical modules 100 are spliced ​​along a preset direction to form a larger vehicle signal light. The preset direction can be a fixed direction or two mutually perpendicular directions.

[0055] Optionally, in an achievable manner of an embodiment of the present application, the first light-isolating component 140 of the multi-pixel optical module 100 includes a light-isolating ring 141 and a light-isolating strip 142 arranged inside the light-isolating ring 141, the light-isolating strip 142 is located between two adjacent light-emitting components 130 of the multi-pixel optical module 100, and the light-isolating ring 141 and the light-isolating strip 142 are connected as a whole; the number of light-isolating strips 142 can be multiple, which needs to be determined according to the number of light source assemblies 120 in the light-isolating ring 141.

[0056] When the multi-pixel optical modules 100 are spliced, the light-isolating rings 141 of two adjacent multi-pixel optical modules 100 are close to each other, and there is a spacing between the side walls of the two light-isolating rings 141 that are close to each other, and the spacing is the spacing between the two adjacent multi-pixel optical modules 100. Assuming that the spacing between the two adjacent multi-pixel optical modules 100 is a, the width of the light-isolating ring 141 is b, and the width of the light-isolating strip 142 is d, then d=2b+a, such a setting can make the spacing between the two pixels at the splicing position equal to the spacing between the two pixels at the non-splicing position after the multi-pixel optical modules 100 are spliced.

[0057] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-pixel optical module, characterized in that: include: A substrate, at least two light source assemblies are arranged on the substrate at intervals, each of the light source assemblies is provided with a light emitting component on a side away from the substrate, the surface of the light emitting component away from the light source assembly is a light emitting surface, the light emitting component is used to guide the light beam emitted by the light source assembly out of the light emitting surface, and a first light isolating component is also provided on the substrate, and the first light isolating component is arranged around the side surfaces of at least two of the light emitting components.

2. The multi-pixel optical module according to claim 1, wherein: The material of the light emitting component is a light-transmitting glue material, and the material of the first light-isolating component is a light-opaque glue material.

3. The multi-pixel optical module according to claim 1, wherein: A second light-blocking component is also disposed on the substrate. The second light-blocking component is disposed around the sides of at least two of the light source assemblies. The surface of the second light-blocking component away from the substrate is connected to the first light-blocking component.

4. The multi-pixel optical module according to claim 1, wherein: The surface of the light emitting component facing the substrate is the light incident surface, the surface of the first light blocking component facing the substrate is lower than the light incident surface or flush with the light incident surface, and the surface of the first light blocking component away from the substrate is higher than the light emitting surface or flush with the light emitting surface.

5. The multi-pixel optical module according to claim 1, wherein: The substrate is a circuit board, and at least two of the light source components are electrically connected to the circuit board respectively.

6. The multi-pixel optical module according to claim 1, wherein: The light source assembly includes at least one light source.

7. The multi-pixel optical module according to claim 1, wherein: The substrate has a plurality of side surfaces connected in sequence, wherein at least some of the side surfaces protrude from the outside of the first light-isolating component. The substrate is also provided with an installation process hole, which is located between the first light-isolating component and at least one side surface protruding from the outside of the first light-isolating component.

8. A vehicle signal light, characterized in that: Comprising a multi-pixel optical module as described in any one of claims 1 to 7.

9. The vehicle signal light according to claim 8, characterized in that: The number of the multi-pixel optical modules is at least two, and at least two of the multi-pixel optical modules are spliced ​​along a preset direction.

10. The vehicle signal light according to claim 9, characterized in that: The first light-isolating component of the multi-pixel optical module comprises a light-isolating ring and a light-isolating strip arranged inside the light-isolating ring, the light-isolating strip is located between two adjacent light-emitting components of the multi-pixel optical module, and the light-isolating ring and the light-isolating strip are connected as one body; The distance between two adjacent multi-pixel optical modules is a, the width of the light-isolating ring is b, and the width of the light-isolating strip is d, then d=2b+a.

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