Light source device and electronic equipment

Abstract

The utility model discloses a light source device and electronic equipment, and relates to the technical field of light sources. The heat dissipation plate is arranged on the light emitting side deviating from the light emitting device; the heat dissipation base is arranged on one side, far away from the light-emitting device, of the heat dissipation plate; the thickness of the heat dissipation base ranges from 1.8 mm to 2.2 mm, or ranges from 2.3 mm to 2.7 mm. According to the light source device, the corresponding appropriate thickness value of the heat dissipation base can be set according to different working rules of the light emitting device, namely, the thickness range is 1.8 mm to 2.2 mm or 2.3 mm to 2.7 mm, the appropriate thickness of the heat dissipation base can provide high heat dissipation performance, and then the light source device with the high heat dissipation performance is obtained.

Description

Technical Field

[0001] The present application relates to the field of light source technology, and in particular to a light source device and an electronic device. Background Art

[0002] At present, there are many technical problems in improving the heat dissipation of light sources. Usually, the heat dissipation performance is improved by changing the structure of the heat dissipation module, and the temperature of the light source is reduced by combining various forms of heat dissipation modules. Different heat dissipation module structures and structural combinations have different effects on the temperature of the light source. However, the existing heat dissipation structure design requires a lot of testing, analysis and comparison, which takes a long time, and the test process may cause the assembly process, external pressure and other factors to affect the analysis results. Therefore, the heat dissipation performance of the existing light source device is insufficient. Utility Model Content

[0003] Embodiments of the present application provide a light source device and an electronic device, which can improve the heat dissipation performance of the light source device.

[0004] According to a first aspect of an embodiment of the present application, a light source device is provided, comprising:

[0005] Light emitting device;

[0006] A heat sink is arranged on a light-emitting side away from the light-emitting device;

[0007] A heat dissipation base, arranged on a side of the heat dissipation plate away from the light emitting device;

[0008] The thickness of the heat dissipation base ranges from 1.8 mm to 2.2 mm, or from 2.3 mm to 2.7 mm.

[0009] In some embodiments, when the operating power range of the light emitting device is less than the first power threshold, the thickness of the heat dissipation base is the first thickness;

[0010] When the operating power range of the light emitting device is greater than or equal to the first power threshold, the thickness of the heat dissipation base is a second thickness;

[0011] The first thickness is smaller than the second thickness.

[0012] In some embodiments, when the operating power of the light-emitting device is less than the first power threshold and the thickness of the heat dissipation base is less than the first thickness, the temperature of the light-emitting device is negatively correlated with the thickness of the heat dissipation base; when the thickness of the heat dissipation base is greater than the first thickness, the temperature of the light-emitting device is positively correlated with the thickness of the heat dissipation base;

[0013] When the operating power of the light-emitting device is greater than or equal to the first power threshold and the thickness of the heat sink is less than the second thickness, the temperature of the light-emitting device is negatively correlated with the thickness of the heat sink; when the thickness of the heat sink is greater than the second thickness, the temperature of the light-emitting device is positively correlated with the thickness of the heat sink.

[0014] In some embodiments, when the operating power range of the light emitting device is greater than or equal to a second power threshold, the thickness of the heat dissipation base is the first thickness, and the second power threshold is less than the first power threshold; and / or,

[0015] When the operating power range of the light emitting device is less than or equal to the third power threshold, the thickness of the heat dissipation base is the second thickness, and the third power threshold is greater than the first power threshold.

[0016] In some embodiments, the light source device further includes:

[0017] The heat-conducting adhesive layer is arranged between the heat dissipation plate and the heat dissipation base.

[0018] In some embodiments, the temperature of the light emitting device is negatively correlated with the thermal conductivity of the thermal conductive adhesive layer.

[0019] In some embodiments, when the thermal conductivity of the thermally conductive adhesive layer is less than a coefficient threshold, the slope of the relationship curve between the temperature of the light-emitting device and the thermal conductivity of the thermally conductive adhesive layer is a first slope;

[0020] When the thermal conductivity of the thermally conductive adhesive layer is greater than the coefficient threshold, the slope of the relationship curve between the temperature of the light-emitting device and the thermal conductivity of the thermally conductive adhesive layer is a second slope;

[0021] The first slope is greater than the second slope.

[0022] In some embodiments, the first power threshold ranges from 48W to 52W; and / or,

[0023] The second power threshold ranges from 33W to 37W; and / or,

[0024] The third power threshold ranges from 68W to 72W; and / or,

[0025] The first thickness ranges from 1.8 mm to 2.2 mm; and / or,

[0026] The second thickness ranges from 2.3 mm to 2.7 mm.

[0027] In some embodiments, the thermal conductivity of the thermally conductive adhesive layer ranges from 0.5 W / mK to 6.5 W / mK; and / or,

[0028] The coefficient threshold ranges from 3.5 W / mK to 4.5 W / mK.

[0029] In some embodiments, the light emitting device comprises an LED device; and / or,

[0030] The heat sink includes an aluminum substrate; and / or,

[0031] The heat dissipation base includes a heat sink copper base; and / or;

[0032] In the case where the light source device comprises a thermally conductive adhesive layer, the thermally conductive adhesive layer comprises thermally conductive silicone grease.

[0033] In some embodiments, the contact area between the heat dissipation base and the thermally conductive adhesive layer is smaller than the surface area of ​​the heat dissipation base on a side close to the thermally conductive adhesive layer; and / or,

[0034] The contact area between the heat sink and the thermally conductive adhesive layer is equal to the surface area of ​​the heat sink close to the thermally conductive adhesive layer; and / or,

[0035] The contact area between the light emitting device and the heat sink is smaller than the surface area of ​​the heat sink on a side close to the light emitting device.

[0036] According to a second aspect of an embodiment of the present application, an electronic device is provided, including:

[0037] A light source device as described in the first aspect.

[0038] In some embodiments, the electronic device includes a projector;

[0039] The projector comprises:

[0040] A heat pipe connected to a heat dissipation base of the light source device;

[0041] heat dissipation fins connected to the heat pipe;

[0042] A fan is connected to the heat dissipation fins.

[0043] The light source device provided in the embodiment of the present application can simulate the relationship between the different thicknesses of the heat sink and the temperature distribution of the light-emitting device through thermal simulation analysis to obtain a more suitable thickness of the heat sink, so as to provide the light-emitting device with a heat dissipation effect that meets the requirements. The change in the thickness of the heat sink will affect the change in its two parameters, thermal resistance and heat capacity. The relationship between the thickness of different heat sinks and the temperature of the light-emitting device can be simulated by thermal simulation analysis to obtain the temperature distribution of the light source device under the appropriate thickness of the heat sink, which is quick and convenient and can shorten the design cycle. Through thermal simulation analysis, the correlation between the thickness of the heat sink and the working power of the light-emitting device can be obtained. Through the regular conclusion of the correlation, the appropriate thickness value of the corresponding heat sink can be set according to the different working rules of the light-emitting device, that is, the thickness range is 1.8mm to 2.2mm, or, 2.3mm to 2.7mm. The appropriate thickness of the heat sink can provide higher heat dissipation performance, thereby obtaining a light source device with higher heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic structural diagram of a light source device provided in an embodiment of the present application;

[0045] Figure 2 A schematic structural diagram of another light source device provided in an embodiment of the present application;

[0046] Figure 3 A schematic diagram of heat transfer of a light source device provided in an embodiment of the present application;

[0047] Figure 4 A graph showing the relationship between the thermal conductivity of a thermally conductive silicone grease and the LED temperature provided in an embodiment of the present application;

[0048] Figure 5 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 0.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0049] Figure 6 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 1.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0050] Figure 7 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 2.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0051] Figure 8 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 3.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0052] Fig. 9A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 4.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0053] Fig.10 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 5.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0054] Fig.11 A temperature distribution cloud diagram of LEDs corresponding to a thermal conductivity of 6.5 W / mk of a thermally conductive silicone grease provided in an embodiment of the present application;

[0055] Fig.12 A graph showing the relationship between heat sink copper bases of different thicknesses and LED temperature when the LED operating power is 40W provided in an embodiment of the present application;

[0056] Fig.13 A temperature distribution cloud diagram of a heat sink copper base with a thickness of 2.0 mm corresponding to an LED working power of 40 W provided in an embodiment of the present application;

[0057] Fig.14 A graph showing the relationship between heat sink copper bases of different thicknesses and LED temperature when the LED operating power is 45W provided in an embodiment of the present application;

[0058] Fig.15 A temperature distribution cloud diagram of a heat sink copper base with a thickness of 2.0 mm corresponding to an LED working power of 45 W provided in an embodiment of the present application;

[0059] Fig.16 A graph showing the relationship between heat sink copper bases of different thicknesses and LED temperature when the LED operating power is 50W provided in an embodiment of the present application;

[0060] Fig.17 A temperature distribution cloud diagram of a heat sink copper base with a thickness of 2.5 mm corresponding to an LED working power of 50 W provided in an embodiment of the present application;

[0061] Fig.18 A graph showing the relationship between heat sink copper bases of different thicknesses and LED temperature when the LED operating power is 55W provided in an embodiment of the present application;

[0062] Fig.19 A temperature distribution cloud diagram of a heat sink copper base with a thickness of 2.5 mm corresponding to an LED working power of 55 W provided in an embodiment of the present application;

[0063] Fig. 20 A graph showing the relationship between heat sink copper bases of different thicknesses and LED temperature when the LED operating power is 60W provided in an embodiment of the present application;

[0064] Fig.21 A temperature distribution cloud diagram of a heat sink copper base with a thickness of 2.5 mm corresponding to an LED working power of 60 W provided in an embodiment of the present application;

[0065] Fig. 22 A schematic structural block diagram of an electronic device provided in an embodiment of the present application;

[0066] Fig.23 A schematic diagram of the partial structure of a projector provided in an embodiment of the present application. DETAILED DESCRIPTION

[0067] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0068] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0069] At present, there are many technical problems in improving the heat dissipation of light sources. Usually, the heat dissipation performance is improved by changing the structure of the heat dissipation module, and the temperature of the light source is reduced by combining various forms of heat dissipation modules. Different heat dissipation module structures and structural combinations have different effects on the temperature of the light source. However, the existing heat dissipation structure design requires a lot of testing, analysis and comparison, which takes a long time, and the test process may cause the assembly process, external pressure and other factors to affect the analysis results. Therefore, the heat dissipation performance of the existing light source device is insufficient.

[0070] In view of this, embodiments of the present application provide a light source device and an electronic device, which can improve the heat dissipation performance of the light source device.

[0071] In a first aspect of an embodiment of the present application, a light source device is provided. Figure 1 This is a schematic structural diagram of a light source device provided in an embodiment of the present application. Figure 1 As shown, the light source device includes: a light emitting device 100, a heat sink 200 and a heat sink base 300; the light emitting device 100 is used to emit light, the heat sink 200 is arranged on the light emitting side L away from the light emitting device 100, and the heat sink 200 is used to conduct heat to the bottom of the light emitting device 100, and to extract the heat to achieve the heat dissipation function. The heat sink base 300 is arranged on the side of the heat sink 200 away from the light emitting device 100, and the heat sink base 300 can dissipate heat from the heat sink 200, and further extract the heat of the light emitting device 100. When the operating power range of the light emitting device 100 is less than the first power threshold, the thickness of the heat sink base 300 is the first thickness; when the operating power range of the light emitting device 100 is greater than or equal to the first power threshold, the thickness of the heat sink base 300 is the second thickness; the first thickness is less than the second thickness. The thickness of the heat sink 300 will affect the heat dissipation performance. The operating power range of the light emitting device 100 will affect the temperature of the light emitting device 100. Different temperature ranges of the light emitting device 100 have different heat dissipation requirements for the heat sink 300. The higher the temperature, the higher the heat dissipation required. Only in this way can the light emitting device 100 be quickly cooled to ensure that the light emitting device 100 operates within a safe temperature range. As the thickness of the heat sink 300 increases, the heat capacity of the heat sink 300 increases, and the heat dissipation performance is good. When the operating power range of the light emitting device 100 is less than the first power threshold, that is, the light emitting device 100 operates at low power, the temperature range of the light emitting device 100 is relatively small. As the temperature of the light emitting device 100 increases, the required heat dissipation performance is not large, and the thickness requirement of the heat sink 300 is relatively small, and a suitable thickness, that is, the first thickness, can be used. When the operating power range of the light emitting device 100 is greater than or equal to the first power threshold, the light emitting device 100 operates within a larger power range, and the temperature is also within a larger range, and the heat dissipation performance of the heat dissipation base 300 is required to be larger, then a suitable thickness, i.e., a second thickness, is adopted, and the second thickness is greater than the first thickness. According to the operating power range of the light emitting device 100, a suitable thickness of the heat dissipation base 300 can be set so that the heat dissipation base 300 provides a suitable heat dissipation function. The first thickness and the second thickness are both within the range of 1.8 mm to 2.2 mm, or, 2.3 mm to 2.7 mm, and can include the end values ​​of the range.

[0072] It should be noted that if Figure 1 As shown, the light emitting device 100 , the heat dissipation plate 200 and the heat dissipation base 300 are stacked and connected in the thickness direction H.

[0073] It should be noted that, for example, the light source is a relatively important device in the projector equipment. During the operation, part of the light emitted by the light source passes through the optical path system for imaging, and most of the light will be converted into a large amount of heat. If the heat cannot be taken away in time, the performance of the light source will be damaged and its life will be greatly reduced. Therefore, the heat dissipation of the light source has become the main research content. At present, the heat dissipation path of the light source is mainly through the heat dissipation substrate, the heat dissipation base and the heat dissipation device outside the light source. The improvement method of light source heat dissipation mainly includes changing the structural form of the heat dissipation module. In actual application, the heat dissipation performance is improved by trying various different heat dissipation module structures. A large number of tests are required for analysis and comparison, which has a long cycle. In addition, the analysis results may be affected by different test methods, test tools, and external pressure during the test. Therefore, the heat dissipation performance of the existing light source device is insufficient.

[0074] In view of the above problems, the light source device provided in the embodiment of the present application can simulate the relationship between the different thicknesses of the heat sink 300 and the temperature distribution of the light emitting device through thermal simulation analysis, and obtain a more suitable thickness of the heat sink, so as to provide the light emitting device 100 with a heat dissipation effect that meets the requirements. The change in the thickness of the heat sink 300 will affect the change in its two parameters of thermal resistance and heat capacity. The relationship between the thickness of different heat sinks and the temperature of the light emitting device can be simulated by thermal simulation analysis, and the temperature distribution of the light source device under the appropriate thickness of the heat sink 300 can be obtained, which is quick and convenient and can shorten the design cycle. Through thermal simulation analysis, the correlation between the thickness of the heat sink 300 and the working power of the light emitting device 100 can be obtained. Through the regular conclusion of the correlation, the appropriate thickness value of the corresponding heat sink 300 can be set according to the different working rules of the light emitting device 100, that is, the thickness range is 1.8mm to 2.2mm, or, 2.3mm to 2.7mm. The appropriate thickness of the heat sink 300 can provide higher heat dissipation performance, thereby obtaining a light source device with higher heat dissipation performance.

[0075] In some embodiments, when the operating power of the light-emitting device 100 is less than the first power threshold and the thickness of the heat dissipation base 300 is less than the first thickness, the temperature of the light-emitting device 100 is negatively correlated with the thickness of the heat dissipation base 300, and when the thickness of the heat dissipation base 300 is greater than the first thickness, the temperature of the light-emitting device 100 is positively correlated with the thickness of the heat dissipation base 300; when the operating power of the light-emitting device 100 is greater than or equal to the first power threshold and the thickness of the heat dissipation base 300 is less than the second thickness, the temperature of the light-emitting device 100 is negatively correlated with the thickness of the heat dissipation base 300, and when the thickness of the heat dissipation base 300 is greater than the second thickness, the temperature of the light-emitting device 100 is positively correlated with the thickness of the heat dissipation base 300. When the operating power range of the light-emitting device 100 is greater than or equal to the second power threshold, the thickness of the heat dissipation base 300 is the first thickness, and the second power threshold is less than the first power threshold. When the operating power range of the light-emitting device 100 is less than or equal to the third power threshold, the thickness of the heat dissipation base 300 is the second thickness, and the third power threshold is greater than the first power threshold.

[0076] Exemplarily, the first power threshold ranges from 48 W to 52 W. Exemplarily, the second power threshold ranges from 33 W to 37 W. Exemplarily, the third power threshold ranges from 68 W to 72 W. Exemplarily, the first thickness ranges from 1.8 mm to 2.2 mm. Exemplarily, the second thickness ranges from 2.3 mm to 2.7 mm.

[0077] In some embodiments, Figure 2 This is a schematic structural diagram of another light source device provided in an embodiment of the present application. Figure 2 As shown, the light source device further includes: a thermally conductive adhesive layer 400, which is disposed between the heat sink 200 and the heat sink base 300. The thermally conductive adhesive layer 400 can discharge the air between the heat sink 200 and the heat sink base 300. The air has a low thermal conductivity and poor thermal conductivity. Replacing the air between the heat sink 200 and the heat sink base 300 with the thermally conductive adhesive layer 400 can improve the heat dissipation performance and also play a certain degree of bonding role.

[0078] For example, taking the light source device applied to a projector as an example, the heat dissipation base 300 of the light source device can be connected to heat dissipation fins through heat pipes, and the heat dissipation fins are in contact with the external environment. Figure 3 This is a schematic diagram of heat transfer of a light source device provided in an embodiment of the present application. Figure 3As shown, the temperature of the light emitting device 100 is indicated as T1, the temperature of the heat sink 200 is indicated as T2, the temperature of the heat sink base 300 is indicated as T3, the temperature of the heat pipe is indicated as T4, the temperature of the heat sink fin is indicated as T5, and the temperature of the external environment is indicated as T6; the thermal resistance of the light emitting device 100 is indicated as R1, the thermal resistance of the heat sink 200 is indicated as R2, the thermal resistance of the thermal conductive adhesive layer 400 is indicated as R3, the thermal resistance of the heat sink base 300 is indicated as R4, the thermal resistance of the heat pipe is indicated as R5, and the thermal resistance of the heat sink fin is indicated as R6. The heat transfer direction of the light source device is indicated as FQ, that is, the heat emitted by the light emitting device 100 passes through the heat sink 200, the thermal conductive adhesive layer 400, the heat sink base 300, the heat pipe and the heat sink fins in sequence, and is finally transferred to the external environment. The thermal conductivity of the thermally conductive adhesive layer 400 and the thickness of the heat dissipation base 300 can be used as variable parameters. By adjusting the thermal conductivity of the thermally conductive adhesive layer 400 and / or the thickness of the heat dissipation base 300, a light source device with higher heat dissipation performance can be obtained.

[0079] Exemplarily, the light emitting device includes an LED device. Exemplarily, the heat sink includes an aluminum substrate. Exemplarily, the heat sink base includes a heat sink copper base. Exemplarily, the thermal conductive adhesive layer includes thermal conductive silicone grease.

[0080] In some embodiments, reference Figure 2 , the contact area between the heat dissipation base 300 and the thermal conductive adhesive layer 400 is smaller than the surface area of ​​the heat dissipation base 300 close to the thermal conductive adhesive layer 400. The contact area between the heat dissipation plate 200 and the thermal conductive adhesive layer 400 is equal to the surface area of ​​the heat dissipation plate 200 close to the thermal conductive adhesive layer 400. The contact area between the light emitting device 100 and the heat dissipation plate 200 is smaller than the surface area of ​​the heat dissipation plate 200 close to the light emitting device 100. The heat dissipation performance is positively correlated with the contact area.

[0081] Exemplarily, T represents the surface temperature of the structural component, in units of °C, R represents the thermal resistance of the structural component, in units of °C / W, Q represents the total heat transferred, in units of W, and the heat transfer of any structural component in the light source device satisfies the following relationship:

[0082]

[0083] ΔT represents the temperature change after the heat flows through two parallel surfaces of any structural component, T1 represents the temperature after the heat flows through one surface of the structural component, T2 represents the temperature after the heat flows through the other surface of the structural component, L is the distance of the heat in the transfer direction, the unit is m, K is the thermal conductivity of the structural component, the unit is W / mK, A is the heat transfer area, the unit is m 2 The structural assembly may include a light emitting device 100, a heat sink 200, a thermal conductive adhesive layer 400, a heat sink base 300, a heat pipe and heat sink fins.

[0084] like Figure 3 As shown, when the ambient temperature T6 and the total heat Q remain unchanged, the thermal resistance values ​​of the light emitting device 100, the heat sink 200, the heat sink base 300, the heat pipe and the heat sink fins remain unchanged, and the thermal resistance value of the thermal conductive adhesive layer 400 is variable. By changing the thermal resistance of the thermal conductive adhesive layer 400, that is, changing the thermal conductivity of the thermal conductive adhesive layer 400, the temperature change of the light emitting device 100 and the heat sink 200 is changed. Figure 5 It can be found that changing the thermal resistance of the thermal conductive adhesive layer 400 will cause the temperature of the light emitting device 100 and the heat sink 200 to change, while the temperature of the heat sink base 300, the heat pipe and the heat sink fins will not change.

[0085] In some embodiments, the temperature of the light emitting device 100 is negatively correlated with the thermal conductivity of the thermal conductive adhesive layer 400. For example, Figure 4 The figure is a graph showing the relationship between the thermal conductivity of a thermally conductive silicone grease and the LED temperature provided in the embodiment of the present application. Figure 4 As shown, the abscissa is the thermal conductivity of the thermal grease, in W / mK, and the ordinate is the LED temperature, in °C. The LED temperature decreases as the thermal conductivity of the thermal grease increases.

[0086] In some embodiments, when the thermal conductivity of the thermally conductive adhesive layer 400 is less than a coefficient threshold, the slope of a curve of the relationship between the temperature of the light-emitting device 100 and the thermal conductivity of the thermally conductive adhesive layer 400 is a first slope; when the thermal conductivity of the thermally conductive adhesive layer 400 is greater than the coefficient threshold, the slope of the curve of the relationship between the temperature of the light-emitting device 100 and the thermal conductivity of the thermally conductive adhesive layer 400 is a second slope; the first slope is greater than the second slope.

[0087] Exemplarily, the coefficient threshold ranges from 3.5 W / mK to 4.5 W / mK, referring to Figure 4 , the slope of the curve with a thermal conductivity less than 3.5 W / mK is greater than the slope of the curve with a thermal conductivity greater than 4.5 W / mK. As the thermal conductivity continues to increase, the temperature change of the LED becomes smaller and gradually tends to be stable.

[0088] Exemplarily, Table 1 is the corresponding data of the change in thermal conductivity of a thermally conductive silicone grease provided in an embodiment of the present application and the change in LED temperature.

[0089]

[0090] Table 1

[0091] As shown in Table 1, when the thermal conductivity of thermal grease is between 0.5W / mk and 1.5W / mk, the LED temperature drop is the largest, reaching 11.7°C; when the thermal conductivity of thermal grease is between 5.5W / mk and 6.5W / mk, the LED temperature changes by 0.7°C, that is, the thermal conductivity increases, and the contribution to improving the LED temperature decreases; when the thermal conductivity of thermal grease is between 3.5W / mk and 4.5W / mk, the LED temperature changes by 1.3°C. Considering the material cost and performance comprehensively, thermal grease with a thermal conductivity range of 3.5W / mk to 4.5 can be used.

[0092] For example, Figure 5 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 0.5W / mk. Figure 5 As shown, the unit of the temperature Temperature of the isotherms of the temperature distribution cloud map is degC (degrees Celsius), the coordinates of the temperature distribution cloud map include horizontal coordinates x and Y, the unit of the coordinates is mm, plane1 represents a certain plane, for example plane1 (Y=5.2mm) represents the plane with coordinate Y=5.2mm.

[0093] like Figure 5 As shown, when the thermal conductivity of the thermal grease is 0.5 W / mk, the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the maximum temperature of the LED reaches 85.4 °C.

[0094] For example, Figure 6 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 1.5W / mk. Figure 6 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 1.5 W / mk, the maximum temperature of the LED reaches 73.7°C.

[0095] For example, Figure 7 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 2.5W / mk. Figure 7 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 2.5 W / mk, the maximum temperature of the LED reaches 69.9°C.

[0096] For example, Figure 8 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 3.5W / mk. Figure 8 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 3.5 W / mk, the maximum temperature of the LED reaches 67.8°C.

[0097] For example, Fig. 9 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 4.5W / mk. Fig. 9 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 4.5 W / mk, the maximum temperature of the LED reaches 66.5°C.

[0098] For example, Fig.10 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of a thermal conductive silicone grease provided in the embodiment of the present application is 5.5W / mk. Fig.10 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 5.5 W / mk, the maximum temperature of the LED reaches 65.5°C.

[0099] For example, Fig.11 The LED temperature distribution cloud diagram corresponding to the thermal conductivity of the thermal conductive silicone grease provided in the embodiment of the present application is 6.5W / mk. Fig.11 As shown, when the thickness of the copper base is 2.5 mm, the thickness of the aluminum substrate is 1.8 mm, and the thermal conductivity of the thermal grease is 6.5 W / mk, the maximum temperature of the LED reaches 64.8°C.

[0100] refer to Figure 5-Figure 11 , when the thermal conductivity of the thermal grease increases, the maximum temperature of the LED decreases; when the thermal conductivity of the thermal grease is 6.5, the maximum temperature of the LED light source is 64.8℃. It can be seen that as the thermal conductivity of the thermal grease increases, the maximum temperature of the LED can be reduced, which contributes to improving the performance of the LED. From a cost perspective, the higher the thermal conductivity of the thermal grease, the higher the cost. Therefore, through simulation results and data comparison, it is more appropriate to choose a thermal conductivity of grease in the range of 3.5W / mk to 4.5, which can well improve the maximum temperature of the LED.

[0101] refer to Figure 5-Figure 11 By changing the thermal conductivity of the thermal grease, the temperature of the LED and the aluminum substrate will change, while the temperature of the copper base, heat pipe, and cooling fins will not change, which is consistent with the theoretical analysis. Therefore, simulation analysis can quickly obtain results and find the best solution based on the results, providing support for design work.

[0102] For example, Fig.12 The relationship between the heat sink copper base with different thicknesses and the LED temperature when the LED working power is 40W is provided in the embodiment of the present application. Fig.12As shown, the LED working power is equivalent to the LED power consumption. The horizontal axis is the thickness of the heat sink copper base, in mm, and the vertical axis is the LED temperature, in °C. When the thickness of the heat sink copper base is 2.0mm, the maximum temperature of the LED reaches the lowest value of 58.2°C. When the thickness of the heat sink copper base is from 1.0mm to 2.0mm, the LED temperature is decreasing. The reason is that the thickness increases, the heat capacity of the heat sink copper base increases, and the heat dissipation performance is good; when the thickness of the heat sink copper base is from 2.0 to 2.5mm, the LED temperature is increasing. The reason is that the thickness of the copper base increases, the thermal resistance increases, and the temperature of the LED increases; when the thickness of the heat sink copper base is from 2.5mm to 4.0mm, the change of the LED temperature is small, because the heat capacity of the heat sink copper base has reached the maximum.

[0103] For example, Fig.13 This is a temperature distribution cloud diagram provided in an embodiment of the present application when the heat sink copper base thickness is 2.0 mm corresponding to an LED working power of 40 W. Fig.13 As shown in the figure, the heat from the LED is transferred to the aluminum substrate, then to the copper base of the heat sink, then to the heat pipe, and finally to the heat sink fins. Fig.13 As shown, the unit of the temperature Temperature of the isotherms of the temperature distribution cloud diagram is degC (degrees Celsius), and the coordinates of the temperature distribution cloud diagram include abscissas x and Y, and the unit of the coordinates is mm.

[0104] For example, Fig.14 The relationship between the heat sink copper base with different thicknesses and the LED temperature when the LED working power is 45W is provided in the embodiment of the present application. Fig.14 As shown in the figure, when the thickness of the heat sink copper base is 2.0mm, the maximum temperature of the LED reaches the lowest value of 62.4℃. When the thickness of the heat sink copper base is from 1.0mm to 2.0mm, the LED temperature is decreasing, because the thickness increases, the heat capacity of the heat sink copper base increases, and the heat dissipation performance is good; when the thickness of the heat sink copper base is from 2.0 to 2.5mm, the LED temperature is increasing, because the thickness of the copper base increases, the thermal resistance increases, and the temperature of the LED increases; when the thickness of the heat sink copper base is from 2.5mm to 4.0mm, the LED temperature changes less, because the heat capacity of the heat sink copper base has reached the maximum.

[0105] For example, Fig.15 This is a temperature distribution cloud diagram provided in an embodiment of the present application when the thickness of the heat sink copper base is 2.0 mm corresponding to an LED working power of 45 W.

[0106] For example, Fig.16 The relationship between the heat sink copper base with different thicknesses and the LED temperature when the LED working power is 50W is provided in the embodiment of the present application. Fig.16As shown in the figure, when the thickness of the heat sink copper base is 2.5mm, the maximum temperature of the LED reaches the lowest value of 70.7℃. When the thickness of the heat sink copper base is from 1.0mm to 2.5mm, the LED temperature is decreasing, because the thickness increases, the heat capacity of the heat sink copper base increases, and the heat dissipation performance is good; when the thickness of the heat sink copper base is from 2.5 to 3.0mm, the LED temperature is increasing, because the thickness of the copper base increases, the thermal resistance increases, and the temperature of the LED increases; when the thickness of the heat sink copper base is from 3.0mm to 4.0mm, the LED temperature changes less, because the heat capacity of the heat sink copper base has reached the maximum.

[0107] For example, Fig.17 A temperature distribution cloud diagram provided in an embodiment of the present application when the thickness of the heat sink copper base is 2.5 mm and the working power of an LED is 50 W.

[0108] For example, Fig.18 The relationship between the heat sink copper base of different thicknesses and the LED temperature when the LED working power is 55W is provided in the embodiment of the present application. Fig.18 As shown in the figure, when the thickness of the heat sink copper base is 2.5mm, the maximum temperature of the LED reaches the lowest value of 75.3℃. When the thickness of the heat sink copper base is from 1.0mm to 2.5mm, the LED temperature is decreasing, because the thickness increases, the heat capacity of the heat sink copper base increases, and the heat dissipation performance is good; when the thickness of the heat sink copper base is from 2.5 to 3.0mm, the LED temperature is increasing, because the thickness of the copper base increases, the thermal resistance increases, and the temperature of the LED increases; when the thickness of the heat sink copper base is from 3.0mm to 4.0mm, the LED temperature changes less, because the heat capacity of the heat sink copper base has reached the maximum.

[0109] For example, Fig.19 A temperature distribution cloud diagram provided in an embodiment of the present application when the thickness of the heat sink copper base is 2.5 mm and the working power of an LED is 55 W.

[0110] For example, Fig. 20 The relationship between the heat sink copper base with different thickness and the LED temperature when the LED working power is 60W is provided in the embodiment of the present application. Fig. 20As shown in the figure, when the thickness of the heat sink copper base is 2.5mm, the maximum temperature of the LED reaches the lowest value of 80℃. When the thickness of the heat sink copper base is from 1.0mm to 2.5mm, the LED temperature is decreasing, because the thickness increases, the heat capacity of the heat sink copper base increases, and the heat dissipation performance is good; when the thickness of the heat sink copper base is from 2.5 to 3.0mm, the LED temperature is increasing, because the thickness of the copper base increases, the thermal resistance increases, and the temperature of the LED increases; when the thickness of the heat sink copper base is from 3.0mm to 4.0mm, the LED temperature changes less, because the heat capacity of the heat sink copper base has reached the maximum.

[0111] For example, Fig.21 A temperature distribution cloud diagram provided in an embodiment of the present application when the thickness of the heat sink copper base is 2.5 mm and the working power of an LED is 60 W.

[0112] refer to Figures 12 to 21 When the LED working power is 40W and 45W, the thickness of the appropriate heat sink copper base is 2.0mm; when the LED working power is 50W, 55W and 60W, the thickness of the appropriate heat sink copper base is 2.5mm; that is, as the working power of the LED increases, the thickness of the appropriate heat sink copper base also increases, so that the copper base can accommodate more heat.

[0113] refer to Figures 12 to 21 When the working power of LED is low, the required heat sink copper base thickness is also small, the thermal resistance is small, and the temperature of LED can reach the minimum value; when the working power of LED is high, the required heat sink copper base thickness is also large, the copper base thickness is large, the heat capacity is large, and the temperature of LED reaches the minimum value. Therefore, the change of the thickness of the heat sink copper base causes the change of its thermal resistance and heat capacity parameters, which causes the temperature of LED to change.

[0114] According to a second aspect of the embodiments of the present application, an electronic device is provided. Fig. 22 This is a schematic structural block diagram of an electronic device provided in an embodiment of the present application. Fig. 22 As shown, the electronic device includes: the light source device 1000 as described in the first aspect.

[0115] In some embodiments, Fig.23 The following is a schematic diagram of a partial structure of a projector provided in an embodiment of the present application. Fig.23 As shown, the electronic device includes a projector; the projector includes: a heat pipe 500, a heat dissipation fin 600 and a fan 700, the heat pipe 500 is connected to the heat dissipation base 300 of the light source device; the fan 700 is connected to the heat dissipation fin 600; and the heat dissipation fin 600 is connected to the heat pipe 500.

[0116] The light source device provided in the embodiment of the present application can simulate the relationship between the different thicknesses of the heat sink 300 and the temperature distribution of the light emitting device through thermal simulation analysis to obtain a more suitable thickness of the heat sink, so as to provide the light emitting device 100 with a heat dissipation effect that meets the requirements. The change in the thickness of the heat sink 300 will affect the change in its two parameters, thermal resistance and heat capacity. The relationship between the thickness of different heat sinks and the temperature of the light emitting device can be simulated by thermal simulation analysis to obtain the temperature distribution of the light source device under the appropriate thickness of the heat sink 300, which is quick and convenient and can shorten the design cycle. Through thermal simulation analysis, the correlation between the thickness of the heat sink 300 and the working power of the light emitting device 100 can be obtained. Through the regular conclusion of the correlation, the appropriate thickness value of the corresponding heat sink 300 can be set according to the different working rules of the light emitting device 100. The appropriate thickness of the heat sink 300 can provide higher heat dissipation performance, thereby obtaining a light source device with higher heat dissipation performance.

[0117] It should be noted that the electronic device provided in the embodiments of the present application may also include any device provided with a light source, such as an illumination lamp, an atmosphere lamp, etc., which are not listed one by one in the embodiments of the present application.

[0118] It should be noted that in the above embodiments, the description of each embodiment has its own emphasis, and for parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0119] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0120] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0121] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalents, this specification is also intended to include these modifications and variations.

Claims

1. A light source device, characterized in that: include: Light emitting device; A heat sink is arranged on a light-emitting side away from the light-emitting device; A heat dissipation base, arranged on a side of the heat dissipation plate away from the light emitting device; The thickness of the heat dissipation base ranges from 1.8 mm to 2.2 mm, or from 2.3 mm to 2.7 mm.

2. The light source device according to claim 1, characterized in that: When the operating power range of the light emitting device is less than the first power threshold, the thickness of the heat dissipation base is the first thickness; When the operating power range of the light emitting device is greater than or equal to the first power threshold, the thickness of the heat dissipation base is a second thickness; The first thickness is smaller than the second thickness.

3. The light source device according to claim 2, characterized in that: When the operating power of the light emitting device is less than the first power threshold and the thickness of the heat dissipation base is less than the first thickness, the temperature of the light emitting device is negatively correlated with the thickness of the heat dissipation base; when the thickness of the heat dissipation base is greater than the first thickness, the temperature of the light emitting device is positively correlated with the thickness of the heat dissipation base; When the operating power of the light-emitting device is greater than or equal to the first power threshold and the thickness of the heat sink is less than the second thickness, the temperature of the light-emitting device is negatively correlated with the thickness of the heat sink; when the thickness of the heat sink is greater than the second thickness, the temperature of the light-emitting device is positively correlated with the thickness of the heat sink.

4. The light source device according to claim 2, characterized in that: When the operating power range of the light emitting device is greater than or equal to a second power threshold, the thickness of the heat dissipation base is the first thickness, and the second power threshold is less than the first power threshold; and / or, When the operating power range of the light emitting device is less than or equal to the third power threshold, the thickness of the heat dissipation base is the second thickness, and the third power threshold is greater than the first power threshold.

5. The light source device according to claim 1, characterized in that: Also includes: The heat-conducting adhesive layer is arranged between the heat dissipation plate and the heat dissipation base.

6. The light source device according to claim 5, characterized in that: The temperature of the light emitting device is negatively correlated with the thermal conductivity of the thermal conductive adhesive layer.

7. The light source device according to claim 6, characterized in that: When the thermal conductivity of the thermally conductive adhesive layer is less than a coefficient threshold, the slope of a curve of a relationship between the temperature of the light-emitting device and the thermal conductivity of the thermally conductive adhesive layer is a first slope; When the thermal conductivity of the thermally conductive adhesive layer is greater than the coefficient threshold, the slope of the relationship curve between the temperature of the light-emitting device and the thermal conductivity of the thermally conductive adhesive layer is a second slope; The first slope is greater than the second slope.

8. The light source device according to claim 4, characterized in that: The first power threshold ranges from 48W to 52W; and / or, The second power threshold ranges from 33W to 37W; and / or, The third power threshold ranges from 68W to 72W; and / or, The first thickness ranges from 1.8 mm to 2.2 mm; and / or, The second thickness ranges from 2.3 mm to 2.7 mm.

9. The light source device according to claim 7, characterized in that: The thermal conductivity of the thermally conductive adhesive layer ranges from 0.5 W / mK to 6.5 W / mK; and / or, The coefficient threshold ranges from 3.5 W / mK to 4.5 W / mK.

10. The light source device according to any one of claims 1 to 7, characterized in that: The light emitting device comprises an LED device; and / or, The heat sink includes an aluminum substrate; and / or, The heat dissipation base includes a heat sink copper base; and / or; In the case where the light source device comprises a thermally conductive adhesive layer, the thermally conductive adhesive layer comprises thermally conductive silicone grease.

11. The light source device according to claim 5, characterized in that: The contact area between the heat dissipation base and the thermally conductive adhesive layer is smaller than the surface area of ​​the heat dissipation base on the side close to the thermally conductive adhesive layer; and / or, The contact area between the heat sink and the thermally conductive adhesive layer is equal to the surface area of ​​the heat sink close to the thermally conductive adhesive layer; and / or, The contact area between the light emitting device and the heat sink is smaller than the surface area of ​​the heat sink on a side close to the light emitting device.

12. An electronic device, characterized in that: include: A light source device as claimed in any one of claims 1 to 11.

13. The electronic device according to claim 12, characterized in that: The electronic device includes a projector; The projector comprises: A heat pipe connected to a heat dissipation base of the light source device; heat dissipation fins connected to the heat pipe; A fan is connected to the heat dissipation fins.

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